User's Guide SLUU159C – February 2005 – Revised January 2012 EV2300 EVM Interface Board This user's guide describes the function and operation of the EV2300 evaluation module. This guide includes a complete description of the EV2300 EVM, as well as a bill of materials, and schematic. 1 2 3 Contents Introduction .................................................................................................................. 2 Interfaces ..................................................................................................................... 2 EV2300 Bill of Materials, Component Placement, Schematic ........................................................ 6 List of Figures ............................................................................................................... 1 Board Layer 1 2 Solder Mask 1 ............................................................................................................... 9 8 3 Solder Mask 2 .............................................................................................................. 10 4 Board Layer 2 .............................................................................................................. 11 5 Component Placement 1 ................................................................................................. 12 6 Component Placement 2 ................................................................................................. 13 7 Internal Board Layer 1 .................................................................................................... 14 8 Internal Board Layer 2 .................................................................................................... 15 List of Tables 1 Ordering Information ........................................................................................................ 2 SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 1 Introduction 1 www.ti.com Introduction This EVM interface board enables an IBM-compatible or other type (with required driver for the particular platform) PC to communicate with Texas Instruments SMBus, HDQ, or DQ interface gas gauges via a Universal Serial Bus (USB) port. In addition to this board, PC software is required to interpret the gas gauge data to complete the evaluation system. 1.1 Features • • • 1.2 Kit Contents • • 1.3 Fully powered from the USB port Capable of providing a 25-mA 3.3-V source Complete interface between USB and SMBus, I2C, and HDQ (8/16) interfaces using a simple API EV2300 circuit module Standard USB cable Ordering Information Table 1. Ordering Information EVM Part Number EV2300 2 Interfaces The EV2300 interfaces are described in the following table. The reference designators on the circuit board and the functions are also listed. Reference Designator HDQ and SMB 2 IC USB 2 Function SMBus, HDQ, and DQ Interface ports 2 Terminal block for connecting to a target device E PROM I C Interface Terminal for connecting to a target E2PROM or I2C interface battery monitor USB Interface Interface to host computer EV2300 EVM Interface Board 2 Function SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Interfaces www.ti.com 2.1 Overview The EV2300 is enclosed and is provided as shown. 2.2 EV2300 Controller The EV2300 controller is a bq8012 running at 4 MHz. The controller firmware is stored in flash memory and is executed by the core at power-up after the boot ROM code verifies the integrity words. The controller communicates with target device(s) through either: a 2-wire SMBus communication port, a 1-wire HDQ port, or a 2-wire E2PROM I2C port. The 2-wire SMBus communication port supports both SMBus and I2C protocols. 2.3 USB Interface (USB) The interface board connects to a USB port (version 1.1) on a host computer and is powered from the port. All communication over the USB is proprietary and does not fit any USB-defined device classes. Therefore communication with the device requires a loader and driver from Texas Instruments. The loader enumerates the device (determines it is present on the USB), then loads the EV2300 controller firmware for the USB interface. Once the firmware load is complete, the loader sends a command to the USB interface IC to execute the new program and the loader driver exits. A new driver takes control and enumerates the EV2300 and makes the device present to programs running on the host. The installer for the USB EVB installs: 1. A loader driver 2. A binary to load onto the USB interface IC 3. An EV2300 controller driver for direct access to the device 4. An EV2300 DLL for application access to the device SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 3 Interfaces 2.4 www.ti.com HDQ Interface (HDQ) This interface allows a host computer to interact with a slave or target device through the two-wire SMBus or the one-wire HDQ interfaces. The ports are labeled with the corresponding signal names above each port connector. Connect the signal and a ground reference (GND), and optionally VOUT, to a target device. The two-wire interface supports SMBus version 1.1 byte, word, block transactions with and without PEC. The SMBus limits the capacitance on each line (Data and Clock) to 100 pF. The EV2300 places 8 pF on each line, so a device may place up to 92 pF total. If the capacitive load approaches or exceeds 100 pF, SMBus communication may not be reliable. 2.5 Pin Name 1 GND Ground return/reference for HDQ interface Description 2 VOUT Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC 3 HDQ HDQ one-wire interface. Pulled up to 3.3-V rail with a 10-kΩ resistor 4 VCC Supplies 3.3 VDC to a target. Current load should be limited to 30 mA I2C/EEPROM Interface (I2C) This interface allows a host computer to interact with a target E2PROM or other I2C interface device such as a battery monitor device through a two-wire I2C interface. The interface contains a controlled power pin, the I2C clock and data lines, and a ground reference. 4 Pin Name 1 GND Ground return. Connected to the SMD and HDQ GND 2 SCL I2C clock. This line must be pulled up by the target. 3 SDA I2C data. This line must be pulled up by the target. 4 VOUT EV2300 EVM Interface Board Description Controlled EEPROM power. Supplies 5 VDC to a target EEPROM IC SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Interfaces www.ti.com 2.6 SMBus Interface (SMBus) Pin Name 1 GND Description 2 SMBC SMB clock pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on this pin. 3 SMBD SMB data pin. This pin is pulled to 3.3 VDC through a 10-kΩ resistor. Do not exceed 5.6 VDC on this pin. 4 NC Ground reference Not connected on this board. This pin is floating. SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 5 EV2300 Bill of Materials, Component Placement, Schematic 3 www.ti.com EV2300 Bill of Materials, Component Placement, Schematic This chapter includes the schematic, component placement on the circuit board, and a listing of the bill of materials for the EV2300 EVM. 3.1 Bill of Materials (BOM) 10 C1-C7, C10-C12, C15, C20 Capacitor, ceramic, 0.1 µF, 25 V, X7R, 10% 603 0 C13 Open 603 2 C16, C21 Capacitor, POSCAP 4.7 µF, 35 V, 20% 1 C18 Capacitor, ceramic, 2200 pF, 50 V, C0G, 10% 1 C19 2 C8, C9 0 (2) (3) (4) Description (2) (3) (4) Ref Des (1) 6 (1) Qty Size MFR Part Number TDK C1608X7R1E104KT 6032 ©) AVX TAJC475K035R 603 TDK C1608C0G1H222KT Capacitor, ceramic, 150 pF, 50 V, C0G, 10% 603 TDK C1608C0G1H151KT Capacitor, ceramic, 22 pF, 50 V, C0G, 10% 603 TDK C1608C0G1H220KT D1-D7, D9, D13-D15, D17 Open 0.068 × 0.049 2 D12, D19 Diode, LED, green, 20 mA, 0.9 mcd 0.068 × 0.049 Panasonic LN1371G-(TR) 1 D20 Diode, LED, red, 20 mA, 0.9 mcd 0.068 × 0.049 Panasonic LN1271R-(TR) 3 D21-D23 Diode, dual, 250 mA, 70 V SOT23 Vishay-Liteon BAW56GS08 5 D8, D10, D11, D16, D18 Diode, low capacitance, TVS SOT23 General Semi GL05T 1 J1 Connector, USB upstream (Type B) 0.47" × 0.67" Molex 67068-1000 3 J13-J15 Header, friction lock assembly, 4-pin right angle 0.400 x 0.500 Molex 22-05-3041 1 J2 Header, 11 pin, 100 mil spacing, (36-pin strip) 121100 Sullins PTC36SAAN 0 J3-J5, J8-J11 Open 0.038" 1 J7 Header, 2 pin, 100 mil spacing, (36-pin strip) 0.100 × 2" Sullins PTC36SAAN 1 Q1 Transistor, NPN, high-performance, 500 mA SOT23 Fairchild MMBT2222A 1 Q2 MOSFET, P-ch, –12 V, 4 A, 51 mΩ SOT23 Vishay Si2335DS 4 R1, R14, R16, R19 Resistor, chip, 10 kΩ, 1/16 W, 5% 603 Std Std 12 R13, R15, R21–R24, R26, R27, R45, R46, R49, R50 Resistor, chip, 100 Ω, 1/16 W, 5% 603 Std Std 3 R18, R42, R43 Resistor, chip, 1 MΩ, 1/16 W, 1% 603 Std Std 1 R2 Resistor, chip, 15 kΩ, 1/16 W, 5% 603 Std Std 7 R3–R5, R32–R34, R39 Resistor, chip, 100 kΩ, 1/16 W, 5% 603 Std Std 3 R30, R51, R52 Resistor, chip, 620 Ω, 1/16 W, 5% 603 Std Std 2 R31, R41 Resistor, chip, 10 Ω, 1/16 W, 5% 603 Std Std 1 R35 Resistor, chip, 61.9 kΩ, 1/16 W, 1% 603 Std Std 1 R53 Resistor, chip, 0 Ω, 1/16 W, 5% 603 Std Std Reference designators marked with an asterisk (*) cannot be substituted. All other components can be substituted with equivalent manufacturers components. These assemblies are ESD sensitive, ESD precautions should be observed. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable. These assemblies must comply with workmanship standards IPC-A-610 Class 2. EV2300 EVM Interface Board SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Qty Ref Des (1) Description (2) (3) (4) Size MFR Part Number 1 R54 Resistor, chip, 113 kΩ, 1/16 W, 0.1% 603 Vishay TNPW06031133BT9R T1 1 R6 Resistor, chip, 1.5 kΩ, 1/16 W, 5% 603 Std Std 0 R7, R10-R12, R17, R20, R25, R28, R36-R38, R40 Open 603 2 R8, R9 Resistor, chip, 33 Ω, 1/16 W, 5% 603 Std Std 0 SW1 Open 5 mm × 5 mm 2 U1, U2 IC, Single bus buffer gate with 3-state output, with negative enable DCK TI SN74LVC1G125DCK 1 U3 IC, Single bus buffer gate with 3-state output, with positive enable DCK TI SN74LVC1G126DCK 1 U4 IC, USB, general purpose, device controller 0.480 × 0.480" TI TUSB3210PM 1 U5 IC, ultra low-power LDO regulator, 3.3 V, 50 mA SOT23-5 TI TPS77033DBV 1 U6 IC, Advance gas gauge DBT38 TI bq8015DBT 1 Y1 or Y4 Crystal, high performance, 12.00 MHz, SMT 0.126 × 0.126 Citizen or Daishinku CSA-309-12.000MABJ or DSX630G-12.00 MHz 0 Y2 or Y3 Crystal, 32.768 MHz, 7-12 pF capacitance 1,9 mm × 5 mm Daishinku or ECS DST520G-32.768kHz or ECS-0.327-8-14 1 N/A Plastic enclosure, bone, Texas Instruments silkscreen PacTec 84107-501-039 Wire Cable Assembly (5) 1 Mate Connector, female, 0.100 centers 22-01-30 47 Molex 4 N/A Terminals, crimp, tin 08-50-011 4 Molex N/A Wire, insulated 22 Awg, red, 18 inches (±3 inches) (VOUT) Any Any N/A Wire, insulated 22 Awg, white, 18 inches (±3 inches) (SCL) Any Any N/A Wire, insulated 22 Awg, black, 18 inches (±3 inches) (GND) Any Any N/A Wire, insulated 22 Awg, brown, 18 inches (±3 inches) (SDA) Any Any N/A Heatshrink 1" Any Any 1 (5) Make one EEPROM connector wire assembly for each assembly produced, from J15 mate, 4 - 22 AWG wires and crimp terminals. Wire colors for pin numbers are listed below. Strip and tin flying leads 0.25 inches from end of wire. Red - pin #4 (signal VOUT) Brown - pin #3 (signal SDA) White - pin #2 (signal SCL) Black - pin #1 (GND) SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 7 EV2300 Bill of Materials, Component Placement, Schematic 3.2 www.ti.com EV2300 Component Placement Figure 1. Board Layer 1 8 EV2300 EVM Interface Board SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 2. Solder Mask 1 SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 9 EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 3. Solder Mask 2 10 EV2300 EVM Interface Board SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 4. Board Layer 2 SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 11 EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 5. Component Placement 1 12 EV2300 EVM Interface Board SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 6. Component Placement 2 SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 13 EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 7. Internal Board Layer 1 14 EV2300 EVM Interface Board SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 Bill of Materials, Component Placement, Schematic www.ti.com Figure 8. Internal Board Layer 2 SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated EV2300 EVM Interface Board 15 EV2300 Bill of Materials, Component Placement, Schematic 1 OUT EN NC/FB IN 4 5 EV2300 EVM Interface Board GND 16 2 EV2300 Schematic 3 3.3 www.ti.com + + SLUU159C – February 2005 – Revised January 2012 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from A Revision (February 2005) to B Revision ............................................................................................. Page • • Changed label ............................................................................................................................ 3 Changed HDQ Interface pin names .................................................................................................... 4 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from B Revision (December 2011) to C Revision ........................................................................................... Page • Added Schematic ....................................................................................................................... 16 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 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