AOSMD AO4406AL

AO4406AL
N-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO4406AL uses advanced trench technology to
provide excellent RDS(ON) with low gate charge.
This device is suitable for high side switch in SMPS and
general purpose applications.
VDS (V) = 30V
ID = 12A
(VGS = 10V)
RDS(ON) < 11.5mΩ
(VGS = 10V)
RDS(ON) < 15.5mΩ
(VGS = 4.5V)
- RoHS Compliant
- Halogen Free
100% UIS Tested!
100% R g Tested!
D
SOIC-8
D
S
S
S
G
G
D
D
D
D
G
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TC=25°C
Continuous Drain
Current
Pulsed Drain Current
Avalanche Current
C
C
Repetitive avalanche energy L=0.1mH
Power Dissipation B
C
TC=25°C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
Alpha & Omega Semiconductor, Ltd.
±20
V
A
10
IDM
100
IAR
22
A
EAR
24
mJ
3.1
PD
TC=70°C
Units
V
12
ID
TC=70°C
Maximum
30
TJ, TSTG
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
W
2
RθJA
RθJL
Typ
31
59
16
°C
Max
40
75
24
Units
°C/W
°C/W
°C/W
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AO4406AL
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
Min
Conditions
ID=250µA, VGS=0V
VDS=30V, VGS=0V
1
5
VDS=0V, VGS= ±20V
100
Gate Threshold Voltage
VDS=VGS ID=250µA
1.5
ID(ON)
On state drain current
VGS=10V, VDS=5V
100
VGS=10V, ID=12A
TJ=125°C
VGS=4.5V, ID=10A
gFS
Forward Transconductance
VSD
IS=1A,VGS=0V
Diode Forward Voltage
Maximum Body-Diode Continuous Current
IS
VDS=5V, ID=12A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=10V, VDS=15V, ID=12A
Units
V
TJ=55°C
Static Drain-Source On-Resistance
Max
30
VGS(th)
RDS(ON)
Typ
1.9
2.5
µA
nA
V
A
9.5
11.5
14
17
12.5
15.5
45
0.75
mΩ
mΩ
S
1
V
4
A
610
760
910
pF
88
125
160
pF
40
70
100
pF
0.8
1.6
2.4
Ω
11
14
17
nC
5
6.6
8
nC
1.9
2.4
2.9
nC
3
4.2
nC
1.8
VGS=10V, VDS=15V, RL=1.25Ω,
RGEN=3Ω
4.4
ns
9
ns
17
ns
6
ns
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=12A, dI/dt=500A/µs
5.6
7
8
Qrr
Body Diode Reverse Recovery Charge IF=12A, dI/dt=500A/µs
6.4
8
9.6
ns
nC
2
A. The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P D is based on T J(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
2
FR-4 board with
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2oz. Copper, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating.
Rev 0 : Oct-08
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
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AO4406AL
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
100
30
10V
6V
80
25
4.5V
20
ID(A)
7V
60
ID (A)
VDS=5V
5V
4V
40
15
10
3.5V
20
5
VGS=3V
0
0
1
2
3
4
125°C
0
1
5
1.5
2
2.5
3
3.5
4
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
18
Normalized On-Resistance
1.8
16
RDS(ON) (mΩ)
25°C
VGS=4.5V
14
12
10
VGS=10V
8
VGS=10V
ID=12A
1.6
1.4
17
VGS=4.5V
5
ID=10A 2
1.2
10
1
0.8
6
0
5
0
10
15
20
25
30
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage (Note E)
25
50
75
100
125
150
175
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction
18
Temperature (Note E)
30
1.0E+02
ID=12A
1.0E+01
25
125°C
IS (A)
RDS(ON) (mΩ)
40
1.0E+00
20
15
10
1.0E-01
1.0E-02
5
1.0E-04
0
1.0E-05
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Alpha & Omega Semiconductor, Ltd.
25°C
1.0E-03
25°C
2
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO4406AL
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1200
10
VDS=15V
ID=12A
1000
Ciss
Capacitance (pF)
VGS (Volts)
8
6
4
2
600
400
Coss
200
0
Crss
0
0
2
4
6
8
10
12
Qg (nC)
Figure 7: Gate-Charge Characteristics
14
0
60
5
10
15
20
25
VDS (Volts)
Figure 8: Capacitance Characteristics
30
1000.0
50
TA=25°C
40
10µs
TA=100°C
30
TA=150°C
20
TA=125°C
100.0
ID (Amps)
ID(A), Peak Avalanche Current
800
10.0
RDS(ON)
limited
100µs
1ms
10ms
100ms
1.0
TJ(Max)=150°C
TA=25°C
0.1
10
10µs
DC
10s
0.0
0
0.000001
0.1
0.00001
0.0001
0.001
Time in avalanche, t A (s)
Figure 12: Single Pulse Avalanche capability
(Note C)
1
10
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
1000
TA=25°C
Power (W)
100
10
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-to-Ambient (Note F)
Alpha & Omega Semiconductor, Ltd.
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AO4406AL
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
ZθJA Normalized Transient
Thermal Resistance
10
1
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
40
RθJA=75°C/W
0.1
PD
0.01
Single Pulse
Ton
0.001
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note F)
Alpha & Omega Semiconductor, Ltd.
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AO4406AL
Gate Charge Test Circuit & W aveform
Vgs
Qg
10V
+
+ Vds
VDC
-
VDC
DUT
Qgs
Qgd
-
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
Vgs
90%
+ Vdd
DUT
VDC
Rg
-
10%
Vgs
Vgs
t d(on)
tr
t d(off)
t on
tf
t off
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
E AR= 1/2 LIAR
Vds
BVDSS
Vds
Id
+ Vdd
Vgs
Vgs
VDC
Rg
-
I AR
Id
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
DUT
Vds -
Isd
Vgs
Isd
L
Vgs
Ig
Alpha & Omega Semiconductor, Ltd.
+ Vdd
VDC
-
IF
t rr
dI/dt
I RM
Vdd
Vds
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