LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 LM27313/LM27313-Q1 Check for Samples: LM27313 FEATURES DESCRIPTION • The LM27313 switching regulator is a current-mode boost converter with a fixed operating frequency of 1.6 MHz. 1 2 • • • • • • • • • • LM27313-Q1 is an Automotive Grade Product that is AEC-Q100 Grade 1 Qualified (-40°C to +125°C Operating Junction Temperature) 30V DMOS FET Switch 1.6 MHz Switching Frequency Low RDS(ON) DMOS FET Switch Current up to 800 mA Wide Input Voltage Range (2.7V–14V) Low Shutdown Current (<1 µA) 5-Lead SOT-23 Package Uses Tiny Capacitors and Inductors Cycle-by-Cycle Current Limiting Internally Compensated The use of the SOT-23 package, made possible by the minimal losses of the 800 mA switch, and small inductors and capacitors result in extremely high power density. The 30V internal switch makes these solutions perfect for boosting to voltages of 5V to 28V. This part has a logic-level shutdown pin that can be used to reduce quiescent current and extend battery life. Protection is provided through cycle-by-cycle current limiting and thermal shutdown. Internal compensation simplifies design and reduces component count. APPLICATIONS • • • • • White LED Current Source PDA’s and Palm-Top Computers Digital Cameras Portable Phones, Games and Media Players GPS Devices Typical Application Circuits U1 VIN SHDN R3 51k C1 2.2 PF R1/117k FB SHDN GND R2 13.3k VIN R3 51k C1 2.2 PF U1 C2 4.7 PF SW R1/205k LM27313 SHDN GND CF 220 pF 12V OUT 260 mA (TYP) D1 MBR0530 L1/10 PH 5 VIN GND SW LM27313 GND SHDN D1 MBR0520 L1/10 PH 5 VIN FB R2 13.3k CF 120 pF 20V OUT 130 mA (TYP) C2 4.7 PF 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2013, Texas Instruments Incorporated LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com Connection Diagram Figure 1. 5-Lead SOT-23 Package – Top View See Package Number DBV PIN DESCRIPTIONS Pin Name 1 SW 2 GND 3 FB 4 SHDN 5 VIN Function Drain of the internal FET switch. Analog and power ground. Feedback point that connects to external resistive divider to set VOUT. Shutdown control input. Connect to VIN if this feature is not used. Analog and power input. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −65°C to +150°C Storage Temperature Range Lead Temp. (Soldering, 5 sec.) 300°C Power Dissipation (3) Internally Limited FB Pin Voltage −0.4V to +6V SW Pin Voltage −0.4V to +30V −0.4V to +14.5V Input Supply Voltage Shutdown Input Voltage ESD Rating (1) (2) (3) (4) 2 (4) (Survival) Human Body Model −0.4V to +14.5V ±2 kV Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is to be functional, but does not ensure specific limits. For ensured specifications and conditions see the Electrical Characteristic table. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature, TJ(MAX) = 125°C, the junction-to-ambient thermal resistance for the SOT-23 package, θJ-A = 265°C/W, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature for designs using this device can be calculated using the formula: If power dissipation exceeds the maximum specified above, the internal thermal protection circuitry will protect the device by reducing the output voltage as required to maintain a safe junction temperature. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD22-A114. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 Operating Ratings VIN 2.7V to 14V VSW(MAX) 30V VSHDN 0V to VIN Junction Temperature, TJ (1) -40°C to 125°C θJ-A (SOT-23-5) (1) 265°C/W The maximum power dissipation which can be safely dissipated for any application is a function of the maximum junction temperature, TJ(MAX) = 125°C, the junction-to-ambient thermal resistance for the SOT-23 package, θJ-A = 265°C/W, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature for designs using this device can be calculated using the formula: If power dissipation exceeds the maximum specified above, the internal thermal protection circuitry will protect the device by reducing the output voltage as required to maintain a safe junction temperature. Electrical Characteristics Unless otherwise specified: VIN = 5V, VSHDN = 5V, IL = 0 mA, and TJ = 25°C. Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range (−40°C ≤ TJ ≤ +125°C). Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Symbol Parameter Conditions VIN Input Voltage ISW Switch Current Limit See (1) Switch ON Resistance ISW = 100 mA RDS(ON) VSHDN(TH) ISHDN Shutdown Threshold Shutdown Pin Bias Current Min 2.7 Device ON 0.80 Max Units 14 V 650 mΩ 1.25 500 A 1.5 Device OFF VSHDN = 0 0 VSHDN = 5V 0 2 1.230 1.255 Feedback Pin Reference Voltage VIN = 3V IFB Feedback Pin Bias Current VFB = 1.23V 60 VSHDN = 5V, Switching 2.1 3.0 400 500 0.024 1 Quiescent Current 1.205 VSHDN = 5V, Not Switching VSHDN = 0 ΔVFB/ΔVIN FB Voltage Line Regulation fSW Switching Frequency DMAX Maximum Duty Cycle IL Switch Leakage 2.7V ≤ VIN ≤ 14V Not Switching, VSW = 5V V 0.50 VFB IQ (1) Typical 1.6 80 88 V nA 0.02 1.15 µA mA µA %/V 1.90 MHz 1 µA % Switch current limit is dependent on duty cycle. Limits shown are for duty cycles ≤ 50%. See Figure 15 in Application Information – MAXIMUM SWITCH CURRENT section. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 3 LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified: VIN = 5V, SHDN pin is tied to VIN, TJ = 25°C. Iq VIN (Active) vs Temperature Oscillator Frequency vs Temperature Figure 2. Figure 3. Max. Duty Cycle vs Temperature Feedback Voltage vs Temperature 88.5 MAX DUTY CYCLE (%) 88.4 88.3 88.2 88.1 88.0 87.9 87.8 -40 -25 0 25 50 75 100 125 TEMPERATURE (oC) 4 Figure 4. Figure 5. RDS(ON) vs Temperature Current Limit vs Temperature Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: VIN = 5V, SHDN pin is tied to VIN, TJ = 25°C. RDS(ON) vs VIN Efficiency vs Load Current (VOUT = 12V) Figure 8. Figure 9. Efficiency vs Load Current (VOUT = 15V) Efficiency vs Load Current (VOUT = 20V) 100 100 90 90 VIN = 10V VIN = 5V 70 VIN = 3.3V 60 50 40 30 50 40 30 10 10 0 200 400 800 600 1000 VIN = 3.3V 60 20 0 VIN = 5V 70 20 0 VIN = 10V 80 EFFICIENCY (%) EFFICIENCY (%) 80 0 100 200 300 400 500 600 700 LOAD CURRENT (mA) LOAD CURRENT (mA) Figure 10. Figure 11. Efficiency vs Load Current (VOUT = 25V) 100 90 VIN = 10V EFFICIENCY (%) 80 70 VIN = 5V 60 50 40 30 20 10 0 0 50 100 150 200 250 300 350 400 LOAD CURRENT (mA) Figure 12. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 5 LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com Block Diagram Theory of Operation The LM27313 is a switching converter IC that operates at a fixed frequency of 1.6 MHz using current-mode control for fast transient response over a wide input voltage range and incorporate pulse-by-pulse current limiting protection. Because this is current mode control, a 50 mΩ sense resistor in series with the switch FET is used to provide a voltage (which is proportional to the FET current) to both the input of the pulse width modulation (PWM) comparator and the current limit amplifier. At the beginning of each cycle, the S-R latch turns on the FET. As the current through the FET increases, a voltage (proportional to this current) is summed with the ramp coming from the ramp generator and then fed into the input of the PWM comparator. When this voltage exceeds the voltage on the other input (coming from the Gm amplifier), the latch resets and turns the FET off. Since the signal coming from the Gm amplifier is derived from the feedback (which samples the voltage at the output), the action of the PWM comparator constantly sets the correct peak current through the FET to keep the output voltage in regulation. Q1 and Q2 along with R3 - R6 form a bandgap voltage reference used by the IC to hold the output in regulation. The currents flowing through Q1 and Q2 will be equal, and the feedback loop will adjust the regulated output to maintain this. Because of this, the regulated output is always maintained at a voltage level equal to the voltage at the FB node "multiplied up" by the ratio of the output resistive divider. The current limit comparator feeds directly into the flip-flop, that drives the switch FET. If the FET current reaches the limit threshold, the FET is turned off and the cycle terminated until the next clock pulse. The current limit input terminates the pulse regardless of the status of the output of the PWM comparator. 6 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 APPLICATION INFORMATION SELECTING THE EXTERNAL CAPACITORS The LM27313 requires ceramic capacitors at the input and output to accommodate the peak switching currents the part needs to operate. Electrolytic capacitors have resonant frequencies which are below the switching frequency of the device, and therefore can not provide the currents needed to operate. Electrolytics may be used in parallel with the ceramics for bulk charge storage which will improve transient response. When selecting a ceramic capacitor, only X5R and X7R dielectric types should be used. Other types such as Z5U and Y5F have such severe loss of capacitance due to effects of temperature variation and applied voltage, they may provide as little as 20% of rated capacitance in many typical applications. Always consult capacitor manufacturer’s data curves before selecting a capacitor. High-quality ceramic capacitors can be obtained from Taiyo-Yuden, AVX, and Murata. SELECTING THE OUTPUT CAPACITOR A single ceramic capacitor of value 4.7 µF to 10 µF will provide sufficient output capacitance for most applications. For output voltages below 10V, a 10 µF capacitance is required. If larger amounts of capacitance are desired for improved line support and transient response, tantalum capacitors can be used in parallel with the ceramics. Aluminum electrolytics with ultra low ESR such as Sanyo Oscon can be used, but are usually prohibitively expensive. Typical AI electrolytic capacitors are not suitable for switching frequencies above 500 kHz due to significant ringing and temperature rise due to self-heating from ripple current. An output capacitor with excessive ESR can also reduce phase margin and cause instability. SELECTING THE INPUT CAPACITOR An input capacitor is required to serve as an energy reservoir for the current which must flow into the inductor each time the switch turns ON. This capacitor must have extremely low ESR and ESL, so ceramic must be used. We recommend a nominal value of 2.2 µF, but larger values can be used. Since this capacitor reduces the amount of voltage ripple seen at the input pin, it also reduces the amount of EMI passed back along that line to other circuitry. FEED-FORWARD COMPENSATION Although internally compensated, the feed-forward capacitor Cf is required for stability (see Typical Application Circuits). Adding this capacitor puts a zero in the loop response of the converter. Without it, the regulator loop can oscillate. The recommended frequency for the zero fz should be approximately 8 kHz. Cf can be calculated using the formula: Cf = 1 / (2 x π x R1 x fz) (1) SELECTING DIODES The external diode used in the typical application should be a Schottky diode. If the switch voltage is less than 15V, a 20V diode such as the MBR0520 is recommended. If the switch voltage is between 15V and 25V, a 30V diode such as the MBR0530 is recommended. If the switch voltage exceeds 25V, a 40V diode such as the MBR0540 should be used. The MBR05xx series of diodes are designed to handle a maximum average current of 500mA. For applications with load currents to 800mA, a Microsemi UPS5817 can be used. LAYOUT HINTS High frequency switching regulators require very careful layout of components in order to get stable operation and low noise. All components must be as close as possible to the LM27313 device. It is recommended that a 4layer PCB be used so that internal ground planes are available. As an example, a recommended layout of components is shown: Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 7 LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com Figure 13. Recommended PCB Component Layout Some additional guidelines to be observed: 1. Keep the path between L1, D1, and C2 extremely short. Parasitic trace inductance in series with D1 and C2 will increase noise and ringing. 2. The feedback components R1, R2 and CF must be kept close to the FB pin of the LM27313 to prevent noise injection on the high impedance FB pin. 3. If internal ground planes are available (recommended) use vias to connect directly to the LM27313 ground at device pin 2, as well as the negative sides of capacitors C1 and C2. SETTING THE OUTPUT VOLTAGE The output voltage is set using the external resistors R1 and R2 (see Typical Application Circuits). A value of 13.3 kΩ is recommended for R2 to establish a divider current of approximately 92 µA. R1 is calculated using the formula: R1 = R2 x ( (VOUT / VFB) − 1 ) (2) DUTY CYCLE The maximum duty cycle of the switching regulator determines the maximum boost ratio of output-to-input voltage that the converter can attain in continuous mode of operation. The duty cycle for a given boost application is defined as: VOUT + VDIODE - VIN Duty Cycle = VOUT + VDIODE - VSW (3) This applies for continuous mode operation. The equation shown for calculating duty cycle incorporates terms for the FET switch voltage and diode forward voltage. The actual duty cycle measured in operation will also be affected slightly by other power losses in the circuit such as wire losses in the inductor, switching losses, and capacitor ripple current losses from self-heating. Therefore, the actual (effective) duty cycle measured may be slightly higher than calculated to compensate for these power losses. A good approximation for effective duty cycle is : DC (eff) = (1 - Efficiency x (VIN / VOUT)) (4) Where the efficiency can be approximated from the curves provided. 8 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 INDUCTANCE VALUE The first question we are usually asked is: “How small can I make the inductor?” (because they are the largest sized component and usually the most costly). The answer is not simple and involves trade-offs in performance. More inductance means less inductor ripple current and less output voltage ripple (for a given size of output capacitor). More inductance also means more load power can be delivered because the energy stored during each switching cycle is: E = L/2 x (lp)2 where • “lp” is the peak inductor current. (5) An important point to observe is that the LM27313 will limit its switch current based on peak current. This means that since lp(max) is fixed, increasing L will increase the maximum amount of power available to the load. Conversely, using too little inductance may limit the amount of load current which can be drawn from the output. Best performance is usually obtained when the converter is operated in “continuous” mode at the load current range of interest, typically giving better load regulation and less output ripple. Continuous operation is defined as not allowing the inductor current to drop to zero during the cycle. It should be noted that all boost converters shift over to discontinuous operation as the output load is reduced far enough, but a larger inductor stays “continuous” over a wider load current range. To better understand these tradeoffs, a typical application circuit (5V to 12V boost with a 10 µH inductor) will be analyzed. Since the LM27313 typical switching frequency is 1.6 MHz, the typical period is equal to 1/fSW(TYP), or approximately 0.625 µs. We will assume: VIN = 5V, VOUT = 12V, VDIODE = 0.5V, VSW = 0.5V. The duty cycle is: Duty Cycle = ((12V + 0.5V - 5V) / (12V + 0.5V - 0.5V)) = 62.5% (6) The typical ON time of the switch is: (62.5% x 0.625 µs) = 0.390 µs (7) It should be noted that when the switch is ON, the voltage across the inductor is approximately 4.5V. Using the equation: V = L (di/dt) (8) We can then calculate the di/dt rate of the inductor which is found to be 0.45 A/µs during the ON time. Using these facts, we can then show what the inductor current will look like during operation: Figure 14. 10 µH Inductor Current, 5V–12V Boost During the 0.390 µs ON time, the inductor current ramps up 0.176A and ramps down an equal amount during the OFF time. This is defined as the inductor “ripple current”. It can also be seen that if the load current drops to about 33 mA, the inductor current will begin touching the zero axis which means it will be in discontinuous mode. A similar analysis can be performed on any boost converter, to make sure the ripple current is reasonable and continuous operation will be maintained at the typical load current values. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 9 LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com MAXIMUM SWITCH CURRENT The maximum FET switch current available before the current limiter cuts in is dependent on duty cycle of the application. This is illustrated in Figure 15 below which shows typical values of switch current as a function of effective (actual) duty cycle: SWITCH CURRENT LIMIT (mA) 1600 1400 1200 1000 VIN = 5V VIN = 3.3V 800 600 VIN = 2.7V 400 200 0 0 20 40 60 80 100 DUTY CYCLE (%) = [1 - EFF*(VIN/VOUT))] Figure 15. Switch Current Limit vs Duty Cycle CALCULATING LOAD CURRENT As shown in the figure which depicts inductor current, the load current is related to the average inductor current by the relation: ILOAD = IIND(AVG) x (1 - DC) where • "DC" is the duty cycle of the application. (9) The switch current can be found by: ISW = IIND(AVG) + ½ (IRIPPLE) (10) Inductor ripple current is dependent on inductance, duty cycle, input voltage and frequency: IRIPPLE = DC x (VIN - VSW) / (fSW x L) (11) Combining all terms, we can develop an expression which allows the maximum available load current to be calculated: ILOAD(max) = (1 - DC) x (ISW(max) - DC (VIN - VSW)) 2fL (12) The equation shown to calculate maximum load current takes into account the losses in the inductor or turn-OFF switching losses of the FET and diode. For actual load current in typical applications, we took bench data for various input and output voltages and displayed the maximum load current available for a typical device in graph form: 10 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 Figure 16. Max. Load Current vs VIN DESIGN PARAMETERS VSW AND ISW The value of the FET "ON" voltage (referred to as VSW in the equations) is dependent on load current. A good approximation can be obtained by multiplying the "ON Resistance" of the FET times the average inductor current. FET on resistance increases at VIN values below 5V, since the internal N-FET has less gate voltage in this input voltage range (see Typical Performance Characteristics curves). Above VIN = 5V, the FET gate voltage is internally clamped to 5V. The maximum peak switch current the device can deliver is dependent on duty cycle. The minimum switch current value (ISW) is ensured to be at least 800 mA at duty cycles below 50%. For higher duty cycles, see Typical Performance Characteristics curves. THERMAL CONSIDERATIONS At higher duty cycles, the increased ON time of the FET means the maximum output current will be determined by power dissipation within the LM27313 FET switch. The switch power dissipation from ON-state conduction is calculated by: PSW = DC x IIND(AVG)2 x RDS(ON) (13) There will be some switching losses as well, so some derating needs to be applied when calculating IC power dissipation. MINIMUM INDUCTANCE In some applications where the maximum load current is relatively small, it may be advantageous to use the smallest possible inductance value for cost and size savings. The converter will operate in discontinuous mode in such a case. The minimum inductance should be selected such that the inductor (switch) current peak on each cycle does not reach the 800 mA current limit maximum. To understand how to do this, an example will be presented. In this example, the LM27313 nominal switching frequency is 1.6 MHz, and the minimum switching frequency is 1.15 MHz. This means the maximum cycle period is the reciprocal of the minimum frequency: TON(max) = 1/1.15M = 0.870 µs (14) We will assume: VIN = 5V, VOUT = 12V, VSW = 0.2V, and VDIODE = 0.3V. The duty cycle is: Duty Cycle = ((12V + 0.3V - 5V) / (12V + 0.3V - 0.2V)) = 60.3% (15) Therefore, the maximum switch ON time is: (60.3% x 0.870 µs) = 0.524 µs (16) An inductor should be selected with enough inductance to prevent the switch current from reaching 800 mA in the 0.524 µs ON time interval (see Figure 17): Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 11 LM27313 SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 www.ti.com Figure 17. Discontinuous Design, 5V–12V Boost The voltage across the inductor during ON time is 4.8V. Minimum inductance value is found by: L = V x (dt/dl) L = 4.8V x (0.524 µs / 0.8 mA) = 3.144 µH (17) (18) In this case, a 3.3 µH inductor could be used, assuming it provided at least that much inductance up to the 800 mA current value. This same analysis can be used to find the minimum inductance for any boost application. INDUCTOR SUPPLIERS Some of the recommended suppliers of inductors for this product include, but are not limited to, Sumida, Coilcraft, Panasonic, TDK and Murata. When selecting an inductor, make certain that the continuous current rating is high enough to avoid saturation at peak currents. A suitable core type must be used to minimize core (switching) losses, and wire power losses must be considered when selecting the current rating. SHUTDOWN PIN OPERATION The device is turned off by pulling the shutdown pin low. If this function is not going to be used, the pin should be tied directly to VIN. If the SHDN function will be needed, a pull-up resistor must be used to VIN (50kΩ to 100 kΩ is recommended), or the pin must be actively driven high and low. The SHDN pin must not be left unterminated. 12 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 LM27313 www.ti.com SNVS487D – DECEMBER 2006 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 12 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LM27313 13 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) LM27313XMF/NOPB Package Type Package Pins Package Drawing Qty ACTIVE SOT-23 DBV 5 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SRPB (4/5) LM27313XMFX NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 125 SRPB LM27313XMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SRPB LM27313XQMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SD3B LM27313XQMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SD3B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM27313, LM27313-Q1 : • Catalog: LM27313 • Automotive: LM27313-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM27313XMFX SOT-23 DBV 5 3000 178.0 8.4 LM27313XQMF/NOPB SOT-23 DBV 5 1000 178.0 LM27313XQMFX/NOPB SOT-23 DBV 5 3000 178.0 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM27313XMFX SOT-23 DBV 5 3000 210.0 185.0 35.0 LM27313XQMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM27313XQMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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