AUSTIN AS5SS256K18DQ

SSRAM
Austin Semiconductor, Inc.
256K x 18 SSRAM
PIN ASSIGNMENT
(Top View)
Synchronous Burst SRAM,
Flow-Through
SA
SA
CE\
CE2
NC
MARKING
-8*
-9
-10
SA
NC
NC
VDDQ
V SS
NC
DQPa
DQa
DQa
V SS
VDDQ
DQa
DQa
V SS
NC
VDD
ZZ
DQa
DQa
VDDQ
V SS
DQa
DQa
NC
NC
V SS
VDDQ
NC
NC
NC
**pins 42,43 reserved for future address expansion for 8Mb, 16Mb densities.
DQ
No. 1001
CE2), burst control inputs (ADSC\, ADSP\, ADV\), byte write enables
(BWx\) and global write (GW\).
Asynchronous inputs include the output enable (OE\), clock (CLK)
and snooze enable (ZZ). There is also a burst mode input (MODE) that
selects between interleaved and linear burst modes. The data-out (Q),
enabled by OE\, is also asynchronous. WRITE cycles can be from one
to two bytes wide, as controlled by the write control inputs.
Burst operation can be initiated with either address status processor
(ADSP\) or address status controller (ADSC\) inputs. Subsequent burst
addresses can be internally generated as controlled by the burst advance input (ADV\).
Address and write control are registered on-chip to simplify WRITE
cycles. This allows self-timed WRITE cycles. Individual byte enables
allow individual bytes to be written. During WRITE cycles on this x18
device BWa\ controls DQa pins and DQPa; BWb\ controls DQb pins
and DQPb. GW\ LOW causes all bytes to be written. Parity bits are
available on this device.
ASI’s 4Mb Synchronous Burst SRAMs operate from a +3.3V VDD
power supply, and all inputs and outputs are TTL-compatible. The device is ideally suited for 486, Pentium®, and PowerPC systems and
those systems that benefit from a wide synchronous data bus.
IT
XT
*available as IT only.
For more products and information
please visit our web site at
www.austinsemiconductor.com
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. Synchronous Burst SRAM family
employs high-speed, low power CMOS designs that are fabricated using an advanced CMOS process.
ASI’s 4Mb Synchronous Burst SRAMs integrate a 256K x 18, SRAM
core with advanced synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers controlled by a
positive-edge-triggered single clock input (CLK). The synchronous
inputs include all addresses, all data inputs, active LOW chip enable
(CE\), two additional chip enables for easy depth expansion (CE2\,
AS5SS256K18
Rev. 2.1 06/05
1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
MODE
SA
SA
SA
SA
• Timing
7.5ns/8ns/113 MHz
8.5ns/10ns/100 MHz
10ns/15ns/66 MHz
• Packages
100-pin TQFP
• Operating Temperature Ranges:
- Military -55oC to +125oC
- Industrial -45oC to +85oC
NC
NC
NC
VDDQ
V SS
NC
NC
DQb
DQb
V SS
VDDQ
DQb
DQb
V SS
VDD
NC
V SS
DQb
DQb
VDDQ
V SS
DQb
DQb
DQPb
NC
V SS
VDDQ
NC
NC
NC
SA1
SA0
DNU
DNU
VSS
VDD
NF**
NF**
SA
SA
SA
SA
SA
SA
SA
• Fast access times: 8, 10, and 15ns
• Fast clock speed: 113, 100, and 66 MHz
• Fast clock and OE\ access times
• Single +3.3V +0.3V/-0.165V power supply (VDD)
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRTIE control and GLOBAL WRITE
• Three chip enables for simple depth expansion and address
pipelining
• Clock-controlled and registered addresses, data I/Os and
control signals
• Interally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down
• Low capacitive bus loading
• Operating Temperature Ranges:
- Military -55oC to +125oC
- Industrial -40oC to +85oC
NC
bwB\
BWa\
CE2\
VDD
V SS
CLK
GW\
BWE\
OE\
ADSC\
ADSP\
ADV\
SA
SA
100-pin TQFP
FEATURES
OPTIONS
AS5SS256K18
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
SSRAM
Austin Semiconductor, Inc.
AS5SS256K18
PIN DESCRIPTIONS
PIN NUMBERS
SYM
TYPE
DESCRIPTION
37, 36, 32-35, 44-50,
80-82, 99, 100
93, 94
SA0, SA1,
SA
BWa\
BWb\
Input
87
BWE\
Input
88
GW\
Input
89
CLK
Input
98
CE\
Input
92
CE2\
Input
Synchronous Address Inputs: These inputs are registered and must meet the setup and
hold times around the rising edge of CLK.
Synchronous Byte Write Enables: These active LOW inputs allow individual bytes to be
written and must meet the setup and hold times around the rising edge of CLK. A byte
write enables is LOW for a WRITE cycle and HIGH for a READ cycle. BWa\ controls DQa
pins and DQPa; BWb\ controls DQb pins and DQPb.
Byte Write Enable: This active LOW input permits BYTE WRITE operations and must meet
the setup and hold times around the rising edge of CLK.
Global Write: This active LOW input allows a full 18-bit WRITE to occur independent of the
BWE\ and BWx\ lines and must meet the setup and hold times around the rising edge of
CLK.
Clock: This signal registers the addresses, data, chip enables, byte write enables and burst
control inputs on its rising edge. All synchronous inputs must meet setup and hold times
around the clock’s rising edge.
Synchronous Chip Enable: This active LOW input is used to enable the device and
Conditions the internal use of ADSP\. CE\ is sampled only when a new external address is
loaded.
Synchronous Chip Enable: This active LOW input is used to enable the device and is
sampled only when a new external address is loaded.
97
CE2
Input
Synchronous Chip Enable: This active HIGH input is used to enable the device and is
sampled only when a new external address is loaded.
86
OE\
Input
Output Enable: This active LOW, asynchronous input enables the data I/O output drivers.
83
ADV\
Input
84
ADSP\
Input
85
ADSC\
Input
31
MODE
Input
64
ZZ
Input
(a) 58, 59, 62, 63, 68,
69, 72, 73
(b) 8, 9, 12,13, 18, 19,
22, 23
74, 24
DQa
DQb
Input/
Output
Synchronous Address Advance: This active LOW input is used to advance the internal
burst counter, controlling burst access after the external address is loaded. A HIGH on this
pin effectively causes wait states to be generated (no address advance). To ensure use of
correct address during WRITE cycle, ADV\ must be HIGH at the rising edge of the first
clock after an ADSP\ cycle is initiated.
Synchronous Address Status Processor: This active LOW input interrupts any ongoing
burst, causing a new external address to be registered. A READ is performed using the
new address, independent of the byte write enables and ADSC\, but dependent upon CE\,
CE2, and CE2\. ADSP\ is ignored if CE\ is HIGH. Power-down state is entered if CE2 if
LOW or CE2\ is HIGH.
Synchronous Address Status Controller: This active LOW input interrupts any ongoing
burst, causing a new external address to be registered. A READ or WRITE is performed
using the new address if CE\ is LOW. ADSC\ is also used to place the chip into powerdown state when CE\ is HIGH.
Mode: This input selects the burst sequence. A LOW on this pin selects LINEAR BURST. A
NC or HIGH on this pin selects INTERLEAVED BURST. Do not alter input state while
device is operating.
Snooze Enable: This active HIGH, asynchronous input causes the device to enter a lowpower standby mode in which all data in the memory array is retained. When ZZ is active,
all other inputs are ignored.
SRAM Data I/Os: Byte "a" is DQa pins; Byte "b" is DQb pins. Input data must meet setup
and hold times around the rising edge of CLK.
NC/DQPa
NC/DQPb
NC/ I/O
No Connect/Parity Data I/Os: Byte "a" is DQPa pins; Byte "b" is DQPb pins.
15, 41,65, 91
VDD
Supply
Power Supply: See DC Electrical Characteristics and Operating Conditions for range.
4, 11, 20, 27, 54, 61,
70, 77
VDDQ
Supply
Isolated Output Buffer Supply: See DC Electrical Characterics and Operating Conditions for
range.
5, 10, 14, 17, 21, 26,
40, 55, 60, 67 71, 76,
90
38, 39
VSS
Supply
Ground: GND
DNU
---
1-3, 6, 7, 16,25, 28-30,
51-53, 56,57, 66, 75,
78, 79, 95, 96
NC
-----
42, 43
NF
AS5SS256K18
Rev. 2.1 06/05
Input
Do Not Use: These signals may either be unconnected or wired to GND to improve
package heat dissipation.
No Connect: These signals are not internally connected and may be connected to ground to
improve package heat dissipation.
No Function: These pins are internally connected to the die and will have the capacitance of
input pins. It is allowable to leave these pins unconnected or driven by signals.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
2
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
INTERLEAVED BURST ADDRESS TABLE (MODE=NC OR HIGH)
FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)
X…X00
X…X01
X…X10
X…X11
X…X01
X…X00
X…X11
X…X10
X…X10
X…X11
X…X00
X…X01
X…X11
X…X10
X…X01
X…X00
LINEAR BURST ADDRESS TABLE (MODE=LOW)
FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)
X…X00
X…X01
X…X10
X…X11
X…X01
X…X10
X…X11
X…X00
X…X10
X…X11
X…X00
X…X01
X…X11
X…X00
X…X01
X…X10
PARTIAL TRUTH TABLE FOR WRITE COMMANDS
FUNCTION
READ
READ
WRITE Byte "a"
WRITE Byte "b"
WRITE All Bytes
WRITE All Bytes
GW\
H
H
H
H
H
L
BWE\
H
L
L
L
L
X
BWa\
X
H
L
H
L
X
BWb\
X
H
H
L
L
X
NOTE: Using BWE\ and BWa\ through BWb\, any one or more bytes may be
written.
FUNCTIONAL BLOCK DIAGRAM
18
SA0, SA1, SA
MODE
ADV\
CLK
18
ADDRESS
REGISTER
16
2
Q1
BINARY
COUNTER AND
LOGIC
Q0
CLR
18
SA0-SA1
SA1'
SA0'
ADSC\
ADSP\
BWb\
9
BYTE "b"
WRITE REGISTER
9
BWa\
BWE\
GW\
CE\
CE2
CE2\
OE\
BYTE "a"
WRITE REGISTER
BYTE "b"
WRITE DRIVER
BYTE "a"
WRITE DRIVER
9
9
256K x 9 x 2
MEMORY
ARRAY
18
SENSE
AMPS
18
OUTPUT
BUFFERS
18
DQs
DQPa
DQPb
INPUT
REGISTERS
18
ENABLE
REGISTER
2
NOTE: The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions and timing
diagrams for detailed information.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
3
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
TRUTH TABLE
OPERATION
DESELECT Cycle, Power-Down
DESELECT Cycle, Power-Down
DESELECT Cycle, Power-Down
DESELECT Cycle, Power-Down
DESELECT Cycle, Power-Down
SNOOZE MODE, Power-Down
READ Cycle, Begin Burst
READ Cycle, Begin Burst
WRITE Cycle, Begin Burst
READ Cycle, Begin Burst
READ Cycle, Begin Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
READ Cycle, Continue Burst
WRITE Cycle, Continue Burst
WRITE Cycle, Continue Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
READ Cycle, Suspend Burst
WRITE Cycle, Suspend Burst
WRITE Cycle, Suspend Burst
ADDRESS
USED
NONE
NONE
NONE
NONE
NONE
NONE
EXTERNAL
EXTERNAL
EXTERNAL
EXTERNAL
EXTERNAL
NEXT
NEXT
NEXT
NEXT
NEXT
NEXT
CURRENT
CURRENT
CURRENT
CURRENT
CURRENT
CURRENT
CE\ CE2\ CE2 ZZ ADSP\ ADSC\ ADV\ WRITE\ OE\ CLK
H
L
L
L
L
X
L
L
L
L
L
X
X
H
H
X
H
X
X
H
H
X
H
X
X
H
X
H
X
L
L
L
L
L
X
X
X
X
X
X
X
X
X
X
X
X
X
L
X
L
X
X
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
X
L
L
H
H
X
L
L
H
H
H
H
H
X
X
H
X
H
H
X
X
H
X
L
X
X
L
L
X
X
X
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
L
L
L
L
L
L
H
H
H
H
H
H
X
X
X
X
X
X
X
X
L
H
H
H
H
H
H
L
L
H
H
H
H
L
L
X
X
X
X
X
X
L
H
X
L
H
L
H
L
H
X
X
L
H
L
H
X
X
L-H
L-H
L-H
L-H
L-H
X
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
DQ
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
Q
High-Z
D
Q
High-Z
Q
High-Z
Q
High-Z
D
D
Q
High-Z
Q
High-Z
D
D
NOTES: 1. X means “Don’t Care.” \ means active LOW. H means logic HIGH. L means logic LOW.
2. For WRITE\, L means any one or more byte write enable signals (BWa\, BWb\) and BWE\ are LOW or GW\ is LOW. WRITE\ = H for all BWx\,
BWE\, GW\ HIGH.
3. BWa\ enables WRITEs to DQas and DQPa. BWb\ enables WRITEs to DQbs and DQPb.
4. All inputs except OE\ and ZZ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK.
5. Wait states are inserted by suspending burst.
6. For a WRITE operation following a READ operation, OE\ must be HIGH before the input data setup time and held HIGH throughout the input
data hold time.
7. This device contains circuitry that will ensure the outputs will be in High-Z during power-up.
8. ADSP\ LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more byte write enable signals
and BWE\ LOW or GW\ LOW for the subsequent L-H edge of CLK. Refer to WRITE timing diagram for clarification.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
4
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
ABSOLUTE MAXIMUM RATINGS*
*Stresses greater than those listed under "Absolute Maximum Ratings"
may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
**Maximum junction temperature depends upon package type, cycle
time, loading, ambient temperature and airflow.
Voltage on VDD Supply Relative to VSS............-0.5V to +4.6V
Voltage on VDDQ Supply Relative to VSS.........-0.5V to +4.6V
Storage Temperature (plastic) .....................-55°C to +125°C
Max Junction Temperature**.......................................+150°C
Short Circuit Output Current..........…...........................100mA
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(-55oC < TA < +125oC and -40oC<TA<+85oC; VDD = +3.3V +0.3V/-0.165V unless otherwise noted)
DESCRIPTION
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
CONDITIONS
SYMBOL
VIH
VIL
MIN
2.0
-0.3
MAX
VDD +0.3
0.8
UNITS
V
V
NOTES
1, 2
1, 2
Input Leakage Current
(0V<VIN<VDD)
ILI
-2
2
µΑ
3
Output(s) disabled;
0V<VIN<VDD
ILO
-2
2
µΑ
VOH
VOL
VDD
VDDQ
2.4
-3.135
3.135
-0.5
3.6
3.6
V
V
V
V
CI
MAX
4
UNITS
pF
NOTES
6
TA = 25°C; f = 1MHz;
CO
5
pF
6
VDD = 3.3V
CA
3.5
pF
6
CCK
3.5
pF
6
CONDITIONS
SYM
TYP
UNITS
NOTES
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51
θJA
46
°C/W
6
θJC
2.8
°C/W
6
Output Leakage Current
IOH = -4.0mA
IOL = 8.0 mA
Output High Voltage
Output Low Voltage
Supply Voltage
Isolated Output Buffer Supply
1, 4
1, 4
1
1, 5
CAPACITANCE
DESCRIPTION
Control Input Capacitance
CONDITIONS
Input/Output Capacitance (DQ)
Address Capacitance
SYM
Clock Capacitance
THERMAL RESISTANCE
DESCRIPTION
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Top of Case)
NOTES:
1. All voltages referenced to VSS (GND)
2. Overshoot: VIH < +4.6V for t < tKC/2 for I < 20mA
Undershoot: VIL > -0.7V for t < tKC/2 for I < 20mA
Power-up: VIH < +3.6V and VDD<3.135V for t < 200ms
3. MODE pin has an internal pull-up, and input leakage = ±10µA.
4. The load used for VOH, VOL testing is shown in Figure 2 for 3.3V I/O. AC load current is higher then the stated DC values.
5. VDDQ should never exceed VDD. VDD and VDDQ can be connected together, for 3.3V I/O operation only.
6. This parameter is sampled.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
5
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
IDD ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(-55oC < TA < +125oC and -40oC<TA<+85oC; VDD = +3.3V +0.3V/-0.165V unless otherwise noted)
PARAMETER
CONDITIONS
Power Supply Current:
Operating
Device selected; all inputs < VIL or > VIH;
Cycle time > tKC (MIN); VDD = MAX; Outputs Open
Power Supply Current:
Idle
ADV\, GW\, BWx\ > VIH; All inputs < VSS +0.2 or
SYM
-8
MAX
-9
-10
IDD
375
325
250
mA
2, 3, 4
IDD1
100
85
65
mA
2, 3, 4
ISB2
10
10
10
mA
3, 4
ISB3
25
25
25
mA
3, 4
ISB4
100
85
65
mA
3, 4
UNITS NOTES
Device selected; VDD = MAX; ADSC\, ADSP\,
t
> VDDQ -0.2; Cycle time > KC (MIN);
Outputs Open
Device deselected; VDD = MAX;
CMOS Standby
TTL Standby
All inputs < Vss +0.2 or > VDDQ -0.2;
All inputs static; CLK frequency =0
Device deselected; VDD = MAX;
All inputs < VIL or > VIH;
All inputs static; CLK frequency = 0
Device deselected; VDD = MAX;
Clock Running
ASDP\, ADV\, GW\, BWx\ > VIH;
All inputs < VSS +0.2 or > VDDQ -0.2;
t
Cycle time > KC (MIN)
NOTES:
1. VDDQ = +3.3V +0.3V/-0.165V for 3.3V I/O configuration.
2. IDD is specified with no output current and increases with faster cycle times. IDDQ increases with faster cycle
times and greater output loading.
3. “Device deselected” means device is in power-down mode as defined in the truth table. “Device selected” means
device is active (not in power-down mode).
4. Typical values are measured at 3.3V, 25°C and 15ns cycle time.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
6
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Note 1) -55oC < TA < +125oC and -40oC<TA<+85oC; VDD = +3.3V +0.3V/-0.165V unless otherwise noted)
DESCRIPTION
SYMBOL
-8
MIN
-9
MAX
MIN
-10
MAX
MIN
MAX
UNITS
NOTES
CLOCK
Clock cycle time
tKC
8.8
10
15
ns
Clock frequency
tKF
Clock HIGH time
tKH
2.5
3.0
4.0
ns
2
Clock LOW time
tKL
2.5
3.0
4.0
ns
2
113
100
66
MHz
OUTPUT TIMES
Clock to output valid
tKQ
Clock to output invalid
tKQX
1.5
3.0
3.0
ns
3
Clock to output in Low-Z
tKQLZ
1.5
3.0
3.0
ns
3, 4, 5
Clock to output in High-Z
tKQHZ
4.2
5.0
5.0
ns
3, 4, 5
OE\ to output valid
tOEQ
4.2
5.0
5.0
ns
6
ns
3, 4, 5
ns
3, 4, 5
OE\ to output in Low-Z
tOELZ
OE\ to output in High-Z
SETUP TIMES
tOEHZ
7.5
0
8.5
0
4.2
10
0
5.0
5.0
ns
tAS
1.5
1.8
2.0
ns
7, 8
Address status (ADSC\, ADSP\)
tADSS
1.5
1.8
2.0
ns
7, 8
Address advance (ADV\)
tAAS
1.5
1.8
2.0
ns
7, 8
Byte write enables (BWa\-BWb\, GW\, BWE\)
tWS
1.5
1.8
2.0
ns
7, 8
Data-in
tDS
1.5
1.8
2.0
ns
7, 8
Chip enable (CE\)
HOLD TIMES
tCES
1.5
1.8
2.0
ns
7, 8
Address
tAH
0.5
0.5
0.5
ns
7, 8
Address status (ADSC\, ADSP\)
tADSH
0.5
0.5
0.5
ns
7, 8
Address advance (ADV\)
tAAH
0.5
0.5
0.5
ns
7, 8
Byte write enables (BWa\-BWb\, GW\, BWE\)
tWH
0.5
0.5
0.5
ns
7, 8
Data-in
tDH
0.5
0.5
0.5
ns
7, 8
Chip enable (CE\)
tCEH
0.5
0.5
0.5
ns
7, 8
Address
NOTES:
1. Test conditions as specified with the output loading shown in Figure 1 for 3.3V I/O (VDDQ = +3.3V +0.3V/-0.165V) unless otherwise
noted.
2. Measured as HIGH above VIH and LOW below VIL.
3. This parameter is measured with the output loading shown in Figure 2 for 3.3V I/O.
4. This parameter is sampled.
5. Transition is measured ±500mV from steady state voltage.
6. OE\ is a “Don’t Care” when a byte write enable is sampled LOW.
7. A READ cycle is defined by byte write enables all HIGH or ADSP\ LOW for the required setup and hold times. A WRITE cycle is
defined by at least one byte write enable LOW and ADSP\ HIGH for the required setup and hold times.
8. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK when either ADSP\ or
ADSC\ is LOW and chip enabled. All other synchronous inputs must meet the setup and hold times with stable logic levels for all rising edges
of clock (CLK) when the chip is enabled. Chip enable must be valid at each rising edge of CLK when either ADSP\ or ADSC\ is LOW to
remain enabled.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
AC TEST CONDITIONS
OUTPUT LOADS
VIH = (VDD/2.2) + 1.5V
Input pulse levels
VIL = (VDD/2.2) - 1.5V
1ns
VDD/2.2
Input rise and fall times
Input timing reference levels
Output reference levels
Output load
DQ
Z 0=50Ω
50Ω
VDDQ/2.2
See Figures 1 and 2
Vt = 1.5V
Fig. 1 OUTPUT LOAD EQUIVALENT
LOAD DERATING CURVES
ASI’s 256K x 18 Synchronous Burst SRAM timing is dependent upon
the capacitive loading on the outputs.
3.3v
SNOOZE MODE
317Ω
SNOOZE MODE is a low-current, “power-down” mode in which the
device is deselected and current is reduced to ISB2Z. The duration of
SNOOZE MODE is dictated by the length of time ZZ is in a HIGH
state. After the device enters SNOOZE MODE, all inputs except ZZ
become gated inputs and are ignored.
ZZ is an asynchronous, active HIGH input that causes the device to
enter SNOOZE MODE. When ZZ becomes a logic HIGH, ISB2Z is
DQ
5 pF
351Ω
guaranteed after the setup time tZZ is met. Any READ or WRITE
operation pending when the device enters SNOOZE MODE is not
quaranteed to complete successfully. Therefore, SNOOZE MODE
must not be initiated until valid pending operations are completed.
Fig. 2 OUTPUT LOAD EQUIVALENT
SNOOZE MODE ELECTRICAL CHARACTERISTICS
DESCRIPTION
Current during SNOOZE MODE
CONDITIONS
SYM
ZZ > VIH
MIN
UNITS
mA
NOTES
ISB2Z
MAX
10
ZZ active to input ignored
tZZ
tKC
ns
1
ZZ inactive to input sampled
tRZZ
ns
1
ZZ active to snooze current
tZZI
ns
1
ZZ inactive to exit snooze current
tRZZI
ns
1
tKC
tKC
0
NOTE: 1. This parameter is sampled.
SNOOZE MODE WAVEFORM
CLK
t RZZ
t ZZ
ZZ
ISUPPLY
ALL INPUTS*
* Except ZZ
AS5SS256K18
Rev. 2.1 06/05
t ZZI
ISB2
t
RZZI
12345
11234567890
12345
12
12345
11234567890
12345
12
12345
1234567890
1
12345
12
12345
11234567890
12345
12
1234
1234
1234Don’t Care
1234
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
8
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
READ TIMING
t KC
tKL
○
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Burst wraps around
to its initial state.
○
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○
○
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○
○
BURST READ
tKQHZ
123
12
123
12
Q(A2) 123
123 Q(A2+1) 12
12 Q(A2+2)
○
12
12
12
12 Q(A2+3) 12
12
12
○
○
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Q(A2+2)
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○
123456789012
123456
1
123456789012
123456
1
123456789012
1
123456789012
1123456
123456
123456789012
1
123456789012
1123456
123456
123456789012
123456
○
○
○
○
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
○
123456
123456
123456
123456
123456
123456
123456
ADV\ suspends burst.
○
○
○
○
○
○
(NOTE 1)
○
○
123456
123456
123456
123456
123456
123456
123456
○
○
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123456
123456
123456
123456
123456
123456
123456
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○
○
○
tOELZ tKQ
t
KQX
123
1234
12
12
123
1234
12
123
123 Q(A2)1234
1234 Q(A2+1)
○
○
○
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123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
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○
Q(A1)
SINGLE READ
○
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12345
12345
12345
12345
12345
12345
12345
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○
123456
123456
123456
123456
123456
123456
○
○
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○
tKQ
tOEHZ
○
○
○
○
○
○
○
○
High-Z
○
Q
1234
1234
1234
1234
○
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123456
123456
123456
123456
123456
123456
123456
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○
tOEQ
○
○
tKQLZ
Deselect Cycle
○
○
○
○
○
123456
123456
123456
123456
123456
123456
123456
○
tAAS tAAH
123456
1234567890123456
1234567890123456
1234567890123456
1234567890123456
1234567890123456
1234567890123456
○
○
○
○
OE\
123456
123456
123456
123456
123456
123456
123456
123456789012345678901234567890121234567890123456789012345678901212345678901234567
123456789012345678901234567890121234567890123456789012345678901212345678901234567
123456789012345678901234567890121234567890123456789012345678901212345678901234567
123456789012345678901234567890121234567890123456789012345678901212345678901234567
123456789012345678901234567890121234567890123456789012345678901212345678901234567
123456789012345678901234567890121234567890123456789012345678901212345678901234567
○
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123456
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
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12345
12345
12345
12345
12345
12345
12345
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123456
123456
123456
123456
123456
123456
123456
12345678
12
12345678901234567890123456789012123456789012345678901234567890121234567890123456789
12345678
12
12345678901234567890123456789012123456789012345678901234567890121234567890123456789
12345678
12
12345678
1212345678901234567890123456789012123456789012345678901234567890121234567890123456789
12345678901234567890123456789012123456789012345678901234567890121234567890123456789
12345678
12
12345678901234567890123456789012123456789012345678901234567890121234567890123456789
○
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123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
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12345
12345
12345
12345
12345
12345
12345
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123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
tADSH
(Note 4)
12345678
12
12345678901234567890123456789012123456789012345678901234567890121234567890123456789
○
○
1234567890123456789012
123456
12
1234567890123456789012
123456
12
1234567890123456789012
123456
12
1234567890123456789012
123456
12
123456
12
1234567890123456789012
ADV\ 1234567890123456789012
123456
12
1234567890123456789012
123456
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123456
123456
123456
123456
123456
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123456
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123456
123456
123456
123456
123456
123456
123456
t
CES CEH t WS t WH
1234567
1234567890123
1
12345
123456789
12345
1234567
1234567890123
12345
123456789
12345
123456789
12345
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
○
123456
123456
123456
123456
123456
123456
123456
○
○
○
1234567890123456789012
123456
12
1234567890123456789012
123456
12
11
1234567890123
CE\ 1234567
1234567
1234567890123
11
1234567
1234567890123
1234567
1234567890123
(Note 2) 1234567
1
1234567890123
1234567
1234567
1234567
1234567
1234567
1234567
1234567
A2
○
○
○
○
○
tAH
123456
12
BWE\, GW\, 1234567890123456789012
1234567890123456789012
123456
12
1234567890123456789012
123456
12
123456
12
BWa\-BWb\ 1234567890123456789012
t
123456
123456
123456
123456
123456
123456
○
○
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t ADSS
123456
123456
123456
123456
123456
123456
123456
123456
○
○
A1
○
123456
123456
123456
123456
123456
123456
123456
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
○
t AS
○
○
12345678
12345678
12
12345678
12345678
12
12345678
12345678
12
12345678
12
ADDRESS 12345678
12345678
12345678
12
12345678
12345678
12
○
○
○
○
○
○
○
○
tADSH
1234
123456789
12345
1234
1234
123456789
12345
1234
123456789
1234
12345
1234
123456789
1234
12345
1234
123456789
1234
12345
1234
1234
123456789
12345
1234
1234
12345
○
12345
12345
12345
ADSC\ 12345
12345
12345
tKH
○
○
○
123456
123456
123456
123456
123456
123456
○
1234567
1234567
1234567
1234567
1234567
○
○
○
t ADSS
1234567
○
12345
12345
12345
ADSP\ 12345
12345
12345
○
○
○
○
○
○
○
CLK
READ TIMING PARAMETERS
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
8.8
10
15
ns
tKC
113
tKF
MHz
tADSS
1.5
1.8
2.0
ns
2.5
3.0
4.0
ns
tAAS
1.5
1.8
2.0
ns
tKL
2.5
3.0
4.0
ns
tWS
1.5
1.8
2.0
ns
ns
tCES
1.5
1.8
2.0
ns
7.5
8.5
10
tKQX
1.5
3.0
3.0
ns
tAH
0.5
0.5
0.5
ns
tKQLZ
1.5
3.0
3.0
ns
tADSH
0.5
0.5
0.5
ns
5.0
ns
tAAH
0.5
0.5
0.5
ns
5.0
ns
tWH
0.5
0.5
0.5
ns
ns
tCEH
0.5
0.5
0.5
ns
4.2
tKQHZ
tOELZ
tOEHZ
5.0
4.2
tOEQ
1.
2.
3.
4.
66
tKH
tKQ
NOTE:
100
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
1.5
1.8
2.0
ns
tAS
0
5.0
0
4.2
0
5.0
5.0
ns
Q(A2) referes to output from address A2. Q(A2+1) refers to output from the next internal burst address following A2.
CE2\ and CE2 have timing identical to CE\. On this diagram, when CE\ is LOW, CE2\ is LOW and CE2 is HIGH. When CE\ is HIGH, CE2\ is HIGH and CE2 is LOW.
Timing is shown assuming that the device was not enabled before entering into this sequence.
Outputs are disabled tKQHZ after deselect.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
9
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
t KC
tKL
WRITE TIMING
○
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123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
○
○
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○
123456789
123456789
123456789
123456789
123456789
123456789
○
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123456789
123456789
123456789
123456789
123456789
123456789
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○
tAAS t AAH
123456
12345
1234
123456789
1234
123456
1234
12345
123456789
1234
123456
1234
12345
1234
123456789
123456
1234
12345
123456789
1234
123456
1234123456789
12345
1234
123456
1234
12345
123456789
1234
123456
○
○
○
1234567
1234567890123456789012345
12
1234567
1234567890123456789012345
12
1234567890123456789012345
1234567
12
1234567
12
1234567890123456789012345
1234567
1234567890123456789012345
12
1234567
12
1234567890123456789012345
1234567
1234567890123456789012345
12
○
○
○
○
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123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
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1234567
1234567
1234567
1234567
1234567
1234567
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
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123456
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123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
○
t WH
○
○
○
t
WS
123456
123456
123456
123456
123456
123456
123456
○
○
○
○
○
○
○
12345678
123456789012345678901
12
123456789012345678901
12345678
12
123456789012345678901
12345678
12
12345678
123456789012345678901
12
12345678
123456789012345678901
12
○
○
○
○
○
123456
123456
123456
123456
123456
123456
123456
○
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123456
123456
123456
123456
123456
123456
123456
○
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123456
123456
123456
123456
123456
123456
123456
○
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123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
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A3
○
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
tADSH
12345678
123456789012345678901
12
○
○
○
○
○
○
○
○
○
○
○
○
ADV\ suspends burst.
○
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○
(Note 3)
tDS t DH
○
○
○
○
○
○
○
○
○
○
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
123456789
1234567890123456789012345678901212345678901234567890123456789012123456789012
12345
○
○
1234567
1234567
1234567
1234567
1234567
1234567
1234567
○
123456
123456
123456
123456
123456
123456
○
○
○
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123456
123456
123456
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123456
123456
123456
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123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
○
○
○
○
○
○
○
○
t WH
○
○
○
○
○
t
WS
123456
123456
123456
123456
123456
123456
○
○
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123456
123456
123456
123456
123456
123456
123456
12
Q 12
12
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
8.8
10
15
ns
tKC
NOTE:
○
○
Extended
BURST WRITE
BURST WRITE
12345
12345
12345
12345Don’t
WRITE TIMING PARAMETERS
113
100
MHz
tCES
1.5
1.8
2.0
ns
2.5
3.0
4.0
ns
tAH
0.5
0.5
0.5
ns
tKL
2.5
3.0
4.0
ns
tADSH
0.5
0.5
0.5
ns
ns
tAAH
0.5
0.5
0.5
ns
4.2
66
5.0
5.0
Care
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
1.5
1.8
2.0
ns
tDS
tKH
tOEHZ
○
(Note 1)
SINGLE WRITE
tKF
12
12
12
12
12
12 D(A3+1) 12 D(A3+2) 12
12
○
○
D(A3)
○
○
○
○
12
12
12
12 D(A2+3) 12
12
○
123
123
12
D(A2+1) 12 D(A2+1) 123 D(A2+2)
○
12
12
○
○
○
○
t OEHZ
12
12
12
BURST READ
○
○
High-Z
○
○
○
1234
12
123456
12345
12
12
12
123456
12345
12
12
1234
12
12345
12
123456
D(A1) 1234
D(A2) 12
○
D
○
○
○
○
○
○
○
○
○
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○
○
○
○
○
○
○
○
○
○
(Note 4)
○
123456
123456
123456
123456
123456
123456
123456
12345
1234567890123456789012345678901212345678901234567890
12345
12345
1234567890123456789012345678901212345678901234567890
12345
1234567890123456789012345678901212345678901234567890
12345
12345
12345
12345
1234567890123456789012345678901212345678901234567890
12345
1234567890123456789012345678901212345678901234567890
12345
12345
12345
1234567890123456789012345678901212345678901234567890
12345
1234567890123456789012345678901212345678901234567890
12345
12345
1234
1234567890
12345
1234
1234
12345
1234567890
12345
1234
1234
12345
12345
1234
1234567890
1234
12345
1234567890
12345
1234
1234
12345
12345
1234
1234567890
1234
12345
1234567890
12345
1234
○
○
○
123456
123456
123456
123456
123456
123456
123456
ADSC\ extends burst. t
123456
123456
123456
ADSS
123456
123456
123456
123456
123456
123456
123456
123456
○
○
○
○
○
○
○
○
○
123456789012345678
123456789012345678
123456789012345678
123456789012345678
123456789012345678
123456789012345678
○
OE\
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
CES CEH
123456
123456789012
12
1234
1234567890
12345
1234
123456
123456789012
12
1234
1234567890
12345
123456
1234567890
1234
123456789012
12
1234
12345
123456789012
12
1234
12345
1234
123456
1234567890
1234
123456
123456789012
12
1234
1234567890
12345
1234
123456789012
12
1234
12345
123456
1234567890
1234
123456
123456789012
1234
1234567890
12345
12345
12345
12345
12345
ADV\ 12345
12345
(Note 5)
12345
1234
1234567890
12345
1234
1234
12345
1234567890
12345
1234
1234
12345
1234567890
12345
1234
1234
12345
12345
1234
1234567890
1234
12345
1234567890
12345
1234
1234
12345
1234567890
12345
1234
○
○
t
123456
123456
123456
123456
123456
123456
123456
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
123456789
12345
12345
○
○
○
○
○
○
○
○
○
○
○
t
123456
123456
123456
123456
123456
123456
123456
123456
BYTE WRITE signals are ignored
when
ADSP\ is12345
LOW.
1234
123456789
1234
123456789
12345
1234
123456789
12345
1234
123456789
12345
1234
123456789
12345
123456789
1234
12345
○
○
○
○
○
○
○
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
12345
123456789
12345
123456789
12345
12345
123456789
12345
○
CE\
(NOTE 2)
○
○
○
○
○
○
○
○
○
t
○
○
○
○
○
○
○
AH
12345678901234567
12345678901234567
12345678901234567
12345678901234567
12345678901234567
12345678901234567
123456
123456
123456
123456
123456
123456
123456
12345678
1234567890123456789012345678901212345678901234
12
12345678
1
12345678
1234567890123456789012345678901212345678901234
12
12345678
1
1234567890123456789012345678901212345678901234
12345678
12
12345678
1
1234567890123456789012345678901212345678901234
12345678
12
12345678
1
12345678
1234567890123456789012345678901212345678901234
12
12345678
1
12345678
1234567890123456789012345678901212345678901234
12
12345678
1
A2
○
○
○
○
A1
○
1234
1234
1234
GW\ 1234
1234
1234
○
○
○
○
○
1234
1234567890
1234
1234
12345
1234567890
12345
1234
1234
12345
1234567890
12345
1234
1234567890
1234
12345
12345
1234
1234
12345
1234567890
12345
1234
1234
1234
12345
1234567890
12345
1234
12345
1234567890
12345
12345678
12345678
123
12345678
12345678
123
123
12345678
12345678
123
12345678
12345678
12345678
12345678
123
12345678
12345678
123
○
1234
1234
BEW\, 1234
1234
1234
BWa\ - BWb\ 1234
123456
123456
123456
123456
123456
123456
○
○
○
○
○
○
○
○
○
○
○
○
123456
123456
123456
123456
123456
123456
○
○
○
tAS
tKH
○
○
○
○
○
○
○
tADSH
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
123456789
12345
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
1234567
12345678
12
1234567
12345678
12
1234567
12345678
12
1234567
12345678
12
ADDRESS 1234567
12345678
12
1234567
12345678
12
○
○
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
123456
○
○
○
○
○
tADSS
123456
○
1234
1234
1234
1234
ADSC\ 1234
1234
1234
○
○
1234
1234
1234
ADSP\ 1234
1234
1234
○
○
○
CLK
tAS
1.5
1.8
2.0
ns
tWH
0.5
0.5
0.5
ns
tADSS
1.5
1.8
2.0
ns
tDH
0.5
0.5
0.5
ns
tAAS
1.5
1.8
2.0
ns
tCEH
0.5
0.5
0.5
ns
tWS
1.5
1.8
2.0
ns
1. D(A2) refers to output from address A2. D(A2+1) refres to output from the next internal burst address following A2.
2. CE2\ and CE2 have timing identical to CE\. On this diagram, when CE\ is LOW, CE2\ is LOW and CE2 is HIGH. When CE\ is HIGH, CE2\ is HIGH and CE2 is LOW.
3. OE\ must be HIGH before the input data setup and held HIGH throughout the data hold time. This prevents input/output data contention for the time period
prior to the byte write enable inputs being sampled.
4. ADV\ must be HIGH to permit a WRITE to the loaded address.
5. Full-width WRITE can be initiated by GW\ LOW; or GW\ HIGH and BWE\, BWa\ and BWb\ LOW.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
10
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
READ/WRITE TIMING6
tKC
tKL
○
○
○
○
○
○
○
○
123456
123456
123456
123456
123456
123456
123456
123456
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12345
12345
12345
12345
12345
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12345
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○
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123456
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○
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○
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○
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123456
123456
123456
123456
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○
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123456
123456
123456
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123456
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○
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○
○
○
123456
123456
123456
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○
○
○
○
123456
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○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
12345
12345
12345
12345
12345
12345
12345
12345
○
○
○
○
○
○
○
○
○
○
○
○
123456
123456
123456
123456
123456
123456
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123456
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123456
○
○
○
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○
○
tOELZ
○
○
○
○
○
○
○
○
○
○
○
○
tDS tDH
○
○
○
○
OE\
○
○
○
○
○
○
○
○
○
○
○
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○
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○
○
○
○
○
12345678901234567
12345678901234567
12345678901234567
12345678901234567
12345678901234567
12345678901234567
○
○
○
○
123456789012345678
123456789012345678
123456789012345678
123456789012345678
123456789012345678
123456789012345678
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
tCEH
12345678901234567890123456789012123456789012
123456
12
12345678901234567890123456789012123456789012
123456
12
123456
12
12345678901234567890123456789012123456789012
123456
12
12345678901234567890123456789012123456789012
ADV\ 12345678901234567890123456789012123456789012
123456
12
123456
12
12345678901234567890123456789012123456789012
○
12345
1234567890123456789012345678901212345678
1234
12345
1234567890123456789012345678901212345678
1234
1234
12345
1234567890123456789012345678901212345678
1234
1234
12345
1234
1234567890123456789012345678901212345678
1234
12345
1234567890123456789012345678901212345678
1234
1234
12345
1234567890123456789012345678901212345678
1234
1234
12345
1234567890123456789012345678901212345678
1234
1234
○
t
WH 1234
12345
1234
123456789
1234
12345
123456789
1234
1234
12345
123456789
1234
1234
12345
1234
123456789
1234
12345
123456789
1234
1234123456789
12345
1234
123456789
○
○
○
○
○
○
○
○
○
○
○
○
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
123456789
12345
12345
12345
123456789
12345
123456789
12345
12345
○
○
○
CES
123456
123456
123456
123456
123456
123456
123456
123456
○
○
○
○
○
A6
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
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○
○
○
○
○
○
○
○
○
○
○
123
123
123
123
123
123
A5
○
○
1234567890123
1234567890123
1234567890123
1234567890123
1234567890123
1234567890123
○
123456789012345
123456789012345
123456789012345
123456789012345
123456789012345
123456789012345
○
○
○
○
A4
○
○
○
t WS
○
○
12345678
12345678901234567890123456789012123
12
12345678
1
12345678
12345678901234567890123456789012123
12
12345678
1
12345678
12
12345678
1
12345678901234567890123456789012123
12345678
12
12345678
1
12345678901234567890123456789012123
12345678
12345678901234567890123456789012123
12
12345678
1
12345678
12
12345678
1
12345678901234567890123456789012123
○
○
○
○
○
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
A3
○
○
○
○
○
○
○
○
t
○
○
○
○
CE\
(Note 2)
123456
123456
123456
123456
123456
123456
123456
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
12345678
12345678
123
○
○
○
○
t
123456
123456
123456
123456
123456
123456
123456
○
A2
AH
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
12345
12345
123456789
○
○
○
BWE\, GW\
BWa\ - BWb\
tKH
○
○
○
○
○
○
○
t AS
○
○
○
A1
○
ADDRESS
123456
123456
123456
123456
123456
123456
○
○
○
123
123
123
123
123
123
tADSH
123456
○
○
○
○
○
○
○
○
○
○
○
○
123456
123456
123456
123456
123456
123456
○
12345
12345
12345
ADSC\ 12345
12345
12345
123456
123456
123456
123456
123456
123456
123456
○
○
○
t ADSS
123456
123456
123456
123456
123456
123456
123456
○
12345
12345
12345
12345
ADSP\ 12345
12345
○
CLK
Q
D(A3)
tOEHZ
1234
123
1234
123
1234
1234 Q(A1) 123
123 Q(A2)
Back-to-Back READS
(NOTE 5)
D(A5)
○
High-Z
○
D
11
11
tKQ
Q(A4)
SINGLE WRITE
(NOTE 1)12
12
12
12 Q(A4+1) 12
12
113
66
Care
12345
12345
12345
Undefined
12345
12345
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
1.5
1.8
2.0
ns
tWS
MHz
tDS
1.5
1.8
2.0
ns
tKH
2.5
3.0
4.0
ns
tCES
1.5
1.8
2.0
ns
tKL
2.5
3.0
4.0
ns
tAH
0.5
0.5
0.5
ns
ns
tADSH
0.5
0.5
0.5
ns
ns
tWH
0.5
0.5
0.5
ns
ns
tDH
0.5
0.5
0.5
ns
tCEH
0.5
0.5
0.5
ns
7.5
tKQ
tOELZ
0
8.5
0
3.5
tOEHZ
NOTE:
100
Back-to-Back
WRITE’s
123456
123456
123456Don’t
123456
123456
-8
-9
-10
SYM MIN MAX MIN MAX MIN MAX UNITS
8.8
10
15
ns
tKC
10
0
4.2
5.0
tAS
1.5
1.8
2.0
ns
tADSS
1.5
1.8
2.0
ns
D(A6)
Q(A4+3)
BURST READ
READ/WRITE PARAMETERS
tKF
Q(A4+2)
12
12
12
1. Q(A4) refers to output from address A4. Q(A4+1) refers to output from the next internal burst address following A4.
2. CE2\ and CE2 have timing identical to CE\. On this diagram, when CE\ is LOW, CE2\ is LOW and CE2 is HIGH. When CE\ is HIGH, CE2\ is HIGH and CE2 is LOW.
3. The data bus (Q) remains in High-Z following a WRITE cycle unless an ADSP\, ADSC\, or ADV\ cycle is performed.
4. GW\ is HIGH.
5. Back-to-back READs may be controlled by either ADSP\ or ADSC\.
6. Timing is shown assuming that the device was not enabled before entering into this sequence.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
11
SSRAM
AS5SS256K18
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS
ASI Case #1001 (Package Designator DQ)
16.00 +0.20/-0.05
14.00 + 0.10
Pin #1 ID
20.10 + 0.10
22.10 + 0.10/-0.15
DETAIL A
0.25
Gage Plane
0.10 +0.10/-0.05
1.00 TYP
0.62
See Detail A
1.40 + 0.05
0.10
0.15 +0.03/-0.02
1.50 + 0.10
NOTE:
0.32 +0.06/-0.10
0.65
0.60 + 0.15
1. All dimensions in Millimeters (MAX/MIN) or typical where noted.
2. Package width and length do not include mold protrusion; allowable mold protursion is 0.25mm per side.
AS5SS256K18
Rev. 2.1 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
12
SSRAM
Austin Semiconductor, Inc.
AS5SS256K18
ORDERING INFORMATION
EXAMPLE: AS5SS256K18DQ-8/IT
Device Number
AS5SS256K18
AS5SS256K18
AS5SS256K18
Package
Speed ns Process
Type
DQ
-8
IT only
DQ
-9
/*
DQ
-10
/*
*AVAILABLE PROCESSES
IT = Industrial Temperature Range
XT = Extended Temperature Range
AS5SS256K18
Rev. 2.1 06/05
-40oC to +85oC
-55oC to +125oC
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
13