Agilent HSMF-C118 TriColor ChipLED Data Sheet Features • Common anode • Small 3.2 x 2.7 x 1.1 mm package • Diffused optics • Red/Green/Blue color combination • Available in 8 mm tape on 7 inch (178 mm) diameter reels • High brightness using AlInGaP and InGaN die technology Description The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. • Compatible with reflow soldering The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. Applications • Backlighting • Status indicator • Front panel indicator In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity. • Office automation, home appliances, industrial equipment CAUTION: HSMF-C118 is Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Package Dimensions LED DIE 3 2 1.5 (0.059) 4 2.7 (0.106) 1 3.2 (0.126 ) COMMON ANODE 2.0 (0.079) 1 0.6 (0.024) DIFFUSED EPOXY 1.1 (0.043) PC BOARD 2 4 3 RED GREEN BLUE 0.5 (0.020) POLARITY 0.7 (0.028) ANODE MARK 1.1 (0.043) 0.5 (0.020) HSMF-C118 NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE NOTED. 2 Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current[1, 3, 4] Power Dissipation[1] DC Forward Current[2] Power Dissipation[2] Reverse Voltage (I R = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature AlInGaP Red 20 48 15 36 5 95 InGaN Green 20 78 15 59 5 95 –40 to +85 –40 to +85 See IR soldering profile (Figure 6) InGaN Blue 20 78 15 59 5 95 Units mA mW mA mW V ˚C ˚C ˚C Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25˚C Color AlInGaP Red InGaN Green InGaN Blue Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 3.5 3.9 3.5 3.9 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 17 110 110 Thermal Resistance RθJ-PIN (˚C/W) Typ. 400 450 450 Optical Characteristics at TA = 25˚C Color AlInGaP Red InGaN Green InGaN Blue Luminous Intensity Iv (mcd) @ IF = 20 mA[1] Min. Typ. 25 90 40 120 10 40 Peak Wavelength λpeak (nm) Typ. 637 523 468 Color, Dominant Wavelength λd[2] (nm) Typ. 626 525 470 Viewing Angle 2 θ1/2 Degrees[3] Typ. 135 130 125 Luminous Efficacy ηv (lm/W) Typ. 155 490 80 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 3 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Agilent Technologies’ Application Brief AB D-007 for additional details/explanation on driving the part in parallel circuit. Intensity (Iv) Bin Limits[1] IF – FORWARD CURRENT – mA 100 90 InGaN BLUE 80 InGaN GREEN AS RED 70 60 50 40 30 20 10 0 400 450 Tolerance: ± 15%. 500 550 600 650 Bin ID – Red Color Bins Dom. Wavelength (nm) Min. Max. 615.0 630.0 Tolerance: ± 1 nm Bin ID A B C D Green Color Bins Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0 Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 1.4 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) Tolerance: ± 1 nm 1.0 0.8 GREEN, BLUE 0.6 0.4 RED 0.2 0 0 5 10 15 20 2.0 2.5 3.0 3.5 4.0 VF – FORWARD VOLTAGE – V Color Bin Limits[1] Bin ID A B C D GREEN & BLUE 1 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. Blue Color Bins Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 RED 10 0.1 1.5 700 25 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 30 Figure 2. Forward current vs. forward voltage. IF MAX. – MAXIMUM FORWARD CURRENT – mA Intensity (mcd) Min. Max. 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 RELATIVE INTENSITY Bin ID L M N P Q R 100 25 20 AS RED 15 GREEN, BLUE 10 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature (1 chip lit up). 1.0 RELATIVE INTENSITY – % 0.9 0.8 0.7 0.6 0.5 0.4 RED BLUE GREEN 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. 1.0 (0.039) 0.4 (0.016) TEMPERATURE 10 SEC. MAX. 230°C MAX. 1.0 (0.039) 4°C/SEC. MAX. 140-160°C 4°C/SEC. MAX. –3°C/SEC. MAX. 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. 5 NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 7. Recommended soldering pattern. USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xx xx xxxxxx xx PRINTED LABEL Figure 8. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 9. Reel dimensions. 6 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE DIM. B (SEE TABLE 1) USER FEED DIRECTION COVER TAPE 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C118 DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 10. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 7 MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 ± 5˚C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. June 3, 2002 5988-6892EN