HSMB-C1xx Surface Mount ChipLEDs Data Sheet HSMB-C112, HSMB-C172, HSMB-C192, HSMB-C196, HSMB-C152 Description Features This series of low current blue ChipLEDs is designed specifically for low current application. This makes them very suitable for cellular phone and portable equipment which runs off a battery. These parts are according to industry standard footprint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMB-C172/192/196 series and 3000 units per reel for the HSMB-C112/152 series. These parts are compatible with IR soldering. • Various size and mount options available • Industry standard footprint • Operating temperature range of –30˚C to +85˚C • Compatible with IR solder reflow • Available in 8 mm tape on 7" diameter reel Applications • LCD backlighting • Keypad backlighting • Pushbutton backlighting • Symbol indicator • Front panel indicator CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK CATHODE LINE LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.8 (0.031) 1.6 (0.063 ) 0.3 (0.012) 0.5 (0.020) CATHODE LINE 3.2 (0.126 ) 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C172 HSMx-C112 CATHODE MARK 1.6 (0.063) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD 0.5 (0.020) CATHODE LINE 0.5 ± 0.2 (0.020 ± 0.008) 0.5 ± 0.2 (0.020 ± 0.008) SOLDERING TERMINAL HSMx-C152 2 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Package Dimensions CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.031) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 1.0 (0.039) POLARITY 0.3 (0.012) POLARITY 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) 0.6 (0.023) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) PC BOARD 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C192 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3 SOLDERING TERMINAL HSMx-C196 Device Selection Guide Package Dimension (mm) 1.6 (L) x 0.8 (W) x 0.6 (H) 1.6 (L) x 0.8 (W) x 0.8 (H) 2.0 (L) x 1.25 (W) x 0.8 (H) 3.2 (L) x 1.5 (W) x 1.0 (H)[1] 3.2 (L) x 1.6 (W) x 1.1 (H) GaN Blue HSMB-C196 HSMB-C192 HSMB-C172 HSMB-C112 HSMB-C152 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Nondiffused Untinted, Diffused Note: 1. Right angle package. Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current[1] Power Dissipation HSMB-C112/172/192/196/152 10 46 Units mA mW Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature 5 V 95 ˚C –30 to +85 ˚C –40 to +85 ˚C See reflow soldering profile (Figure 7 & 8) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Part Number HSMB-C152/C172/C192/C196 HSMB-C112 Forward Voltage VF (Volts) @ IF = 10 mA Typ. Max. 4.0 4.6 4.0 4.6 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 43 43 Thermal Resistance RθJ-PIN (˚C/W) Typ. 550 550 Peak Wavelength λpeak (nm) Typ. 428 428 428 428 428 Color Dominant Wavelength λd[2] (nm) Typ. 462 462 462 462 462 Viewing Angle 2 θ1/2 Degrees[3] Typ. 130 170 170 170 170 Luminous Efficacy ηv (lm/w) Typ. 55 55 55 55 55 VF Tolerance: ± 0.1 V Optical Characteristics at TA = 25˚C Part Number HSMB-C112 HSMB-C172 HSMB-C192 HSMB-C196 HSMB-C152 Luminous Intensity Iv (mcd) @ 10 mA[1] Min. Typ. 1.1 3.1 1.1 3.0 1.1 3.0 1.1 3.0 1.1 3.0 Notes: 1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 IF – FORWARD CURRENT – mA Dom. Wavelength (nm) Min. Max. 460 465 465 470 470 475 475 480 RELATIVE INTENSITY – % Bin ID A B C D 100 100 Blue Color Bin Limits[1] 80 60 40 20 Tolerance: ±1 nm 0 400 450 500 550 600 650 10 1 0.1 700 WAVELENGTH – nm 3.0 3.2 3.4 3.6 3.8 4.0 4.2 VF – FORWARD VOLTAGE – V Light Intensity (Iv) Bin Limits[1] Tolerance: ± 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago srepresentative for information regarding currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 5 Figure 2. Forward current vs. forward voltage. IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 120 100 80 60 40 20 0 0 5 10 15 20 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. 100 90 RELATIVE INTENSITY – % Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152. 10 SEC. MAX. TEMPERATURE RELATIVE INTENSITY – % 100 80 60 230°C MAX. 4°C/SEC. MAX. 140-160°C –3°C/SEC. 4°C/SEC. MAX. 40 OVER 2 MIN. TIME 20 0 -100 Figure 7. Recommended reflow soldering profile. -80 -60 -40 -20 0 20 40 60 80 100 ANGLE 10 - 30 SEC. 80 TEMPERATURE RELATIVE INTENSITY – % 100 60 40 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. 20 100 SEC. MAX. 60 - 120 SEC. 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 TIME ANGLE (Acc. to J-STD-020C) Figure 8. Recommended Pb-free reflow soldering profile. Figure 6. Relative intensity vs. angle for HSMx-C112. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.0 (0.039) 0.2 (0.008) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) CENTERING BOARD Figure 9. Recommended soldering pattern for HSMx-C112. 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 10. Recommended soldering pattern for HSMx-C172. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C192 and HSMx-C196. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 6 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 12. Recommended soldering pattern for HSMx-C152. USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 13. Reeling orientation. ;; ;; ;; ;; ;; ;; 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 14. Reel dimensions. 7 ;;; ;;;;;; ;;; ;;;;;;;;; 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) ;;; ;;; DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) HSMx-C110 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMx-C196 SERIES HSMx-C192 SERIES HSMx-C172 SERIES HSMx-C112 SERIES HSMx-C152 SERIES 1.85 (0.073) 1.75 (0.069) 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) 0.88 (0.035) 0.90 (0.035) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 0.85 (0.033) 0.90 (0.035) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) R 1.0 ± 0.05 (0.039 ± 0.002) DIM. B (SEE TABLE 1) Figure 15. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 16. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 8 MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0416EN AV02-0976EN January 8, 2008