ETC HSMB-C112

Agilent HSMB-C1xx
Surface Mount ChipLEDs
Data Sheet
Features
• Various size and mount options
available
• Industry standard footprint
• Operating temperature range of
–30˚C to +85˚C
• Compatible with IR solder reflow
• Available in 8 mm tape on
7" diameter reel
HSMB-C112/C172/C192/C196/C152
Applications
• LCD backlighting
• Keypad backlighting
Description
This series of low current blue
ChipLEDs is designed specifically
for low current application. This
makes them very suitable for
cellular phone and portable
equipment which runs off a
battery. These parts are
according to industry standard
footprint. In order to facilitate
automated pick and place
operation, these ChipLEDs are
shipped in tape and reel, with
4000 units per reel for HSMBC172/192/196 series and 3000
units per reel for the HSMBC112/152 series. These parts are
compatible with IR soldering.
• Pushbutton backlighting
• Symbol indicator
• Front panel indicator
CAUTION: HSMB-C1xx LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions
during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details.
Package Dimensions
CATHODE
MARK
CATHODE
MARK
LED DIE
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
DIFFUSED
EPOXY
1.5 (0.059)
POLARITY
0.3 (0.012)
PC BOARD
PC BOARD
0.8 (0.031)
0.3 (0.012)
0.5 (0.020)
CATHODE LINE
1.6 (0.063 )
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
0.9 (0.035)
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C172
HSMx-C112
CATHODE
MARK
LED DIE
1.6 (0.063)
0.8 (0.031)
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
0.5 (0.020)
CATHODE LINE
0.5 ± 0.2
(0.020 ± 0.008)
0.5 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C152
2
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Package Dimensions
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
1.0
(0.039)
POLARITY
0.3 (0.012)
POLARITY
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
PC BOARD
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
PC BOARD
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C192
HSMx-C196
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 0.8 (W) x 0.6 (H)
1.6 (L) x 0.8 (W) x 0.8 (H)
2.0 (L) x 1.25 (W) x 0.8 (H)
3.2 (L) x 1.0 (W) x 1.5 (H)[1]
3.2 (L) x 1.6 (W) x 1.1 (H)
GaN Blue
HSMB-C196
HSMB-C192
HSMB-C172
HSMB-C112
HSMB-C152
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
Note:
1. Right angle package.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current[1]
Power Dissipation
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMB-C112/172/192/196/152
10
48
5
95
–30 to +85
–40 to +85
See IR soldering profile (Figure 7)
Units
mA
mW
V
˚C
˚C
˚C
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25˚C
Part Number
HSMB-C152/C172/C192/C196
HSMB-C112
Forward
Voltage
VF (Volts)
@ IF = 10 mA
Typ.
Max.
4.1
4.6
4.1
4.6
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
43
43
Thermal
Resistance
RθJ-PIN (˚C/W)
Typ.
550
550
Peak
Wavelength
λpeak (nm)
Typ.
428
428
428
428
428
Color
Dominant
Wavelength
λd[2] (nm)
Typ.
462
462
462
462
462
Viewing Angle
2 θ1/2 Degrees[3]
Typ.
130
170
170
170
170
Luminous
Efficacy
ηv (lm/w)
Typ.
55
55
55
55
55
VF Tolerance: ± 0.1 V
Optical Characteristics at TA = 25˚C
Part Number
HSMB-C112
HSMB-C172
HSMB-C192
HSMB-C196
HSMB-C152
Luminous
Intensity
Iv (mcd)
@ 10 mA[1]
Min.
Typ.
1.0
3.1
1.0
3.0
1.0
3.0
1.0
3.0
1.0
3.0
Notes:
1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2.The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
IF – FORWARD CURRENT – mA
Dom. Wavelength (nm)
Min.
Max.
460
465
465
470
470
475
475
480
RELATIVE INTENSITY – %
Bin ID
A
B
C
D
100
100
Blue Color Bin Limits[1]
80
60
40
20
Tolerance: ±1 nm
0
400
450
500
550
600
650
10
1
0.1
700
WAVELENGTH – nm
Tolerance: ± 15%
Note:
1. Bin categories are established for
classification of products. Products may
not be available in all categories. Please
contact your Agilent representative for
information regarding currently available
bins.
IF MAX. – MAXIMUM FORWARD CURRENT – mA
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
120
100
80
60
40
20
0
0
5
10
3.4
3.8
4.0
4.2
15
20
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
12
10
8
6
4
2
0
0 10 20 30 40 50 60 70 80 90 100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152.
5
3.6
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
RELATIVE INTENSITY – %
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
3.2
VF – FORWARD VOLTAGE – V
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Min.
Max.
0.11
0.18
0.18
0.29
0.29
0.45
0.45
0.72
0.72
1.10
1.10
1.80
1.80
2.80
2.80
4.50
4.50
7.20
7.20
11.20
11.20
18.00
18.00
28.50
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
3.0
RELATIVE INTENSITY – %
100
80
60
40
20
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
ANGLE
80
10 SEC. MAX.
60
TEMPERATURE
RELATIVE INTENSITY – %
100
40
20
230°C MAX.
4°C/SEC. MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
TIME
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C112.
Figure 7. Recommended reflow soldering
profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.2 (0.047)
1.0 (0.039)
0.2 (0.008)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
CENTERING
BOARD
Figure 8. Recommended soldering pattern for HSMx-C112.
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 9. Recommended soldering pattern for HSMx-C172.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 10. Recommended soldering pattern for HSMx-C192
and HSMx-C196.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
6
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended soldering pattern for HSMx-C152.
–3°C/SEC.
USER FEED DIRECTION
CATHODE SIDE
xxx
xxxxx
xxxxx
xxxxx
xx
PRINTED LABEL
Figure 12. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 13. Reel dimensions.
7
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. A
DIM. B
DIM. C
± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004)
PART NUMBER
DIM. A
(SEE TABLE 1)
HSMx-C196 SERIES
HSMx-C192 SERIES
1.80 (0.071)
1.80 (0.071)
0.95 (0.037)
0.95 (0.037)
0.75 (0.030)
0.87 (0.034)
HSMx-C172 SERIES
HSMx-C112 SERIES
HSMx-C152 SERIES
2.40 (0.094)
3.40 (0.134)
3.75 (0.148)
1.60 (0.063)
1.70 (0.067)
2.10 (0.083)
1.20 (0.047)
1.20 (0.047)
1.20 (0.047)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
Figure 14. Tape dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 15. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
For product information and a complete list of
Agilent contacts and distributors, please go
to our web site.
www.agilent.com/semiconductors
E-mail: [email protected]
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-4385EN
June 14, 2002
5988-7127EN
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.