AGILENT HSMC-C120

Agilent HSMA/C/L-C120,
HSMD/G/S/H-C120, HSMM/N/Q/R-C120
Right Angle ChipLED
Data Sheet
Features
• Small size right angle mount
• 0603 industry standard footprint
• Operating temperature range of
–30˚C to +85˚C
• Available in various colors
• Compatible with IR solder reflow
• Available in 8 mm tape on 7"
diameter reel
• Reel sealed in zip locked
moisture barrier bags
Description
This series of right angle mount
ChipLEDs is designed with the
smallest footprint to achieve high
density of components on board.
They have the industry standard
footprint of 1.6 mm x 1.0 mm
and a height of only 0.6 mm. This
makes them very suitable for
cellular phone and mobile
equipment backlighting and
Applications
indication application where
space is a constraint. They are
available in a wide range of color
combination. In order to facilitate
automated pick and place
operation, these ChipLEDs are
shipped in tape and reel, with
4000 units per reel. These parts
are compatible with IR soldering.
• LCD backlighting
• Keypad backlighting
• Pushbutton backlighting
• Symbol indicator
CAUTION: HSMM/N/Q/R-C120 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Agilent Technologies Application
Note AN-1142 for additional details.
Package Dimensions
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
LED DIE
0.6 (0.024)
0.3 (0.012)
1.6 (0.063)
POLARITY[3]
1.2 (0.047)
CLEAR
EPOXY
1.0 (0.039)
0.4 (0.016)
PC BOARD
3 – 0.3 (0.012)
CATHODE LINE
SOLDERING
TERMINAL
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3. POLARITY FOR HSMH-C120 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING.
Device Selection Guide
AS AlInGaP
Amber
HSMA-C120
Red
HSMC-C120
AlGaAs
Red
HSMH-C120
GaP
Green
HSMG-C120
2
Orange
HSML-C120
InGaN
Green
HSMM-C120
HSMQ-C120
Blue
HSMN-C120
HSMR-C120
Orange
HSMD-C120
HER
HSMS-C120
Package Description
Untinted, Non Diffused
Package Description
Untinted,
Non Diffused
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current[1] [2]
Power Dissipation
Reverse Voltage (I R = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMA/C/L- HSMD/G/S- HSMHC120
C120
C120
25
20
25
60
52
65
5
5
5
95
95
95
–30 to +85
–40 to +85
See IR soldering profile (Figure 6)
HSMM/NC120
20
78
5
95
HSMQ/RC120
20
78
5
95
Units
mA
mW
V
˚C
˚C
˚C
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
Electrical Characteristics at TA = 25˚C
Part Number
HSMA-C120
HSMC-C120
Forward
Voltage
VF (Volts)
@ IF = 20 mA
Typ.
Max.
1.9
2.4
1.9
2.4
Reverse
Breakdown
VR (Volts)
@ IR = 100 µA
Min.
5
5
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
11
15
Thermal
Resistance
RθJ-PIN (˚C/W)
Typ.
400
400
HSML-C120
HSMD-C120
HSMG-C120
HSMS-C120
HSMH-C120
HSMM-C120
HSMN-C120
HSMQ-C120
HSMR-C120
1.9
2.2
2.2
2.1
1.8
3.4
3.4
3.4
3.4
5
5
5
5
5
5
5
5
5
20
7
9
5
20
45
45
100
100
400
350
350
350
400
450
450
450
450
Note:
1. VF tolerance: ± 0.1 V
3
2.4
2.6
2.6
2.6
2.6
3.9
3.9
3.9
3.9
Optical Characteristics at TA = 25˚C
Part Number
HSMA-C120
HSMC-C120
HSML-C120
HSMD-C120
HSMG-C120
HSMS-C120
HSMH-C120
HSMM-C120
HSMN-C120
HSMQ-C120
HSMR-C120
Luminous
Intensity
Iv (mcd)
@ 20 mA[1]
Min.
25
25
25
2.5
4.0
2.5
4.0
40
10
40
16
Typ.
90
90
90
8
15
10
15
120
30
145
55
Peak
Wavelength
λpeak[2] (nm)
Typ.
595
637
609
605
570
630
660
523
468
520
469
Dominant
Wavelength
λd[2] (nm)
Typ.
592
626
605
604
572
626
639
525
470
527
473
Viewing Angle
2 θ1/2 Degrees[3]
Typ.
155
155
155
155
155
155
155
155
155
155
155
Luminous
Efficacy
ηv (lm/w)
Typ.
480
155
370
380
595
145
70
490
80
500
85
Notes:
1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical
axis of the lamp package.
2.The coordinate is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Light Intensity (Iv) Bin Limits[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
Intensity (mcd)
Min.
Max.
0.11
0.18
0.18
0.29
0.29
0.45
0.45
0.72
0.72
1.10
1.10
1.80
1.80
2.80
2.80
4.50
4.50
7.20
7.20
11.20
11.20
18.00
18.00
28.50
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
Tolerance: ± 15%
4
Color Bin Limits [1]
Green Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
561.5
564.5
B
564.5
567.5
C
567.5
570.5
D
570.5
573.5
E
573.5
576.5
Tolerance: ± 0.5 nm
Yellow/Amber Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
E
592.0
594.5
F
594.5
597.0
Tolerance: ± 0.5 nm
Blue Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
460.0
465.0
B
465.0
470.0
C
470.0
475.0
D
475.0
480.0
InGaN Green Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
515.0
520.0
B
520.0
525.0
C
525.0
530.0
D
530.0
535.0
Tolerance: ± 1 nm
Tolerance: ± 1 nm
100
Orange Color Bins
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
597.0
600.0
B
600.0
603.0
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
F
612.0
615.0
RELATIVE INTENSITY – %
Color Bin Limits
HER
70
60
GaP ORANGE
AlGaAs RED
50
40
30
20
10
550
600
650
700
750
WAVELENGTH - nm
100
RELATIVE INTENSITY – %
Please contact your Agilent representative
for information on currently available bins.
GaP GREEN
80
0
500
Tolerance: ± 1 nm
Notes:
1.Bin categories are established for
classification of products. Products may not
be available in all categories.
90
90
80
InGaN BLUE
AS AMBER
AS ORANGE
AS RED
70
60
InGaN GREEN
50
40
30
20
10
0
400
450
550
500
600
650
700
WAVELENGTH - nm
Figure 1. Relative intensity vs. wavelength.
IF – FORWARD CURRENT – mA
100
AS AllnGaP
AlGaAs
10
HER
GaP ORANGE
GaP GREEN
1
0.1
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
VF – FORWARD VOLTAGE – V
IF – FORWARD CURRENT – mA
100
10
HSMM,
HSMN InGaN
HSMQ,
HSMR InGaN
1
0.1
1.5
2.0
2.5
3.0
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
5
3.5
4.0
1.2
1.0
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.2
0.8
AS AlInGaP
0.6
AlGaAs
0.4
GaP
0.2
0
0
5
10
15
20
0.8
HSMQ,
HSMR InGaN
0.6
0.2
0
25
HSMM,
HSMN InGaN
0.4
0
IF – FORWARD CURRENT – mA
5
10
15
20
25
IF – FORWARD CURRENT – mA
30
25
AlInGaP
AlGaAs
20
GaP
15
10
5
0
0
10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
IF MAX. – MAXIMUM FORWARD CURRENT – mA
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature.
6
25
HSMQ,
HSMR InGaN
20
15
HSMM,
HSMN InGaN
10
5
0
0
10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
100
90
RELATIVE INTENSITY
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle.
0.4 (0.016)
10 SEC. MAX.
TEMPERATURE
0.4 (0.016)
230°C MAX.
4°C/SEC. MAX.
140-160°C
0.7 (0.028)
4°C/SEC.
MAX.
–3°C/SEC. MAX.
0.15 (0.006)
CENTERING
BOARD
OVER 2 MIN.
TIME
Figure 6. Recommended reflow soldering profile.
Note: All dimensions in millimeters (inches).
7
0.8
(0.031)
1.2
(0.047)
Figure 7. Recommended soldering pattern.
0.8
(0.031)
USER FEED DIRECTION
CATHODE SIDE
xxx
xxxxx
xxxxx
xxxxx
xxxxx
xx
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
∅ 20.20 MIN.
(∅ 0.795 MIN.)
∅ 13.1 ± 0.5
(∅ 0.516 ± 0.020)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 9. Reel dimensions.
8
DIM. C
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
4.0 (0.157)
∅1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
CATHODE
1.75 (0.069)
3.5 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.0 ± 0.30
(0.315 ± 0.012)
4.0 (0.157)
CARRIER TAPE
R 0.5 ± 0.05
(0.020 ± 0.002)
DIM. B
(SEE TABLE 1)
USER FEED
DIRECTION
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
HSMx-C120 SERIES
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
1.90 (0.075)
1.15 (0.045)
Figure 10. Tape dimensions.
END
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
START
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
MINIMUM OF
230 mm (9.05 IN.)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 11. Tape leader.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
9
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
0.75 (0.030)
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
April 6, 2002
5988-5401EN