Agilent HSMA/C/L-C120, HSMD/G/S/H-C120, HSMM/N/Q/R-C120 Right Angle ChipLED Data Sheet Features • Small size right angle mount • 0603 industry standard footprint • Operating temperature range of –30˚C to +85˚C • Available in various colors • Compatible with IR solder reflow • Available in 8 mm tape on 7" diameter reel • Reel sealed in zip locked moisture barrier bags Description This series of right angle mount ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and Applications indication application where space is a constraint. They are available in a wide range of color combination. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with IR soldering. • LCD backlighting • Keypad backlighting • Pushbutton backlighting • Symbol indicator CAUTION: HSMM/N/Q/R-C120 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE 0.6 (0.024) 0.3 (0.012) 1.6 (0.063) POLARITY[3] 1.2 (0.047) CLEAR EPOXY 1.0 (0.039) 0.4 (0.016) PC BOARD 3 – 0.3 (0.012) CATHODE LINE SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3. POLARITY FOR HSMH-C120 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING. Device Selection Guide AS AlInGaP Amber HSMA-C120 Red HSMC-C120 AlGaAs Red HSMH-C120 GaP Green HSMG-C120 2 Orange HSML-C120 InGaN Green HSMM-C120 HSMQ-C120 Blue HSMN-C120 HSMR-C120 Orange HSMD-C120 HER HSMS-C120 Package Description Untinted, Non Diffused Package Description Untinted, Non Diffused Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current[1] [2] Power Dissipation Reverse Voltage (I R = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMA/C/L- HSMD/G/S- HSMHC120 C120 C120 25 20 25 60 52 65 5 5 5 95 95 95 –30 to +85 –40 to +85 See IR soldering profile (Figure 6) HSMM/NC120 20 78 5 95 HSMQ/RC120 20 78 5 95 Units mA mW V ˚C ˚C ˚C Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25˚C Part Number HSMA-C120 HSMC-C120 Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 1.9 2.4 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 11 15 Thermal Resistance RθJ-PIN (˚C/W) Typ. 400 400 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 HSMQ-C120 HSMR-C120 1.9 2.2 2.2 2.1 1.8 3.4 3.4 3.4 3.4 5 5 5 5 5 5 5 5 5 20 7 9 5 20 45 45 100 100 400 350 350 350 400 450 450 450 450 Note: 1. VF tolerance: ± 0.1 V 3 2.4 2.6 2.6 2.6 2.6 3.9 3.9 3.9 3.9 Optical Characteristics at TA = 25˚C Part Number HSMA-C120 HSMC-C120 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 HSMQ-C120 HSMR-C120 Luminous Intensity Iv (mcd) @ 20 mA[1] Min. 25 25 25 2.5 4.0 2.5 4.0 40 10 40 16 Typ. 90 90 90 8 15 10 15 120 30 145 55 Peak Wavelength λpeak[2] (nm) Typ. 595 637 609 605 570 630 660 523 468 520 469 Dominant Wavelength λd[2] (nm) Typ. 592 626 605 604 572 626 639 525 470 527 473 Viewing Angle 2 θ1/2 Degrees[3] Typ. 155 155 155 155 155 155 155 155 155 155 155 Luminous Efficacy ηv (lm/w) Typ. 480 155 370 380 595 145 70 490 80 500 85 Notes: 1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.The coordinate is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3.θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 Tolerance: ± 15% 4 Color Bin Limits [1] Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ± 0.5 nm Yellow/Amber Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Tolerance: ± 0.5 nm Blue Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 InGaN Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Tolerance: ± 1 nm Tolerance: ± 1 nm 100 Orange Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 RELATIVE INTENSITY – % Color Bin Limits HER 70 60 GaP ORANGE AlGaAs RED 50 40 30 20 10 550 600 650 700 750 WAVELENGTH - nm 100 RELATIVE INTENSITY – % Please contact your Agilent representative for information on currently available bins. GaP GREEN 80 0 500 Tolerance: ± 1 nm Notes: 1.Bin categories are established for classification of products. Products may not be available in all categories. 90 90 80 InGaN BLUE AS AMBER AS ORANGE AS RED 70 60 InGaN GREEN 50 40 30 20 10 0 400 450 550 500 600 650 700 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. IF – FORWARD CURRENT – mA 100 AS AllnGaP AlGaAs 10 HER GaP ORANGE GaP GREEN 1 0.1 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 VF – FORWARD VOLTAGE – V IF – FORWARD CURRENT – mA 100 10 HSMM, HSMN InGaN HSMQ, HSMR InGaN 1 0.1 1.5 2.0 2.5 3.0 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 5 3.5 4.0 1.2 1.0 1.0 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 0.8 AS AlInGaP 0.6 AlGaAs 0.4 GaP 0.2 0 0 5 10 15 20 0.8 HSMQ, HSMR InGaN 0.6 0.2 0 25 HSMM, HSMN InGaN 0.4 0 IF – FORWARD CURRENT – mA 5 10 15 20 25 IF – FORWARD CURRENT – mA 30 25 AlInGaP AlGaAs 20 GaP 15 10 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C IF MAX. – MAXIMUM FORWARD CURRENT – mA IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 6 25 HSMQ, HSMR InGaN 20 15 HSMM, HSMN InGaN 10 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. 0.4 (0.016) 10 SEC. MAX. TEMPERATURE 0.4 (0.016) 230°C MAX. 4°C/SEC. MAX. 140-160°C 0.7 (0.028) 4°C/SEC. MAX. –3°C/SEC. MAX. 0.15 (0.006) CENTERING BOARD OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. Note: All dimensions in millimeters (inches). 7 0.8 (0.031) 1.2 (0.047) Figure 7. Recommended soldering pattern. 0.8 (0.031) USER FEED DIRECTION CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 8. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) ∅ 20.20 MIN. (∅ 0.795 MIN.) ∅ 13.1 ± 0.5 (∅ 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 9. Reel dimensions. 8 DIM. C (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 4.0 (0.157) ∅1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) CATHODE 1.75 (0.069) 3.5 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.0 ± 0.30 (0.315 ± 0.012) 4.0 (0.157) CARRIER TAPE R 0.5 ± 0.05 (0.020 ± 0.002) DIM. B (SEE TABLE 1) USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C120 SERIES DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) 1.90 (0.075) 1.15 (0.045) Figure 10. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 IN.) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape leader. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. 9 Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. 0.75 (0.030) www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. April 6, 2002 5988-5401EN