TI LMT85

LMT85, LMT85-Q1
www.ti.com
SNIS168A – MARCH 2013 – REVISED JUNE 2013
LMT85/LMT85-Q1 SC70, Analog Temperature Sensors with Class-AB Output
Check for Samples: LMT85, LMT85-Q1
FEATURES
DESCRIPTION
•
The LMT85/LMT85-Q1 are precision analog output
CMOS integrated-circuit temperature sensors that
operates at a supply voltage as low as 1.8 Volts. A
class-AB output structure gives the LMT85/LMT85Q1 strong output source and sink current capability
for driving heavy loads. This means it is well suited to
source the input of a sample-and-hold analog-todigital converter with its transient load requirements.
While operating over the wide temperature range of
−50°C to 150°C, the device delivers an output voltage
that is inversely proportional to measured
temperature. The LMT85/LMT85-Q1 low supply
current makes it ideal for battery-powered systems as
well as general temperature sensing applications.
1
2
•
•
•
•
•
•
LMT85-Q1 is AEC-Q100 Grade 0 qualified and
is Manufactured on an Automotive Grade Flow
Push-Pull Output with 50 µA Source Current
Capability
Very Accurate Over Wide Temperature Range
of −50°C to 150°C
Low Quiescent Current
Output is Short-Circuit Protected
Extremely Small SC70 Package
Cost-effective Alternative to Thermistors
APPLICATIONS
•
•
•
•
•
•
•
•
•
The LMT85/LMT85-Q1 can operate with a 1.8V
supply while measuring temperature over the full
−50°C to150°C operating range.
Automotive
Industrial
White Goods
Battery Management
Disk Drives
Appliances
Games
Wireless Transceivers
Cell phones
The
LMT85/LMT85-Q1
alternatives to thermistors.
CONNECTION DIAGRAM
1
5
GND
VDD
2
GND
3
OUT
are
cost-competitive
TYPICAL TRANSFER CHARACTERISTIC
Output Voltage vs Temperature
LMT85
4
VDD
Figure 1. SOT Top View
See Package Number DCK0005A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
LMT85, LMT85-Q1
SNIS168A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TYPICAL APPLICATION
Full-Range Celsius Temperature Sensor (−50°C to 150°C)
VDD (+1.8V to +5.5V)
VDD
VDD
LMT85
CBP
OUT
GND
GND
PIN DESCRIPTIONS
LABEL
PIN
NUMBER
TYPE
GND
5
Ground
VDD
1
Power
EQUIVALENT CIRCUIT
FUNCTION
Power Supply Ground
Positive Supply Voltage
VDD
Outputs a voltage which is inversely proportional to
temperature
OUT
3
Analog Output
VDD
4
Power
Positive Supply Voltage
GND
2
Ground
Power Supply Ground
GND
2
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
LMT85, LMT85-Q1
www.ti.com
SNIS168A – MARCH 2013 – REVISED JUNE 2013
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
MIN
UNIT
MAX
Supply Voltage
−0.3
6.
V
Voltage at Output Pin
−0.3
(VDD + 0.5)
V
±7
mA
5
mA
150
°C
Output Current
Input Current at any pin
(2)
−65
Storage Temperature
Maximum Junction Temperature (TJMAX)
ESD Susceptibility
(3)
:
150
°C
Human Body Model
2500
V
Machine Model
250
V
Soldering process must comply with Texas Instruments Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
(1)
(2)
(3)
(4)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not specific performance limits. For specifications and test conditions, see the Electrical
Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the
device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
OPERATING RATINGS
VALUE
Specified Temperature Range:
Supply Voltage Range (VDD)
Thermal Resistance (θJA)
(1)
(2)
(1) (2)
UNIT
TMIN ≤ TA ≤ TMAX
(SOT)
°C
−50 ≤ TA ≤ +150
°C
1.8 to 5.5
V
415
°C/W
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
ACCURACY CHARACTERISTICS
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.
PARAMETER
Temperature Error
(1)
(2)
CONDITIONS
(2)
TYPICAL
LIMITS
(1)
UNIT
70°C to 150°C; VDD = 1.9 V to 5.5 V
0.4
2.7
°C
0°C to 150°C; VDD = 1.9 V to 5.5 V
0.7
2.7
°C
0°C to 150°C; VDD = 2.6 V to 5.5 V
0.3
–50°C to 0°C; VDD = 2.3 V to 5.5 V
0.7
–50°C to 0°C; VDD = 2.9 V to 5.5 V
0.25
°C
2.7
°C
°C
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Transfer Table at the specified
conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified
conditions. Accuracy limits do not include load regulation; they assume no DC load.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
3
LMT85, LMT85-Q1
SNIS168A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, these specifications apply for +VDD = 1.8V to 5.5V. Boldface limits apply for TA = TJ = TMIN to
TMAX ; all other limits TA = TJ = 25°C.
PARAMETER
CONDITIONS
Sensor Gain
IS
CL
(3)
–0.22
–1
0.26
1
TA = -50°C to 150°C, (VDD - VOUT) ≥ 100 mV
Output Load Capacitance
(6)
(5)
(6)
4
mV
mV
5.4
8.1
μA
5.4
9
μA
1.9
ms
±50
µA
1100
CL= 0 pF to 1100 pF
UNITS
μV/V
200
TA = 30°C to 150°C, (VDD - VOUT) ≥ 100 mV
(2)
mV/°C
Sink ≤ 50 μA, VOUT ≥ 200 mV
Output drive
(1)
(2)
(3)
(4)
MAX
Source ≤ 50 μA, (VDD - VOUT) ≥ 200 mV
(4)
Supply Current (5)
Power-on Time
(1)
–8.2
Load Regulation
Line Regulation
TYPICAL
0.7
pF
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Source currents are flowing out of the LMT85/LMT85-Q1. Sink currents are flowing into the LMT85/LMT85-Q1.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in OUTPUT VOLTAGE
SHIFT.
The input current is leakage only and is highest at high temperature. It is typically only 0.001 µA. The 1 µA limit is solely based on a
testing limitation and does not reflect the actual performance of the part.
Specified by design and characterization.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
LMT85, LMT85-Q1
www.ti.com
SNIS168A – MARCH 2013 – REVISED JUNE 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Temperature Error vs
Temperature
Minimum Operating Temperature vs
Supply Voltage
4
Minimum Operating Temperature (ƒC)
40
TEMPERATURE ERROR (ºC)
3
2
1
0
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125 150
30
20
10
0
±10
±20
±30
±40
±50
1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 5.50
Supply Voltage (V)
TEMPERATURE (ºC)
C002
Figure 2.
Figure 3.
Supply Current vs
Temperature
Supply Current vs
Supply Voltage
Figure 4.
Figure 5.
Load Regulation, Sourcing Current
Load Regulation, Sinking Current
Figure 6.
Figure 7.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
5
LMT85, LMT85-Q1
SNIS168A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Change in Vout vs
Overhead Voltage
Supply-Noise Gain vs
Frequency
Figure 8.
Figure 9.
Output Voltage vs
Supply Voltage
Figure 10.
6
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
LMT85, LMT85-Q1
www.ti.com
SNIS168A – MARCH 2013 – REVISED JUNE 2013
LMT85/LMT85-Q1 TRANSFER FUNCTION
The output voltage of the LMT85/LMT85-Q1, across the complete operating temperature range, is shown in
Table 1. This table is the reference from which the LMT85/LMT85-Q1 accuracy specifications (listed in the
ELECTRICAL CHARACTERISTICS section) are determined. This table can be used, for example, in a host
processor look-up table. A file containing this data is available for download at www.ti.com
Table 1. LMT85/LMT85-Q1 Transfer Table
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-50
1955
-10
1648
30
1324
70
991
110
651
-49
1949
-9
1639
31
1316
71
983
111
642
-48
1942
-8
1631
32
1308
72
974
112
634
-47
1935
-7
1623
33
1299
73
966
113
625
-46
1928
-6
1615
34
1291
74
957
114
617
-45
1921
-5
1607
35
1283
75
949
115
608
-44
1915
-4
1599
36
1275
76
941
116
599
-43
1908
-3
1591
37
1267
77
932
117
591
-42
1900
-2
1583
38
1258
78
924
118
582
-41
1892
-1
1575
39
1250
79
915
119
573
-40
1885
0
1567
40
1242
80
907
120
565
-39
1877
1
1559
41
1234
81
898
121
556
-38
1869
2
1551
42
1225
82
890
122
547
-37
1861
3
1543
43
1217
83
881
123
539
-36
1853
4
1535
44
1209
84
873
124
530
-35
1845
5
1527
45
1201
85
865
125
521
-34
1838
6
1519
46
1192
86
856
126
513
-33
1830
7
1511
47
1184
87
848
127
504
-32
1822
8
1502
48
1176
88
839
128
495
-31
1814
9
1494
49
1167
89
831
129
487
-30
1806
10
1486
50
1159
90
822
130
478
-29
1798
11
1478
51
1151
91
814
131
469
-28
1790
12
1470
52
1143
92
805
132
460
-27
1783
13
1462
53
1134
93
797
133
452
-26
1775
14
1454
54
1126
94
788
134
443
-25
1767
15
1446
55
1118
95
779
135
434
-24
1759
16
1438
56
1109
96
771
136
425
-23
1751
17
1430
57
1101
97
762
137
416
-22
1743
18
1421
58
1093
98
754
138
408
-21
1735
19
1413
59
1084
99
745
139
399
-20
1727
20
1405
60
1076
100
737
140
390
-19
1719
21
1397
61
1067
101
728
141
381
-18
1711
22
1389
62
1059
102
720
142
372
-17
1703
23
1381
63
1051
103
711
143
363
-16
1695
24
1373
64
1042
104
702
144
354
-15
1687
25
1365
65
1034
105
694
145
346
-14
1679
26
1356
66
1025
106
685
146
337
-13
1671
27
1348
67
1017
107
677
147
328
-12
1663
28
1340
68
1008
108
668
148
319
-11
1656
29
1332
69
1000
109
660
149
310
150
301
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
7
LMT85, LMT85-Q1
SNIS168A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
Although the LMT85/LMT85-Q1 is very linear, its response does have a slight umbrella parabolic shape. This
shape is very accurately reflected in Table 1. The Transfer Table can be calculated by using the parabolic
equation.
mV
mV
ª
º ª
2º
VTEMP mV = 1324.0mV - «8.194
T - 30°C » - «0.00262 2 T - 30°C »
°C
¬
¼ ¬
°C
¼
(1)
For a linear approximation, a line can easily be calculated over the desired temperature range from the Table
using the two-point equation:
·
¹
V - V1 =
V2 - V1
T2 - T1
· u (T - T1)
¹
(2)
Where V is in mV, T is in °C, T1 and V1 are the coordinates of the lowest temperature, T2 and V2 are the
coordinates of the highest temperature.
For example, if we want to resolve this equation, over a temperature range of 20°C to 50°C, we would proceed
as follows:
1159 mV - 1405 mV·
u (T - 20oC)
50oC - 20oC
¹
·
¹
V - 1405 mV =
(3)
o
o
V - 1405 mV = (-8.20 mV / C) u (T - 20 C)
(4)
o
V = (-8.20 mV / C) u T + 1569 mV
(5)
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
MOUNTING AND THERMAL CONDUCTIVITY
The LMT85/LMT85-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It
can be glued or cemented to a surface.
To ensure good thermal conductivity, the backside of the LMT85/LMT85-Q1 die is directly attached to the GND
pin (Pin 2). The temperatures of the lands and traces to the other leads of the LMT85/LMT85-Q1 will also affect
the temperature reading.
Alternatively, the LMT85/LMT85-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped
into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT85/LMT85-Q1 and accompanying
wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the
circuit may operate at cold temperatures where condensation can occur. If moisture creates a short circuit from
the output to ground or VDD, the output from the LMT85/LMT85-Q1 will not be correct. Printed-circuit coatings are
often used to ensure that moisture cannot corrode the leads or circuit traces.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. The equation used to calculate the rise in the LMT85/LMT85-Q1 die
temperature is:
TJ = TA + TJA ¬ª(VDDIS ) + (VDD - VOUT ) IL ¼º
(6)
where TA is the ambient temperature, IS is the supply current, ILis the load current on the output, and VO is the
output voltage. For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 μA, VOUT = 1324 mV, and
IL = 2 μA, the junction temperature would be 30.0143°C, showing a self-heating error of only 0.0143°C. Since the
LMT85/LMT85-Q1's junction temperature is the actual temperature being measured, care should be taken to
minimize the load current that the LMT85/LMT85-Q1 is required to drive. Table 2 shows the thermal resistance of
the LMT85/LMT85-Q1.
Table 2. LMT85/LMT85-Q1 Thermal Resistance
8
DEVICE NUMBER
TI PACKAGE NUMBER
THERMAL RESISTANCE (θJA)
LMT85DCK
DCK0005A
415°C/W
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
LMT85, LMT85-Q1
www.ti.com
SNIS168A – MARCH 2013 – REVISED JUNE 2013
OUTPUT AND NOISE CONSIDERATIONS
A push-pull output gives the LMT85/LMT85-Q1 the ability to sink and source significant current. This is beneficial
when, for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these
applications the source current is required to quickly charge the input capacitor of the ADC. See the
APPLICATION CIRCUITS section for more discussion of this topic. The LMT85/LMT85-Q1 are ideal for this and
other applications which require strong source or sink current.
The LMT85/LMT85-Q1's supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was
measured during bench tests. Its typical attenuation is shown in the TYPICAL PERFORMANCE
CHARACTERISTICS section. A load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 5 centimeters of the LMT85/LMT85-Q1.
CAPACITIVE LOADS
The LMT85/LMT85-Q1 handles capacitive loading well. In an extremely noisy environment, or when driving a
switched sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling.
Without any precautions, the LMT85/LMT85-Q1 can drive a capacitive load less than or equal to 1100 pF as
shown in Figure 11. For capacitive loads greater than 1100 pF, a series resistor may be required on the output,
as shown in Figure 12.
VDD
LMT85
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD ” 1100 pF
Figure 11. LMT85 No Decoupling Required for Capacitive Loads Less than 1100 pF
VDD
RS
LMT85
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD > 1100 pF
Figure 12. LMT85 with Series Resistor for Capacitive Loading Greater than 1100 pF
CLOAD
MINIMUM RS
1.1 nF to 99 nF
3 kΩ
100 nF to 999 nF
1.5 kΩ
1 μF
800 Ω
OUTPUT VOLTAGE SHIFT
The LMT85/LMT85-Q1 are very linear over temperature and supply voltage range. Due to the intrinsic behavior
of an NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped
over the operating range of the device. The location of the shift is determined by the relative levels of VDD and
VOUT. The shift typically occurs when VDD- VOUT = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The accuracy
specifications in the ELECTRICAL CHARACTERISTICS table already include this possible shift.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
9
LMT85, LMT85-Q1
SNIS168A – MARCH 2013 – REVISED JUNE 2013
www.ti.com
APPLICATION CIRCUITS
V+
VTEMP
R3
VT1
R4
VT2
LM4040
VDD
VT
R1
4.1V
U3
0.1 PF
LMT85
R2
(High = overtemp alarm)
+
U1
-
VOUT
VOUT
VTemp
U2
VT1 =
(4.1)R2
R1 + R2||R3
VT2 =
(4.1)R2
R2 + R1||R3
Figure 13. Celsius Thermostat
VDD
SHUTDOWN
VOUT
LMT85
Any logic
device output
Figure 14. Conserving Power Dissipation with Shutdown
Simplified Input Circuit of
SAR Analog-to-Digital Converter
Reset
+2.7V to +5.5V
Input
Pin
LMT85
VDD
CBP
RMUX
RSS
Sample
OUT
GND
CFILTER
CMUX
CSAMPLE
Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When the
ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such as the
LMT85/LMT85-Q1 temperature sensor and many op amps. This requirement is easily accommodated by the addition
of a capacitor (CFILTER). The size of CFILTER depends on the size of the sampling capacitor and the sampling
frequency. Since not all ADCs have identical input stages, the charge requirements will vary. This general ADC
application is shown as an example only.
Figure 15. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
10
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: LMT85 LMT85-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LMT85DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BPA
LMT85DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BPA
LMT85QDCKRQ1
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BRA
LMT85QDCKTQ1
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BRA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jun-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMT85, LMT85-Q1 :
• Catalog: LMT85
• Automotive: LMT85-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMT85DCKR
SC70
DCK
5
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT85DCKT
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT85QDCKRQ1
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT85QDCKTQ1
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMT85DCKR
SC70
DCK
5
3000
210.0
185.0
35.0
LMT85DCKT
SC70
DCK
5
250
210.0
185.0
35.0
LMT85QDCKRQ1
SC70
DCK
5
3000
210.0
185.0
35.0
LMT85QDCKTQ1
SC70
DCK
5
250
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated