TI TPA2016D2YZHT

TPA2016D2
YZH
RTJ
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
2.8-W/Ch Stereo Class-D Audio Amplifier with Dynamic Range Compression and AGC
FEATURES
1
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23
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Filter-Free Class-D Architecture
1.7 W/Ch Into 8 Ω at 5 V (10% THD+N)
750 mW/Ch Into 8 Ω at 3.6 V (10% THD+N)
2.8 W/Ch Into 4 Ω at 5 V (10% THD+N)
1.5 W/Ch Into 4 Ω at 3.6 V (10% THD+N)
Power Supply Range: 2.5 V to 5.5 V
Flexible Operation With/Without I2C
Programmable DRC/AGC Parameters
Digital I2C Volume Control
Selectable Gain from –28 dB to 30 dB in 1-dB
Steps (when compression is used)
Selectable Attack, Release and Hold Times
4 Selectable Compression Ratios
Low Supply Current: 3.5 mA
Low Shutdown Current: 0.2 µA
High PSRR: 80 dB
Fast Start-up Time: 5 ms
AGC Enable/Disable Function
Limiter Enable/Disable Function
Short-Circuit and Thermal Protection
Space-Saving Package
– 2,2 mm × 2,2 mm Nano-Free™ WCSP (YZH)
APPLICATIONS
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Wireless or Cellular Handsets and PDAs
Portable Navigation Devices
Portable DVD Player
Notebook PCs
Portable Radio
Portable Games
Educational Toys
USB Speakers
DESCRIPTION
The TPA2016D2 is a stereo, filter-free Class-D audio
power amplifier with volume control, dynamic range
compression (DRC) and automatic gain control
(AGC). It is available in a 2.2 mm x 2.2 mm WCSP
package and 20-pin QFN package.
The DRC/AGC function in the TPA2016D2 is
programmable via a digital I2C interface. The
DRC/AGC function can be configured to automatically
prevent distortion of the audio signal and enhance
quiet passages that are normally not heard. The
DRC/AGC can also be configured to protect the
speaker from damage at high power levels and
compress the dynamic range of music to fit within the
dynamic range of the speaker. The gain can be
selected from –28 dB to +30 dB in 1-dB steps. The
TPA2016D2 is capable of driving 1.7 W/Ch at 5 V or
750 mW/Ch at 3.6 V into 8 Ω load or 2.8 W/Ch at 5 V
or 1.5 W/Ch at 3.6 V into 4 Ω load. The device
features independent software shutdown controls for
each channel and also provides thermal and short
circuit protection.
In addition to these features, a fast start-up time and
small package size make the TPA2016D2 an ideal
choice for cellular handsets, PDAs and other portable
applications.
SIMPLIFIED APPLICATION DIAGRAM
To Battery
10 mF
AVDD
PVDDL PVDDR
TPA2016D2
CIN 1 mF
INL–
Analog
Baseband
or
Codec
OUTL+
INL+
INR–
INR+
OUTL–
OUTR+
2
I C Clock
Digital
Baseband
2
I C Data
Master Shutdown
OUTR–
SCL
SDA
SDZ
AGND
PGND
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Nano-Free is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
TPA2016D2
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
2
I C Interface
IC shutdown
SDA
SCL
Bias and
References
2
I C Interface
& Control
SDZ
AVDD
PVDDL
C IN
Differential
INL+
Input Left
OUTL+
INLVolume
Control
Power
Stage
Class-D
Modulator
OUTL-
1uF
AGC
Reference
AGC
PVDDR
C IN
INR-
Differential
INR+
Input Right
OUTR+
Volume
Control
Power
Stage
Class-D
Modulator
OUTR-
1uF
AGND
PGND
DEVICE PINOUT
INL+
INL–
A1
A2
A3
A4
AVDD
SCL
SDA
AGND
INL+
B1
B2
B3
B4
INL-
PVDDR
SDZ
PGND
PVDDL
AGND
C1
C2
C3
C4
PVDDL
OUTR+
OUTR–
OUTL–
OUTL+
D1
D2
D3
D4
20
15
INR+
INRAVDD
PVDDR
5
11
2
PVDDR
OUTR-
PGND
10
OUTL-
6
OUTL+
PVDDL
16
1
OUTR+
INR+
SCL
INR–
SDZ
RTJ (QFN) PACKAGE
(Top View)
SDA
YZH (WCSP) PACKAGE
(Top View)
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
PIN FUNCTIONS
PIN
NAME
I/O/P
DESCRIPTION
WCSP
RTJ
INR+
A2
15
I
Right channel positive audio input
INR–
A1
14
I
Right channel negative audio input
INL+
A3
1
I
Left channel positive audio input
INL–
A4
2
I
Left channel negative audio input
SDZ
C2
18
I
Shutdown terminal (active low)
SDA
B3
19
I/O
I2C data interface
SCL
B2
17
I
I2C clock interface
OUTR+
D1
10
O
Right channel positive differential output
OUTR–
D2
9
O
Right channel negative differential output
OUTL+
D4
6
O
Left channel positive differential output
OUTL–
D3
7
O
Left channel negative differential output
AVDD
B1
13
P
Analog supply (must be the same as PVDDR and PVDDL)
AGND
B4
3
P
Analog ground (all GND pins need to be connected)
PVDDR
C1
11, 12
P
Right channel power supply (must be the same as AVDD and PVDDL)
PGND
C3
8
P
Power ground (all GND pins need to be connected)
PVDDL
C4
4, 5
P
Left channel power supply (must be the same as AVDD and PVDDR)
16, 20
Not connected
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted).
VALUE / UNIT
VDD
Supply voltage
AVDD, PVDDR, PVDDL
–0.3 V to 6 V
SDZ, INR+, INR–, INL+, INL–
Input voltage
–0.3 V to VDD+0.3 V
SDA, SCL
–0.3 V to 6 V
Continuous total power dissipation
See Dissipation Ratings Table
TA
Operating free-air temperature range
–40°C to +85°C
TJ
Operating junction temperature range
–40°C to 150°C
Tstg
Storage temperature range
ESD
–65°C to 150°C
Electro-Static Discharge Tolerance, all pins
Human Body Model (HBM)
2 KV
Charged Device Model (CDM)
500 V
3.2 Ω
RLOAD Minimum load resistance
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS TABLE (1)
(1)
PACKAGE
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
16-ball WCSP
1.25 W
10 mW/°C
0.8 W
0.65 W
20–pin QFN
5.2 W
41.6 mW/°C
3.12 W
2.7 W
Dissipations ratings are for a 2-side, 2-plane PCB.
3
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
AVAILABLE OPTIONS (1)
TA
PACKAGED DEVICES (2)
PART NUMBER
SYMBOL
–40°C to 85°C
16-ball, 2,2 mm × 2,2 mm WCSP (+0.01 mm/
-0.09 mm tolerance)
TPA2016D2YZHR
CCJ
TPA2016D2YZHT
CCJ
TPA2016D2RTJR
–
TPA2016D2RTJT
–
–40°C to 85°C
(1)
(2)
20–pin, 4 mm × 4 mm QFN (RTJ)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
The YZH packages are only available taped and reeled. The suffix R indicates a reel of 3000; the suffix T indicates a reel of 250.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
VDD
Supply voltage
AVDD, PVDDR, PVDDL
2.5
5.5
VIH
High-level input voltage
SDZ, SDA, SCL
1.3
VIL
Low-level input voltage
SDZ, SDA, SCL
TA
Operating free-air temperature
UNIT
V
V
–40
0.6
V
+85
°C
ELECTRICAL CHARACTERISTICS
at TA = 25°C, VDD = 3.6 V, SDZ = 1.3 V, and RL = 8 Ω + 33 µH (unless otherwise noted).
PARAMETER
VDD
ISDZ
ISWS
IDD
TEST CONDITIONS
MIN
TYP
MAX
2.5
3.6
5.5
SDZ = 0.35 V, VDD = 2.5 V
0.1
1
SDZ = 0.35 V, VDD = 3.6 V
0.2
1
SDZ = 0.35 V, VDD = 5.5 V
0.3
1
SDZ = 1.3 V, VDD = 2.5 V
35
50
SDZ = 1.3 V, VDD = 3.6 V
50
70
SDZ = 1.3 V, VDD = 5.5 V
75
110
VDD = 2.5 V
3.5
4.5
VDD = 3.6 V
3.7
4.7
VDD = 5.5 V
4.5
5.5
300
325
kHz
1
µA
Supply voltage range
Shutdown quiescent current
Software shutdown quiescent
current
Supply current
fSW
Class D Switching Frequency
IIH
High-level input current
VDD = 5.5 V, SDZ = 5.8 V
275
IIL
Low-level input current
VDD = 5.5 V, SDZ = –0.3 V
tSTART
Start-up time
2.5 V ≤ VDD ≤ 5.5 V no pop, CIN ≤ 1 µF
POR
Power on reset ON threshold
POR
Power on reset hysteresis
–1
2
CMRR
Input common mode rejection
Voo
Output offset voltage
VDD = 3.6 V, AV = 6 dB, RL = 8 Ω, inputs ac
grounded
ZOUT
Output Impedance in shutdown
mode
SDZ = 0.35 V
Gain accuracy
Compression and limiter disabled, Gain = 0 to 30 dB
Power supply rejection ratio
VDD = 2.5 V to 4.7 V
PSRR
4
–10
V
µA
µA
mA
µA
5
RL = 8 Ω, Vicm = 0.5 V and Vicm = VDD – 0.8 V,
differential inputs shorted
UNIT
ms
2.3
V
0.2
V
–70
dB
2
10
2
–0.5
kΩ
0.5
-80
mV
dB
dB
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
OPERATING CHARACTERISTICS
at TA = 25°C, VDD = 3.6V, SDZ = 1.3 V, RL = 8 Ω +33 µH, and AV = 6 dB (unless otherwise noted).
PARAMETER
TEST CONDITIONS
kSVR
VDD = 3.6 Vdc with ac of 200 mVPP at 217 Hz
power-supply ripple rejection ratio
THD+N
Total harmonic distortion + noise
MIN
TYP
faud_in = 1 kHz; PO = 550 mW; VDD = 3.6 V
0.1%
faud_in = 1 kHz; PO = 1 W; VDD = 5 V
0.1%
faud_in = 1 kHz; PO = 630 mW; VDD = 3.6 V
1%
faud_in = 1 kHz; PO = 1.4 W; VDD = 5 V
1%
NfonF
Output integrated noise
Av = 6 dB
44
NfoA
Output integrated noise
Av = 6 dB floor, A-weighted
33
FR
Frequency response
Av = 6 dB
Pomax
η
Maximum output power
Efficiency
MAX
–68
20
UNIT
dB
µV
µV
20000
Hz
THD+N = 10%, VDD = 5 V, RL = 8 Ω
1.72
W
THD+N = 10%, VDD = 3.6 V, RL = 8 Ω
750
mW
THD+N = 10%, VDD = 5 V, RL = 4 Ω
2.8
W
THD+N = 10% , VDD = 3.6 V, RL = 4 Ω
1.5
mW
THD+N = 1%, VDD = 3.6 V, RL = 8 Ω, PO= 0.63 W
90%
THD+N = 1%, VDD = 5 V, RL = 8 Ω, PO = 1.4 W
90%
TEST SET-UP FOR GRAPHS
TPA2016D2
CI
+
Measurement
Output
–
IN+
OUT+
Load
CI
IN–
VDD
+
OUT–
30 kHz
Low-Pass
Filter
+
Measurement
Input
–
GND
1 mF
VDD
–
(1)
All measurements were taken with a 1-µF CI (unless otherwise noted.)
(2)
A 33-µH inductor was placed in series with the load resistor to emulate a small speaker for efficiency measurements.
(3)
The 30-kHz low-pass filter is required, even if the analyzer has an internal low-pass filter. An RC low-pass filter (1 kΩ
4.7 nF) is used on each output for the data sheet graphs.
(4)
All THD + N graphs are taken with outputs out of phase (unless otherwise noted). All data is taken on left channel.
(5)
All data is taken on the WCSP package unless otherwise noted.
5
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
I2C TIMING CHARACTERISTICS
For I2C Interface Signals Over Recommended Operating Conditions (unless otherwise noted)
PARAMETER
fSCL
Frequency, SCL
tW(H)
Pulse duration, SCL high
tW(L)
tSU(1)
TEST CONDITIONS
MIN
No wait states
TYP
MAX
UNIT
400
kHz
0.6
µs
Pulse duration, SCL low
1.3
µs
Setup time, SDA to SCL
100
ns
th1
Hold time, SCL to SDA
10
ns
t(buf)
Bus free time between stop and start
condition
1.3
µs
tSU2
Setup time, SCL to start condition
0.6
µs
th2
Hold time, start condition to SCL
0.6
µs
tSU3
Setup time, SCL to stop condition
0.6
µs
tw(L)
tw(H)
SCL
t su1
th1
SDA
Figure 1. SCL and SDA Timing
SCL
t(buf)
th2
tsu2
tsu3
Start Condition
Stop Condition
SDA
Figure 2. Start and Stop Conditions Timing
6
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
TYPICAL CHARACTERISTICS
with C(DECOUPLE) = 1 µF, CI = 1 µF.
SUPPLY CURRENT
vs
SUPPLY VOLTAGE IN SHUTDOWN
100
8
80
IDD − Supply Current − µA
10
6
4
2
0
2.5
3.5
4.5
40
G001
−10
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
Limiter
−20
RL = 8 Ω + 33 µH
VSupply = 5 V
Fixed Gain = Max Gain = 30 dB
Compression Ratio = 1:1
−30
−20
−10
Level
Level
Level
Level
Level
Level
Level
Level
Level
= −6.5
= −4.5
= −2.5
= −0.5
= 1.5
= 3.5
= 5.5
= 7.5
=9
0
−10
Fixed Gain = −12
Fixed Gain = −9
Fixed Gain = −6
Fixed Gain = −3
Fixed Gain = 0
Fixed Gain = 3
Fixed Gain = 6
Fixed Gain = 9
Fixed Gain = 12
−20
−30
−50
−70
10
−50
−30
−10
G003
G004
Figure 6.
OUTPUT LEVEL
vs
INPUT LEVEL WITH 4:1 COMPRESSION
OUTPUT LEVEL
vs
INPUT LEVEL WITH 8:1 COMPRESSION
20
Limiter Level = 9 dBV
RL = 8 Ω + 33 µH
VSupply = 5 V
Compression Ratio = 4:1
Max Gain = 30 dB
10
−20
Fixed Gain = −15
Fixed Gain = −12
Fixed Gain = −9
Fixed Gain = −6
Fixed Gain = −3
Fixed Gain = 0
Fixed Gain = 3
Fixed Gain = 6
−30
Fixed Gain = −27
Fixed Gain = −24
Fixed Gain = −21
Fixed Gain = −18
−40
−50
−30
−10
Input Level − dBV
0
Limiter Level = 9 dBV
RL = 8 Ω + 33 µH
VSupply = 5 V
Compression Ratio = 8:1
Max Gain = 30 dB
−10
−20
−30
Fixed Gain = −27
Fixed Gain = −24
Fixed Gain = −21
Fixed Gain = −18
Fixed Gain = −15
−40
10
10
Input Level − dBV
Figure 5.
−10
−50
−70
0
Limiter Level = 9 dBV
RL = 8 Ω + 33 µH
VSupply = 5 V
Fixed Gain (2:1)
Compression Ratio = 2:1
Max Gain = 30 dB
−40
Input Level − dBV
0
G002
OUTPUT LEVEL
vs
INPUT LEVEL WITH 2:1 COMPRESSION
0
10
5.5
OUTPUT LEVEL
vs
INPUT LEVEL WITH LIMITER ENABLED
10
20
4.5
Figure 4.
10
−50
−40
3.5
Figure 3.
20
−30
SDZ = 0 V
20
20
−40
Output Level − dBV
60
VDD − Supply Voltage − V
Output Level − dBV
Output Level − dBV
VDD − Supply Voltage − V
SDZ = VDD, SWS = 1
0
2.5
5.5
Output Level − dBV
IDD − Quiescent Supply Current − mA
QUIESCENT SUPPLY CURRENT
vs
SUPPLY VOLTAGE
−50
−70
G005
Figure 7.
−50
−30
Input Level − dBV
Fixed Gain = −12
Fixed Gain = −9
Fixed Gain = −6
Fixed Gain = −3
Fixed Gain = 0
Fixed Gain = 3
−10
10
G006
Figure 8.
7
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS (continued)
with C(DECOUPLE) = 1 µF, CI = 1 µF.
20
Output Level − dBV
10
0
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
Limiter Level = 9 dBV
RL = 8 Ω + 33 µH
VSupply = 5 V
Fixed Gain = 0 dB
Max Gain = 30 dB
−10
−20
−30
Compression
Compression
Compression
Compression
−40
−50
−70
−50
−30
Ratio = 1:1
Ratio = 2:1
Ratio = 4:1
Ratio = 8:1
−10
10
Input Level − dBV
THD+N − Total Harmonic Distortion + Noise − %
OUTPUT LEVEL
vs
INPUT LEVEL
10
Gain = 6 dB
RL = 8 Ω + 33 µH
VSupply = 3.6 V
1
PO = 0.25 W
PO = 0.05 W
0.1
PO = 0.5 W
0.01
0.001
20
100
1k
f − Frequency − Hz
G007
Figure 9.
KSVR − Supply Ripple Rejection Ratio − dB
0.01
PO = 1 W
0.001
20
100
1k
10k
−30
−40
−50
VCC = 5 V
VCC = 2.5 V
−60
−70
VCC = 3.6 V
−80
20
100
1k
10k
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
VSupply = 5 V
0.1
PO − Output Power − W
1
3
20k
G011
Figure 12.
0.1
0.01
0.01
−20
Figure 11.
VSupply = 3.6 V
1
Gain = 6 dB
RL = 8 Ω + 33 µH
Right Channel
−10
G009
100
10
0
f − Frequency − Hz
f − Frequency − Hz
THD+N − Total Harmonic Distortion + Noise − %
20k
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
PO = 0.5 W
PO = 0.1 W
0.1
G008
SUPPLY RIPPLE REJECTION RATIO
10
1
20k
Figure 10.
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
Gain = 6 dB
RL = 8 Ω + 33 µH
VSupply = 5 V
10k
100
10
Gain = 6 dB
RL = 4 W + 33 mH
QFN Only
VDD = 5 V
VDD = 3.6 V
1
VDD = 2.5 V
0.1
0.01
0.01
G010
Figure 13.
0.1
1
3
PO − Output Power − W
Figure 14.
8
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Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
TYPICAL CHARACTERISTICS (continued)
with C(DECOUPLE) = 1 µF, CI = 1 µF.
EFFICIENCY
vs
OUTPUT POWER (PER CHANNEL)
EFFICIENCY
vs
OUTPUT POWER (PER CHANNEL)
100
100
90
80
VDD = 2.5 V
60
Efficiency − %
Efficiency − %
80
VDD = 5 V
VDD = 3.6 V
40
70
VDD = 3.6 V
60
VDD = 5 V
VDD = 2.5 V
50
40
fIN = 1 kHz
Gain = 6 dB
RL = 4 W + 33 mH
QFN Only
30
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
20
0
0.0
0.5
1.0
1.5
20
10
0
0.0
2.0
PO − Output Power (Per Channel) − W
1.5
2.0
2.5
3.0
PO − Output Power (Per Channel) − W
G012
Figure 16.
TOTAL POWER DISSIPATION
vs
TOTAL OUTPUT POWER
TOTAL POWER DISSIPATION
vs
TOTAL OUTPUT POWER
1.0
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
0.4
PD − Total Power Dissipation − W
PD − Total Power Dissipation − W
1.0
Figure 15.
0.5
VDD = 3.6 V
0.3
VDD = 5 V
VDD = 2.5 V
0.2
0.1
fIN = 1 kHz
Gain = 6 dB
RL = 4 W + 33 mH
QFN Only
0.9
0.8
0.7
0.6
VDD = 3.6 V
0.5
VDD = 2.5 V
0.4
VDD = 5 V
0.3
0.2
0.1
0.0
0.0
0
1
2
3
0
4
PO − Total Output Power − W
1
2
3
4
5
6
PO − Total Output Power − W
G013
Figure 17.
Figure 18.
TOTAL SUPPLY CURRENT
vs
TOTAL OUTPUT POWER
TOTAL SUPPLY CURRENT
vs
TOTAL OUTPUT POWER
1.4
Gain = 6 dB
RL = 8 Ω + 33 µH
f = 1 kHz
VDD = 3.6 V
0.8
0.6
IDD − Total Supply Current − A
1.0
IDD − Total Supply Current − A
0.5
VDD = 5 V
VDD = 2.5 V
0.4
0.2
VDD = 5 V
1.2
VDD = 3.6 V
1.0
VDD = 2.5 V
0.8
0.6
fIN = 1 kHz
Gain = 6 dB
RL = 4 W + 33 mH
QFN Only
0.4
0.2
0.0
0.0
0
1
2
3
PO − Total Output Power − W
4
0
G014
Figure 19.
1
2
3
4
5
6
PO − Total Output Power − W
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
with C(DECOUPLE) = 1 µF, CI = 1 µF.
OUTPUT POWER
vs
SUPPLY VOLTAGE
OUTPUT POWER
vs
SUPPLY VOLTAGE
2.0
4.0
fIN = 1 kHz
Gain = 6 dB
RL = 8 W + 33 mH
WCSP
3.5
PO − Output Power − W
PO − Output Power − W
2.5
1.5
THD = 10%
1.0
THD = 1%
0.5
3.0
fIN = 1 kHz
Gain = 6 dB
QFN
THD = 1%, 4 W
2.5
2.0
THD = 10%, 4 W
1.5
1.0
THD = 10%, 8 W
0.5
THD = 1%, 8 Ω
0.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
2.5
5.5
3.0
VCC − Supply Voltage − V
3.5
4.0
4.5
5.0
5.5
VCC − Supply Voltage − V
Figure 21.
Figure 22.
SPACER
1
Output
SWS
Disable
0.75
Voltage - V
0.5
0.25
0
-0.25
-0.5
-0.75
-1
0
200m
400m
600m
800m
1m
1.2m
1.4m
1.6m
1.8m
2m
7m
8m
9m
10m
t - Time - s
Figure 23. Shutdown Time
SPACER
1
Output
0.75
SWS Enable
Voltage - V
0.5
0.25
0
-0.25
-0.5
-0.75
-1
0
1m
2m
3m
4m
5m
6m
t - Time - s
Figure 24. Startup Time
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APPLICATION INFORMATION
AUTOMATIC GAIN CONTROL
The Automatic Gain Control (AGC) feature provides continuous automatic gain adjustment to the amplifier
through an internal PGA. This feature enhances the perceived audio loudness and at the same time prevents
speaker damage from occurring (Limiter function).
The AGC function attempts to maintain the audio signal gain as selected by the user through the Fixed Gain,
Limiter Level, and Compression Ratio variables. Other advanced features included are Maximum Gain and Noise
Gate Threshold. Table 1 describes the function of each variable in the AGC function.
Table 1. TPA2016D2 AGC Variable Descriptions
VARIABLE
DESCRIPTION
Maximum Gain
The gain at the lower end of the compression region.
Fixed Gain
The normal gain of the device when the AGC is inactive.
The fixed gain is also the initial gain when the device comes out of shutdown mode or when the AGC is
disabled.
Limiter Level
The value that sets the maximum allowed output amplitude.
Compression Ratio
The relation between input and output voltage.
Noise Gate Threshold
Below this value, the AGC holds the gain to prevent breathing effects.
Attack Time
The minimum time between two gain decrements.
Release Time
The minimum time between two gain increments.
Hold Time
The time it takes for the very first gain increment after the input signal amplitude decreases.
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The AGC works by detecting the audio input envelope. The gain changes depending on the amplitude, the limiter
level, the compression ratio, and the attack and release time. The gain changes constantly as the audio signal
increases and/or decreases to create the compression effect. The gain step size for the AGC is 0.5 dB. If the
audio signal has near-constant amplitude, the gain does not change. Figure 25 shows how the AGC works.
INPUT SIGNAL
Limiter threshold
Limiter threshold
B
C
D
E
A
GAIN
OUTPUT SIGNAL
Limiter threshold
Release Time
Hold Time
Attack Time
Limiter threshold
A.
Gain decreases with no delay; attack time is reset. Release time and hold time are reset.
B.
Signal amplitude above limiter level, but gain cannot change because attack time is not over.
C.
Attack time ends; gain is allowed to decrease from this point forward by one step. Gain decreases because the
amplitude remains above limiter threshold. All times are reset
D.
Gain increases after release time finishes and signal amplitude remains below desired level. All times are reset after
the gain increase.
E.
Gain increases after release time is finished again because signal amplitude remains below desired level. All times
are reset after the gain increase.
Figure 25. Input and Output Audio Signal vs Time
Since the number of gain steps is limited the compression region is limited as well. The following figure shows
how the gain changes vs. the input signal amplitude in the compression region.
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VIN - dBV
Figure 26. Input Signal Voltage vs Gain
Thus the AGC performs a mapping of the input signal vs. the output signal amplitude. This mapping can be
modified according to the variables from Table 1.
The following graphs and explanations show the effect of each variable to the AGC independently and which
considerations should be taken when choosing values.
Fixed Gain: The fixed gain determines the initial gain of the AGC. Set the gain using the following variables:
• Set the fixed gain to be equal to the gain when the AGC is disabled.
• Set the fixed gain to maximize SNR.
• Set the fixed gain such that it will not overdrive the speaker.
Increasing
Fixed Gain
G
xe
d
Decreasing
Fixed Gain
1:
1
Fi
VOUT - dBV
ai
n
=
3
Fi
x
dB
ed
G
ai
n
=
6
dB
Figure 27 shows how the fixed gain influences the input signal amplitude vs. the output signal amplitude state
diagram. The dotted 1:1 line is displayed for reference. The 1:1 line means that for a 1dB increase in the input
signal, the output increases by 1dB.
VIN - dBV
Figure 27. Output Signal vs Input Signal State Diagram Showing Different Fixed Gain Configurations
If the Compression function is enabled, the Fixed Gain is adjustable from –28dB to 30dB. If the Compression
function is disabled, the Fixed gain is adjustable from 0dB to 30dB.
Limiter Level: The Limiter level sets the maximum amplitude allowed at the output of the amplifier. The limiter
should be set with the following constraints in mind:
• Below or at the maximum power rating of the speaker
• Below the minimum supply voltage in order to avoid clipping
Figure 28 shows how the limiter level influences the input signal amplitude vs. the output signal amplitude state
diagram.
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Limiter Level= 630mW
Limiter Level= 500mW
VOUT - dBV
Limiter Level = 400 mW
Increasing
Limiter
Level
Decreasing
Limiter
Level
VIN - dBV
Figure 28. Output Signal vs Input Signal State Diagram Showing Different Limiter Level Configurations
The limiter level and the fixed gain influence each other. If the fixed gain is set high, the AGC has a large limiter
range. The fixed gain is set low, the AGC has a short limiter range. Figure 29 illustrates the two examples:
Small
Fixed
Gain
1:
1
VOUT - dBV
Large Fixed Gain
VIN - dBV
Figure 29. Output Signal vs. Input Signal State Diagram Showing Same Limiter Level Configurations with
Different Fixed Gain Configurations
Compression Ratio: The compression ratio sets the relation between input and output signal outside the limiter
level region. The compression ratio compresses the dynamic range of the audio. For example if the audio source
has a dynamic range of 60dB and compression ratio of 2:1 is selected, then the output has a dynamic range of
30dB. Most small form factor speakers have small dynamic range. Compression ratio allows audio with large
dynamic range to fit into a speaker with small dynamic range.
The compression ratio also increases the loudness of the audio without increasing the peak voltage. The higher
the compression ratio, the louder the perceived audio.
For example:
• A compression ratio of 4:1 is selected (meaning that a 4dB change in the input signal results in a 1dB signal
change at the output)
• A fixed gain of 0dB is selected and the maximum audio level is at 0dBV.
When the input signal decreases to –32dBV, the amplifier increases the gain to 24dB in order to achieve an
output of –8dBV. The output signal amplitude equation is:
Output signal amplitude =
Input signal initial amplitude - |Current input signal amplitude|
Compression ratio
(1)
In this example:
-8dBV =
0dBV - | - 32 dBV|
4
(2)
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The gain change equation is:
æ
ö
1
Gain change = ç 1 ÷ × Input signal change
Compression ratio ø
è
(3)
1ö
æ
24 dB = ç 1 - ÷ × 32
4ø
è
(4)
Consider the following when setting the compression ratio:
• Dynamic range of the speaker
• Fixed gain level
• Limiter Level
• Audio Loudness vs Output Dynamic Range.
Figure 30 shows different settings for dynamic range and different fixed gain selected but no limiter level.
Rotation
Point@
higher gain
8 :1
4 :1
2
Increasing
Fixed Gain
:1
VOUT - dBV
1
Rotation
Point@
lower gain
:1
8 :1
Decreasing
4 :1
2:
1
1
:1
VIN - dBV
Figure 30. Output Signal vs Input Signal State Diagram Showing Different Compression Ratio
Configurations with Different Fixed Gain Configurations
The rotation point is always at Vin = 10dBV. The rotation point is not located at the intersection of the limiter
region and the compression region. By changing the fixed gain the rotation point will move in the y-axis direction
only, as shown in the previous graph.
Interaction between compression ratio and limiter range: The compression ratio can be limited by the limiter
range. Note that the limiter range is selected by the limiter level and the fixed gain.
For a setting with large limiter range, the amount of gain steps in the AGC remaining to perform compression are
limited. Figure 31 shows two examples, where the fixed gain was changed.
1. Small limiter range yielding a large compression region (small fixed gain).
2. Large limiter range yielding a small compression region (large fixed gain).
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Small
Compression
Region
Large Limiter
Range
Rotation
Point @
higher gain
Large
Compression
Region
1:
1
VOUT - dBV
Rotation
Point @
lower gain
Small Limiter
Range
VIN - dBV
Figure 31. Output Signal vs Input Signal State Diagram Showing the Effects of the Limiter Range to the
Compression Region
Input Signal
Amplitude - Vrms
Noise Gate Threshold: The noise gate threshold prevents the AGC from changing the gain when there is no
audio at the input of the amplifier. The noise gate threshold stops gain changes until the input signal is above the
noise gate threshold. Select the noise gate threshold to be above the noise but below the minimum audio at the
input of the amplifier signal. A filter is needed between delta-sigma CODEC/DAC and TPA2016D2 for
effectiveness of the noise gate function. The filter eliminates the out-of-band noise from delta-sigma modulation
and keeps the CODEC/DAC output noise lower than the noise gate threshold.
No
Audio
Noise Gate Threshold
time
Gain - dB
Gain does not change
in this region
time
Figure 32. Time Diagram Showing the Relationship Between Input Signal Amplitude, Noise Gate
Threshold and Gain Versus Time
Maximum Gain: This variable limits the number of gain steps in the AGC. This feature is useful in order to
accomplish a more advanced output signal vs. input signal transfer characteristic.
For example, to prevent the gain from going above a certain value, reduce the maximum gain.
However, this variable will affect the limiter range and the compression region. If the maximum gain is
decreased, the limiter range and/or compression region is reduced. Figure 33 illustrates the effects.
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1:
1
VOUT - dBV
Max Gain Max Gain
= 30dB
= 22dB
VIN - dBV
Figure 33. Output Signal vs. Input Signal State Diagram Showing Different Maximum Gains
A particular application requiring maximum gain of 22dB, for example. Thus, set the maximum gain at 22dB. The
amplifier gain will never have a gain higher than 22dB; however, this will reduce the limiter range.
Attack, Release, and Hold time:
• The attack time is the minimum time between gain decreases.
• The release time is the minimum time between gain increases.
• The hold time is the minimum time between a gain decrease (attack) and a gain increase (release). The hold
time can be deactivated. Hold time is only valid if greater than release time.
Successive gain decreases are never faster than the attack time. Successive gain increases are never faster
than the release time.
All time variables (attack, release and hold) start counting after each gain change performed by the AGC. The
AGC is allowed to decrease the gain (attack) only after the attack time finishes. The AGC is allowed to increase
the gain (release) only after the release time finishes counting. However, if the preceding gain change was an
attack (gain increase) and the hold time is enabled and longer than the release time, then the gain is only
increased after the hold time.
The hold time is only enabled after a gain decrease (attack). The hold time replaces the release time after a gain
decrease (attack). If the gain needs to be increased further, then the release time is used. The release time is
used instead of the hold time if the hold time is disabled.
The attack time should be at least 100 times shorter than the release and hold time. The hold time should be the
same or greater than the release time. It is important to select reasonable values for those variables in order to
prevent the gain from changing too often or too slow.
Figure 34 illustrates the relationship between the three time variables.
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Input Signal
Amplitue (Vrms)
Gain dB
Time end
Attack time
Time reset
Release time
Hold timer not used after
first gain increase
Hold time
time
Figure 34. Time Diagram Showing the Relation Between the Attack, Release, and Hold Time vs Input
Signal Amplitude and Gain
Figure 35 shows a state diagram of the input signal amplitude vs. the output signal amplitude and a summary of
how the variables from table 1 described in the preceding pages affect them.
Fixed
Gain
Rotation
Point
8:1
¥:1
1:
1
4:1
2:1
nR
sio
1
:1
A
tta
R
c
el
k
ea
Ti
se
m
e
Ti
m
e
Noise Gate Threshold
VOUT - dBV
r es
mp
Co
Limiter
Level
ion
eg
Maximum
Gain
VIN - dBV
10 dBV
Figure 35. Output Signal vs. Input Signal State Diagram
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TPA2016D2 AGC OPERATION
The TPA2016D2 is controlled by the I2C interface. The correct start-up sequence is:
1. Apply the supply voltage to the AVDD and PVDD (L, R)pins.
2. Apply a voltage above VIH to the SDZ pin. The TPA2016D2 powers up the I2C interface and the control logic.
By default, the device is in active mode (SWS = 0). After a few milliseconds the amplifier will enable the
class-D output stage and become fully operational.
3. The amplifier starts at a gain of 0 dB and the AGC starts ramping the gain after the input signal exceeds the
noise gate threshold.
CAUTION:
Do not interrupt the start-up sequence after changing SDZ from VIL to VIH.
Do not interrupt the start-up sequence after changing SWS from 1 to 0.
The default conditions of TPA2016D2 allows audio playback without I2C control. Refer to Table 4 for entire
default conditions.
There are several options to disable the amplifier:
• Write SPK_EN_R = 0 and SPK_EN_L = 0 to the register (0x01, 6 and 0x01, 7). This write disables each
speaker amplifier, but leaves all other circuits operating.
• Write SWS = 1 to the register (0x01, 5). This action disables most of the amplifier functions.
• Apply VIL to SDZ. This action shuts down all the circuits and has very low quiescent current consumption.
This action resets the registers to its default values.
CAUTION:
Do not interrupt the shutdown sequence after changing SDZ from VIH to VIL.
Do not interrupt the shutdown sequence after changing SWS from 0 to 1.
TPA2016D2 AGC RECOMMENDED SETTINGS
Table 2. Recommended AGC Settings for Different Types of Audio Source (VDD = 3.6V)
AUDIO
SOURCE
COMPRESSION
RATIO
ATTACK TIME
(ms/6 dB)
RELEASE TIME
(ms/6 dB)
HOLD TIME
(ms)
FIXED GAIN
(dB)
LIMITER LEVEL
(dBV)
Pop Music
4:1
1.28 to 3.84
986 to 1640
137
6
7.5
Classical
2:1
2.56
1150
137
6
8
Jazz
2:1
5.12 to 10.2
3288
—
6
8
Rap/ Hip Hop
4:1
1.28 to 3.84
1640
—
6
7.5
Rock
2:1
3.84
4110
—
6
8
Voice/ News
4:1
2.56
1640
—
6
8.5
GENERAL I2C OPERATION
The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a
system. The bus transfers data serially one bit at a time. The address and data 8-bit bytes are transferred most
significant bit (MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device
with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the
bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data
terminal (SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on
SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit transitions must occur within
the low time of the clock period. Figure 36 shows a typical sequence. The master generates the 7-bit slave
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address and the read/write (R/W) bit to open communication with another device, and then waits for an
acknowledge condition. The TPA2016D2 holds SDA low during the acknowledge clock period to indicate
acknowledgment. When this acknowledgment occurs, the master transmits the next byte of the sequence. Each
device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same
signals via a bidirectional bus using a wired-AND connection.
An external pull-up resistor must be used for the SDA and SCL signals to set the logic high level for the bus.
When the bus level is 5 V, use pull-up resistors between 1 kΩ and 2 kΩ.
8- Bit Data for
Register (N)
8- Bit Data for
Register (N+1)
Figure 36. Typical I2C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 36.
SINGLE-AND MULTIPLE-BYTE TRANSFERS
The serial control interface supports both single-byte and multi-byte read/write operations for all registers.
During multiple-byte read operations, the TPA2016D2 responds with data, one byte at a time, starting at the
register assigned, as long as the master device continues to respond with acknowledgments.
The TPA2016D2 supports sequential I2C addressing. For write transactions, if a register is issued followed by
data for that register and all the remaining registers that follow, a sequential I2C write transaction has occurred.
For I2C sequential write transactions, the register issued then serves as the starting point, and the amount of
data subsequently transmitted, before a stop or start is transmitted, determines the number of registers written.
SINGLE-BYTE WRITE
As Figure 37 shows, a single-byte data write transfer begins with the master device transmitting a start condition
followed by the I2C device address and the read/write bit. The read/write bit determines the direction of the data
transfer. For a write data transfer, the read/write bit must be set to '0'. After receiving the correct I2C device
address and the read/write bit, the TPA2016D2 responds with an acknowledge bit. Next, the master transmits the
register byte corresponding to the TPA2016D2 internal memory address being accessed. After receiving the
register byte, the TPA2016D2 again responds with an acknowledge bit. Next, the master device transmits the
data byte to be written to the memory address being accessed. After receiving the register byte, the TPA2016D2
again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the
single-byte data write transfer.
Start
Condition
Acknowledge
A6
A5
A4
A3
A2
A1
I2C Device Address and
Read/Write Bit
A0
R/W ACK A7
Acknowledge
A6
A5
A4
A3
A2
A1
A0 ACK D7
Register
Acknowledge
D6
D5
D4
D3
Data Byte
D2
D1
D0 ACK
Stop
Condition
Figure 37. Single-Byte Write Transfer
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MULTIPLE-BYTE WRITE AND INCREMENTAL MULTIPLE-BYTE WRITE
A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes
are transmitted by the master device to the TPA2016D2 as shown in Figure 38. After receiving each data byte,
the TPA2016D2 responds with an acknowledge bit.
Register
Figure 38. Multiple-Byte Write Transfer
SINGLE-BYTE READ
As Figure 39 shows, a single-byte data read transfer begins with the master device transmitting a start condition
followed by the I2C device address and the read/write bit. For the data read transfer, both a write followed by a
read are actually executed. Initially, a write is executed to transfer the address byte of the internal memory
address to be read. As a result, the read/write bit is set to a '0'.
After receiving the TPA2016D2 address and the read/write bit, the TPA2016D2 responds with an acknowledge
bit. The master then sends the internal memory address byte, after which the TPA2016D2 issues an
acknowledge bit. The master device transmits another start condition followed by the TPA2016D2 address and
the read/write bit again. This time the read/write bit is set to '1', indicating a read transfer. Next, the TPA2016D2
transmits the data byte from the memory address being read. After receiving the data byte, the master device
transmits a not-acknowledge followed by a stop condition to complete the single-byte data read transfer.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A5
A1
A0 R/W ACK A7
I2C Device Address and
Read/Write Bit
Acknowledge
A6
A5
A4
A0 ACK
Not
Acknowledge
Acknowledge
A6
A5
A1
A0 R/W ACK D7
D6
I2C Device Address and
Read/Write Bit
Register
D1
D0 ACK
Stop
Condition
Data Byte
Figure 39. Single-Byte Read Transfer
MULTIPLE-BYTE READ
A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes
are transmitted by the TPA2016D2 to the master device as shown in Figure 40. With the exception of the last
data byte, the master device responds with an acknowledge bit after receiving each data byte.
Repeat Start
Condition
Start
Condition
Acknowledge
A6
A0 R/W ACK A7
I2C Device Address and
Read/Write Bit
Acknowledge
A6
A5
A0 ACK
Acknowledge
A6
A0 R/W ACK D7
I2C Device Address and
Read/Write Bit
Register
Acknowledge
D0
ACK D7
First Data Byte
Acknowledge
Not
Acknowledge
D0 ACK D7
D0 ACK
Other Data Bytes
Last Data Byte
Stop
Condition
Figure 40. Multiple-Byte Read Transfer
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Register Map
Table 3. TPA2016D2 Register Map
Register
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
SPK_EN_R
SPL_EN_L
SWS
FAULT_R
FAULT_L
Thermal
1
NG_EN
2
0
0
ATK_time [5]
ATK_time [4]
ATK_time [3]
ATK_time [2]
ATK_time [1]
ATK_time [0]
3
0
0
REL_time [5]
REL_time [4]
REL_time [3]
REL_time [2]
REL_time [1]
REL_time [0]
4
0
0
Hold_time [5]
Hold_time [4]
Hold_tme [3]
Hold_time [2]
Hold_time [1]
Hold_time [0]
5
0
0
FixedGain [5]
FixedGain [4]
FixedGain [3]
FixedGain [2]
FixedGain [1]
FixedGain [0]
6
Output
Limiter
Disable
NoiseGate
Threshold
[1]
NoiseGate
Threshold [2]
Output Limiter
Level [4]
Output Limiter
Level [3]
Output Limiter
Level [2]
Output Limiter
Level [1]
Output Limiter
Level [0]
7
Max Gain
[3]
Max Gain
[2]
Max Gain [1]
Max Gain [0]
0
0
Compression
Ratio [1]
Compression
Ratio [0]
The default register map values are given in Table 4.
Table 4. TPA2016D2 Default Register Values Table
Register
0x01
0x02
0x03
0x04
0x05
0x06
0x07
Default
C3h
05h
0Bh
00h
06h
3Ah
C2h
Any register above address 0x08 is reserved for testing and should not be written to because it may change the
function of the device. If read, these bits may assume any value.
Some of the default values can be reprogrammed through the I2C interface and written to the EEPROM. This
function is useful to speed up the turn-on time of the device and minimizes the number of I2C writes. If this is
required, contact your local TI representative.
The TPA2016D2 I2C address is 0xB0 (binary 10110000) for writing and 0xB1 (binary 10110001) for reading. If a
different I2C address is required, please contact your local TI representative. See the General I2C operation
section for more detail.
The following tables show the details of the registers, the default values, and the values that can be programmed
through the I2C interface.
22
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
IC FUNCTION CONTROL (Address: 1)
REGISTER
ADDRESS
01 (01H) – IC
Function Control
I2C BIT
LABEL
DEFAULT
DESCRIPTION
7
SPK_EN_R
1 (enabled)
Enables right amplifier
6
5
4
SPK_EN_L
SWS
FAULT_R
1 (enabled)
0 (enabled)
0
3
FAULT_L
0
2
1
0
Thermal
UNUSED
NG_EN
0
1
1 (enabled)
Enables left amplifier
Shutdown IC when bit = 1
Changes to a 1 when there is a short on the right channel. Reset by writing
a 0.
Changes to a 1 when there is a short on the left channel. Reset by writing a
0
Changes to a 1 when die temperature is above 150°C
Enables Noise Gate function
SPK_EN_R:
Enable bit for the right-channel amplifier. Amplifier is active when bit is high. This function is
gated by thermal and returns once the IC is below the threshold temperature.
SPK_EN_L:
Enable bit for the left-channel amplifier. Amplifier is active when bit is high. This function is
gated by thermal and returns once the IC is below the threshold temperature
SWS:
Software shutdown control. The device is in software shutdown when the bit is '1' (control, bias
and oscillator are inactive). When the bit is '0' the control, bias and oscillator are enabled.
Fault_L:
This bit indicates that an over-current event has occurred on the left channel with a '1'. This bit
is cleared by writing a '0' to it.
Fault_R:
This bit indicates that an over-current event has occurred on the right channel with a '1'. This
bit is cleared by writing a '0' to it.
Thermal:
This bit indicates a thermal shutdown that was initiated by the hardware with a '1'. This bit is
deglitched and latched, and can be cleared by writing a '0' to it.
NG_EN:
Enable bit for the Noise Gate function. This function is enabled when this bit is high. This
function can only be enabled when the Compression ratio is not 1:1.
AGC ATTACK CONTROL (Address: 2)
REGISTER
ADDRESS
02 (02H) –
AGC Control
ATK_time
I2C
BIT
7:6
5:0
LABEL
Unused
ATK_time
DEFAULT
00
000101
(6.4 ms/6 dB)
DESCRIPTION
AGC Attack time (gain ramp down)
Per Step
Per 6 dB
90% Range
000001
0.1067 ms
1.28 ms
5.76 ms
000010
0.2134 ms
2.56 ms
11.52 ms
000011
0.3201 ms
3.84 ms
17.19 ms
000100
0.4268 ms
5.12 ms
23.04 ms
(time increases by 0.1067 ms with every step)
111111
6.722 ms
80.66 ms
362.99 ms
These bits set the attack time for the AGC function. The attack time is the minimum time
between gain decreases.
23
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SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
AGC RELEASE CONTROL (Address: 3)
I2C
BIT
7:6
5:0
REGISTER
ADDRESS
03 (03H) –
AGC Release
Control
REL_time
LABEL
Unused
REL_time
DEFAULT
00
001011
(1.81 sec/6 dB)
DESCRIPTION
AGC Release time (gain ramp down)
Per Step
Per 6 dB
000001
0.0137 s
0.1644 s
000010
0.0274 s
0.3288 s
000011
0.0411 s
0.4932 s
000100
0.0548 s
0.6576 s
(time increases by 0.0137 s with every step)
111111
0.8631 s
10.36 s
90% Range
0.7398 s
1.4796 s
2.2194 s
2.9592 s
46.6 s
These bits set the release time for the AGC function. The release time is the minimum time
between gain increases.
AGC HOLD TIME CONTROL (Address: 4)
REGISTER
ADDRESS
04 (04H) –
AGC Hold
Time
Control
Hold_time
2
I C BIT
7:6
5:0
LABEL
Unused
Hold_time
DEFAULT
00
000000
(Disabled)
DESCRIPTION
AGC Hold time
Per Step
000000
Hold Time Disable
000001
0.0137 s
000010
0.0274 s
000011
0.0411 s
000100
0.0548 s
(time increases by 0.0137 s with every step)
111111
0.8631 s
These bits set the hold time for the AGC function. The hold time is the minimum time between
a gain decrease (attack) and a gain increase (release). The hold time can be deactivated.
24
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TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
AGC FIXED GAIN CONTROL (Address: 5)
REGISTER
ADDRESS
05 (05H) –
AGC Fixed
Gain Control
Fixed Gain
I2C
BIT
7:6
5:0
LABEL
Unused
Fixed Gain
DEFAULT
00
00110 (6dB)
DESCRIPTION
Sets the fixed gain of the amplifier: two's compliment
Gain
100100
–28 dB
100101
–27 dB
100110
–26 dB
(gain increases by 1 dB with every step)
111101
–3 dB
111110
–2 dB
111111
–1 dB
000000
0 dB
000001
1 dB
000010
2 dB
000011
3 dB
(gain increases by 1dB with every step)
011100
28 dB
011101
29 dB
011110
30 dB
These bits are used to select the fixed gain of the amplifier. If the Compression is enabled,
fixed gain is adjustable from –28dB to 30dB. If the Compression is disabled, fixed gain is
adjustable from 0dB to 30dB.
25
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SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
AGC CONTROL (Address: 6)
REGISTER
ADDRESS
06 (06H) –
AGC Control
I2C
BIT
7
6:5
4:0
LABEL
DEFAULT
Output Limiter
Disable
NoiseGate
Threshold
0 (enable)
Output Limiter
Level
11010 (6.5dBV)
01 (4mVrms)
DESCRIPTION
Disables the output limiter function. Can only be disabled when the AGC
compression ratio is 1:1 (off)
Select the threshold of the noise gate
Threshold
00
1 mVrms
01
4 mVrms
10
10 mVrms
11
20 mVrms
Selects the output limiter level
Output Power
Peak Output
dBV
(Wrms)
Voltage (Vp)
00000
0.03
0.67
–6.5
00001
0.03
0.71
–6
00010
0.04
0.75
–5.5
(Limiter level increases by 0.5dB with every step)
11101
0.79
3.55
8
11110
0.88
3.76
8.5
11111
0.99
3.99
9
Output Limiter
Disable
This bit disables the output limiter function when set to 1. Can only be disabled when
the AGC compression ratio is 1:1
NoiseGate Threshold
These bits set the threshold level of the noise gate. NoiseGate Threshold is only
functional when the compression ratio is not 1:1
Output Limiter Level
These bits select the output limiter level. Output Power numbers are for 8Ω load.
AGC CONTROL (Address: 7)
REGISTER
ADDRESS
07 (07H) –
AGC Control
I2C
BIT
7:4
LABEL
Max Gain
DEFAULT
1100 (30 dB)
DESCRIPTION
Selects the maximum gain the AGC can achieve
0000
0001
0010
(gain increases by 1 dB with every step)
1100
3:2
1:0
Unused
Compression
Ratio
00
10 (4:1)
Gain
18 dB
19 dB
20 dB
30 dB
Selects the compression ratio of the AGC
00
01
10
11
Ratio
1:1 (off)
2:1
4:1
8:1
Compression Ratio These bits select the compression ratio. Output Limiter is enabled by default when the
compression ratio is not 1:1.
Max Gain
These bits select the maximum gain of the amplifier. In order to maximize the use of the
AGC, set the Max Gain to 30dB
26
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Product Folder Link(s): TPA2016D2
TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
DECOUPLING CAPACITOR ＝S)
The TPA2016D2 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling
to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients,
spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-µF ceramic capacitor
(typically) placed as close as possible to the device PVDD (L, R) lead works best. Placing this decoupling
capacitor close to the TPA2016D2 is important for the efficiency of the Class-D amplifier, because any resistance
or inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering
lower-frequency noise signals, a 4.7 µF or greater capacitor placed near the audio power amplifier would also
help, but it is not required in most applications because of the high PSRR of this device.
INPUT CAPACITORS ＝I)
The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in
Equation 5.
1
fC =
(2p ´ RI ´ CI )
(5)
The value of the input capacitor is important to consider as it directly affects the bass (low frequency)
performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the
corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase
output offset. Equation 6 is used to solve for the input coupling capacitance. If the corner frequency is within the
audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance
causes an impedance mismatch at the corner frequency and below.
1
CI =
(2p ´ RI ´ fC )
(6)
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use non solder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 41 and Table 5 shows the appropriate diameters for a
WCSP layout. The TPA2016D2 evaluation module (EVM) layout is shown in the next section as a layout
example.
27
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TPA2016D2
SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
Figure 41. Land Pattern Dimensions
Table 5. Land Pattern Dimensions (1)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
SOLDER PAD
DEFINITIONS
COPPER PAD
SOLDER MASK (5)
OPENING
COPPER
THICKNESS
Non solder mask
defined (NSMD)
275 µm
(+0.0, –25 µm)
375 µm
(+0.0, –25 µm)
1 oz max (32 µm)
(2) (3) (4)
STENCIL (6)
(7)
OPENING
275 µm × 275 µm Sq. (rounded
corners)
STENCIL
THICKNESS
125 µm thick
Circuit traces from NSMD defined PWB lands should be 75 µm to 100 µm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
Solder mask thickness should be less than 20 µm on top of the copper circuit pattern
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
COMPONENT LOCATION
Place all the external components very close to the TPA2016D2. Placing the decoupling capacitor, CS, close to
the TPA2016D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
TRACE WIDTH
Recommended trace width at the solder balls is 75 µm to 100 µm to prevent solder wicking onto wider PCB
traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2016D2, use 100-µm trace
widths at the solder balls and at least 500-µm PCB traces to ensure proper performance and output power for
the device. For the remaining signals of the TPA2016D2, use 75-µm to 100-µm trace widths at the solder balls.
The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation
28
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TPA2016D2
www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009
EFFICIENCY AND THERMAL INFORMATION
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the packages are shown in the dissipation rating table. Converting this to θJA for the WCSP package:
100°C/W
(7)
Given θJA of 100°C/W, the maximum allowable junction temperature of 150°C, and the maximum internal
dissipation of 0.4 W (0.2 W per channel) for 1.5 W per channel, 8-Ω load, 5-V supply, from Figure 15, the
maximum ambient temperature can be calculated with the following equation.
TA Max = TJMax - qJA PDMAX = 150 - 100 (0.4) = 110°C
(8)
Equation 8 shows that the calculated maximum ambient temperature is 110°C at maximum power dissipation
with a 5-V supply and 8-Ω a load. The TPA2016D2 is designed with thermal protection that turns the device off
when the junction temperature surpasses 150°C to prevent damage to the IC. Also, using speakers more
resistive than 8-Ω dramatically increases the thermal performance by reducing the output current and increasing
the efficiency of the amplifier.
OPERATION WITH DACS AND CODECS
In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor
from the audio amplifier. This occurs when mixing of the output frequencies of the CODEC/DAC mix with the
switching frequencies of the audio amplifier input stage. The noise increase can be solved by placing a low-pass
filter between the CODEC/DAC and audio amplifier. This filters off the high frequencies that cause the problem
and allow proper performance. See the functional block diagram.
FILTER FREE OPERATION AND FERRITE BEAD FILTERS
A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the
frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC
and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead,
choose one with high impedance at high frequencies, and low impedance at low frequencies. In addition, select a
ferrite bead with adequate current rating to prevent distortion of the output signal.
Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads
from amplifier to speaker. Figure 42 shows typical ferrite bead and LC output filters.
Ferrite
Chip Bead
OUTP
1 nF
Ferrite
Chip Bead
OUTN
1 nF
Figure 42. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A)
29
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SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com
Revision History
Changes from Original (June 2008) to Revision A ......................................................................................................... Page
•
Changed From: 1.4 W/Ch Into 8 Ω at 5 V (10% THD+N) To: 1.7 W/Ch Into 8 Ω at 5 V (10% THD+N)............................... 1
Changes from Revision A (June 2008) to Revision B .................................................................................................... Page
•
•
•
•
Changed Feature High PSRR From: 75 dB at 217 Hz To: 80 dB ......................................................................................... 1
Added 00 to Default column ................................................................................................................................................ 23
Added 00 to Default column ................................................................................................................................................ 24
Added 00 to Default column ................................................................................................................................................ 24
Changes from Revision B (June 2008) to Revision C .................................................................................................... Page
•
Changed RLOADfrom 6.4 Ω to 3.2Ω ....................................................................................................................................... 3
Changes from Revision C (October 2008) to Revision D ............................................................................................... Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added Feature: 2.8 W/Ch Into 4 Ω at 5 V (10% THD+N)...................................................................................................... 1
Added Feature: 1.5 W/Ch Into 4 Ω at 3.6 V (10% THD+N)................................................................................................... 1
Added the RTJ (QFN) package. ............................................................................................................................................ 1
Added the RTJ (QFN) pin out package. ................................................................................................................................ 2
Added the RTJ (QFN) package to the Dissipation Ratings Table. ....................................................................................... 3
Changed the RTJ Package Options to the Available Options Table..................................................................................... 4
Changed ISWS Softwre shutdown 3.6V From: Max 60 To: 70 A ............................................................................................ 4
Changed ISWS Softwre shutdown 5.5V From: Max 100 to 110 A........................................................................................... 4
Changed Output offset TYP From 0 mV To: 2 mV................................................................................................................ 4
Added text notes 4 and 5 to the Test Set-Up for Graphs. ..................................................................................................... 5
Deleted Table of Graphs from the Typical Characteristics. ................................................................................................... 7
Added 4Ω Efficiency Graph ................................................................................................................................................... 9
Added 4Ω Total Power Dissipation Graph............................................................................................................................. 9
Added 4Ω Total Supply Current Graph.................................................................................................................................. 9
Added QFN Output Power Graph........................................................................................................................................ 10
30
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPA2016D2RTJR
ACTIVE
QFN
RTJ
20
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA
2016D2
TPA2016D2RTJT
ACTIVE
QFN
RTJ
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA
2016D2
TPA2016D2YZHR
ACTIVE
DSBGA
YZH
16
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
CCJ
TPA2016D2YZHT
ACTIVE
DSBGA
YZH
16
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
CCJ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPA2016D2RTJR
QFN
RTJ
20
3000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
TPA2016D2RTJR
QFN
RTJ
20
3000
330.0
12.4
4.3
4.3
1.1
8.0
12.0
Q2
TPA2016D2RTJT
QFN
RTJ
20
250
180.0
12.4
4.3
4.3
1.1
8.0
12.0
Q2
TPA2016D2RTJT
QFN
RTJ
20
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
TPA2016D2YZHR
DSBGA
YZH
16
3000
178.0
8.4
2.18
2.18
0.81
4.0
8.0
Q1
TPA2016D2YZHR
DSBGA
YZH
16
3000
180.0
8.4
2.18
2.18
0.81
4.0
8.0
Q1
TPA2016D2YZHT
DSBGA
YZH
16
250
180.0
8.4
2.18
2.18
0.81
4.0
8.0
Q1
TPA2016D2YZHT
DSBGA
YZH
16
250
178.0
8.4
2.18
2.18
0.81
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA2016D2RTJR
QFN
RTJ
20
3000
367.0
367.0
35.0
TPA2016D2RTJR
QFN
RTJ
20
3000
370.0
355.0
55.0
TPA2016D2RTJT
QFN
RTJ
20
250
195.0
200.0
45.0
TPA2016D2RTJT
QFN
RTJ
20
250
210.0
185.0
35.0
TPA2016D2YZHR
DSBGA
YZH
16
3000
217.0
193.0
35.0
TPA2016D2YZHR
DSBGA
YZH
16
3000
182.0
182.0
17.0
TPA2016D2YZHT
DSBGA
YZH
16
250
182.0
182.0
17.0
TPA2016D2YZHT
DSBGA
YZH
16
250
217.0
193.0
35.0
Pack Materials-Page 2
D: Max = 2.164 mm, Min =2.104 mm
E: Max = 2.142 mm, Min =2.082 mm
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