TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 2.9 W/Channel Mono Class-D Audio Subsystem with DirectPath™ Headphone Amplifier & SpeakerGuard™ FEATURES 1 • Mono Class-D Amp: 730 mW into 8 Ω from 3.6 V Supply (1% THD) • Class-D Bypass Switches • DirectPath™ Stereo Headphone Amplifier – No Output Capacitors Required • SpeakerGuard™ Automatic Gain Control (AGC) • One Differential Mono and Two Stereo Single-Ended Inputs • 3:1 Input MUX with Mode Control • 32-Step Volume Control for Both Input Channels • Independent Volume Controls for All Inputs • Independent Shutdown for Headphone and Class-D Amplifiers • I2C™ Interface • Short-Circuit and Thermal-Overload Protection • Operates from 2.5 V to 5.5 V • 25-Ball 2,16 mm × 2,11 mm, 0,4 mm pitch WCSP 23 APPLICATIONS • • • • Smart Phones / Cellular Phones Portable Media Players Portable Gaming Multimedia Platforms DESCRIPTION The TPA2051D3 is an audio subsystem with a mono Class-D power amplifier, a stereo DirectPath headphone amplifier, and bypass switches. The DirectPath headphone amplifier eliminates the need for external dc-blocking output capacitors. The built-in charge pump creates a negative supply voltage for the headphone amplifier, allowing a 0 V dc bias at the output. The DirectPath headphone amplifier drives 25 mW into 16 Ω speakers from a 4.2 V supply. The subsystem includes three inputs: A differential mono input and two stereo single-ended (SE) inputs. The stereo inputs are also configurable as differential mono inputs. Each input channel has an independent volume control. Seven operating modes provide input-to-output combinations and shutdown control. Operating mode and volume levels are controlled over a 1.8 V compatible I2C interface. The TPA2051D3 uses SpeakerGuardTM technology to prevent output clipping distortion and excessive power to the speaker and headphones. The Class-D amplifier includes a bypass mode. This allows the baseband IC (BB) to directly drive the 8Ω speaker. This is useful for dual-mode speaker phones in voice–only mode. The Class-D amplifier uses 4.9 mA and the DirectPath amplifier uses 4.1 mA of typical quiescent current. Total supply current reduces to less than 1 µA in shutdown. The TPA2051D3 is available in a 25-bump 2,16 mm × 2,11 mm, 0,4 mm pitch WCSP with less than 0.8 mm height. Bypass+ BypassMono+ ABB Mono- Left (SE) TPA2051D3 Mono Class-D plus DirectPathTM 8 Dual-Mode Speaker Codec (MP3) Right (SE) Left (SE) Stereo Headphone Jack FM Tuner Right (SE) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DirectPath, SpeakerGuard are trademarks of Texas Instruments. I2C is a trademark of Phillips Electronics. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL BLOCK DIAGRAM PVDD 1 mF BYPASS+ MONO+ MONO- Voice- Mode Bypass + – PVDD Gain Select: -60 dB to +18 dB Volume Control PWM +12 dB +6 dB HBridge OUT+ OUT- PGND BYPASSVoice - Mode Bypass INL1 Mux + Mode Control + -60 dB to +18 dB Volume Control INR1 SpeakerGuard ™ AGC INL2 -60 dB to +18 dB Volume Control HPVDD Gain Select: 0 dB to -12 dB HPL HPVSS HPVDD 1.5 dB/ step INR2 HPR HPVSS DVDD SDA I2C Interface SCL CPP Bias Control and Pop Suppression EN VREF 1 mF AGND Charge Pump 1 mF CPN HPVDD 2.2 mF HPVSS PGND 2.2 mF AVDD 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 DEVICE PINOUT A1 A2 A3 A4 A5 OUT+ PVDD PGND OUT– CPN B1 B2 B3 B4 B5 AVDD BYPASS+ BYPASS– DVDD CPP C1 C2 C3 C4 C5 MONO– SDA SCL EN HPL D1 D2 D3 D4 D5 MONO+ INL2 INL1 HPVDD HPVSS E1 E2 E3 E4 E5 INR2 INR1 VREF AGND HPR Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 3 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com PIN FUNCTIONS PIN INPUT/ OUTPUT/ POWER (I/O/P) DESCRIPTION NAME BALL WCSP OUT+ A1 O Speaker positive output; connect to + terminal of loudspeaker PVDD A2 P Supply for Class-D amplifier. Connect to voltage supply PGND A3 P Ground for Class-D amplifier; connect to GND directly or to the ground plane OUT– A4 O Speaker negative output; connect to – terminal of loudspeaker CPN A5 P Charge pump flying capacitor negative terminal. Connect negative side of capacitor between CPP and CPN AVDD B1 P Connect to voltage supply BYPASS+ B2 I Bypass Mode positive input BYPASS– B3 I Bypass Mode negative input DVDD B4 P Connect to I2C bus supply voltage CPP B5 P Charge pump flying capacitor positive terminal. Connect positive side of capacitor between CPP and CPN MONO– C1 I Mono negative differential input SDA C2 I/O I2C data input SCL C3 I I2C clock input EN C4 I Master shutdown HPL C5 O Headphone left channel output MONO+ D1 I Mono positive differential input INL2 D2 I Input channel 2 left input INL1 D3 I Input channel 1 left input HPVDD D4 O Headphone reference voltage. Connect to 2.2 µF capacitor to ground HPVSS D5 P Negative supply generated by the charge pump. Connect a 2.2 µF cap to ground to reduce voltage ripple INR2 E1 I Input channel 2 right input INR1 E2 I Input channel 1 right input VREF E3 I Reference voltage. Connect to 1 µF capacitor to ground AGND E4 P Connect to ground plane HPR E5 O Headphone right channel output ORDERING INFORMATION TA PACKAGED DEVICES (1) –40°C to 85°C (1) (2) 4 25-ball WSCP PART NUMBER (2) SYMBOL TPA2051D3YFFR TPA2051 TPA2051D3YFFT TPA2051 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. The YFF package is only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range, TA = 25°C (unless otherwise noted) VALUE / UNIT Supply voltage, AVDD, PVDD –0.3 V to 6.0 V I2C Supply Voltage DVDD VI –0.3 to 3.6 V Input Voltage –0.3 V to AVDD + 0.3 V Output Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40°C to 85°C TJ Operating junction temperature range –40°C to 150°C Tstg Storage temperature range –65°C to 85°C DISSIPATION RATINGS PACKAGE TA < 25°C POWER RATING OPERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING YFF (WCSP) 845 mW 6.757 mW/°C 540 mW 440 mW RECOMMENDED OPERATING CONDITIONS MIN MAX Supply voltage, AVDD, PVDD 2.5 5.5 V I2C supply voltage, DVDD 1.7 3.3 V VIH High-level input voltage VIL Low-level input voltage TA SDA, SCL, EN, DVDD = 1.8 V 1.3 SDA, SCL, EN, DVDD = 3.3 V 3.0 UNIT V V SDA, SCL, EN, DVDD = 1.8 V 0.3 V SDA, SCL, EN, DVDD = 3.3 V 0.3 V 85 °C MAX UNIT Operating free-air temperature –40 ELECTRICAL CHARACTERISTICS over operating free-air temperature range, TA = 25°C (unless otherwise noted) MIN TYP Power supply rejection ratio (Class-D amplifier) PARAMETER AVDD = PVDD = 2.5 V to 5.5 V, Single-ended modes TEST CONDITIONS 60 75 dB Power supply rejection ratio (headphone amplifiers) AVDD = PVDD = 2.5 V to 5.5 V, Single-ended modes 75 85 dB High-level input current (SDA, SCL, EN) 1 µA Low-level input current (SDA, SCL, EN) 1 µA Supply current AVDD = PVDD = 2.5 V, Class-D and headphone amplifiers active, no load 6.3 7.5 mA AVDD = PVDD = 3.6 V, Class-D and headphone amplifiers active, no load 7.1 8.5 mA AVDD = PVDD = 3.6 V, headphone active, Class-D deactivated, no load 4.1 5.25 mA AVDD = PVDD = 3.6 V, Class-D active, headphone deactivated, no load 4.9 6.0 mA AVDD = PVDD = 2.5 V to 5.5 V, Full shutdown mode 0.2 1 µA Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 5 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com TIMING REQUIREMENTS For I2C Interface Signals and voltage power up sequence, over recommended operating conditions (unless otherwise noted) PARAMETER fSCL Frequency, SCL tW(H) Pulse duration, SCL high tW(L) tsu1 TEST CONDITIONS MIN No wait states TYP MAX UNIT 400 kHz 0.6 µs Pulse duration, SCL low 1.3 µs Setup time, SDA to SCL 100 ns th1 Hold time, SCL to SDA 10 ns t(buf) Bus free time between stop and start condition 1.3 µs tsu2 Setup time, SCL to start condition 0.6 µs th2 Hold time, start condition to SCL 0.6 µs tsu3 Setup time, SCL to stop condition 0.6 tpws Power up delay time, AVDD and PVDD to DVDD power up sequence tens Enable pin wait time tSWS tEN µs 100 µs 1000 µs SWS enable wait time 250 µs Spk_Enable, HPL_Enable, HPR_Enable wait time 250 µs tw(L) tw(H) SCL t su1 th1 SDA Figure 1. SCL and SDA Timing SCL th2 t(buf) tsu2 tsu3 Start Condition Stop Condition SDA Figure 2. Start and Stop Conditions Timing 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 PVDD AVDD tpws DVDD tens EN Figure 3. Supply Voltage Timing tSWS or tEN SDA SWS or EN Write Other Write 2 Figure 4. I C SWS and Enable Register Timing Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 7 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com OPERATING CHARACTERISTICS VDD = 3.6 V, TA = 25°C, Input gain = 0 dB, Class-D gain = +6 dB, Headphone gain = 0 dB, RSPEAKER = 8 Ω, RHEADPHONES = 16 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CLASS-D POWER AMPLIFIER PO Speaker output power THD = 1%, AVDD = PVDD = 4.2 V, f = 1 kHz 1000 THD = 1%, AVDD = PVDD = 3.6 V, f = 1 kHz 730 THD = 10%, AVDD = PVDD = 3.6 V, f = 1 kHz 900 THD = 10%, AVDD = PVDD = 5.0 V, f = 1 kHz, RSPEAKER = 4 Ω 2900 SNR Signal-to-noise ratio PO = 600 mW En Noise output voltage A-weighted THD+N Total harmonic distortion plus noise (1) PO = 400 mW, f = 1 kHz 0.06% PO = 1 W , AVDD = PVDD = 5.0 V, f = 1 kHz 0.04% AC PSRR AC-Power supply rejection ratio Thermal shutdown mW 97 dB 21 µVRMS 200 mVpp ripple, f = 217 Hz 77 dB 200 mVpp ripple, f = 10 kHz 68 dB Threshold 150 °C Hysteresis 15 °C 2 kΩ 25 mW ±0.6 mV Output impedance in shutdown HEADPHONE AMPLIFIER PO Headphone output power (2) THD = 1%, AVDD = PVDD = 3.0 V, f = 1 kHz, in-phase VOS Output Offset Voltage Volume at 0 dB Output impedance in shutdown Ω 25 SNR Signal-to-noise ratio PO = 20 mW 97 dB En Noise output voltage A-weighted 7.5 µVRMS THD+N Total harmonic distortion plus noise (1) PO = 20 mW, f = 1 kHz 0.02% PO = 20 mW into 32 Ω, f = 1 kHz 0.01% AC PSRR AC-Power supply rejection ratio fOSC Charge pump switching frequency ΔAV Gain matching HBM Electrostatic discharge RON THD 200 mVpp ripple, f = 217 Hz 95 200 mVpp ripple, f = 10 kHz 84 dB dB 1200 kHz Between Left and Right channels 0.1 dB HPLEFT and HPRIGHT ±8 kV Bypass switch on impedance AVDD = PVDD = 3 V, VDIFF = 2 VP-P, VCM = AVDD/2, Temp = 25°C 1.1 Total harmonic distortion VDIFF = 2 VP-P, f = 1 kHz, RSERIES = 10 Ω BYPASS MODE 2.7 Ω 0.02% Off attenuation 80 dB INPUT SECTION RIN Input impedance (per input pin) Volume Control gain = 18 dB VIN_MAX Maximum differential input signal swing Volume Control gain = –66 dB 8 kΩ 5.2 VP–P 2.6 Volume Control gain = 18 dB 0.22 GAIN = 0 dB, f = 1 kHz Start-up time from shutdown (1) (2) 5.0 Volume Control gain = 0 dB Gain matching Crosstalk 4.0 0.1 dB 60 dB 8 ms A-weighted Per output channel Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 TYPICAL CHARACTERISTICS AVDD = PVDD = 3.6 V, CI = CVREF = CF = 1 µF, CHPVDD = CHPVSS = 2.2 µF, TA = 25°C, unless otherwise specified Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB 1 0.1 0.01 0.001 100 1k f − Frequency − Hz 10k 20k VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 10 1 0.1 0.01 1m 10m 100m 1 2 Figure 6. TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE (HP) vs FREQUENCY VDD = 2.5 V, PO = 5 mW VDD = 3.6 V, PO = 10 mW VDD = 5.0 V, PO = 20 mW Stereo SE Input 1 Mode RL = 16 Ω Total Gain = 0 dB Out of Phase 0.1 0.01 0.001 20 100 1k f − Frequency − Hz 10k 10 VDD = 2.5 V, PO = 5 mW VDD = 3.6 V, PO = 10 mW VDD = 5.0 V, PO = 20 mW Stereo SE Input 1 Mode RL = 32 Ω Total Gain = 0 dB Out of Phase 1 0.1 0.01 0.001 20k 20 100 1k f − Frequency − Hz 10k 20k Figure 7. Figure 8. TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER 100 10 Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB Figure 5. 10 1 100 PO − Output Power − W THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 20 THD+N − Total Harmonic Distortion + Noise − % VDD = 2.5 V, PO = 150 mW VDD = 3.6 V, PO = 400 mW VDD = 5.0 V, PO = 800 mW THD+N − Total Harmonic Distortion + Noise − % 10 TOTAL HARMONIC DISTORTION + NOISE (SP) vs OUTPUT POWER Stereo SE Input 1 Mode RL = 16 Ω Total Gain = 0 dB In−Phase VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 1 0.1 0.01 100u 1m 10m 50m THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % TOTAL HARMONIC DISTORTION + NOISE (SP) vs FREQUENCY 100 10 Stereo SE Input 1 Mode RL = 16 Ω Total Gain = 0 dB Out of Phase VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 1 0.1 0.01 100u PO − Output Power − W 1m 10m 50m PO − Output Power − W Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 9 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) AVDD = PVDD = 3.6 V, CI = CVREF = CF = 1 µF, CHPVDD = CHPVSS = 2.2 µF, TA = 25°C, unless otherwise specified 100 Stereo SE Input 1 Mode RL = 32 Ω Total Gain = 0 dB In−Phase 10 VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 1 0.1 0.01 100u 1m 10m TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % TOTAL HARMONIC DISTORTION + NOISE (HP) vs OUTPUT POWER 50m 100 Stereo SE Input 1 Mode RL = 32 Ω Total Gain = 0 dB Out of Phase 10 1 0.1 0.01 100u 1m PO − Output Power − W Figure 12. POWER SUPPLY REJECTION RATIO (SP) vs FREQUENCY POWER SUPPLY REJECTION RATIO (HP) vs FREQUENCY 0 VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V −40 −60 −80 −100 100 1k f − Frequency − Hz 10k −20 VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V −40 −60 −80 20k 20 100 1k f − Frequency − Hz Figure 13. Figure 14. SUPPLY CURRENT (HP) vs TOTAL OUTPUT POWER SUPPLY CURRENT (HP) vs TOTAL OUTPUT POWER 100m 10k 20k 100m Stereo SE Input 1 Mode RL = 16 Ω Total Gain = 0 dB Out of Phase IDD − Supply Current − A IDD − Supply Current − A RL = 32 Ω Stereo SE Input 1 Mode Input Level = 0.2 Vpp Total Gain = 0 dB −100 20 10m Stereo SE Input 1 Mode RL = 32 Ω Total Gain = 0 dB Out of Phase 10m VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 1m VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 1m 1u 10u 100u 1m 10m 40m 1u PO − Total Output Power − W 10u 100u 1m 10m 40m PO − Total Output Power − W Figure 15. 10 50m Figure 11. RL = 8 Ω + 33 µH Mono Input Mode Input Level = 0.2 Vpp Total Gain = 0 dB −20 10m PO − Output Power − W PSRR − Power Supply Rejection Ratio − dB PSRR − Power Supply Rejection Ratio − dB 0 VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V Figure 16. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 TYPICAL CHARACTERISTICS (continued) AVDD = PVDD = 3.6 V, CI = CVREF = CF = 1 µF, CHPVDD = CHPVSS = 2.2 µF, TA = 25°C, unless otherwise specified TOTAL POWER DISSIPATION (SP) vs TOTAL OUTPUT POWER SUPPLY CURRENT (SP) vs TOTAL OUTPUT POWER 500m 120m Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB 450m 400m IDD − Supply Current − A PD − Total Power Dissipation − W 140m 100m 80m 60m 40m 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 350m 300m 250m 200m 150m 100m VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 20m Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 50m 0 0.0 1.8 0.2 0.4 0.6 PO − Total Output Power − W EFFICIENCY (SP) vs OUTPUT POWER OUTPUT POWER (SP) vs SUPPLY VOLTAGE 2.0 60 50 40 Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB 30 PO − Output Power − W η − Efficiency − % 70 20 VDD = 2.5 V VDD = 3.6 V VDD = 5.0 V 10 1.6 1.8 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Mono Input Mode RL = 8 Ω + 33 µH Total Gain = 6 dB 1.6 1.2 0.8 0.4 THD + N = 10% THD + N = 1% 0.0 2.5 1.8 3.0 3.5 4.0 4.5 5.0 5.5 VDD − Supply Voltage − V PO − Output Power − W Figure 19. Figure 20. OUTPUT POWER PER CHANNEL (HP) vs SUPPLY VOLTAGE OUTPUT POWER PER CHANNEL (HP) vs SUPPLY VOLTAGE 50m 40m 30m 20m Stereo SE Input 1 Mode RL = 16 Ω Total Gain = 0 dB Out of Phase 3.0 3.5 THD + N = 10% THD + N = 1% 4.0 4.5 5.0 5.5 PO − Output Power Per Channel − W 50m PO − Output Power Per Channel − W 1.4 2.4 80 0 2.5 1.2 Figure 18. 90 10m 1.0 Figure 17. 100 0 0.0 0.8 PO − Total Output Power − W 40m 30m 20m 10m Stereo SE Input 1 Mode RL = 32 Ω Total Gain = 0 dB Out of Phase 0 2.5 VDD − Supply Voltage − V 3.0 3.5 THD + N = 10% THD + N = 1% 4.0 4.5 5.0 5.5 VDD − Supply Voltage − V Figure 21. Figure 22. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 11 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) AVDD = PVDD = 3.6 V, CI = CVREF = CF = 1 µF, CHPVDD = CHPVSS = 2.2 µF, TA = 25°C, unless otherwise specified SPEAKER TO HEADPHONE CROSSTALK vs FREQUENCY COMMON-MODE REJECTION RATIO (SP) vs FREQUENCY Mono Input Mode Speaker RL = 8 Ω + 33 µH Headphone RL = 32 Ω PO = 250 mW −20 −40 Crosstalk − dB CMRR − Common−Mode Rejection Ratio − dB 0 −60 −80 −100 −120 −140 −160 0 RL = 8 Ω + 33 µH VDD = 3.6 V Input Level = 0.2 Vpp Total Gain = 6 dB −20 −40 −60 −80 −100 20 100 1k f − Frequency − Hz 10k 20k 20 100 1k f − Frequency − Hz 10k Figure 23. Figure 24. DIFFERENTIAL INPUT IMPEDANCE vs VOLUME CONTROL GAIN SINGLE-ENDED INPUT IMPEDANCE vs VOLUME CONTROL GAIN 100k 50k VDD = 3.6 V VDD = 3.6 V Single−Ended Input Impedance − Ω Differential Input Impedance − Ω 90k 80k 70k 60k 50k 40k 30k 20k 0 6 12 40k 35k 30k 25k 20k 15k 5k −66 −60 −54 −48 −42 −36 −30 −24 −18 −12 −6 Volume Control Gain − dB 18 SUPPLY CURRENT vs SUPPLY VOLTAGE SPEAKER LIMITER OUTPUT LEVEL vs INPUT LEVEL SPKR Enabled Only HP Enabled Only SPKR and HP Enabled 10 8 10 5 6 4 2 0 Limiter = 1.3 V Limiter = 1.65 V Limiter = 2.1 V Limiter = 2.6 V −4 4.0 4.5 5.0 5.5 −6 −20 VDD − Supply Voltage − V Figure 27. 12 18 Mono Input Mode RL = 8 Ω + 33 µH VDD = 5 V Total Gain = 16 dB −2 3.5 12 12 SPKR RL = 8 Ω + 33 µH HP RL = 32 Ω SPKR Total Gain = 6 dB HP Total Gain = 0 dB 3.0 6 Figure 26. 15 0 2.5 0 Figure 25. Output Level − dBV IDD − Supply Current − mA 20 45k 10k 10k −66 −60 −54 −48 −42 −36 −30 −24 −18 −12 −6 Volume Control Gain − dB 25 20k −15 −10 −5 Input Level − dBV 0 5 Figure 28. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 TYPICAL CHARACTERISTICS (continued) AVDD = PVDD = 3.6 V, CI = CVREF = CF = 1 µF, CHPVDD = CHPVSS = 2.2 µF, TA = 25°C, unless otherwise specified SPEAKER OUTPUT - STARTUP vs TIME SPEAKER OUTPUT - SHUTDOWN vs TIME 3.5 3.5 3.0 Speaker Output SDA 3.0 2.5 Startup Time = 7.8 ms 2.5 2.0 V − Voltage − V V − Voltage − V 2.0 Speaker Output SDA 1.5 1.0 0.5 1.5 1.0 0.5 0.0 0.0 −0.5 −0.5 −1.0 −1.0 −1.5 −1.5 0 2m 4m 6m 8m 10m 12m t − Time − s 14m 16m 18m 20m 0 1m 2m 3m t − Time − s 4m Figure 29. Figure 30. HEADPHONE OUTPUT - STARTUP vs TIME HEADPHONE OUTPUT - SHUTDOWN vs TIME 2.0 5m 2.0 HP Output SDA HP Output SDA 1.5 1.5 1.0 V − Voltage − V V − Voltage − V Startup Time = 7.4 ms 0.5 0.0 −0.5 1.0 0.5 0.0 −0.5 −1.0 −1.0 0 2m 4m 6m 8m 10m 12m t − Time − s 14m 16m 18m 20m 0 Figure 31. 1m 2m 3m t − Time − s 4m 5m Figure 32. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 13 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com APPLICATION CIRCUIT VBATT VBATT 1μ F 1 μF AVDD PVDD TPA2051D3 Voice-Mode Bypass BYPASS+ 9.1Ω VDD MONO+ ABB 1μF MONO + Gain Select: -66dB to +18dB Volume Control – 1μF Voice-Mode Bypass Mixer + Mode Control + AGC INL1 CODEC 1μF INR1 -66dB to +18dB Volume Control 1μF 1μF 1μF INR2 8Ω Dual-Mode Speaker OUT+ VDD Gain Select -12dB to 0dB INL2 FM Tuner HBridge PGND BYPASS9.1Ω OUTPWM +12 dB +6 dB HPLEFT Stereo Headphone Jack VSS VDD 1.5dB/ step -66dB to +18dB Volume Control HPRIGHT DVDD VSS SDA SCL I2C Interface CPP DBB Bias Control and Pop Suppression EN VREF 1μF AGND Charge Pump 1 μF CPN HPVDD HPVSS 2.2μF 2.2μF PGND Figure 33. Typical Apps Configuration with Differential Input Signals GENERAL I2C OPERATION The I2C bus employs two signals, SDA (data) and SCL (clock), to communicate between integrated circuits in a system. The bus transfers data serially one bit at a time. The address and data 8-bit bytes are transferred most significant bit (MSB) first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data terminal (SDA) while the clock is at logic high to indicate start and stop conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data-bit transitions bust occur within the low time of the clock period. Figure 34 shows a typical sequence. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another device and then waits for an acknowledge condition. The TPA2051D3 holds SDA low during the acknowledge clock period to indicate acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection. The TPA2051D3 operates as an I2C slave. The I2C voltage can not exceed the TPA2051D3 supply voltage, AVDD. An external pull-up resistor must be used for the SDA and SCL signals to set the logic high level for the bus. When the bus level is 3.3 V, use pull-up resistors between 660 Ω and 1.2 kΩ. 8- Bit Data for Register (N) 8- Bit Data for Register (N+1) Figure 34. Typical I2C Sequence 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is shown in Figure 34. SINGLE-AND MULTIPLE-BYTE TRANSFERS The serial control interface supports both single-byte and multi-byte read/write operations for all registers. During multiple-byte read operations, the TPA2051D3 responds with data, a byte at a time, starting at the register assigned, as long as the master device continues to respond with acknowledges. The TPA2051D3 supports sequential I2C addressing. For write transactions, if a register is issued followed by data for that register and all the remaining registers that follow, a sequential I2C write transaction has taken place. For I2C sequential write transactions, the register issued then serves as the starting point, and the amount of data subsequently transmitted, before a stop or start is transmitted, determines to how many registers are written. SINGLE-BYTE WRITE As shown in Figure 35, a single-byte data write transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a write data transfer, the read/write bit must be set to 0. After receiving the correct I2C device address and the read/write bit, the TPA2051D3 responds with an acknowledge bit. Next, the master transmits the register byte corresponding to the TPA2051D3 internal memory address being accessed. After receiving the register byte, the TPA2051D3 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write transfer. Start Condition Acknowledge A6 A5 A4 A3 A2 A1 A0 R/W ACK A7 Acknowledge A6 I2C Device Address and Read/Write Bit A5 A4 A3 A2 A1 A0 ACK D7 Acknowledge D6 D5 Register D4 D3 Data Byte D2 D1 D0 ACK Stop Condition Figure 35. Single-Byte Write Transfer MULTIPLE-BYTE WRITE AND INCREMENTAL MULTIPLE-BYTE WRITE A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes are transmitted by the master device to the TPA2051D3 as shown in Figure 36. After receiving each data byte, the TPA2051D3 responds with an acknowledge bit. Register Figure 36. Multiple-Byte Write Transfer SINGLE-BYTE READ As shown in Figure 37, a single-byte data read transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually done. Initially, a write is done to transfer the address byte of the internal memory address to be read. As a result, the read/write bit is set to a 0. After receiving the TPA2051D3 address and the read/write bit, the TPA2051D3 responds with an acknowledge Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 15 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com bit. The master then sends the internal memory address byte, after which the TPA2051D3 issues an acknowledge bit. The master device transmits another start condition followed by the TPA2051D3 address and the read/write bit again. This time, the read/write bit is set to 1, indicating a read transfer. Next, the TPA2051D3 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge followed by a stop condition to complete the single-byte data read transfer. Repeat Start Condition Start Condition Acknowledge A6 A5 A1 A0 R/W ACK A7 I2C Device Address and Read/Write Bit Acknowledge A6 A5 A4 Not Acknowledge Acknowledge A0 ACK A6 A5 A1 A0 R/W ACK D7 D6 I2C Device Address and Read/Write Bit Register D1 D0 ACK Stop Condition Data Byte Figure 37. Single-Byte Read Transfer MULTIPLE-BYTE READ A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes are transmitted by the TPA2051D3 to the master device as shown in Figure 38. With the exception of the last data byte, the master device responds with an acknowledge bit after receiving each data byte. Repeat Start Condition Start Condition Acknowledge A6 Acknowledge A0 R/W ACK A7 A6 I2C Device Address and Read/Write Bit A5 A0 ACK Acknowledge A6 A0 R/W ACK D7 I2C Device Address and Read/Write Bit Register Acknowledge Not Acknowledge D0 ACK D7 D0 ACK Acknowledge D0 ACK D7 First Data Byte Other Data Bytes Last Data Byte Stop Condition Figure 38. Multiple-Byte Read Transfer REGISTER MAPS REGISTER BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 0 Version[3] Version[2] Version[1] Version[0] Reserved Reserved Spk_Fault Thermal 1 LIM_SEL LIM_EN Reserved SWS HPL_Enable HPR_Enable Spk_Enable VM_Bypass 2 ATK_time[4] ATK_time[3] ATK_time[2] ATK_time[1] ATK_time[0] LIMSPK[2] LIMSPK[1] LIMSPK[0] 3 REL_time[4] REL_time[3] REL_time[2] REL_time[1] REL_time[0] LIMHP[2] LIMHP[1] LIMHP[0] 4 Mode[2] Mode[1] Mode[0] MON_Vol[4] MON_Vol[3] MON_Vol[2] MON_Vol[1] MON_Vol[0] 5 SPK_Gain HP_0dB Reserved ST1_Vol[4] ST1_Vol[3] ST1_Vol[2] ST1_Vol[1] ST1_Vol[0] 6 HP_Gain[2] HP_Gain[1] HP_Gain[0] ST2_Vol[4] ST2_Vol[3] ST2_Vol[2] ST2_Vol[1] ST2_Vol[0] Bits labeled “Reserved” are reserved for future enhancements. They may not be written to as it may change the function of the device. If read, these bits may assume any value. The TPA2051D3 I2C address is 0xE0 (binary 11100000) for writing and 0xE1 (binary 11100001) for reading. Refer to the General I2C Operation section for more details Fault Register (Address: 0) BIT 7 6 5 4 3 2 1 0 Function Version[3] Version[2] Version[1] Version[0] Reserved Reserved Spk_Fault Thermal Reset Value 0 0 0 0 0 0 0 0 16 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 Version[3:0] Read-only bits that indicate the silicon revision. Spk_Fault Logic high indicates an output over-current event has occurred on the Class-D channel output. This bit is clear-on-write. Thermal Logic high indicates thermal shutdown activated. Bit automatically clears when the thermal condition lowers past the hysteresis threshold. Reserved These bits are reserved for future enhancements. If read these bits may assume any value. Amplifier Control Register (Address: 1) BIT 7 6 5 4 3 2 1 0 Function LIM_SEL LIM_EN Reserved SWS HPL_Enable HPR_Enable Spk_Enable VM_Bypass Reset Value 1 0 0 0 0 0 0 1 LIM_SEL Selects which limiter register value is used. Set to logic high for LIMSPK[2:0]. Set to logic low for LIMHP[2:0]. Default is 1 (speaker limiter selected). LIM_EN AGC limiter function enable. Set to logic high to enable the limiter function. SWS Software Shutdown Mode. Set to logic high to deactivate the amplifier. HPL_Enable Headphone left channel enable. Set to logic low to deactivate left channel. HPR_Enable Headphone right channel enable. Set to logic low to deactivate right channel. Spk_Enable Class-D power amplifier enable. Set to logic low to deactivate speaker Class-D power amplifier. VM_Bypass Speaker bypass mode. Set to logic low to deactivate speaker bypass. Setting VM_Bypass to 1 forces SPK_Enable to 0 and bypasses the volume control. The headphone amplifiers can still be enabled/disabled and the volume control for inputs 1 and 2 are still active. Reserved These bits are reserved for future enhancements. If read these bits may assume any value. Attack Time and Speaker Limiter Control Register (Address: 2) BIT 7 6 5 4 3 2 1 0 Function ATK_time[4] ATK_time[3] ATK_time[2] ATK_time[1] ATK_time[0] LIMSPK[2] LIMSPK[1] LIMSPK[0] Reset Value 0 0 1 0 0 1 0 1 ATK_time [4:0] Five bit attack time (gain decrease) control for the AGC. 00000 sets to the lowest attack time. Default setting on power up is 00100 (6.4 ms / step) LIMSPK[2:0] Three-bit limiter level control for the speaker amplifier. 000 sets to the lowest limiter level. Default setting on power-up is 101 (4.2 Vpeak) Release Time and Headphone Limiter Level Control Register (Address: 3) BIT 7 6 5 4 3 2 1 0 Function REL_time[4] REL_time[3] REL_time[2] REL_time[1] REL_time[0] LIMHP[2] LIMHP[1] LIMHP[0] Reset Value 0 1 0 1 0 1 1 1 REL _time [4:0] Five bit release time (gain increase) control for the AGC. 00000 sets to the lowest release time. Default setting on power up is 01010 (451 ms / step) LIMHP [2:0] Three-bit limiter level control for the headphone amplifier. 000 sets to the lowest limiter level. Default setting on power-up is 111 (highest setting) Mode / Mono Input Volume Control Register (Address: 4) Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 17 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com BIT 7 6 5 4 3 2 1 0 Function Mode[2] Mode[1] Mode[0] MON_Vol[4] MON_Vol[3] MON_Vol[2] MON_Vol[1] MON_Vol[0] Reset Value 0 0 0 0 1 1 0 1 Mode[2:0] Sets mux output mode. Refer to Modes of Operation section for details. Default mode is 000 (Mono Input selected) on power-up. MON_Vol[4:0] Five-bit volume control for Mono input mode (mode 0). 11111 sets device to its highest channel gain; 00000 sets device to its lowest channel gain. Default setting on power-up is 01101 (0 dB). Stereo Input 1 / Output Gain Control Register (Address: 5) BIT 7 6 5 4 3 2 1 0 Function SPK_Gain HP_0dB Reserved ST1_Vol[4] ST1_Vol[3] ST1_Vol[2] ST1_Vol[1] ST1_Vol[0] Reset Value 0 0 0 0 1 1 0 1 SPK_Gain Class-D speaker amplifier gain. Set to logic high for 12 dB Class-D gain. Set to logic low for 6 dB Class-D gain. HP_0dB Set bit to 1 to set HP amp gain to 0 dB regardless of HP_Gain[2:0] setting. The default is 0. Reserved These bits are reserved for future enhancements. Do not write to these bits as writing to these bits may change device function. If read these bits may assume any value. ST1_Vol[4:0] Five-bit volume control for Stereo Input 1 (modes 1, 3, 5, and 6): INL1 and INR1. 11111 sets device to its highest gain; 00000 sets device to its lowest gain. Default setting on power-up is 01101 (0 dB). Stereo Input 2 / Headphone Gain Control Register (Addresses: 6) BIT 7 6 5 4 3 2 1 0 Function HP_Gain[2] HP_Gain1] HP_Gain[0] ST2_Vol[4] ST2_Vol[3] ST2_Vol[2] ST2_Vol[1] ST2_Vol[0] Reset Value 0 0 0 0 1 1 0 1 HP_Gain [2:0] Headphone gain select. Sets the gain of the headphone output amplifiers according to Table 2. The default is 000. ST2_Vol[4:0] 18 Five-bit volume control for Stereo Input 2 (modes 2 and 4): INL2 and INR2. 11111 sets device to its highest gain; 00000 sets device to its lowest gain. Default setting on power-up is 01101 (0 dB). Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 MODES OF OPERATION The TPA2051D3 supports numerous modes of operation. "Stereo 1" refers to the INL1 and INR1 input pair; "Stereo 2" refers to the INL2 and INR2 input pair. The "Mono Diff 1" input refers to the differential input at INL1 INR1 and "Mono Diff 2" refers to the differential input at INL2 - INR2, which are typically connected to the differential output of the baseband IC. "Mono" refers to the Mono+ – Mono– differential input. Use the following sequence to prevent pop when changing modes: • Change Mode[2:0] bits to 111 (Mute) • Change to desired new Mode[2:0] Mux Output Mode The input mux selects which device input is directed to both the Class-D and headphone amplifiers. Mux summing and output are after the channel volume controls, as shown in the Simplified Functional Diagram on page 2. Control the mux through the Mode[2:0] bits in Mux Output Control (Register 2, Bits 0 – 2) according to the table below. MODE BYTE: MODE[2:0] MUX MODE HEADPHONE OUTPUT SPEAKER OUTPUT LEFT RIGHT 0 [000] Mono Input Mono+ – Mono– Mono+ – Mono– Mono+ – Mono– 1 [001] Mono Diff Input 1 L1 – R1 L1 – R 1 L1 – R 1 2 [010] Mono Diff Input 2 L2–R2 L2–R2 L2–R2 3 [011] Stereo SE Input 1 L1 + R 1 L1 R1 4 [100] Stereo SE Input 2 L2 + R2 L2 R2 5 [101] Mono Diff Input 1 + 2 (L1 – R1) + (L2 – R2) (L1 – R1) + (L2 – R2) (L1 – R1) + (L2 – R2) 6 [110] Mono SE Input 1 + 2 (L1 – R1) + (L2 – R2) (L1 – R1) (L2 – R2) 7 [111] MUTE MUTE MUTE MUTE Voice-Mode Bypass Enable Voice-Mode Bypass mode by setting VM_Bypass (Register 1, Bit 0) to logic high. This deactivates the Class-D amplifier regardless of Spk_Enable bit status, and enables the bypass mode around the Class-D amp, connecting BYPASS+ to OUT+ and BYPASS– to OUT–. This allows the baseband IC to drive the dual-mode loudspeaker directly without using the Class-D amplifier, saving power and reducing noise for low-power voice-only phone modes. POWER–UP SEQUENCE AND TIMING The TPA2051D3 startup sequence is shown in Figure 3. It is important to minimize the time delay between powering up AVDD/PVDD and powering up DVDD in order to minimize potential spikes in the supply current. It is important to observe the minimum delay time between powering up DVDD and enabling the TPA2051D3 (changing EN pin from LOW to HIGH) in order to prevent spikes in the supply current. After changing SWS from logic HIGH (amplifier disabled) to logic LOW (amplifier enabled) wait 250 µsec, before the next I2C write (refer to Figure 4). After changing Spk_Enable, HPL_Enable, or HPR_Enable from logic LOW (amplifier disabled) to logic HIGH (amplifier enabled) wait 250 µsec, before the next I2C write (refer to Figure 4). When enabling the Class-D amplifier (Spk_Enable from LOW to HIGH) and/or the headphone amplifiers (HPL_Enable or HPR_Enable from LOW to HIGH) for the first time after changing EN from LOW to HIGH follow this sequence: • Set Mode[2:0] to 111 • Change VM_Bypass to 0 and Spk_Enable (and/or HPx_Enable) to 1 • Change to desired Mode[2:0] Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 19 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com OPERATION WITH DELAYED DVDD SUPPLY In case the DVDD supply can not be available within tpws(refer to Figure 3) use the supply of TPA2051D3 (AVDD or PVDD) to power up DVDD. Refer to Figure 39 for an application diagram. The TPA2051D3 DVDD supply must be less than or equal to SDA/SCL VIH. SDA/SCL VIH can be higher than DVDD but must be lower than PVDD. PVDD/AVDD DVDD DVDD BB IC TPA2051D3 SCL SCL SDA SDA GPIO (EN) 8Ω Dual-Mode Speaker EN Stereo Headphone Jack Figure 39. Operation With Delayed DVDD Supply SHUTDOWN CONTROL AND POWER MANAGEMENT Power management for the TPA2051D3 is divided into four sections: Class-D power amplifier, headphone left amplifier, headphone right amplifier, and bypass mode. Each section has its own enable bit in the Amplifier Control byte (Register 1). Set Register 1, Bits 3 through 0 to logic low to turn off the amplifier via software control. The software shutdown mode can also be achieved by changing the SWS to logic high (Register 1, Bit 4). This will turn off all sections of the amplifier and also the reference and bias circuitry, regardless of the settings on Register 1, Bits 3 through 1. For lowest current consumption in shutdown mode change the EN pin to logic low or change SWS to logic HIGH. This will turn off all sections of the amplifier including reference, and bias. All register contents are maintained provided the supply voltage is not powered down. On supply power-down, all information programmed into the registers by the user is lost, returning all registers back to their default state once power is reapplied. Charge Pump Enable The charge pump generates a negative voltage supply for the headphone amplifiers. This allows a 0 V bias on the amplifier outputs, eliminating the need for an output coupling capacitor. The charge pump will automatically activate if either the HPL_Enable or HPR_Enable bits are set to logic high. Class-D Output Amplifier The input to the Class-D amplifier is always a mono sum (L + R) of the mux output, regardless of mux mode. Set the Spk_Enable bit (Register 1, Bit 1) to logic high to enable the Class-D power amplifier. The Class-D amplifier draws 4.9 mA of typical supply current when active and less than 1 µA when deactivated. The gain of the Class-D amplifier can be selected between +6 dB and +12 dB. Set register 5 bit 7 to logic low to select a gain of +6 dB and to logic high to select a gain of +12 dB. 20 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 Table 1. Class-D Amplifier Gain Levels CLASS-D GAIN REGISTER BYTE: SPK_GAIN NOMINAL GAIN 0 +6 dB 1 +12 dB DirectPath Headphone Amplifier Set the HPL_Enable bit (Register 1, Bit 3) to logic high to enable the headphone left output and the HPR_Enable bit (Register 1, Bit 2) to logic high to enable the headphone right output. The headphone amplifier draws 4.1 mA of typical supply current with both left and right outputs active and less than 1 µA when deactivated. Voice Bypass Mode Set the VM_Bypass bit (Register 1, Bit 0) to logic high to the bypass mode from BYPASS+ and BYPASS–to the speaker pins (OUT+ and OUT-pins). This will automatically disable the Class-D speaker amplifier. HEADPHONE AMPLIFIER GAIN The Headphone amplifier gain can be differentiated from the default volume control gain. Register 6, bits 7 to 5 and register 5 bit 6 can be used to attenuate the gain on the headphone amplifier. This function is useful to differentiate the channel gain of the speaker amplifier from the channel gain of the headphone amplifier. So for the same input signal different output voltage levels for the speaker and the headphone amplifier can be selected. The following table shows the gain values. This feature is required since the headphone does not require the same output voltage level as the speaker amplifier. Table 2. Headphone Amplifier Gain Levels HEADPHONE GAIN REGISTER BYTE: HP_0dB, HP_GAIN[2:0] NOMINAL GAIN HEADPHONE GAIN REGISTER BYTE: HP_0DB, HP_GAIN[2:0] NOMINAL GAIN 0000 -12 dB 0101 -4.5 dB 0001 -10.5 dB 0110 -3 dB 0010 -9 dB 0111 -1.5 dB 0011 -7.5 dB 1xxx 0 dB 0100 -6 dB VOLUME CONTROL The TPA2051D3 has three independent volume controls: One for the mono input configurations (Mode 0), one for the STEREO1 input pair (INL1 and INR1, when in Mode 1, 3, 5, and 6), and one for the STEREO2 input pair (INL2 and INR2, when in Mode 2 and 4). Each have 5-bit (32-step) resolution and are audio tapered; gain step changes become smaller at higher gain settings. All volume controls range from –66 dB to +18 dB. The Class-D speaker amplifier gain can be selected between 6 dB and 12 dB on top of the volume control. Thus the total gain for the speaker channel (volume control plus Class-D amplifier) range is from –60 dB to +30 dB. The headphone amplifiers have a secondary volume control (see Headphone Amplifier Gain section) besides the main volume control. The secondary volume control ranges from –12 dB to 0 dB in 1.5 dB steps. Thus the total gain for the headphone channel (volume control plus headphone amplifier) range is from –78 dB to +18 dB. The Mono Input volume control byte is located in Register 4, Bits 4 to 0. The Stereo Input 1 volume control byte is located at Register 5, Bits 4 to 0, and the Stereo Input 2 volume control byte is at Register 6, Bits 4 to 0. Gain matching between the left and right channels for STEREO1 and STEREO2 is presented in the operating characteristics table. The input impedance to the TPA2051D3 changes as gain changes. See the Operating Characteristics section for specifications. Values listed in Table 3 are nominal values. When the SpeakerGuardTM (Automatic Gain Control) is enabled the volume changes at a rate dictated by the attack time (volume decrease) and the release time (volume increase). Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 21 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com AUDIO TAPER GAIN VALUES For MONO, STEREO1, and STEREO2 inputs. Table 3. Volume Control Gain Table VOLUME CONTROL REGISTER BYTE: VOL[4:0] NOMINAL GAIN VOLUME CONTROL REGISTER BYTE: VOL[4:0] NOMINAL GAIN 00000 –66 dB 10000 +3 dB 00001 –54 dB 10001 +4 dB 00010 –42 dB 10010 +5 dB 00011 –36 dB 10011 +6 dB 00100 –30 dB 10100 +7 dB 00101 –24 dB 10101 +8 dB 00110 –18 dB 10110 +9 dB 00111 –12 dB 10111 +10 dB 01000 –9 dB 11000 +11 dB 01001 –6 dB 11001 +12 dB 01010 –4.5 dB 11010 +13 dB 01011 –3 dB 11011 +14 dB 01100 –1.5 dB 11100 +15 dB 01101 0 dB 11101 +16 dB 01110 +1 dB 11110 +17 dB 01111 +2 dB 11111 +18 dB AUTOMATIC GAIN CONTROL The automatic gain control (AGC) is a limiter function only (SpeakerGuardTM). It works by automatically adjusting amplifier gain based on the audio signal level. This prevents speaker damage from audio that is too loud. The AGC function can also be used to improve audio loudness without increasing the peak power delivered to the speaker. If the audio signal is higher than the limiter level, the gain will decrease until the audio signal is just below the limiter setting. The gain decrease rate (attack time) is set via I2C interface. If the audio signal is below the limiter level and the gain is below the fixed gain, the gain will increase. The gain increase rate (release time) is set via I2C interface. There are two register settings for the limiter level. The first one is for the speaker amplifier, and the second one is for the headphone amplifier. If the speaker and headphone amplifiers are enabled at the same time, the limiter level setting for the speaker amplifier takes precedence in setting the gain. If only the HP amplifier is enabled, then the channel with the highest signal level dictates the AGC gain. Table 4 shows the selectable limiter levels for the Class-D amplifier when SPK_Gain (Register 5, bit 7) is LOW (6 dB). 22 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 INPUT SIGNAL Release Time Attack Time GAIN Gain Step OUTPUT SIGNAL LIMITER LEVEL Figure 40. SpeakerGuardTM Operation Table 4. Speaker Output Limiter Levels SPEAKER LIMITER REGISTER BYTE: LIMSPK [2:0] DIFFERENTIAL OUTPUT PEAK VOLTAGE 000 2.6 V 001 3.0 V 010 3.3 V 011 3.6 V 100 3.9 V 101 4.2 V 110 4.8 V 111 5.2 V Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 23 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com The headphone amplifier limiter settings depend on the setting of the HP_gain bits. Table 5 shows limiter values for different headphone amplifier gains. Table 5. Typical Headphone Output Limiter Levels HEADPHONE LIMITER REGISTER BYTE: LIMHP [2:0] HEADPHONE OUTPUT PEAK VOLTAGE (HP_GAIN = 0dB) HEADPHONE OUTPUT PEAK VOLTAGE (HP_GAIN = -6dB) HEADPHONE OUTPUT PEAK VOLTAGE (HP_GAIN = -12dB) 000 0.65 V 0.325 V 0.163 V 001 0.75 V 0.375 V 0.188 V 010 0.83 V 0.415 V 0.208 V 011 0.90 V 0.45 V 0.225 V 100 0.97 V 0.485 V 0.244 V 101 1.05 V 0.525 V 0.263 V 110 1.2 V 0.60 V 0.300 V 111 1.3 V 0.65 V 0.325 V The attack and release time can be selected via I2C interface. Table 6 gives the possible selections for the attack time. Table 6. Attack Time Selection 24 ATTACK TIME REGISTER BYTE: ATK_TIME[4:0] ATTACK TIME (MS/STEP) ATTACK TIME REGISTER BYTE: ATK_TIME[4:0] ATTACK TIME (MS/STEP) 00000 1.28 10000 21.76 00001 2.56 10001 23.04 00010 3.84 10010 24.32 00011 5.12 10011 25.6 00100 6.4 10100 26.88 00101 7.68 10101 28.16 00110 8.96 10110 29.44 00111 10.24 10111 30.72 01000 11.52 11000 32 01001 12.8 11001 33.28 01010 14.08 11010 34.56 01011 15.36 11011 35.84 01100 16.64 11100 37.12 01101 17.92 11101 38.4 01110 19.2 11110 39.68 01111 20.48 11111 40.96 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 Table 7 gives the possible selections for the release time. Table 7. Release Time Selection RELEASE TIME REGISTER BYTE: REL_TIME[4:0] RELEASE TIME (MS/STEP) RELEASE TIME REGISTER BYTE: REL_TIME[4:0] RELEASE TIME (MS/STEP) 00000 41 10000 697 00001 82 10001 738 00010 123 10010 779 00011 164 10011 820 00100 205 10100 861 00101 246 10101 902 00110 287 10110 943 00111 328 10111 984 01000 369 11000 1025 01001 410 11001 1066 01010 451 11010 1107 01011 492 11011 1148 01100 533 11100 1189 01101 574 11101 1230 01110 615 11110 1271 01111 656 11111 1312 DECOUPLING CAPACITOR The TPA2051D3 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients, spikes, or digital hash on the line a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 1 µF, placed as close as possible to the device PVDD lead works best. Placing this decoupling capacitor close to the TPA2051D3 is important for the efficiency of the Class-D amplifier, because any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering lower-frequency noise signals, a 4.7 µF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device. INPUT CAPACITORS The TPA2051D3 does not require input coupling capacitors if the design uses a differential source that is biased within the common mode input range. If the input signal is not biased within the recommended common-mode input range, if high pass filtering is needed, or if using a single-ended source, input coupling capacitors are required. The input capacitors and input resistors form a high-pass filter with the corner frequency, ƒC, determined in Equation 1. 1 ¦C = (2 p ´ RI ´ CI ) (1) The value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase output offset. Equation 2 is used to solve for the input coupling capacitance. If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 25 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com CI = 1 (2p ´ RI ´ ¦ C ) (2) If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. BOARD LAYOUT In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 41 and Table 8 shows the appropriate diameters for a WCSP layout. The TPA2051D3 evaluation module (EVM) layout is shown in the next section as a layout example. Figure 41. Land Pattern Dimensions 26 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 TPA2051D3 www.ti.com ...................................................................................................................................................................................................... SLOS641 – JUNE 2009 Table 8. Land Pattern Dimensions (1) (2) (3) (4) (1) (2) (3) (4) (5) (6) (7) SOLDER PAD DEFINITIONS COPPER PAD SOLDER MASK (5) OPENING COPPER THICKNESS STENCIL (6) (7) OPENING STENCIL THICKNESS Nonsolder mask defined (NSMD) 230 µm (+0.0, –25 µm) 310 µm (+0.0, –25 µm) 1 oz max (32 µm) 275 µm x 275 µm Sq. (rounded corners) 100 µm thick Circuit traces from NSMD defined PWB lands should be 75 µm to 100 µm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application. Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 µm on top of the copper circuit pattern Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces. COMPONENT LOCATION Place all the external components very close to the TPA2051D3. Placing the decoupling capacitor, Cs, close to the TPA2051D3 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. Trace Width Recommended trace width at the solder balls is 75-µm to 100-µm to prevent solder wicking onto wider PCB traces. For high current pins (PVDD, PGND, and audio output pins) of the TPA2051D3, use 100-µm trace widths at the solder balls and at least 500-µm PCB traces to ensure proper performance and output power for the device. For the remaining signals of the TPA2051D3, use 75-µm to 100-µm trace widths at the solder balls. The audio input pins (INR± and INL±) must run side-by-side to maximize common-mode noise cancellation. EFFICIENCY AND THERMAL INFORMATION The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the packages are shown in the dissipation rating table. Converting this to θJA for the WCSP package: 1 1 θJA = = = 148°C/W Derating Factor 0.0068 (3) Given θJA of 148°C/W, the maximum allowable junction temperature of 150°C, and the internal dissipation of 0.2 W for 2 W, 8 Ω load, 5 V supply, the maximum ambient temperature can be calculated with Equation 4. TA MAX = TJMAX - θJA PDmax = 150 - 148(0.2) = 120oC (4) Equation 4 shows that the calculated maximum ambient temperature is 120°C at maximum power dissipation with a 5 V supply and 8 Ω a load. The TPA2051D3 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC. OPERATION WITH DACS AND CODECS In using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor from the audio amplifier. This occurs when mixing of the output frequencies of the CODEC/DAC mix with the switching frequencies of the audio amplifier input stage. The noise increase can be solved by placing a low-pass filter between the CODEC/DAC and audio amplifier. This filters off the high frequencies that cause the problem and allow proper performance. See Figure 42 for the application diagram. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 27 TPA2051D3 SLOS641 – JUNE 2009 ...................................................................................................................................................................................................... www.ti.com Bypass+ BypassMono+ ABB Mono- Left (SE) TPA2051D3 Mono Class-D plus DirectPathTM 8 Dual-Mode Speaker Codec (MP3) Right (SE) Left (SE) Stereo Headphone Jack FM Tuner Right (SE) Figure 42. Example of Low Pass Input Filter Application FILTER FREE OPERATION AND FERRITE BEAD FILTERS A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead, choose one with high impedance at high frequencies, and very low impedance at low frequencies. In addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal. Use an LC output filter if there are low frequency (< 1 MHz) EMI sensitive circuits and/or there are long leads from amplifier to speaker. Figure 43 shows typical ferrite bead output filters. Figure 43. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608S221A) 28 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPA2051D3 PACKAGE OPTION ADDENDUM www.ti.com 6-Jul-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA2051D3YFFR ACTIVE DSBGA YFF 25 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPA2051D3YFFT ACTIVE DSBGA YFF 25 250 SNAGCU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPA2051D3YFFR Package Package Pins Type Drawing SPQ DSBGA 3000 YFF 25 Reel Reel Diameter Width (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 2.38 2.4 0.8 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2051D3YFFR DSBGA YFF 25 3000 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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