TI TC271

TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
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High-Resolution, Solid-State Monochrome
Image Sensor for Video or Still-Picture
Photography
Frame Transfer With Two Field Memories
Allows Multimode Operation
1044 (H) x 576 (V) Active Elements in
Image-Sensing Area
11-mm Image-Area Diagonal Is Compatible
With 2/3” Vidicon Optics
Fast-Clear Capability
Electron-Hole Recombination Antiblooming
Dynamic Range . . . More Than 60 dB
High Photoresponse Uniformity
On-Chip Cross-Coupled Resets for Easy
Off-Chip Implementation of CCSH VideoSignal Processing
Solid-State Reliability With No Image
Burn-in, Residual Imaging, Image
Distortion, Image Lag, or Microphonics
Low Dark Current
DUAL-IN-LINE PACKAGE
(TOP VIEW)
SUB 1
22 SUB
ABG 2
21 TDB
IAG 3
20 ABG
SAG1 4
19 IAG
ADB 5
18 TMG
OUT3 6
17 SAG2
OUT2 7
16 SRG3
OUT1 8
15 SRG2
AMP GND 9
14 SRG1
CDB 10
13 TRG
SUB 11
12 SUB
description
The TC271 is a frame-transfer charge-coupled-device (CCD) image sensor with two field memories. It is
suitable for use in PAL-video or still-picture photography applications. Its image-sensing area is configured into
580 lines; 576 of these are active and the remaining four are used for dark reference. Each line is configured
into 1080 pixels with 1044 active and 36 for dark reference. The TC271 has a standard aspect ratio of 4:3 and
a standard 11-mm image-sensing-area diagonal. Its blooming protection, which is an integral part of each pixel,
is based on electron-hole recombination and is activated by clocking the antiblooming gate.
One important aspect of the TC271 high-resolution sensor is its ability to simultaneously capture both fields of
a TV frame. Its two independently addressable memories allow separate storage of each field and operation
in a variety of modes, including CCIR with true interlace, CCIR with pseudointerlace, progressive scan, and
nonstandard pseudointerlace with a resolution of 1152 lines.
A unique multiplexer section (see Figure 1) rearranges the horizontal pixels into vertical groups of three and
separates and loads the image into the two field memories. The independent addressing of each field memory
provides flexibility for different modes of operation. The interdigitated layout of the memories allows each
memory to share the same bank of three serial registers and associated charge-detection amplifiers (see
Figure 2 and the functional block diagram). Each register and associated amplifier reads out every third column
of the image area (see Figure 3). The three amplifiers are optimized dual-source followers that allow the use
of off-chip double correlated-clamp sample-and-hold amplifiers for removing KTC noise.
The TC271 is built using TI-proprietary virtual-phase technology, which provides devices with high blue
response, low dark current, high photoresponse uniformity, and single-phase clocking. The TC271 is
characterized for operation from –10°C to 40°C.
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no
circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent
damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
Copyright  1996, Texas Instruments Incorporated
ADVANCE INFORMATION concerns new products in the sampling or
preproduction phase of development. Characteristic data and other
specifications are subject to change without notice.
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1
TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
functional block diagram
Top Drain
21
ABG
2
20
IAG
3
Image Area With
Blooming Protection
19
TDB
ABG
IAG
Dark Reference Elements
3:2 Multiplexer
SAG1
ADB
OUT3
18
5
Amplifiers
17
Storage Area
6
16
7
OUT2
15
14
OUT1
8
Transfer Gates
and
Serial Registers
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
Clearing Drain
12 Dummy
Elements
2
TMG
4
9
AMP GND
10
CDB
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13
SAG2
SRG3
SRG2
SRG1
TRG
TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
sensor topology diagram
1080 Pixels
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉ
ÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
1044 Active Pixels
34 Dark Pixels
1/2 Dark Pixel
1 Dark Pixel
1/2 Dark Pixel
576 Active Lines
4 Dark Lines
Multiplexer
870 Lines
12
360
12
360
12
360
Dummy Pixels
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
ABG†
NO.
2
I
Antiblooming gate
ABG†
20
I
Antiblooming gate
ADB
5
I
Supply voltage for amplifier-drain bias
AMP GND
9
CDB
IAG†
IAG†
10
I
Supply voltage for clearing-drain bias
3
I
Image-area gate
19
I
Image-area gate
OUT1
8
O
Output signal 1
OUT2
7
O
Output signal 2
OUT3
6
O
Output signal 3
SAG1
4
I
Storage-area gate
Amplifier ground
SAG2
17
I
Storage-area gate
SRG1
14
I
Serial-register gate 1
SRG2
15
I
Serial-register gate 2
SRG3
SUB†
16
I
Serial-register gate 3
1
Substrate and clock return
SUB†
SUB†
11
Substrate and clock return
12
Substrate and clock return
SUB†
22
Substrate and clock return
TDB
21
I
Supply voltage for top-drain bias
TMG
18
I
Transfer-multiplex gate
TRG
13
I
Transfer gate
† All pins of the same name should be connected together externally (i.e., pin 2 to pin 20,
pin 3 to pin 19, etc.).
detailed description
The TC271 consists of five basic functional blocks: (1) the image-sensing area, (2) the multiplexer block, (3)
the image-storage area with dual-field memories, (4) the serial-register and transfer gates, and (5) the low-noise
signal-processing amplifier block with charge-detection nodes. The location of each of these blocks is identified
in the functional block diagram.
image-sensing area
Figure 4 and Figure 5 show cross sections with potential-well diagrams and top views of image-sensing
elements. As light enters the silicon in the image-sensing area, free electrons are generated and collected in
the potential wells of the sensing elements. During this time, blooming protection is activated by applying a burst
of pulses to the antiblooming-gate inputs every horizontal-blanking interval. This prevents blooming caused by
the spilling of charge from overexposed elements into neighboring elements. Thirty-four full columns and one
half-column of elements at the right edge of the image-sensing area are shielded from incident light; these
elements provide the dark reference used in subsequent video-processing circuits to restore the video-black
level. There are also one full column and one half-column of light-shielded elements at the left edge of the
image-sensing area and four lines of light-shielded elements at the bottom of the image area immediately above
the multiplexer. The latter prevent charge leakage from the image area into the multiplexer.
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
multiplexer and image-storage area
After integration, the multiplexer rearranges two horizontal lines into vertical groups of three and separates and
loads the image into the storage area. Figure 1 shows the layout of the multiplexer gate and its interface to the
two field memories. Figure 2 shows the interface region between the storage area and the three serial registers.
A drain is also provided to clear the image-sensing and image-storage areas of unwanted charge. Such charge
can accumulate in the imager during the startup of operation or under special circumstances when nonstandard
TV operation is desired. The sensor’s independently addressable memories allow several different modes of
sensor operation including (1) a normal-light mode, (2) a low-light mode, (3) a still mode, and (4) a
progressive-scan mode. The timing for these four modes is given in Figure 6 through Figure 9. The
parallel-transfer timing is shown in Figure 10.
serial registers and amplifiers
After transfer to the serial registers (see Figure 11, which shows the horizontal timing that gives the necessary
sequence of pulses for transfer from the storage area to the serial registers), the charge is converted to a signal
voltage at the sense node and buffered with a dual-stage source follower. The three serial registers are typically
clocked 120 degrees out of phase with each serial-gate pulse supplying a detection-node reset signal for one
of the other two serial gates (see Figure 12). The readout timing, which includes the three serial pulses and the
pixel-clamp pulses used in an off-chip double-correlated sampling circuit, is shown in Figure 13. The detection
nodes and amplifiers are located some distance from the edge of the storage area. Twelve dummy elements
are incorporated at the end of each serial register to span the distance. The location of the dummy elements,
which are considered to be part of the amplifiers, is shown in the functional block diagram. A schematic of the
detection node and amplifier is given in Figure 3.
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
8.4 µm
Image
Area
580 Lines
Clocked Gate
11.4µm
Antiblooming Gate
4.6 µm
Channel Stops
Multiplexer
Clocked Gate
Clocked Wells
Multiplexer
Virtual Wells
Clocked
Gate
Memory A
Clocked Gate
Memory B
Metal Bus Lines
for Memory A and B
7.6 µm
Memory
Area
870 Lines
3.8 µm
12.6 µm
Figure 1. Layout of Multiplexing Gate
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
Contact Holes
to Metal Bus Lines
Memory
Area
870 Lines
Clocked Gates
Memory A, B
Channel Stop
Channel Stop
Common
Virtual Well
Clocked Gate
Serial Register 1
Horizontal
Register 1
Transfer Gate
Clocked Gate
Serial Register 2
Horizontal
Register 2
Figure 2. Layout of the Interface Region Between the Memories and the Serial Registers
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
ADB VREF
Q1
SRG1
Q2
Q3
q
VO1
Q4
SRG2
Q5
Q6
q
VO2
Q7
Q8
SRG3
Q9
q
VO3
Figure 3. Circuit Diagram – Charge-Detection Amplifiers
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
8.4 µm(H)
Light
Clocked Barrier
φ-IAG
11.4 µm(V)
Virtual Barrier
φ-ABG
Antiblooming
Clocking Levels
Antiblooming Gate
Virtual Well
Clocked Well
Accumulated Charge
Figure 4. Charge-Accumulation Process
φ-PS
Clocked Phase
Virtual Phase
Channel Stops
Figure 5. Charge-Transfer Process
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
IAG
TMG
SAG1
SAG2
ABG
TRG
SRG1, SRG2,
SRG3
Figure 6. Vertical Timing, Normal-Light Mode
IAG
TMG
SAG1
SAG2
ABG
TRG
SRG1, SRG2,
SRG3
Figure 7. Vertical Timing, Low-Light Mode
IAG
TMG
SAG1
SAG2
ABG
TRG
SRG1, SRG2,
SRG3
Figure 8. Vertical Timing, Still Mode
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
IAG
TMG
SAG1
SAG2
ABG
TRG
SRG1, SRG2,
SRG3
Figure 9. Vertical Timing, Progressive-Scan Mode
ABG
IAG
TMG
SAG1
SAG2
Figure 10. Parallel-Transfer Timing
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
TRG
SAG1, SAG2†
SRG1, SRG2, SRG3
† These clocks are mode-dependent.
Figure 11. Horizontal Timing
Dummy Pixels
9
10
11
Image Pixels
12
345
346
347
Dark Pixels
348
5
SRG1
SRG2
SRG3
Figure 12. Start of Serial-Transfer Timing
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7
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
SRG1
OUT1
CL1
SH1
SRG2
OUT2
CL2
SH2
SRG3
OUT3
CL3
SH3
NOTES: A. The video-processing (off-chip) pulses are defined as follows:
CL1 = Clamp pulse for video from OUT1
SH1 = Sample pulse for the sample-and-hold amplifier for video 1
CL2 = Clamp pulse for video from OUT2
SH2 = Sample pulse for the sample-and-hold amplifier for video 2
CL3 = Clamp pulse for video from OUT3
SH3 = Sample pulse for the sample-and-hold amplifier for video 3
B. The signals for channel (n+1) are phase shifted 120° from the signals for channel (n). For example, SRG2 is phase shifted
120° relative to SRG1, SRG3 is phase shifted 120° relative to SRG2, OUT2 is phase shifted 120° relative to OUT1, OUT3 is
phase shifted 120° relative to OUT2, and so forth.
Figure 13. Video-Process Timing
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
spurious-nonuniformity specification
The spurious-nonuniformity specification of the TC271 CCD grades – 30 and – 40 is based on several sensor
characteristics:
•
•
•
Amplitude of the nonuniform pixel
Polarity of the nonuniform pixel
– Black
– White
Column amplitude
The CCD sensors are characterized in both an illuminated condition and a dark condition. In the dark condition,
the nonuniformity is specified in terms of absolute amplitude as shown in Figure 14. In the illuminated condition,
the nonuniformity is specified as a percentage of the total illumination as shown in Figure 15.
The nonuniformity specification for the TC271 is as follows (CCD video-output signal is 50 mV ±10 mV):
PIXEL NONUNIFORMITY
PART NUMBER
COLUMN NONUNIFORMITY
DARK CONDITION
ILLUMINATED CONDITION
PIXEL AMPLITUDE, x (mV)
% OF TOTAL ILLUMINATION
TC271-30
x ≤ 12 mV
x ≤ 10
x < 0.5 mV
TC271-40
x ≤ 15 mV
x ≤ 15
x ≤ 1 mV
COLUMN AMPLITUDE, x (mV)
mV
Amplitude
% of Total
Illumination
t
Figure 14. Pixel Nonuniformity,
Dark Condition
14
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Figure 15. Pixel Nonuniformity,
Illuminated Condition
• DALLAS, TEXAS 75265
TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC: ADB, CDB, TDB (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 15 V
Input voltage range, VI: ABG, IAG, SAG1, SAG2, SRG1, SRG2, SRG3, TRG . . . . . . . . . . . . –15 V to 15 V
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 10°C to 40°C
Storage temperature range, TSTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30°C to 85°C
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to the substrate terminal.
recommended operating conditions
Supply voltage, VCC
ADB, CDB, TDB
MIN
NOM
MAX
11
12
13
Substrate bias voltage
0
IAG
SAG1 SAG2
SAG1,
SRG1 SRG2
SRG1,
SRG2, SRG3
Input voltage, VI‡
TMG
High level
2
Low level
–11
High level
2
Low level
–11
High level
2
Low level
–11
High level
2
Low level
–11
High level
TRG
Load capacitance
2.5
3
–9
2.5
3
–9
2.5
3
V
–9
4.5
5
–2
– 1.55
–7.5
–7
– 6.5
High level
2
2.5
Low level
–11
ABG
Clock frequency, fclock
3
–9
4
Low level
V
V
– 2.85
Intermediate level§
ABG
2.5
UNIT
3
–9
0.625
IAG
1.11
SAG1, SAG2, TMG
6.67
SRG1, SRG2, SRG3
6.67
TRG
1.67
OUT1, OUT2, OUT3
MHz
8
pF
Operating free-air temperature, TA
– 10
40
°C
‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for clock voltage
levels.
§ Adjustment is required for optimal performance.
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
electrical characteristics over recommended operating ranges of supply voltage and operating
free-air temperature (unless otherwise noted)
PARAMETER
MIN
TYP†
MAX
UNIT
Dynamic range (see Note 2)
60
dB
Charge-conversion factor
6.5
µV/e
Charge-transfer efficiency (see Note 3)
Signal-response delay time, τ (see Note 4 and Figure 19)
Gamma (see Note 5)
Output resistance
0.9999
0.99995
1.000
18
20
22
0.89
0.94
0.99
350
1/f noise (5 kHz)
Noise voltage
0.1
Random noise (f = 100 kHz)
0.08
Noise-equivalent signal
15
Rejection ratio at 4.77 MHz
ADB (see Note 6)
20
SRGn (see Note 7)
40
ABG (see Note 8)
30
Supply current
4
capacitance Ci
Input capacitance,
IAG
12000
SAG1, SAG2
11000
ABG
4600
TMG
120
TRG
160
ns
Ω
µV/√Hz
electrons
dB
mA
pF
SRG1, SRG2, SRG3
80
† All typical values are at TA = 25 °C.
NOTES: 2. Dynamic range is – 20 times the logarithm of the mean-noise signal divided by the saturation-output signal.
3. Charge-transfer efficiency is one minus the charge loss per transfer in the output register. The test is performed in the dark using
an electrical-input signal.
4. Signal-response delay time is the time between the falling edge of the SRG clock pulse and the output-signal valid state.
5. Gamma (γ) is the value of the exponent in the equation below for two points on the linear portion of the transfer-function curve:
ǒ
Ǔ +ǒ
Exposure (2)
Exposure (1)
g
Ǔ
Output signal (2)
Output signal (1)
6. ADB rejection ratio is – 20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on ADB.
7. SRGn rejection ratio is – 20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on SRGn.
8. ABG rejection ratio is – 20 times the logarithm of the ac amplitude on OUTn divided by the ac amplitude on ABG.
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
optical characteristics, TA = 25°C, exposure time = 40 ms (unless otherwise noted)
PARAMETER
Sensitivity (see Notes 9 and 10)
MIN
400
With IR filter
52
Saturation signal, Vsat (see Note 11)
Exposure time = 1/50 second
VO = 1/2 VU (see Note 10)
TA = 40°C
TA = 40°C
Dark-signal uniformity
NOTES: 9.
10.
11.
12.
13.
14.
15.
mV/lx
mV
electrons
0.0014
Dark-signal (see Note 15)
Dark current
UNIT
125
Smear (see Notes 13 and 14)
Output-signal uniformity
MAX
410
70 x 103
Image-area well capacity
Blooming-overload ratio (see Note 12)
TYP
No IR filter
5
1
mV
6
mV
0.3
mV
TA = 21°C
100
pA/cm2
Sensitivity is measured at any illumination level that gives an output voltage level less than VU. A CM-500 filter is used.
VU is the output voltage that represents the threshold of operation of antiblooming. VU ≈ 1/2 saturation signal.
Saturation is the condition in which further increase in exposure does not lead to further increase in output signal.
Blooming is the condition in which charge is induced in an element by light incident on another element. Blooming-overload ratio
is the ratio of blooming exposure to saturation exposure.
Smear is the measure of error induced by transferring charge through an illuminated pixel in shutterless operation. It is equivalent
to the ratio of the single-pixel transfer time during a fast dump to the exposure time using an illuminated section that is 1/10 of the
image-area vertical height with recommended clock frequencies.
The fast-dump clocking rate during vertical timing is 1.0 MHz, and the illuminated section is 1/10 of the height of the image section.
Dark-signal level is measured from the dark dummy pixels.
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
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PARAMETER MEASUREMENT INFORMATION
Blooming Point
With Antiblooming
Enabled
VO
Blooming Point
With Antiblooming
Disabled
Dependent on
Well Capacity
Vsat (min)
Level Dependent
Upon Antiblooming
Gate High Level
Vuse (max)
Vuse (typ)
DR
Vn
Lux
(light input)
DR (dynamic range)
voltage
+ camera white-clip
Vn
Vn = noise-floor voltage
Vsat (min) = minimum saturation voltage
Vuse (max) = maximum usable voltage
Vuse (typ) = typical user voltage (camera white clip)
NOTES: A. Vuse (typ) is defined as the voltage determined to equal the camera white clip. This voltage must be less than Vuse (max).
B. A system trade-off is necessary to determine the system light sensitivity versus the signal/noise ratio. By lowering the
Vuse (typ),
the light sensitivity of the camera is increased; however, this sacrifices the signal/noise ratio of the camera.
Figure 16. Typical Vsat, Vuse Relationship
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
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PARAMETER MEASUREMENT INFORMATION
100%
VIH min
90%
Intermediate Level
10%
VIL max
0%
tr
tf
Slew rate between 10% and 90% = 70 to 120 V/µs, tr = 150 ns, tf = 90 ns
Figure 17. Typical Clock Waveform for ABG, IAG, SAG1, SAG2, AND TMG
VIH min
100%
90%
10%
VIL max
0%
tr
tf
Slew rate between 10% and 90% = 300 V/µs, tr = tf = 15 ns
Figure 18. Typical Clock Waveform for SRG1, SRG2, SRG3, and TRG
1.5 V to 2.5 V
SRG
–9V
– 9 V to –11 V
0%
OUT
90%
100%
CCD Delay
τ
10 ns
15 ns
Sample
and
Hold
Figure 19. SRG and OUT Waveforms
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TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
APPLICATION INFORMATION
VSS
OUT
VCC
GND
GND
V
VCC
TMS3473B
Master Oscillator
V
CLK
MEMB
TMG
CBLNK MEMA
PC3
IAG
PC2
ABG
PC1
GT
CSYNC SRG3
SH3
SRG2
SRG1
SH2
TRG
SH1
CBLNK
PC3
PC2
PC1
CSYNC
SH3
SH2
SH1
VCC
1
2
3
4
5
6
7
8
9
10
VSS
IASR
ABSR
VCC
ABLVL
IAOUT
ABOUT
SAOUT
VCC
VABG –
IALVL
I/N
IAIN
ABIN
MIDSEL
SAIN
PD
GND
VABG+
VSS
20
47 kΩ
19
18
17
16
15
14
13
12
11
20 kΩ
12 V
100 Ω
Parallel Driver
OUT 3
2N3904
(see Note B)
1 kΩ
User-Defined Timer
12 V
TMS3473B
IALVL
DC VOLTAGES
VCC
VSS
V
ABLVL
VABG +
VABG –
IALVL
5V
– 10 V
2V
– 1.5 V
4V
–6 V
–5 V
VCC
1
2
3
4
5
6
7
8
9
10
VSS
IASR
ABSR
VCC
ABLVL
IAOUT
ABOUT
SAOUT
VCC
VABG –
IALVL
I/N
IAIN
ABIN
MIDSEL
SAIN
PD
GND
VABG+
VSS
20
19
18
17
16
15
14
13
12
11
47 kΩ
100 Ω
20 kΩ
2N3904
TC271
VABG –
VABG +
SN28846
VCC
SEL0OUT
GND
PD
SRG3IN
SRG2IN
SRG1IN
TRGIN
NC
SEL1OUT
VSS
VSS
SEL0
NC
VCC
SRG3OUT
SRG2OUT
SRG1OUT
TRGOUT
VCC
SEL1
(see Note B)
1 kΩ
ABLVL
Parallel Driver
1
2
3
4
5
6
7
8
9
10
OUT 2
20
19
18
17
16
15
14
13
12
11
12 V
1
2
3
4
5
6
7
8
9
10
11
SUB
ABG
IAG
SAG1
ADB
OUT3
OUT2
OUT1
AMP GND
CDB
SUB
SUB
TDB
ABG
IAG
TMG
SAG2
SRG3
SRG2
SRG1
TRG
SUB
22
21
20
19
18
17
16
15
14
13
12
12 V
Image Sensor
12 V
Serial Driver
100 Ω
2N3904
OUT 1
(see Note B)
1 kΩ
SUPPORT CIRCUITS
DEVICE
PACKAGE
SN28846DW
20 pin small outline
APPLICATION
Serial driver
Driver for SRG1, SRG2, SRG3, and TRG
FUNCTION
TMS3473BDW
20 pin small outline
Parallel driver
Driver for IAG, SAG1, SAG2, ABG, and TMG
Figure 20. Typical Application Circuit Diagram
NOTES: A. Decoupling capacitors are not shown.
B. TI recommends designing AC coupled systems.
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TC271
1080 × 580-PIXEL CCD IMAGE SENSOR
SOCS039A – JANUARY 1994 – REVISED JUNE 1996
MECHANICAL DATA
The package for the TC271 consists of a ceramic base, a glass window, and a 22-lead frame. The package leads
are configured in a dual in-line organization and fit into mounting holes with 2.54 mm (0.10 in) center-to-center
spacings. The glass window is sealed to the package by an epoxy adhesive. It can be cleaned by any standard
procedure for cleaning optical assemblies or by wiping the surface with a cotton swab moistened with alcohol.
TC271 (22 pin)
23,39 (0.921)
Optical Center
2,01 x 2,39
(0.079 x 0.094)
2,01 (0.079)
Optical
C
L
(see Note B)
18,24
(0.718)
9,35 (0.368)
REF
8,00 (0.315)
Index Dot
27,81 (1.095) MAX
18,54 MAX
(0.730)
3,86 (0.152) MAX
0,25 (0.010)
2,21 (0.087)
0,46 (0.018)
10,16 (0.400) TYP
2,54 (0.100)
5,50 ± 0,76
(0.217 ± 0.030)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
7/94
NOTES: A. Single dimensions are nominal.
B. The center of the package and the center of the image area are not coincident.
C. The distance from the top of the glass to the image-sensor surface is typically 1,46 mm (0.057 in). The glass is 0,95 ±0,08 mm and
has an index of refraction of 1.53.
D. Each pin centerline is located within 0,25 mm (0.010 in) of its true longitudinal position.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
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