TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 D Designed for Analog and Digital Wireless D D D D D D D D D D Handsets, Voice-Enabled Terminals, and Telecommunications Applications 2.7-V to 3.3-V Operation Selectable 13-Bit Linear or 8-Bit A-Law Companded Conversion Differential Microphone Input with External Gain Setting Differential Earphone Output Capable of Driving a 32-Ω to 8-Ω Load Programmable Volume Control in Linear Mode Microphone (MIC) and Earphone (EAR) Mute Functions Typical Power Dissipation of 0.03 mW in Power-Down Mode 2.048-MHz Master Clock Rate 300-Hz to 3.4-kHz Passband Low Profile 20-Terminal TSSOP Packaging PW PACKAGE (TOP VIEW) MICMUTE RESET VSS EARVSS EAROUT+ EARVDD EAROUT– EARVSS MICGAIN+ MICIN– 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 EARMUTE MCLK PCMSYNC PCMO PCMI DVSS DVDD LINSEL MICGAIN – MICIN+ description The TWL1107 voice-band audio processor (VBAP) is designed to perform the transmit encoding analog-to-digital (A/D) conversion, the receive decoding digital-to-analog (D/A) conversion, and the transmit and receive filtering for voice-band communications systems. The TWL1107 device operates in either the 13-bit linear or 8-bit companded (A-law) mode. The VBAP generates its own internal clocks from a 2.048-MHz master clock input. This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C, Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. VBAP is a trademark of Texas Instruments. All other trademarks are the products of their respective owners. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 functional block diagram PCMI PCMSYNC (16) (18) (17) PCMO (19) MCLK PLL TX Filter MICGAIN – (12) MIC Amp 1 (11) MICIN + + (10) – MICIN – MICGAIN + MIC Amp 2 LINSEL EARVDD EARVSS VSS DVSS DVDD Analog Modulator RX Volume Control RX Filter (1) EARMUTE (2) (13) (6) (8) (4) (3) Power and Reset (15) (14) RX = Receive TX = Transmit 2 Digital Modulator and Filter (5) EAR AMP (9) MICMUTE RESET PCM Interface POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 (20) EAROUT+ (7) EAROUT– TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 detailed description power up/reset An external reset must be applied to the active-low RESET terminal while MCLK is active to ensure reset at power up. reference A precision band-gap reference voltage is generated internally and supplies all required references to operate the transmit and receive channels. phase-locked loop The phase-locked loop generates the internal clock frequency required for internal digital filters and modulators by phase locking to 2.048-MHz master clock input. PCM interface The PCM interface transmits and receives data at the PCMO and PCMI terminals respectively. The data is transmitted or received at the MCLK speed once on each PCMSYN cycle. The PCMSYN can be driven by an external source that is derived from the master clock and used as an interrupt to the host controller. microphone input The microphone input circuit consists of two differential input/differential output amplifiers (MIC Amp 1 and MIC Amp 2). MIC Amp 1 is a low-noise differential amplifier capable of an externally set gain. MIC Amp 2 is a differential amplifier with a fixed gain of 6 dB. analog modulator The transmit channel modulator is a third-order sigma-delta design. transmit filter The transmit filter is a digital filter designed to meet Consultive Committee on International Telegraphy and Telephony (CCITT) G.714 requirements. The TWL1107 device operates in either the 13-bit linear or 8-bit companded A-law mode. receive filter The receive (RX) filter is a digital filter that meets CCITT G.714 requirements. The TWL1107 device operates in either the 13-bit linear or 8-bit A-law companded mode, which is selected at the LINSEL input. receive volume control In linear mode, the three least significant bits of the 16-bit PCMI data sample is used to control volume. The volume range is – 18 dB to 3 dB in 3-dB steps. digital modulator and filter The second-order digital modulator and filter convert the received digital PCM data to the analog output required by the earphone interface. earphone amplifiers EAROUT is recommended for use as a differential output; however, it can be connected in single-ended topology as well. Clicks and pops are suppressed from the differential output. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 Terminal Functions TERMINAL TERMINAL NO. I/O DESCRIPTION EARVSS 4 I Analog ground for EAROUT+ DVDD 14 I Digital positive power supply DVSS 15 I Digital negative power supply EARMUTE 20 I Earphone mute EAROUT– 7 O Earphone amplifier negative output EAROUT+ 5 O Earphone amplifier positive output EARVDD 6 I Analog positive power supply for the earphone amplifiers EARVSS 8 I Analog ground for EAROUT– LINSEL 13 I Companding enable MCLK 19 I Master system clock input (2.048 MHz) (digital) MICGAIN+ 9 I Microphone gain positive feedback MICGAIN– 12 I Microphone gain negative feedback MICMUTE 1 I Microphone mute MICIN– 10 I Microphone negative input (–) MICIN+ 11 I Microphone positive input (+) PCMI 16 I Receive PCM input PCMO 17 O Transmit PCM output PCMSYNC 18 I PCM frame synchronization RESET 2 I Active-low reset VSS 3 I Ground return for band-gap internal reference. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, DVDD, EARVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 3.6 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 3.6 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 3.6 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE 4 PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 85°C POWER RATING PW 680 W 6.8 W/°C 270 W POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 recommended operating conditions (see Note 2) MIN Supply voltage, DVDD, EARVDD NOM 2.7 High-level input voltage, VIH MAX UNIT 3.3 V 0.7 x VDD V Low-level input voltage, VIL 0.3 x VDD Load impedance between EAROUT+ and EAROUT–, RL Ω 8 to 32 Input voltage, MICIN Operating free-air temperature, TA V 0.9 x VDD V 85 _C – 40 NOTES: 1. To avoid possible damage and resulting reliability problems to these CMOS devices, follow the power-up sequence detailed in the system reliability features paragraph. 2. Voltages are with respect to DVSS and EARVSS. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) supply current PARAMETER TEST CONDITIONS MIN Operating IDD Supply current from VDD tpu Power-up time from power down Power down, MCLK not present TYP MAX UNIT 5 7 10 30 mA µA 10 ms digital interface PARAMETER TEST CONDITIONS VOH VOL High-level output voltage, PCMO IOH = – 3.2 mA, IOL = 3.2 mA, IIH IIL High-level input current, any digital input CI Co Low-level output voltage, PCMO VDD = 3 V VDD = 3 V MIN TYP MAX DVDD – 0.25 UNIT V 0.2 V 10 µA 10 µA Input capacitance 10 pF Output capacitance 20 pF Low-level input current, any digital input VI = 2.2 V to VDD VI = 0 to 0.8 V microphone interface PARAMETER VIO IIB Input offset voltage Ci Input capacitance Vn TEST CONDITIONS See Note 3 Input bias current MIN TYP MAX –5 5 mV – 250 250 nA 5 Microphone input referred noise, psophometric weighted MIC Amp 1 gain = 23.5 dB, See Note 4 MICMUTE UNIT 2.9 – 80 pF 4 µVrms dB NOTES: 3. Measured while MICIN+ and MICIN– are connected together. Less than 0.5 mV offset results in 0 value code on PCMOUT. 4. Configured as shown in Figure 3. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) speaker interface PARAMETER TEST CONDITIONS Earphone AMP output power (see Note 5) IOmax Maximum out output ut current for EAROUT (rms) MIN TYP MAX VDD = 2.7 V, fully differential, 8-Ω load, 3-dBm0 output, volume control = – 3 dB, PCMI data input to – 4 dB level 161 200 VDD = 2.7 V, fully differential, 16-Ω load, 3-dBm0 output, volume control = – 3 dB, PCMI data input to – 2 dB level 128 160 VDD = 2.7 V, fully differential, 32-Ω load, 3-dBm0 output, volume control = – 3 dB, PCMI data input to – 1 dB level 81 100 3-dBm0 input, 8-Ω load 141 178 3-dBm0 input, 16-Ω load 90 112 50 63 3-dBm0 input, 32-Ω load EARMUTE – 80 UNIT mW mA dB NOTE 5: Maximum power is with a load impedance of –20%, at 25°C. transmit gain and dynamic range, companded mode (A-law) or linear mode selected (see Notes 6 and 7) MAX UNIT Transmit reference-signal level (0dB) PARAMETER Differential, MIC Amp 1 configured for 23.5 dB gain TEST CONDITIONS 88 Overload-signal level (3 dBm0) Differential, MIC Amp 1 configured for 23.5 dB gain 124 mVpp mVpp Absolute gain error 0 dBm0 input signal, 2.7 V ≤ VDD ≤ 3.3 V MICIN–, MICIN+ to PCMO at 3 dBm0 to – 30 dBm0 Gain G i error with ith iinputt llevell relative l ti tto gain i att –10 dBm0 MICIN, MICIN MICIN+ to PCMO MIN TYP –1 1 – 0.5 0.5 MICIN–, MICIN+ to PCMO at – 31 dBm0 to – 45 dBm0 –1 1 MICIN–, MICIN+ to PCMO at – 46 dBm0 to – 55 dBm0 –1.2 1.2 dB dB NOTES: 6. Unless otherwise noted, the analog input is 0 dB, 1020-Hz sine wave, where 0 dB is defined as the zero-reference point of the channel under test. 7. The reference signal level, which is input to the transmit channel, is defined as a value 3 dB below the full-scale value of 124-mVpp. transmit filter transfer, companded mode (A-law) or linear mode selected PARAMETER TEST CONDITIONS Gain relative to input in ut signal gain at 1.02 kHz 6 POST OFFICE BOX 655303 MIN TYP MAX fMIC < 100 Hz fMIC = 200 Hz – 0.5 0.5 – 0.5 0.5 fMIC = 300 Hz to 3 kHz fMIC = 3.4 kHz – 0.5 0.5 – 1.5 0 fMIC = 4 kHz fMIC = 4.6 kHz – 14 fMIC = 8 kHz – 47 • DALLAS, TEXAS 75265 – 35 UNIT dB TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) transmit idle channel noise and distortion, companded mode (A-law) selected PARAMETER TEST CONDITIONS Transmit idle channel noise, psophometrically weighted MIN MIC Amp 1 configured for 23.5 dB gain (see Note 8) Transmit signal signal-to-distortion to distortion ratio with 1.02-kHz sine-wave input Intermodulation distortion, 2 2-tone tone CCITT method, composite power level, – 13 dBm0 TYP –80 MICIN–, MICIN+ to PCMO at 3 dBm0 27 MICIN–, MICIN+ to PCMO at 0 dBm0 30 MICIN–, MICIN+ to PCMO at – 5 dBm0 33 MICIN–, MICIN+ to PCMO at – 10 dBm0 36 MICIN–, MICIN+ to PCMO at – 20 dBm0 35 MICIN–, MICIN+ to PCMO at – 30 dBm0 26 MICIN–, MICIN+ to PCMO at – 40 dBm0 24 MICIN–, MICIN+ to PCMO at – 45 dBm0 19 CCITT G.712 (7.1), R2 49 CCITT G.712 (7.2), R2 51 MAX UNIT –70 dBm0p dBm0 dB NOTE 8: With recommended impedances and resistor tolerance of 1% transmit idle channel noise and distortion, linear mode selected PARAMETER TEST CONDITIONS Transmit idle channel noise, psophometrically weighted MIN MIC Amp 1 configured for 23.5 dB gain (see Note 8) Transmit signal signal-to-total to total distortion ratio with 1.02 1.02-kHz kHz sine-wave input TYP MAX UNIT – 80 –74 dBm0p MICIN–, MICIN+ to PCMO at 3 dBm0 40 55 MICIN–, MICIN+ to PCMO at 0 dBm0 50 61 MICIN–, MICIN+ to PCMO at – 5 dBm0 52 62 MICIN–, MICIN+ to PCMO at –10 dBm0 56 66 MICIN–, MICIN+ to PCMO at –20 dBm0 52 68 MICIN–, MICIN+ to PCMO at – 30 dBm0 51 61 MICIN–, MICIN+ to PCMO at – 40 dBm0 43 59 MICIN–, MICIN+ to PCMO at – 45 dBm0 38 55 dB NOTE 8: With recommended impedances and resistor tolerance of 1% receive gain and dynamic range, linear or companded (A-law) mode selected (see Note 9) PARAMETER Overload-signal Overload signal level (3 dB) Absolute gain error TEST CONDITIONS TYP 3.20 Load = 16 Ω, volume control = – 3 dB, PCMI data input to – 2 dB level 4.05 Load = 32 Ω, volume control = – 3 dB, PCMI data input to – 1 dB level 4.54 0 dBm0 input signal, 2.7 V ≤ VDD ≤ 3.3 V PCMI to EAROUT–, EAROUT+ at 3 dBm0 to – 40 dBm0 Gain G i error with ith output t t llevell relative to gain at –10 dBm0 MIN Load = 8 Ω, volume control = – 3 dB, PCMI data input to – 4 dB level MAX UNIT Vpp –1 1 – 0.5 0.5 PCMI to EAROUT–, EAROUT+ at – 41 dBm0 to – 50 dBm0 –1 1 PCMI to EAROUT–, EAROUT+ at – 51 dBm0 to – 55 dBm0 –1.2 1.2 dB dB NOTE 9: 1020-Hz input signal at PCMI, output measured differentially between EAROUT– and EAROUT+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) receive filter transfer, companded mode (A-law) or linear mode selected (MCLK = 2.048 MHz) (see Note 10) PARAMETER TEST CONDITIONS MIN TYP fEAROUT < 100 Hz fEAROUT = 200 Hz fEAROUT = 300 Hz to 3 kHz fEAROUT = 3.4 kHz Gain relative to in input ut signal gain at 1.02 1.02-kHz kHz MAX UNIT – 15 –5 – 0.5 0.5 –1.5 0 fEAROUT = 4 kHz fEAROUT = 4.6 kHz dB – 14 – 35 fEAROUT = 8 kHz NOTE 10: Volume control = – 3 dB, PCMI data input to – 1 dB level (32-Ω load) – 47 receive idle channel noise and distortion, companded mode (A-law) selected (see Note 10) PARAMETER TEST CONDITIONS Receive noise, C-message weighted MIN PCMI = 11111111 (A-law) Receive signal signal-to-distortion to distortion ratio with 1.02 1.02-kHz kHz sine-wave input PCMI to EAROUT–, EAROUT+ at 3 dBm0 21 PCMI to EAROUT–, EAROUT+ at 0 dBm0 25 PCMI to EAROUT–, EAROUT+ at – 5 dBm0 36 PCMI to EAROUT–, EAROUT+ at –10 dBm0 43 PCMI to EAROUT–, EAROUT+ at – 20 dBm0 40 PCMI to EAROUT–, EAROUT+ at – 30 dBm0 38 PCMI to EAROUT–, EAROUT+ at – 40 dBm0 28 PCMI to EAROUT–, EAROUT+ at – 45 dBm0 23 TYP MAX UNIT – 90 – 88 dBm0 dB NOTE 10: Volume control = – 3 dB, PCMI data input to – 1 dB level (32-Ω load) receive idle channel noise and distortion, linear mode selected (see Note 10) PARAMETER TEST CONDITIONS Receive noise, (20 Hz to 20 kHz brickwall window) Receive signal signal-to-distortion to distortion ratio with 1.02 1.02-kHz kHz sine-wave input (0 – 4 kHz) Intermodulation distortion, 2 2-tone tone CCITT method, composite power level, –13 dBm0 TYP MAX UNIT – 83 – 78 dBm0 PCMI to EAROUT–, EAROUT+ at 3 dBm0 48 52 PCMI to EAROUT–, EAROUT+ at 0 dBm0 51 56 PCMI to EAROUT–, EAROUT+ at – 5 dBm0 57 59 PCMI to EAROUT–, EAROUT+ at –10 dBm0 55 62 PCMI to EAROUT–, EAROUT+ at – 20 dBm0 51 53 PCMI to EAROUT–, EAROUT+ at – 30 dBm0 45 47 PCMI to EAROUT–, EAROUT+ at – 40 dBm0 42 47 PCMI to EAROUT–, EAROUT+ at – 45 dBm0 35 45 CCITT G.712 (7.1), R2 50 CCITT G.712 (7.2), R2 54 NOTE 10: Volume control = – 3 dB, PCMI data input to – 1 dB level (32-Ω load) 8 MIN PCMI = 0000000000000 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 dB dB TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued) power supply rejection PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Supply voltage rejection, transmit channel MICIN–, MICIN+ = 0 V, VDD = 2.7 V + 100 mVpp, f = 1 kHz, Resistor tolerance of 1% –74 – 50 dB Supply voltage rejection, receive channel (differential) PCM code = positive zero, VDD = 2.7 V + 100 mVpp, f = 1 kHz, Resistor tolerance of 1% – 80 – 65 dB TYP MAX crosstalk attenuation, linear mode selected PARAMETER TEST CONDITIONS MIN UNIT Crosstalk attenuation, transmit-to-receive (differential) MICIN–, MICIN+ = 0 dB, f = 300 Hz to 3400 Hz measured differentially between EAROUT– and EAROUT+ 70 dB Crosstalk attenuation, receive-to-transmit PCMI = 0 dBm0, f = 300 Hz to 3400 Hz measured at PCMO 70 dB timing requirements clock MIN tt fmclk NOM MAX Transition time, MCLK 10 MCLK frequency 2.048 UNIT ns MHz MCLK jitter 37% MCLK clock cycles per PCMSYN frame 256 256 cycles transmit (see Figure 1) MIN MAX UNIT ns tsu(PCMSYN) Setup time, PCMSYN high before MCLK ↓ 20 tc(MCLK)– 20 th(PCMSYN) Hold time, PCMSYN high after MCLK ↓ 20 tc(MCLK)– 20 receive (see Figure 2) MIN MAX UNIT tc(MCLK)– 20 tc(MCLK)– 20 ns tsu(PCSYN) th(PCSYN) Setup time, PCMSYN high before MCLK ↓ 20 Hold time, PCMSYN high after MCLK ↓ 20 tsu(PCMI) th(PCMI) Setup time, PCMI high or low before MCLK ↓ 20 ns Hold time, PCMI high or low after MCLK ↓ 20 ns ns switching characteristics over recommended operating conditions, CLmax = 10 pF (see Figure 1) TEST CONDITIONS tpd1 tpd2 Propagation delay time, MCLK bit 1 high to PCMO bit 1 valid tpd3 Propagation delay time, MCLK bit n low to PCMO bit n Hi-Z MIN Propagation delay time, MCLK high to PCMO valid, bits 2 to n POST OFFICE BOX 655303 30 • DALLAS, TEXAS 75265 MAX UNIT 35 ns 35 ns ns 9 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 PARAMETER MEASUREMENT INFORMATION Transmit Time Slot 0 1 2 3 4 N–2 N–1 N N+1 80% MCLK 80% 20% 20% tsu(PCMSYN) ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ th(PCMSYN) PCMSYN PCMO 1 2 tpd3 3 4 N–2 N–1 N See Note C tpd1 NOTES: A. B. C. D. See Note B tpd2 See Note A tsu(PCMO) See Note D This window is allowed for PCMSYN high. This window is allowed for PCMSYN low (th(PCMSYN)max determined by data collision considerations). Transitions are measured at 50%. Bit 1 = Most significant bit (MSB), Bit N = Least significant bit (LSB) Figure 1. Transmit Timing Diagram Receive Time Slot 0 1 2 3 4 N –2 N –1 N N +1 80% 80% MCLK tsu(PCMSYN) PCMSYN 20% 20% th(PCMSYN) ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ See Note A PCMI See Note C 1 See Note B See Note D 2 th(PCMI) 3 4 N –2 N –1 tsu(PCMI) NOTES: A. B. C. D. This window is allowed for PCMSYN high. This window is allowed for PCMSYN low. Transitions are measured at 50%. Bit 1 = Most significant bit (MSB), Bit N = Least significant bit (LSB) Figure 2. Receive Timing Diagram 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 N TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 PRINCIPLES OF OPERATION power-up initialization An external reset with a minimum pulse width of 500 ns must be applied to the active-low RESET terminal with MCLK active to ensure reset upon power up. Table 1. Power-Up and Power-Down Power Consumption (VDD = 2.7 V, Earphone Amplifier Loaded) DEVICE STATUS Power-up MAXIMUM POWER CONSUMPTION 16.2 mW 81 µW Power-down The loss of MCLK (no transition detected) automatically enters the device into a power-down state with PCMO in the high-impedance state. If an asynchronous power down occurs during a pulse code modulation (PCM) data transmit cycle, the PCM interface remains powered up until the PCM data is completely transferred. conversion laws The device can be programmed either for a 13-bit linear or 8-bit (A-law) companding mode. The companding operation approximates the CCITT G.711 recommendation. The linear mode operation uses a 13-bit twos complement format. Linear mode is selected with LINSEL low. LINSEL is high for companding. transmit operation microphone input The microphone input stage is a low-noise differential amplifier. The microphone must be capacitively coupled to the MICIN– and MICIN+ terminals. Preamplifier (MIC Amp 1) gain is determined by selection of external resistors R2 and R3. To achieve the recommended gain setting of 23.5 dB for MIC Amp 1, resistor values of R2 = 34 kΩ and R3 = 510 kΩ are suggested. A 1% tolerance is recommended for all resistors to meet the specification. The recommended input impedance is 35 – 100 kΩ. +V R3 R1 C1 R2 MICGAIN– MICIN+ + _ C1 R1 MIC Amp 1 MICIN– R2 R3 MICGAIN+ R1 + 2 kW C1 + 0.22 mF ǒ Ǔ MIC Amp 1 Gain in dB + 20 log R3 R2 Figure 3. Typical Microphone Interface POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 PRINCIPLES OF OPERATION microphone mute function Transmit channel muting can be selected by setting MICMUTE high. Muting provides 80-dB attenuation of the input microphone signal. receive operation earphone amplifier The analog signal is routed to the earphone amplifier differential output (EAROUT– or EAROUT+), which is capable of driving a load as low as 8 Ω. EAROUT is recommended to be used as a differential output. earphone mute function Receive channel muting can be selected by setting the EARMUTE terminal to high. receive PCM data format D Companded mode: 8 bits are received, the MSB first. D Linear mode: 13 bits are received, the MSB first. Table 2. Receive Data Bit Definitions 12 BIT NO. COMPANDED MODE LINEAR MODE 1 CD7 LD12 2 CD6 LD11 3 CD5 LD10 4 CD4 LD9 5 CD3 LD8 6 CD2 LD7 7 CD1 LD6 8 CD0 LD5 9 – LD4 10 – LD3 11 – LD2 12 – LD1 13 – LD0 14 – RXVOL2 15 – RXVOL1 16 – RXVOL0 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 PRINCIPLES OF OPERATION receive volume control In linear mode, RXVOL [2:0] PCM data bits are used for volume control according to Table 3. Volume control bits must be sent on PCMI for each 13-bit receive word. In companded mode, volume control is fixed at 0 dB. Table 3. Volume Control Bit Definition in Linear Mode RXVOL [2:0] 000 GAIN SETTING 3 dB 001 0 dB 010 – 3 dB 011 – 6 dB 100 – 9 dB 101 – 12 dB 110 – 15 dB 111 – 18 dB support section The clock generator and control circuit uses the master clock input (MCLK) to generate internal clocks to drive internal counters, filters, and converters. clock frequencies and sample rates A fixed PCMSYN rate of 8 kHz determines the sampling rate. The PCMSYN signal must be derived from the master clock. The divide ratio must be set to 256 for the device to work properly. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 TYPICAL CHARACTERISTICS RELATIVE GAIN vs FREQUENCY 20 10 0 0 –20 –10 Relative Gain – dB Relative Gain – dB RELATIVE GAIN vs FREQUENCY –40 See Note A –60 –20 See Note B –30 –80 –40 –100 –50 –120 0 2k 4k –60 6k 0 2k 4k f – Frequency – Hz f – Frequency – Hz Figure 4 Figure 5 6k NOTES: A. Transmit channel frequency response shown relative to the gain at 1.02-kHz input signal in linear mode. B. Receive channel frequency response shown relative to the gain at 1.02-kHz input signal in linear mode. RELATIVE GAIN vs FREQUENCY 20 10 0 0 –20 –10 Relative Gain – dB Relative Gain – dB RELATIVE GAIN vs FREQUENCY –40 See Note C –60 –20 See Note D –30 –80 –40 –100 –50 –120 0 2k 4k 6k –60 0 f – Frequency – Hz 2k f – Frequency – Hz Figure 6 Figure 7 NOTES: C. Transmit channel frequency response shown relative to the gain at 1.02-kHz input signal in A-law mode. D. Receive channel frequency response shown relative to the gain at 1.02-kHz input signal in A-law mode. 14 POST OFFICE BOX 655303 4k • DALLAS, TEXAS 75265 6k TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs SUPPLY VOLTAGE 10 10 8 See Note A Supply Current – µ A Supply Current – mA 8 6 4 2 0 2.5 See Note B 6 4 2 3 0 2.5 3.5 Supply Voltage – V 3 3.5 Supply Voltage – V Figure 8 Figure 9 NOTES: A. Supply current as a function of supply voltage in power-up mode. B. Supply current as a function of supply voltage in power-down mode. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 MECHANICAL DATA PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°–ā8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. 16 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TWL1107 VOICE-BAND AUDIO PROCESSOR (VBAP) SLWS119 – JUNE 2001 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, license, warranty or endorsement thereof. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction of this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use. Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2001, Texas Instruments Incorporated POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17 PACKAGE OPTION ADDENDUM www.ti.com 6-Jul-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TWL1107PW OBSOLETE TSSOP PW 20 TBD Call TI Call TI TWL1107PWR OBSOLETE TSSOP PW 20 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated