CYSTEKEC BTD2195J3

CYStech Electronics Corp.
NPN Epitaxial Planar Transistor
BVCEO
IC
RCESAT
BTD2195J3
Description
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 1/6
120V
4A
600mΩ
The BTD2195J3 is a NPN Darlington transistor, designed for use in general purpose amplifier and low
speed switching application. RoHS compliant package process is adopted.
Equivalent Circuit
Outline
BTD2195J3
TO-252
C
B
E
B:Base
C:Collector
E:Emitter
B C E
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Junction Temperature
Storage Temperature
Note : Single Pulse Pw≦350μs, Duty≦2%.
BTD2195J3
Symbol
VCBO
VCEO
VEBO
IC
ICP
Pd(TA=25℃)
Pd(TC=25℃)
RθJA
RθJC
Tj
Tstg
Limits
Unit
130
120
5
4
6 (Note )
1.5
20
83.3
6.25
150
-55~+150
V
V
V
A
A
W
W
°C/W
°C/W
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 2/6
Characteristics (Ta=25°C)
Symbol
BVCEO
BVCBO
ICBO
ICEO
IEBO
*VCE(sat)
*VCE(sat)
*VBE(on)
*hFE1
*hFE2
*hFE3
Cob
Min.
120
130
-
Typ.
-
600
1000
300
-
-
Max.
1
2
2
1.25
1.5
2.2
200
Unit
V
V
mA
mA
mA
V
V
V
pF
Test Conditions
IC=1mA, IB=0
IC=100μA, IE=0
VCB=100V, IE=0
VCE=50V, IE=0
VEB=5V, IC=0
IC=2A, IB=8mA
IC=2A, IB=2mA
VCE=4V, IC=2A
VCE=3V, IC=1A
VCE=3V, IC=2A
VCE=3V, IC=4A
VCB=10V, IE=0A, f=1MHz
*Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%
Ordering Information
Device
BTD2195J3
BTD2195J3
Package
TO-252
(RoHS compliant)
Shipping
Marking
2500 pcs / Tape & Reel
D2195
CYStek Product Specification
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 3/6
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
10000
10000
Saturation Voltage---(mV)
Current Gain---HFE
VCE = 4V
1000
100
10
1000
100
1
1
10
100
1000
10000
1
Collector Current---IC(mA)
1000
10000
On voltage vs Collector Current
10000
10000
VBE (SAT)@IC = 250IB
VBE (ON) @VCE = 4V
On voltage---(mV)
Saturation Voltage---(mV)
100
Collector Current---I C (mA)
Saturation Voltage vs Collector Current
1000
100
1000
100
10
1
10
100
1000
1
10000
Collector Current---I C (mA)
10
100
1000
10000
Collector Current---I C (mA)
Power Derating Curve
Power Derating Curve
1.75
25
1.5
Power Dissipation---PD(W)
Power Dissipation---PD(W)
10
1.25
1
0.75
0.5
0.25
20
15
10
5
0
0
0
BTD2195J3
50
100
150
Ambient Temperature---TA(℃)
200
0
50
100
150
Case Temperature---TC(℃)
200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
BTD2195J3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
BTD2195J3
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C654J3
Issued Date : 2004.03.18
Revised Date :2009.02.04
Page No. : 6/6
TO-252 Dimension
C
A
Marking:
D
B
D2195
G
F
L
3
H
E
K
Style: Pin 1.Base 2.Collector 3.Emitter
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
*: Typical
Inches
Min.
Max.
0.0177 0.0217
0.0650 0.0768
0.0354 0.0591
0.0177 0.0236
0.2441 0.2677
0.2125 0.2283
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
0.45
0.55
1.65
1.95
0.90
1.50
0.45
0.60
6.20
6.80
5.40
5.80
DIM
G
H
I
J
K
L
Inches
Min.
Max.
0.0866 0.1102
*0.0906
0.0449
0.0346
0.2047 0.2165
0.0551 0.0630
Millimeters
Min.
Max.
2.20
2.80
*2.30
1.14
0.88
5.20
5.50
1.40
1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead : KFC; pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2195J3
CYStek Product Specification