TI TPS826765SIPT

TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
600-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1.0mm)
Check for
Samples: TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676, TPS82677, TPS826711, TPS826745,
TPS826765
FEATURES
1
•
•
•
90% Efficiency at 5.5MHz Operation
17μA Quiescent Current
Wide VIN Range From 2.3V to 4.8V
5.5MHz Regulated Frequency Operation
Spread Spectrum, PWM Frequency Dithering
Best in Class Load and Line Transient
±2% Total DC Voltage Accuracy
Automatic PFM/PWM Mode Switching
Low Ripple Light-Load PFM Mode
≥35dB VIN PSRR (1kHz to 10kHz)
Internal Soft Start, 120-µs Start-Up Time
Integrated Active Power-Down Sequencing
(Optional)
Current Overload and Thermal Shutdown
Protection
Sub 1-mm Profile Solution
Total Solution Size <6.7 mm2
APPLICATIONS
•
•
•
Cell Phones, Smart-Phones
Digital TV, WLAN, GPS and Bluetooth™
Applications
POL Applications
DESCRIPTION
The TPS8267x device is a complete 600mA, DC/DC
step-down power supply intended for low-power
applications. Included in the package are the
switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design.
The TPS8267x is based on a high-frequency
synchronous step-down dc-dc converter optimized for
battery-powered
portable
applications.
The
MicroSiPTM DC/DC converter operates at a regulated
5.5-MHz switching frequency and enters the powersave mode operation at light load currents to maintain
high efficiency over the entire load current range.
The PFM mode extends the battery life by reducing
the quiescent current to 17μA (typ) during light load
operation. For noise-sensitive applications, the device
has PWM spread spectrum capability providing a
lower noise regulated output, as well as low noise at
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
The TPS8267x is packaged in a compact (2.3mm x
2.9mm) and low profile (1.0mm) BGA package
suitable for automated assembly by standard surface
mount equipment.
250
100
90
VI = 3.6 V,
VO = 1.8 V
225
80
DC/DC Converter
VIN
2.3 V .. 4.8 V
VIN
VOUT
1.8 V @ 600mA
SW
CO
CI
GND
ENABLE
L
EN
FB
MODE
Efficiency - %
TPS82671SIP
175
60
150
50
125
40
100
75
30
MODE
SELECTION
200
Efficiency
PFM/PWM Operation
70
Power Loss
PFM/PWM Operation
20
Power Loss - mW
•
•
•
•
•
•
•
•
•
•
•
•
23
50
25
10
GND
Figure 1. Typical Application
0
0.1
1
10
100
IO - Load Current - mA
0
1000
Figure 2. Efficiency vs. Load Current
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroSiP is a trademark of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
-40°C to 85°C
PART
NUMBER
OUTPUT
VOLTAGE (2)
DEVICE
SPECIFIC FEATURE
ORDERING (3)
PACKAGE
MARKING
TPS82670
1.86V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82670SIP
YK
TPS82671
1.8V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS82671SIP
RA
TPS826711
1.8V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826711SIP
YW
TPS82672
1.5V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS82672SIP
WD
TPS82673
1.26V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82673SIP
YL
TPS82674
1.2V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82674SIP
SW
TPS826745
1.225V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826745SIP
B5
TPS82675
1.2V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS82675SIP
RB
TPS82676
1.1V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82676SIP
TU
TPS82677
1.2V
Output Capacitor Discharge
TPS82677SIP
SK
(4)
1.35V
PWM Spread Spectrum Modulation
Output Capacitor Discharge
TPS82678SIP
TN
TPS826765
1.05V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826765SIP
AN
TPS82678
(1)
(2)
(3)
(4)
2
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Internal tap points are available to facilitate output voltages in 25mV increments.
The SIP package is available in tape and reel. Add a R suffix (e.g. TPS82671SIPR) to order quantities of 3000 parts. Add a T suffix (e.g.
TPS82671SIPT) to order quantities of 250 parts.
Product Preview
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
MIN
VI
Voltage at VIN (2) (3)
–0.3
6
V
Voltage at VOUT (3)
–0.3
3.6
V
–0.3
VIN + 0.3
V
Voltage at EN, MODE
(3)
Power dissipation
Internally limited
TA
Operating temperature range (4)
TINT (max)
Maximum internal operating temperature
Tstg
Storage temperature range
ESD rating
(5)
–40
–55
(2)
(3)
(4)
(5)
85
°C
125
°C
125
°C
Human body model
2
kV
Charge device model
1
kV
200
V
Machine model
(1)
UNIT
MAX
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Operation above 4.8V input voltage for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum internal temperature of 105°C.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION
TPS8267xSIP
THERMAL METRIC
(1) (2)
SIP
UNITS
8 PINS
θJA
Junction-to-ambient (top) thermal resistance
125
Junction-to-ambient (bottom) thermal resistance
70
θJCtop
Junction-to-case (top) thermal resistance
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
θJCbot
Junction-to-case (bottom) thermal resistance
(1)
(2)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Thermal data have been measured using TI's 4-layer evaluation board.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
IO
Output current range
TPS82671 to TPS826765
Additional output capacitance (PFM/PWM operation) (2)
TPS82670 to TPS82676
TPS826711, TPS826765
TPS82677, TPS82678
MIN
NOM MAX
2.3
4.8 (1)
0
600
mA
0
2.5
µF
0
4
µF
0
7
µF
Additional output capacitance (PWM operation) (2)
UNIT
V
TA
Ambient temperature
–40
+85
°C
TJ
Operating junction temperature
–40
+125
°C
(1)
(2)
Operation above 4.8V input voltage for extended periods may affect device reliability.
In certain applications larger capacitor values can be tolerable, see output capacitor selection section for more details.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
3
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C;
Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT =
1.8V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
IO = 0mA. Device not switching
17
40
IO = 0mA. PWM operation
5.8
UNIT
SUPPLY CURRENT
IQ
Operating quiescent current
ISD
Shutdown current
UVLO
Undervoltage lockout threshold
EN = GND
μA
mA
0.5
5
μA
2.05
2.1
V
PROTECTION
Thermal shutdown
Thermal shutdown hysteresis
ILIM
Peak Input Current Limit
ISC
Input current limit under short-circuit
conditions
VO shorted to ground
140
°
10
°
C
C
1100
mA
13.5
mA
ENABLE, MODE
VIH
High-level input voltage
VIL
Low-level input voltage
Ilkg
Input leakage current
1.0
V
0.4
V
0.01
1.5
μA
4.9
5.45
6.0
MHz
2.5V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
0.98×VNOM
VNOM
1.03×VNOM
V
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
0.98×VNOM
VNOM
1.04×VNOM
V
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PWM operation
0.98×VNOM
VNOM
1.02×VNOM
V
2.5V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
0.98×VNOM
VNOM
1.04×VNOM
V
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PWM operation
0.98×VNOM
VNOM
1.02×VNOM
V
Input connected to GND or VIN
OSCILLATOR
fSW
Oscillator frequency
IO = 0mA. PWM operation
OUTPUT
VOUT
Regulated DC
output voltage
TPS82670
TPS82671
TPS826711
TPS82672
TPS82673
TPS82674
TPS826745
TPS82675
TPS82676
TPS626765
TPS82677
TPS82678
Line regulation
VI = VO + 0.5V (min 2.5V) to 5.5V, IO = 200 mA
Load regulation
IO = 0mA to 600 mA. PWM operation
Feedback input resistance
ΔVO
Power-save mode
ripple voltage
Start-up time
rDIS
4
0.23
%/V
–0.00085
%/mA
480
kΩ
IO = 1mA, VO = 1.8V
19
mVPP
TPS82673
TPS82674
TPS826745
TPS82675
IO = 1mA, VO = 1.2V
16
mVPP
TPS82671
TPS826711
TPS82676
IO = 1mA, VO = 1.1V
16
mVPP
TPS826765
IO = 1mA, VO = 1.05V
16
mVPP
TPS82677
IO = 1mA, VO = 1.2V
25
mVPP
TPS82678
IO = 1mA, VO = 1.35V
25
mVPP
TPS82671
TPS826711
IO = 0mA, Time from active EN to VO
120
μs
Discharge resistor
for power-down
sequence
Submit Documentation Feedback
Devices featuring active discharge
70
150
Ω
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
PIN ASSIGNMENTS
SIP-8
(TOP VIEW)
VOUT
A1
A2
MODE
B1
B2
GND
C1
C2
A3
C3
SIP-8
(BOTTOM VIEW)
VIN
VIN
EN
EN
GND
GND
A3
C3
VOUT
A2
A1
B2
B1
MODE
C2
C1
GND
PIN DESCRIPTIONS
PIN
NAME
VOUT
NO.
I/O
DESCRIPTION
A1
O
Power output pin. Apply output load between this pin and GND.
VIN
A2, A3
I
The VIN pins supply current to the TPS8267x internal regulator.
EN
B2
I
This is the enable pin of the device. Connect this pin to ground to force the converter into
shutdown mode. Pull this pin to VI to enable the device. This pin must not be left floating and
must be terminated.
This is the mode selection pin of the device. This pin must not be left floating and must be
terminated.
MODE
B1
I
C1, C2, C3
–
MODE = LOW: The device is operating in regulated frequency pulse width modulation mode
(PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load
currents.
MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced.
GND
Ground pin.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
5
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
MODE
EN
VIN
CI
2.2µF
DC/DC CONVERTER
VIN
Undervoltage
Lockout
Bias Supply
Bandgap
Soft-Start
Negative Inductor
Current Detect
V REF = 0.8 V
Power Save Mode
Switching
Thermal
Shutdown
Current Limit
Detect
Frequency
Control
R1
-
L
Gate Driver
R2
Anti
Shoot-Through
VREF
VOUT
1µH
CO
4.7µF
+
Feedback Divider
GND
PARAMETER MEASUREMENT INFORMATION
TPS8267XSIP
DC/DC Converter
VIN
VIN
SW
GND
FB
CI
ENABLE
L
VOUT
CO
EN
MODE
MODE
SELECTION
GND
6
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
η
vs Load current
Efficiency
VO
3, 4
vs Input voltage
5
Peak-to-peak output ripple voltage
vs Load current
6, 7, 8
DC output voltage
vs Load current
9, 10, 11
Combined line/load transient
response
12, 13
14, 15, 16, 17
18, 19, 20
Load transient response
AC load transient response
21
22, 23, 24, 25
26, 27, 28
Load transient response
AC load transient response
29
PFM/PWM boundaries
vs Input voltage
30, 31
IQ
Quiescent current
vs Input voltage
32
fs
PWM switching frequency
vs Input voltage
33
Start-up
PSRR
34, 35
Power supply rejection ratio
vs. Frequency
36
Spurious output noise (PFM mode)
vs. Frequency
37
Spurious output noise (PWM mode)
vs. Frequency
38
Output spectral noise density
vs. Frequency
39
EFFICIENCY
vs
LOAD CURRENT
EFFICIENCY
vs
LOAD CURRENT
100
100
VO = 1.8 V
VO = 1.2 V
90
80
80
60
50
40
VI = 2.7 V
PFM/PWM Operation
70
Efficiency - %
Efficiency - %
70
VI = 3.6 V
PFM/PWM Operation
VI = 4.2 V
PFM/PWM Operation
VI = 3.6 V
Forced PWM Operation
60
50
30
20
20
10
10
1
10
100
1000
VI = 3.6 V
PFM/PWM Operation
VI = 4.2 V
PFM/PWM Operation
VI = 3.6 V
Forced PWM Operation
40
30
0
0.1
VI = 2.7 V
PFM/PWM Operation
90
0
0.1
1
10
IO - Load Current - mA
IO - Load Current - mA
Figure 3.
Figure 4.
Copyright © 2010–2012, Texas Instruments Incorporated
100
1000
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
7
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
EFFICIENCY
vs
INPUT VOLTAGE
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs
LOAD CURRENT
30
VO = 1.8 V
PFM/PWM Operation
92
IO = 100 mA
IO = 300 mA
90
Efficiency - %
88
86
84
82
IO = 10 mA
80
IO = 1 mA
78
76
VO - Peak-to-Peak Output Ripple Voltage - mV
94
VI = 3.6 V
24
22
20
18
16
VI = 4.5 V
14
12
VI = 2.7 V
10
8
6
4
PFM/PWM Operation
2
0
20
40
60
Figure 5.
Figure 6.
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs
LOAD CURRENT
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs
LOAD CURRENT
22
VI = 2.7 V
20
18
VI = 3.6 V
16
VI = 4.5 V
14
12
10
8
6
4
2
PFM/PWM Operation
0
0
20
40
60
80 100 120 140 160 180 200
IO - Load Current - mA
Figure 7.
Submit Documentation Feedback
VO - Peak-to-Peak Output Ripple Voltage - mV
45
VO = 1.2 V (TPS82675)
24
80 100 120 140 160 180 200
IO - Load Current - mA
26
VO - Peak-to-Peak Output Ripple Voltage - mV
VO = 1.8 V (TPS82671)
26
0
74
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7
VI - Input Voltage - V
8
28
VO = 1.2 V (TPS82677)
40
VI = 4.5 V
35
VI = 3.6 V
30
VI = 2.7 V
25
20
15
10
5
0
0
25 50 75 100 125 150 175 200 225 250 275 300
IO - Load Current - mA
Figure 8.
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
DC OUTPUT VOLTAGE
vs
LOAD CURRENT
DC OUTPUT VOLTAGE
vs
LOAD CURRENT
1.836
1.224
VO = 1.8 V (TPS82671)
PFM/PWM Operation
VO = 1.2 V (TPS82675)
PFM/PWM Operation
1.818
VI = 3.6 V
1.800
VI = 2.7 V
1.782
VO - Output Voltage - V
VO - Output Voltage - V
1.212
VI = 4.5 V
VI = 4.5 V
1.2
VI = 3.6 V
VI = 2.7 V
1.188
1.764
0.1
1
10
100
1000
1.176
0.1
1
10
100
1000
IO - Load Current - mA
IO - Load Current - mA
Figure 9.
Figure 10.
DC OUTPUT VOLTAGE
vs
LOAD CURRENT
COMBINED LINE/LOAD TRANSIENT RESPONSE
1.224
VO = 1.2 V (TPS82677)
PFM/PWM Operation
VO = 1.8 V (TPS82671)
30 to 300 mA Load Step
VO - Output Voltage - V
1.212
VI = 4.5 V
3.3V to 3.9V Line Step
1.2
VI = 3.6 V
VI = 2.7 V
1.188
MODE = Low
1.176
0.1
1
10
100
IO - Load Current - mA
Figure 11.
Copyright © 2010–2012, Texas Instruments Incorporated
1000
Figure 12.
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
9
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
COMBINED LINE/LOAD TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
VO = 1.8 V (TPS82671)
VI = 3.6 V,
VO = 1.8 V (TPS82671)
30 to 150 mA Load Step
5 to 150 mA Load Step
2.7V to 3.3V Line Step
MODE = Low
MODE = Low
Figure 13.
Figure 14.
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
VI = 3.6 V,
VO = 1.8 V (TPS82671)
50 to 350 mA Load Step
VI = 2.7 V,
VO = 1.8 V (TPS82671)
50 to 350 mA Load Step
MODE = Low
Figure 15.
10
Submit Documentation Feedback
MODE = Low
Figure 16.
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
VI = 4.5 V,
VO = 1.8 V (TPS82671)
50 to 350 mA Load Step
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
VI = 3.6 V,
VO = 1.8 V (TPS82671)
150 to 500 mA Load Step
MODE = Low
MODE = Low
Figure 17.
Figure 18.
LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
VI = 2.7 V,
VO = 1.8 V (TPS82671)
150 to 500 mA Load Step
VI = 4.5 V,
VO = 1.8 V (TPS82671)
150 to 500 mA Load Step
MODE = Low
Figure 19.
Copyright © 2010–2012, Texas Instruments Incorporated
MODE = Low
Figure 20.
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
11
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
AC LOAD TRANSIENT RESPONSE
VI = 3.6 V,
VO = 1.8 V (TPS82671)
VI = 3.6 V,
VO = 1.2 V
5 to 300 mA Load Sweep
5 to 150 mA Load Step
MODE = Low
VI = 3.6 V,
VO = 1.2 V
MODE = Low
Figure 21.
Figure 22.
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
50 to 350 mA Load Step
VI = 2.7 V,
VO = 1.2 V
50 to 350 mA Load Step
MODE = Low
Figure 23.
12
Submit Documentation Feedback
MODE = Low
Figure 24.
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
50 to 350 mA Load Step
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
VI = 3.6 V,
VO = 1.2 V
150 to 500 mA Load Step
MODE = Low
VI = 2.7 V,
VO = 1.2 V
MODE = Low
Figure 25.
Figure 26.
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION
150 to 500 mA Load Step
VI = 4.5 V,
VO = 1.2 V
150 to 500 mA Load Step
MODE = Low
Figure 27.
Copyright © 2010–2012, Texas Instruments Incorporated
MODE = Low
Figure 28.
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
13
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
AC LOAD TRANSIENT RESPONSE
PFM/PWM BOUNDARIES
140
PFM to PWM
Mode Change
Always PWM
VI = 3.6 V,
VO = 1.2 V
5 to 300 mA Load Sweep
120
The switching mode
changes at these
borders
IO - Load Current - mA
100
MODE = Low
80
60
PWM to PFM
Mode Change
Always PFM
40
20
VO = 1.8 V (TPS82671)
0
2.7
Figure 30.
PFM/PWM BOUNDARIES
QUIESCENT CURRENT
vs
INPUT VOLTAGE
4.5
4.8
28
PFM to PWM
Mode Change
120
26
Always PWM
24
IQ - Quiescent Current - mA
80
PWM to PFM
Mode Change
60
Always PFM
40
TA = 85°C
TA = 25°C
22
The switching mode changes
at these borders
100
IO - Load Current - mA
3.3
3.6
3.9
4.2
VI - Input Voltage - V
Figure 29.
140
20
20
18
16
14
12
TA = -40°C
10
8
6
4
VO = 1.2 V (TPS82674)
0
2.7
3
3.3
3.6
3.9
4.2
VI - Input Voltage - V
Figure 31.
14
3
Submit Documentation Feedback
2
4.5
4.8
0
2.7
3
3.3
3.6
3.9
4.2
VI - Input Voltage - V
4.5
4.8
Figure 32.
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
TYPICAL CHARACTERISTICS (continued)
PWM SWITCHING FREQUENCY
vs
INPUT VOLTAGE
START-UP
6
IO = 150 mA
fS - Switching Frequency - MHz
5.5
IO = 300 mA
5
VI = 3.6 V,
VO = 1.8 V (TPS82671),
IO = 0 mA
IO = 400 mA
4.5
IO = 500 mA
4
3.5
MODE = Low
3
VO = 1.8 V
2.9
3.1 3.3 3.5 3.7 3.9
VI - Input Voltage - V
4.1 4.3 4.5
Figure 33.
Figure 34.
START-UP
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
VI = 3.6 V,
VO = 1.8 V (TPS82671),
RL = 100 Ω
MODE = Low
Figure 35.
Copyright © 2010–2012, Texas Instruments Incorporated
PSRR - Power Supply Rejection Ratio - dB
2.5
2.5 2.7
85
VI = 3.6 V,
80
IO = 10 mA
VO = 1.8 V (TPS82671)
75
PFM Operation
70
IO = 150 mA
65
60
PWM Operation
55
50
45
40
35 IO = 400 mA
30 PWM Operation
25
20
15
10
5
0
0.01
0.1
1
10
100
1000
f - Frequency - kHz
Figure 36.
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
15
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SPURIOUS OUTPUT NOISE (PFM MODE)
vs
FREQUENCY
SPURIOUS OUTPUT NOISE (PWM MODE)
vs
FREQUENCY
5m
500 m
Spurious Output Noise (PWM Mode) - V
Spurious Output Noise (PFM Mode) - V
4.5 m
5m
3.5 m
3m
2.5 m
VI = 2.7 V
2m
VI = 4.2 V
1.5 m
VI = 3.6 V
1m
VO = 1.8 V (TPS82671),
RL = 150 Ω
500 m
50 n
0
Span = 1 MHz
f - Frequency - MHz
VO = 1.8 V (TPS82671),
450 m R = 12 Ω
L
400 m
VI = 4.2 V
350 m
300 m
250 m
200 m
VI = 2.7 V
150 m
100 m
VI = 3.6 V
50 m
5n
0
10
Span = 4 MHz
f - Frequency - MHz
Figure 37.
40
Figure 38.
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
10
Output Spectral Noise Density - µV/VHz
VIN = 3.6 V
VOUT = 1.8 V (TPS82671)
1
IOUT = 10 mA (PFM Mode)
0.1
IOUT = 150 mA (PWM Mode)
0.01
0.001
0.1
1
10
100
f - Frequency - kHz
1000
Figure 39.
16
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
DETAILED DESCRIPTION
OPERATION
The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the
TPS8267x converter operates in power-save mode with pulse frequency modulation (PFM).
The converter uses a unique frequency-locked ring-oscillating modulator to achieve best-in-class load and line
response. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The
loop response to change in VO is essentially instantaneous, which explains the transient response. Although this
type of operation normally results in a switching frequency that varies with input voltage and load current, an
internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating
conditions.
Combined with best-in-class load and line-transient response characteristics, the low quiescent current of the
device (approximately 17μA) helps to maintain high efficiency at light load while that current preserves a fast
transient response for applications that require tight output regulation.
The TPS8267x integrates an input current limit to protect the device against heavy load or short circuits and
features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. Fully
functional operation is permitted down to 2.1V input voltage.
POWER-SAVE MODE
If the load current decreases, the converter enters power-save mode automatically. During power-save mode,
the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output
ripple compared with other PFM architectures.
When in power-save mode, the converter resumes its operation when the output voltage falls below the nominal
voltage. The converter ramps up the output voltage with a minimum of one pulse and goes into power-save
mode when the output voltage is within its regulation limits.
The IC exits PFM mode and enters PWM mode when the output current can no longer be supported in PFM
mode. As a consequence, the DC output voltage is typically positioned approximately 0.5% above the nominal
output voltage. The transition between PFM and PWM is seamless.
PFM Mode at Light Load
PFM Ripple
Nominal DC Output Voltage
PWM Mode at Heavy Load
Figure 40. Operation in PFM Mode and Transfer to PWM Mode
MODE SELECTION
The MODE pin selects the operating mode of the device. Connecting the MODE pin to GND enables the
automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at
moderate to heavy loads, and operates in PFM mode during light loads. This type of operation maintains high
efficiency over a wide load current range.
Pulling the MODE pin high forces the converter to operate in PWM mode even at light-load currents. The
advantage is that the converter modulates its switching frequency according to a spread spectrum PWM
modulation technique that allows simple filtering of the switching harmonics in noise-sensitive applications. In this
mode, the efficiency is lower when compared to the power-save mode during light loads.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
17
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This type
of operation allows efficient power management by adjusting the operation of the converter to the specific system
requirements.
SPREAD SPECTRUM, PWM FREQUENCY DITHERING
The goal of spread spectrum architecture is to spread out the emitted RF energy over a larger frequency range
so that any resulting electromagnetic interference (EMI) is similar to white noise. The end result is a spectrum
that is continuous and lower in peak amplitude. Spread spectrum makes it easier to comply with EMI standards.
It also makes it easier to comply with the power supply ripple requirements in cellular and non-cellular wireless
applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific
frequencies.
Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is
a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases,
the frequency of operation is either fixed or regulated, based on the output load. This method of conversion
creates large components of noise at the frequency of operation (fundamental) and multiples of the operating
frequency (harmonics).
The spread spectrum architecture varies the switching frequency by approximately ±10% of the nominal
switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and
output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency
fm.
0 dBV
FENV,PEAK
Dfc
Dfc
Non-modulated harmonic
F1
Side-band harmonics
window after modulation
0 dBVref
B = 2 × fm × (1 + mf ) = 2 × ( Dfc + fm )
B = 2 × fm × (1 + mf ) = 2 × ( Dfc + fm )
Figure 41. Spectrum of a Frequency Modulated
Sin. Wave with Sinusoidal Variation in Time
Bh = 2 × fm × (1 + mf × h )
Figure 42. Spread Bands of Harmonics in
Modulated Square Signals (1)
Figure 41 and Figure 42 show that after modulation the sideband harmonic is attenuated when compared to the
non-modulated harmonic, and when the harmonic energy is spread into a certain frequency band. The higher the
modulation index (mf) the larger the attenuation.
mƒ =
δ ´ ƒc
ƒm
(1)
With:
fc is the carrier frequency (i.e. nominal switching frequency)
fm is the modulating frequency (approx. 0.016*fc)
δ is the modulation ratio (approx 0.1)
d=
(1)
18
D ƒc
ƒc
(2)
Spectrum illustrations and formulae (Figure 41 and Figure 42) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC
COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See REFERENCES Section for full citation.
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
The maximum switching frequency is limited by the process and by the parameter modulation ratio (δ), together
with fm, which is the bandwidth of the side-band harmonics around the carrier frequency fc. The bandwidth of a
frequency modulated waveform is approximately given by the Carson’s rule and can be summarized as:
(
B = 2 ´ ¦m ´ 1 + m ¦
)=2
´
(D ¦c
+ ¦m )
(3)
fm < RBW: The receiver is not able to distinguish individual side-band harmonics; so, several harmonics are
added in the input filter and the measured value is higher than expected in theoretical calculations.
fm > RBW: The receiver is able to properly measure each individual side-band harmonic separately, so that the
measurements match the theoretical calculations.
SOFT START
The TPS8267x has an internal soft-start circuit that limits the in-rush current during start-up. This circuit limits
input voltage drop when a battery or a high-impedance power source is connected to the input of the MicroSiP™
DC/DC converter.
The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a
function of the output voltage. This mode of operation continues for approximately 100μs after the enable. If the
output voltage does not reach its target value within the soft-start time, the soft-start transitions to a second mode
of operation.
If the output voltage rises above approximately 0.5V, the converter increases the input current limit and thus
enables the power supply to come up properly. The start-up time mainly depends on the capacitance present at
the output node and the load current.
ENABLE
The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously
described. For proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN pin low forces the device into shutdown. In this mode, all internal circuits are turned off and the
VIN current reduces to the device leakage current, which is typically a few hundred nanoamps.
The TPS8267x device can actively discharge the output capacitor when it turns off. The integrated discharge
resistor has a typical resistance of 100 Ω. The required time to ramp down the output voltage depends on the
load current and the capacitance present at the output node.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
19
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
APPLICATION INFORMATION
INPUT CAPACITOR SELECTION
Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to
prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the
system.
For most applications, the input capacitor that is integrated into the TPS8267x should be sufficient. If the
application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance
to find a remedy.
The TPS8267x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable
inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing
can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,
additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the
converter and the power source lead to reduce ringing that can occur between the inductance of the power
source leads and CI.
OUTPUT CAPACITOR SELECTION
The advanced, fast-response, voltage mode, control scheme of the TPS8267x allows the use of a tiny ceramic
output capacitor (CO). For most applications, the output capacitor integrated in the TPS8267x is sufficient.
At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the
voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output
capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup
during large load transitions.
The TPS8267x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any
additional capacitance. Adding a 2.2μF ceramic output capacitor (X7R or X5R dielectric) generally works from a
converter stability point of view, but does not necessarily help to minimize the output ripple voltage.
For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition),
the TPS8267xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca.
1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage
ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC
converter's output.
In applications requiring additional output bypass capacitors located close to the load, care should be taken to
ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment
with additional low value series resistance (e.g. 50 to 100mΩ) in the output path to find a remedy.
Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor
DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) …) that are temperature dependant, the
converter small and large signal behavior must be checked over the input voltage range, load current range and
temperature range.
The easiest sanity test is to evaluate, directly at the converter’s output, the following aspects:
•
•
PFM/PWM efficiency
PFM/PWM and forced PWM load transient response
During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or
ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase
margin.
20
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM
layout.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
Figure 43. Recommended Land Pattern Image and Dimensions
SOLDER PAD
DEFINITIONS (1) (2) (3) (4)
COPPER PAD
Non-solder-mask
defined (NSMD)
0.30mm
(1)
(2)
(3)
(4)
(5)
(6)
SOLDER MASK
OPENING
0.360mm
(5)
COPPER
THICKNESS
STENCIL (6)
OPENING
STENCIL THICKNESS
1oz max (0.032mm)
0.34mm diameter
0.1mm thick
Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
SURFACE MOUNT INFORMATION
The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
21
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
www.ti.com
THERMAL INFORMATION
The die temperature of the TPS8267x must be lower than the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking of the TPS8267x.
To estimate the junction temperature, approximate the power dissipation within the TPS8267x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you
have an actual TPS8267x device and TPS82671EVM evaluation module. Then calculate the internal temperature
rise of the TPS8267x above the surface of the printed circuit board by multiplying the TPS8267x power
dissipation by the thermal resistance.
The actual thermal resistance of the TPS8267x to the printed circuit board depends on the layout of the circuit
board, but the thermal resistance given in the Thermal Information Table can be used as a guide.
Three basic approaches for enhancing thermal performance are listed below:
• Improve the power dissipation capability of the PCB design.
• Improve the thermal coupling of the component to the PCB.
• Introduce airflow into the system.
PACKAGE SUMMARY
SIP PACKAGE
TOP VIEW
A1
BOTTOM VIEW
YML
D
CC
LSB
C1
C2
B1
B2
A1
A2
C3
A3
E
Code:
•
CC — Customer Code (device/voltage specific)
•
YML — Y: Year, M: Month, L: Lot trace code
•
LSB — L: Lot trace code, S: Site code, B: Board locator
MicroSiPTM DC/DC MODULE PACKAGE DIMENSIONS
The TPS8267x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:
• D = 2.30 ±0.05 mm
• E = 2.90 ±0.05 mm
REFERENCES
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
22
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
REVISION HISTORY
Note: Page numbers of current version may differ form previous versions.
Changes from Original (October 2010) to Revision A
Page
•
Added devices TPS82677 and TPS82678 to Header info ................................................................................................... 1
•
Added TPS82678 to Ordering Info table and removed "Product Preview" attribute from TPS82677 .................................. 2
•
Changed graph for Figure 8 .................................................................................................................................................. 8
•
Changed graph for Figure 11 ................................................................................................................................................ 9
•
Added copyright attribution for spectrum illustrations ......................................................................................................... 18
Changes from Revision A (April 2011) to Revision B
Page
•
Added TPS82676 part number to the data sheet header ..................................................................................................... 1
•
Deleted product preview attribute fromTPS82676 device in the Ordering Information table. .............................................. 2
Changes from Revision B (August 2011) to Revision C
Page
•
Added device TPS82672 to Header info .............................................................................................................................. 1
•
Deleted Product Preview annotation from device TPS82672 in Ordering Info table ............................................................ 2
Changes from Revision C (November 2011) to Revision D
Page
•
Added devices TPS82670, TPS82673, and TPS82674 to Header ...................................................................................... 1
•
Changed the TPS82678SIP Package Marking From: TT To: TN in the Ordering Information table ................................... 2
Changes from Revision D (April 2012) to Revision E
Page
•
Added TPS826765 to Header ............................................................................................................................................... 1
•
Added TPS826765 to Ordering Information table ................................................................................................................ 2
Changes from Revision E (November 2012) to Revision F
Page
•
Added TPS826745 to Header ............................................................................................................................................... 1
•
Added TPS826745 to Ordering Information table ................................................................................................................ 2
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765
23
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPS82670SIPR
ACTIVE
uSiP
SIP
8
3000
TBD
Call TI
Call TI
-40 to 85
YK
TXI670
TPS82670SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
YK
TXI670
TPS826711SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
YW
TXI671
TPS826711SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
YW
TXI671
TPS82671SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
RA
TXI671
TPS82671SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
RA
TXI671
TPS82672SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
WD
TXI672
TPS82672SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
WD
TXI672
TPS82673SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
YL
TXI673
TPS82673SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
YL
TXI673
TPS826745SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
TPS826745SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
TPS82675SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
RB
TXI675
TPS82675SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
RB
TXI675
TPS826765SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
AN
TXI676
TPS826765SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
AN
TXI676
TPS82676SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
TU
TXI676
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Jan-2013
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPS82676SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
TU
TXI676
TPS82677SIPR
ACTIVE
uSiP
SIP
8
3000
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
SK
TXI677
TPS82677SIPT
ACTIVE
uSiP
SIP
8
250
Green (RoHS
& no Sb/Br)
Call TI
Level-2-260C-1 YEAR
-40 to 85
SK
TXI677
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated