VISHAY SI2306DS

Si2306DS
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
ID (A)
0.057 @ VGS = 10 V
3.5
0.094 @ VGS = 4.5 V
2.8
D TrenchFETr Power MOSFET
D 100% Rg Tested
-
TO-236
(SOT-23)
G
1
3
S
D
2
Top View
Si2306DS (A6)*
*Marking Code
Ordering Information: Si2306DS-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Symbol
Limit
Drain-Source Voltage
Parameter
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a, b
TA = 25_C
TA = 70_C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a, b
TA = 25_C
Maximum Power Dissipationa, b
TA = 70_C
Operating Junction and Storage Temperature Range
Unit
V
3.5
ID
2.8
IDM
16
IS
1.25
A
1.25
PD
W
0.80
TJ, Tstg
- 55 to 150
_C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction
Junction-to-Ambient
to Ambienta
Symbol
t v 5 sec
Steady State
RthJA
Typical
Maximum
100
130
Unit
_C/W
Notes
a. Surface Mounted on FR4 Board.
b. t v 5 sec.
Document Number: 70827
S-31873—Rev. C, 15-Sep-03
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1
Si2306DS
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 30 V, VGS = 0 V
0.5
VDS = 30 V, VGS = 0 V, TJ = 55_C
10
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On State Drain Currenta
On-State
ID(on)
D( )
VDS w 4.5 V, VGS = 10 V
6
VDS w 4.5 V, VGS = 4.5 V
4
V
0.046
0.057
VGS = 4.5 V, ID = 2.8 A
0.070
0.094
gfs
VDS = 4.5 V, ID = 3.5 A
6.9
VSD
IS = 1.25 A, VGS = 0 V
0.8
Gate Charge
Qg
VDS = 15 V, VGS = 5 V, ID = 3.5 A
4.2
7
Total Gate Charge
Qgt
8.5
20
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Forward Transconductancea
Diode Forward
Voltagea
rDS(on)
mA
A
VGS = 10 V, ID = 3.5 A
Drain Source On-State
Drain-Source
On State Resistancea
nA
W
S
1.2
V
Dynamicb
1.9
VDS = 15 V,, VGS = 10 V,, ID = 3.5 A
nC
1.35
0.5
2.4
W
555
VDS = 15 V,, VGS = 0 V,, f= 1 MHz
120
pF
p
60
Switching
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
9
20
tr
7.5
18
17
35
5.2
12
td(off)
tf
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
ns
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
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Document Number: 70827
S-31873—Rev. C, 15-Sep-03
Si2306DS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
16
VGS = 10 thru 5 V
12
I D - Drain Current (A)
I D - Drain Current (A)
12
4V
8
Transfer Characteristics
16
4
8
TC = 125_C
4
25_C
3 thru 1 V
0
- 55_C
0
0
2
4
6
8
10
0
1
VDS - Drain-to-Source Voltage (V)
3
4
5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
0.5
2
Capacitance
800
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
700
0.4
0.3
0.2
500
400
300
Coss
200
VGS = 4.5 V
0.1
Ciss
600
VGS = 10 V
100
0.0
Crss
0
0
4
8
12
0
16
6
Gate Charge
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
1.6
VDS = 15V
ID = 3.5 A
8
6
4
2
0
0
2
4
6
Qg - Total Gate Charge (nC)
Document Number: 70827
S-31873—Rev. C, 15-Sep-03
18
24
30
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
10
12
8
10
1.4
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 3.5 A
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (_C)
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Si2306DS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
0.4
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
On-Resistance vs. Gate-to-Source Voltage
0.5
10
TJ = 150_C
TJ = 25_C
0.3
0.2
ID = 3.5 A
0.1
0.0
1
0.00
0.2
0.4
0.6
1.0
0.8
0
1.2
VSD - Source-to-Drain Voltage (V)
2
4
8
10
VGS - Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.4
12
ID = 250 mA
0.2
10
8
- 0.0
Power (W)
V GS(th) Variance (V)
6
- 0.2
6
- 0.4
4
- 0.6
2
- 0.8
- 50
- 25
0
25
50
75
100
125
TA = 25_C
0
150
0.01
0.1
1
TJ - Temperature (_C)
10
100
500
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.1
0.2
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 130_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
500
Square Wave Pulse Duration (sec)
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Document Number: 70827
S-31873—Rev. C, 15-Sep-03