EMP110-Q5 5.8 – 8.0 GHz Surface-Mounted PA UPDATED: 04/24/2008 FEATURES • • • • 5.8 – 8.0 GHz Operating Frequency Range 27 dBm Output Power at 1dB Compression 18.0 dB Typical Small Signal Gain -40dBc OIMD3 @Each Tone Pout 17dBm APPLICATIONS • • Point-to-point and point-to-multipoint radio Military Radar Systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25 °C, 50 ohm, VDD=7V, IDQ=400mA) SYMBOL F P1dB Gss OIMD3 Input RL Output RL PARAMETER/TEST CONDITIONS MIN TYP MAX UNITS 8.0 GHz Operating Frequency Range 5.8 Output Power at 1dB Gain Compression 25.5 27.0 dBm Small Signal Gain Output 3rd Order Intermodulation Distortion @∆f=10MHz, Each Tone Pout 17dBm 15.0 18.0 dB -40 -37 dBc Input Return Loss -10 dB Output Return Loss -5 dB Idss Saturate Drain Current VDD Power Supply Voltage VDS =3V, VGS =0V 490 1 Rth Thermal Resistance Tb Operating Base Plate Temperature 620 750 7 8 V o 22 -35 mA C/W +85 ºC ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION2,3 SYMBOL CHARACTERISTIC CONTINUOUS VDS Drain to Source Voltage 8V VGS Gate to Source Voltage -4 V IDD Drain Current Idss IGSF Forward Gate Current 9mA PIN Input Power TCH Channel Temperature 150°C TSTG Storage Temperature -65/150°C PT Total Power Dissipation @ 3dB compression 5.2W 1. Rth is mounting dependent. Measured result when used with Excelics recommended evaluation board. 2. Operating the device beyond any of the above rating may result in permanent damage. 3. Bias conditions must also satisfy the following equation VDS*IDS < (TCH –THS)/RTH; where THS = ambient temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 3 May 2008 EMP110-Q5 5.8 – 8.0 GHz Surface-Mounted PA UPDATED: 04/24/2008 CHIP OUTLINE AND PIN ASSIGNMENT 0.197±0.002 0.197±0.002 EMP110 -Q5 0.042 0.034 0.016 0 REF 0.008 0 REF 0.049 MAX 0.197±0.002 0 REF 0 REF 16 20 0.164 15 1 11 5 10 6 0.026±0.002 0.012±0.002 Additional Notes: 1) Ground Plane must be soldered to PCB RF ground 2) All dimensions are in inches 3) Refer to Excelics application notes on QFNs for further guidelines 4) Pin Assignment: Vd1 RFin Vd2 EMP110 -Q5 Vd2 Vd1 16 20 15 RFout 1 RFout RFin 5 11 10 Vg Pin 1, 2, 4, 5 3 6 7, 8, 9, 10, 11, 12, 14, 15 13 16 17, 18, 19 20 6 Vg Assignment NC RFin Vg NC RFout Vd2 NC Vd1 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 3 May 2008 EMP110-Q5 5.8 – 8.0 GHz Surface-Mounted PA UPDATED: 04/24/2008 Recommended Circuit Schematic: d d 22uF 0.1uF 0.1uF Vd1 NC RFin NC NC RFout NC NC NC NC Vg 22uF Vd2 EMP110 -Q5 NC Vg NC NC NC 22uF NC NC NC NC 0.1uF Notes: 1) External bypass capacitors should be placed as close to the package as possible. 2) Dual biasing sequence required: a. Turn-on Sequence: Apply Vg = -2.5V, followed by Vd = 7V, lastly increase Vg until required Idq b. Turn-off Sequence: Turn off Vd, followed by Vg 3) Demonstration board available upon request. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 3 May 2008