EMP112-Q5 5.0 – 7.2 GHz Surface-Mounted PA UPDATED: 04/24/2008 FEATURES • • • • 5.0 – 7.2 GHz Operating Frequency Range 29.5dBm Output Power at 1dB Compression 17.0 dB Typical Small Signal Gain -40dBc OIMD3 @Each Tone Pout 19.5dBm APPLICATIONS • • Point-to-point and point-to-multipoint radio Military Radar Systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25 °C, 50 ohm, VDD=7V, IDQ=800mA) SYMBOL F P1dB Gss OIMD3 Input RL Output RL PARAMETER/TEST CONDITIONS MIN TYP MAX UNITS 7.2 GHz Operating Frequency Range 5.0 Output Power at 1dB Gain Compression 28.5 29.5 dBm Small Signal Gain Output 3rd Order Intermodulation Distortion @∆f=10MHz, Each Tone Pout 19.5dBm 15.0 17.0 dB -40 -37 dBc Input Return Loss -12 dB Output Return Loss -5 dB Idss Saturate Drain Current VDD Power Supply Voltage VDS =3V, VGS =0V 990 1 Rth Thermal Resistance Tb Operating Base Plate Temperature 1230 1400 7 8 V o 11 -35 mA C/W +85 ºC ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION2,3 SYMBOL CHARACTERISTIC CONTINUOUS VDS Drain to Source Voltage 8V VGS Gate to Source Voltage -4 V IDD Drain Current Idss IGSF Forward Gate Current PIN Input Power TCH Channel Temperature 150°C TSTG Storage Temperature -65/150°C PT Total Power Dissipation 18mA @ 3dB compression 10.4W 1. Rth is mounting dependent. Measured result when used with Excelics recommended evaluation board. 2. Operating the device beyond any of the above rating may result in permanent damage. 3. Bias conditions must also satisfy the following equation VDS*IDS < (TCH –THS)/RTH; where THS = ambient temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 3 May 2008 EMP112-Q5 5.0 – 7.2 GHz Surface-Mounted PA UPDATED: 04/24/2008 CHIP OUTLINE AND PIN ASSIGNMENT 0.197±0.002 0.197±0.002 EMP112 -Q5 0.042 0.034 0.016 0 REF 0.008 0 REF 0.049 MAX 0.197±0.002 0 REF 0 REF 16 20 0.164 15 1 11 5 10 6 0.026±0.002 0.012±0.002 Additional Notes: 1) Ground Plane must be soldered to PCB RF ground 2) All dimensions are in inches 3) Refer to Excelics application notes on QFNs for further guidelines 4) Pin Assignment: Top View Vd1 RFin Bottom View Vd2 EMP112 -Q5 Vd2 Vd1 16 20 15 RFout 1 RFout RFin 5 11 10 Vg 6 Vg Pin 1, 2, 4, 5 3 6 7, 8, 9, 10, 11, 12, 14, 15 13 16 17, 18, 19 20 Assignment NC RFin Vg NC RFout Vd2 NC Vd1 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 3 May 2008 EMP112-Q5 5.0 – 7.2 GHz Surface-Mounted PA UPDATED: 04/24/2008 Recommended Circuit Schematic: Vd 22uF 0.1uF 0.1uF Vd1 NC RFin 22uF NC NC RFout NC NC NC NC Vg Vd Vd2 EMP112 -Q5 NC Vg NC NC NC 22uF NC NC NC NC 0.1uF Notes: 1) External bypass capacitors should be placed as close to the package as possible. 2) Dual biasing sequence required: a. Turn-on Sequence: Apply Vg = -2.5V, followed by Vd = 7V, lastly increase Vg until required Idq b. Turn-off Sequence: Turn off Vd, followed by Vg 3) Demonstration board available upon request. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 3 May 2008