SCBS178O − AUGUST 1992 − REVISED MARCH 2004 D Compatible With IEEE Std 1194.1-1991 D D D D High-Impedance State During Power Up (BTL) TTL A Port, Backplane Transceiver Logic (BTL) B Port Open-Collector B-Port Outputs Sink 100 mA BIAS VCC Minimizes Signal Distortion During Live Insertion or Withdrawal D D and Power Down B-Port Biasing Network Preconditions the Connector and PC Trace to the BTL High-Level Voltage TTL-Input Structures Incorporate Active Clamping to Aid in Line Termination 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1B2 GND 1B3 1B4 GND 1B5 1B6 GND 1B7 1B8 GND 1B9 NC 2B1 GND 2B2 2B3 GND 2B4 2B5 GND 2B6 2B7 GND 2B8 2AO5 2AI5 2AO6 2AI6 GND 2AO7 2AI7 2AO8 2AI8 GND 2AO9 2AI9 VCC 2OEA 2OEA 2LEBA 2CLKBA 2CLKAB 2LEAB 2OEB 2OEB BIAS VCC NC GND 2B9 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC VCC GND 1AO6 1AI6 1AO7 1AI7 GND 1AO8 1AI8 1AO9 1AI9 GND 2AO1 2AI1 2AO2 2AI2 GND 2AO3 2AI3 2AO4 2AI4 GND VCC NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 1AI5 1AO5 1AI4 1AO4 GND 1AI3 1AO3 1AI2 1AO2 GND 1AI1 1AO1 VCC 1OEA 1OEA 1LEBA 1CLKBA 1CLKAB 1LEAB 1OEB 1OEB BG GND BG VCC GND 1B1 PCA PACKAGE (TOP VIEW) NC − No internal connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $ %&'# "$ (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS178O − AUGUST 1992 − REVISED MARCH 2004 description/ordering information The SN74FB1650 contains two 9-bit transceivers designed to translate signals between TTL and backplane transceiver-logic (BTL) environments. The device is designed specifically to be compatible with IEEE Std 1194.1-1991. The B port operates at BTL-signal levels. The open-collector B ports are specified to sink 100 mA. Two output enables (OEB and OEB) are provided for the B outputs. When OEB is low, OEB is high, or VCC is less than 2.1 V, the B port is turned off. The A port operates at TTL-signal levels. The A outputs reflect the inverse of the data at the B port when the A-port output enable (OEA) is high. When OEA is low or when VCC is less than 2.1 V, the A outputs are in the high-impedance state. BIAS VCC establishes a voltage between 1.62 V and 2.1 V on the BTL outputs when VCC is not connected. BG VCC and BG GND are the supply inputs for the bias generator. ORDERING INFORMATION PACKAGE† TA ORDERABLE PART NUMBER TOP-SIDE MARKING 0°C to 70°C TQFP − PCA Tube SN74FB1650PCA FB1650 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Function Tables TRANSCEIVER INPUTS OEA FUNCTION OEA OEB OEB X X H L A data to B bus L H X X B data to A bus A data to B bus, B data to A bus L H H L X X L X X X X H H X X X X L X X B-bus isolation A-bus isolation STORAGE MODE INPUTS 2 FUNCTION LE CLK H X Transparent L ↑ Store data L L Storage POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS178O − AUGUST 1992 − REVISED MARCH 2004 functional block diagram 81 1OEB 1OEB 1CLKAB 1LEAB 1LEBA 1CLKBA 1OEA 1OEA 80 83 82 85 84 87 86 90 1AI1 1D C2 76 1B1 C1 89 1AO1 1D C2 C1 To Eight Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC, BIAS VCC, BG VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI: Except B port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.2 V to 7 V B port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.2 V to 3.5 V Voltage range applied to any B output in the disabled or power-off state, VO . . . . . . . . . . . . . . −0.5 V to 3.5 V Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC Input clamp current, IIK: Except B port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40 mA B port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA Current applied to any single output in the low state, IO: A port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA B port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA Package thermal impedance, θJA (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCBS178O − AUGUST 1992 − REVISED MARCH 2004 recommended operating conditions (see Note 2) VCC, BG VCC, BIAS VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage IIK IOH Input clamp current B port Except B port B port IOL MIN NOM MAX 4.5 5 5.5 1.62 Low-level output current V 2.3 V 2 0.75 1.47 Except B port High-level output current UNIT 0.8 V −18 mA A port −3 mA A port 24 B port 100 mA TA Operating free-air temperature 0 70 °C NOTE 2: To ensure proper device operation, all unused inputs must be terminated as follows: A and control inputs to VCC(5 V) or GND, and B inputs to GND only. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range PARAMETER B port 0.75 B port VCC = 4.5 V IOL = 80 mA IOL = 100 mA Except B port VCC = 5.5 V, VCC = 5.5 V, VI = 5.5 V VI = 2.7 V 50 µA 50 µA VCC = 5.5 V, VCC = 5.5 V, VI = 0.5 V VI = 0.75 V −50 VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.5 V VCC = 0 to 2.1 V, VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V VO = 0.5 V to 2.7 V VCC = 0 to 5.5 V, VCC = 5.5 V, VO = 2.1 V VO = 0 VCC = 5.5 V, IO = 0 AO port Except B port Except B port B port IOZH IOZL AO port IOZPU IOZPD AO port IOH IOS§ B port AO port AO port A port −1.2 −0.5 3.3 0.35 B port to A port 0.5 1.1 −100 −30 V µA A 50 µA −50 µA 50 µA −50 µA 100 µA −150 mA 120 mA 5.5 Control inputs VI = VCC or GND 5.5 AO ports VO = VCC or GND 5.5 VCC = 0 to 5.5 V Cio B port per IEEE Std 1194.1-1991 † All typical values are at VCC = 5 V, TA = 25°C. ‡ For I/O ports, the parameters IIH and IIL include the off-state output current. § Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 4 V 100 AI port Co V 1.15 A port to B port Ci UNIT 2.5 AO port ICC MAX IOH = −3 mA IOL = 24 mA VOH IIL‡ TYP† VCC = 4.5 V, VCC = 4.5 V, Except B port II IIH‡ MIN II = −18 mA II = −40 mA VIK VOL TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 pF pF 5.5 pF SCBS178O − AUGUST 1992 − REVISED MARCH 2004 live-insertion specifications over recommended operating free-air temperature range PARAMETER ICC (BIAS VCC) TEST CONDITIONS VCC = 0 to 4.5 V VCC = 4.5 V to 5.5 V VB = 0 to 2 V, MIN MAX 450 VI (BIAS VCC) = 4.5 V to 5.5 V VO B port VCC = 0, VCC = 0 , VI (BIAS VCC) = 5 V VB = 1 V, IO B port VCC = 0 to 2.2 V, VCC = 0 to 5.5 V, OEB = 0 to 5 V 10 1.62 VI (BIAS VCC) = 4.5 V to 5.5 V 2.1 −1 100 OEB = 0 to 0.8 V 1 UNIT A µA V µA A mA timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) VCC = 5 V, TA = 25°C MIN fclock tw Clock frequency tsu Setup time th Hold time MIN 150 Pulse duration POST OFFICE BOX 655303 CLK or LE 3.3 3.3 Data before LE 4.8 4.8 Data before CLK↑ 4.9 4.9 Data after LE 1.8 1.8 Data after CLK↑ 1.1 1.1 • DALLAS, TEXAS 75265 MAX UNIT 150 MHz MAX ns ns ns 5 SCBS178O − AUGUST 1992 − REVISED MARCH 2004 switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER fmax tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ tsk(p)† tsk(o)† tt Transition time FROM (INPUT) TO (OUTPUT) MIN TYP MIN AI B LEAB B CLKAB B B AO LEBA AO CLKBA AO OEB B OEB B OEA AO OEA AO OEA AO OEA AO MAX 150 MHz 1.8 3.7 5.3 1.8 6.2 2.9 4.4 6 2.9 7.2 2.7 4.2 5.8 2.7 6.4 3.5 5 6.5 3.5 7.3 2.3 3.9 5.5 2.3 6 2.9 4.5 6.1 2.9 6.7 3.5 5.9 7.9 3.5 8.6 2.2 3.7 5.3 2.2 5.7 1.8 3.2 4.6 1.8 5.1 1.7 3 4.4 1.7 4.7 1.8 3.1 4.6 1.8 5.1 1.7 3.1 4.6 1.7 4.9 2.7 4.6 6.4 2.7 6.7 2.9 4.1 5.9 2.9 6.6 2.6 4.3 6.2 2.6 6.6 3.4 4.6 6.4 3.4 7 1.4 2.9 4.4 1.4 4.9 1.4 2.6 4 1.4 4.6 1.7 3.4 5.1 1.7 5.8 2.2 3.6 5 2.2 5.5 1.7 3.3 4.7 1.7 5.5 1.7 3.1 4.4 1.7 5.1 1.5 2.9 4.5 1.5 5.1 2 3.1 4.6 2 4.8 Pulse skew, AI to B or B to AO Output skew, AI to B or B to AO ns ns ns ns ns ns ns ns ns ns ns ns 0.9 1.7 3.1 0.5 4.6 0.5 2 3.6 0.4 4.2 • DALLAS, TEXAS 75265 ns 1 AO outputs (10% to 90%) POST OFFICE BOX 655303 ns 0.5 B outputs (1.3 V to 1.8 V) 1 UNIT MAX 150 t(pr) B-port input pulse rejection † Skew values are applicable for through mode only. 6 VCC = 5 V, TA = 25°C 1 ns ns SCBS178O − AUGUST 1992 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 2.1 V 16.5 Ω 7V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) Test Point From Output Under Test CL = 30 pF (see Note A) 500 Ω LOAD CIRCUIT FOR A OUTPUTS TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open LOAD CIRCUIT FOR B OUTPUTS tw 3V Input 1.5 V 1.5 V 3V 1.5 V Timing Input 0V 0V VOLTAGE WAVEFORMS PULSE DURATION tsu th 3V 3V Input 1.5 V 1.5 V Data Input 1.5 V 1.5 V 0V 0V tPHL tPLH 1.55 V 1.55 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOH Output VOL 3V Output Control tPZL 2V 1.55 V 1.55 V 1V tPHL 1.5 V Output Waveform 1 S1 at 7 V (see Note B) tPLZ 3.5 V 1.5 V tPZH tPLH VOH Output 1.5 V 0V VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (A TO B) Input 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (B TO A) Output Waveform 2 S1 at Open (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH − 0.3 V ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES (A PORT) NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: TTL inputs: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns; BTL inputs: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuits and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74FB1650PCA ACTIVE HLQFP PCA 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SN74FB1650PCAG4 ACTIVE HLQFP PCA 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MHTQ003A – JANUARY 1995 – REVISED DECEMBER 1996 PCA (S-PQFP-G100) PLASTIC QUAD FLATPACK (DIE DOWN) 0,27 0,17 0,50 75 0,08 M 51 Heat Slug 76 50 100 26 1 0,13 NOM 25 12,00 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°– 7° 0,75 0,45 Seating Plane 0,08 1,60 MAX 4040288 / B 10/96 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Thermally enhanced molded plastic package with a heat slug (HSL) Falls within JEDEC MS-026 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated