FINTEK F75367

F75367
F75367 Datasheet
±1oC Temperature Sensor with I2C-SST Bridge
Release Date: February, 2008
Revision: V0.11P
Feb., 2008
V0.11P
F75367
F75367 Datasheet Revision History
Version
Date
Page
Revision History
V0.10P
2007/12/20
-
Preliminary Version.
V0.11P
2008/2/29
-
Add register and function descriptions
Please note that all data and specifications are subject to change without notice. All the trade marks of products and
companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Customers using or selling these products for use
in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from such
improper use or sales.
Feb., 2008
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F75367
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................................................................5
2. FEATURES ....................................................................................................................................................................................5
3. KEY SPECIFICATIONS ..............................................................................................................................................................5
4. PIN CONFIGURATION...............................................................................................................................................................6
5. PIN DESCRIPTION......................................................................................................................................................................6
5.1.
POWER PIN .....................................................................................................................................................................6
5.2.
MONITORING ITEMS AND FAN SPEED CONTROL .............................................................................................................6
6. FUNCTION DESCRIPTION .......................................................................................................................................................7
6.1
ACCESS INTERFACE ............................................................................................................................................................7
6.2
TEMPERATURE MONITORING ..............................................................................................................................................8
6.3
BETA COMPENSATION.........................................................................................................................................................9
6.4
SST MASTER ....................................................................................................................................................................10
6.5
PCB LAYOUT GUIDE ........................................................................................................................................................10
7. REGISTER DESCRIPTION ......................................................................................................................................................11
7.1.
CONFIGURATION REGISTER  INDEX 01H ....................................................................................................................11
7.2.
CONFIGURATION REGISTER  INDEX 0AH ....................................................................................................................12
7.3.
EXTERNAL DEVICE ADDRESS REGISTER INDEX 40H ~ 45H .......................................................................................12
7.4.
EXTERNAL DEVICE INDEX REGISTER INDEX 48H ~ 4DH ............................................................................................12
7.5.
EXTERNAL DEVICE ENABLE REGISTER INDEX 50H ...................................................................................................12
7.6.
EXTERNAL DEVICE MONITORING CYCLE SELECT REGISTER 1  INDEX 52H ...............................................................12
7.7.
EXTERNAL DEVICE MONITORING CYCLE SELECT REGISTER 2  INDEX 53H ...............................................................12
7.8.
SST DEVICE RESET REGISTER  INDEX 55H................................................................................................................12
7.9.
TEMPERATURE INTERRUPT STATUS REGISTER  INDEX 61H (IF DEV_BANK_EN IS 0) .............................................13
7.10.
TEMPERATURE INTERRUPT STATUS REGISTER  INDEX 61H (IF DEV_BANK_EN IS 1) .............................................13
7.11.
TEMPERATURE REAL TIME STATUS REGISTER  INDEX 62H (IF DEV_BANK_EN IS 0) .............................................14
7.12.
TEMPERATURE REAL TIME STATUS REGISTER  INDEX 62H (IF DEV_BANK_EN IS 1) .............................................14
7.13.
TEMPERATURE REAL TIME STATUS REGISTER  INDEX 65H........................................................................................15
7.14.
TEMPERATURE OFFSET BANK SELECT REGISTER  INDEX 67H ....................................................................................15
7.15.
TEMPERATURE OFFSET REGISTER  INDEX 68H ..........................................................................................................15
7.16.
DIODE OPEN STATUS REGISTER  INDEX 6FH (IF DEV_BANK_EN IS 0)..............................................................15
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7.17.
DIODE OPEN STATUS REGISTER  INDEX 6FH (IF DEV_BANK_EN IS 1)..............................................................15
7.18.
TEMPERATURE REGISTER -- INDEX 70H ~ 83H ..............................................................................................................16
7.19.
TEMPERATURE FILTER SELECT REGISTER -- INDEX 8EH ...............................................................................................17
8. ELECTRICAL CHARACTERISTIC........................................................................................................................................18
8.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................18
8.2 DC CHARACTERISTICS ..........................................................................................................................................................18
8.3 AC CHARACTERISTICS ..........................................................................................................................................................20
9. ORDERING INFORMATION ...................................................................................................................................................20
10. PACKAGE DIMENSIONS......................................................................................................................................................21
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1. General Description
The F75367 is a temperature sensor IC with ß compensation and supports I2C to SST Master Bridge
function. This chip provides 2-remote temperature sensor, 1-local temperature sensor and 6-remote
temperature input by SST Master. The local temperature sensor can be applied to sense environment
temperature without any component. The 2 remote temperature sensors can be performed by CPU
thermal diode or transistor 2N3906. The F75367 also can support new generational 45nm CPU
temperature sensing by varied ß of CPU. Besides 3 sets temperature sensors, the F75367 also can read
6 temperature inputs from other devices by SST interfaces. The host can read the extra 6 sets
temperature by I2C interface (I2C to SST Master Bridge). Totally the F75367 can support 9 temperature
outputs for host fan control by I2C.
The F75367 is in the green package of 8-pin SOP and powered by 3.3V.
2. Features
„
Provide 1 on-chip local and 2 remote temperature sensors
z
Accuracy ±1 oC from +60oC to +100oC on remote channel
z
Accuracy ±3 oC from +60oC to +100oC on local channel
„
Support 6 temperature inputs from external sensor devices (ex: F75395)
„
Beta-compensation support for new generational CPU.
„
SST Master interfaces for external devices’ temperature sensing
„
I2C to SST Master Bridge
„
VCC3V operation and 8 SOP Green Package
„
I2C slave address:
F75367
A6
A5
A4
A3
A2
A1
A0
1
0
0
1
1
1
0
3. Key Specifications
„
Supply Voltage
3.0V to 3.6V
„
Operating Supply Current
„
Measured Range
-40 ~ 127 oC
„
Remote Diode Temperature Accuracy
±1oC from +60oC to +100oC
typ.
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±3oC from +60oC to +100oC
Local Temperature Accuracy
„
4. Pin Configuration
,
5. Pin Description
ILv/OD8-S1
- Low level bi-directional pin (VIH Æ 0.9V, VIL Æ 0.6V.). Output with 8mA drive and 1mA sink capability.
OOD12
- can select to OD or OUT by register, with 12 mA source-sink capability.
AOUT
- Output pin(Analog).
OD12
- Open-drain output pin with 12 mA sink capability.
OD12-5V
Open-drain output pin with 12 mA sink capability, 5V tolerance.
INts5V
- TTL level input pin and schmitt trigger, 5V tolerance.
AIN
- Input pin(Analog).
P
- Power.
5.1.
Power Pin
Pin No.
8
5
Pin Name
VCC
GND
Type
P
P
Description
3.3V power supply voltage input
GND
5.2. Monitoring Items and Fan Speed Control
Pin No.
1
Pin Name
2
D1+
SST_M
Type
ILv/OD8-S1
AOUT
AIN
PWR
Description
Intel SST master hardware monitor interface
Positive connection to remote temperature sensor
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3
D-
AGND
Negative connection to remote temperature sensor
4
D2+
AOUT
AIN
Positive connection to remote temperature sensor
6
SCLK_S
INts5V
Slave serial bus clock
7
SDATA_S
INts5V/OD12
Slave serial bus data
6. Function Description
The F75367 is a temperature sensor IC with ß compensation and supports I2C to SST Master Bridge
function. This chip provides 2-remote temperature sensors, 1-local temperature sensor and 6-external
remote temperature input (external devices) by SST Master. The local temperature sensor can be
applied to sense environment temperature without any component. The 2 remote temperature sensors
can be performed by CPU thermal diode or transistor 2N3906. The F75367 supports new generational
45nm CPU temperature sensing by varied ß of CPU. Besides 3 temperature sensors, the F75367 also
can read 6 temperature inputs from other devices by SST interfaces. The host can read the extra 6 sets
temperature by I2C interface (I2C to SST Master Bridge). Totally the F75367 can support 9 temperature
outputs for host fan control by I2C.
6.1 Access Interface
The F75367 can be connected to a compatible 2-wire serial system management bus as a slave device
under the control of the master device, using two device terminals SCL and SDA. The F75367 supports
I2C protocol of, “Write Byte”, “Read Byte”, both with or without Packet Error checking (PEC) which is
calculated using CRC-8. For detail information about PEC, please check I2C specification. F75367 also
supports Alert Response Address (ARA) protocol.
The operation of the protocol is described with details in the following sections.
(a) I2C write to internal address register followed by the data byte
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0
7
8
0
7
8
SCL
SDA
1
0
0
Start By
Master
1
1
0
0
R/W
D7
D6
Ack
by
395
Frame 1
Serial Bus Address Byte
D5
D4
D3
D2
D1
D0
Ack
by
395
Frame 2
Internal Index Register Byte
0
7
8
SCL (Continued)
SDA (Continued)
D7
D6
D5
D4
D3
D2
D1
D0
Stop
by
Master
Frame 3
Data Byte
Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte
(b) Serial bus write to internal address register only
0
7
8
0
7
8
SCL
SDA
1
0
Start By
Master
0
1
1
1
0
R/W
D7
D6
Ack
by
395
Frame 1
Serial Bus Address Byte
D5
D4
D3
D2
D1
D0
Ack
by
395
Frame 2
Internal Index Register Byte
Stop by
Master
0
Figure 2. Serial Bus Write to Internal Address Register Only
(c) Serial bus read from a register with the internal address register prefer to desired location
0
7
8
0
7
8
SCL
1
SDA
Start By
Master
0
0
1
1
1
0
R/W
D7
Ack
by
395
Frame 1
Serial Bus Address Byte
D6
D5
D4
D3
D2
D1
D0
Ack
by
Master
Frame 2
Internal Index Register Byte
Stop by
Master
0
Figure 3. Serial Bus Read from Internal Address Register
6.2 Temperature Monitoring
The F75367 monitors local and 2 remote temperature sensors. Both can be measured from 0°C to
140.875°C.
The temperature format is as the following table:
Temperature ( High Byte )
Digital Output
Temperature ( Low Byte )
Digital Output
0°C
0000 0000
0°C
000 0 0000
1°C
0000 0001
0.125°C
001 0 0000
25°C
0001 1001
0.250°C
010 0 0000
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50°C
0011 0010
0.375°C
011 0 0000
75°C
0100 1011
0.500°C
100 0 0000
90°C
0101 1010
0.625°C
101 0 0000
100°C
0110 0100
0.750°C
110 0 0000
140°C
1000 1100
0.875°C
111 0 0000
Remote-sensor transistor manufacturers
Manufacturer
Model Number
Panasonic
2SB0709 2N3906
Philips
PMBT3906
6.3 Beta Compensation
The F75367 is configured to detect the temperature of diodes (e.g. 2N3906) or CPU thermal diodes. The
diode can be connected in different way as below Figure.
D+
D+
D-
D-
Substrate PNP transistor
i.e. CPU
Discrete PNP transistor
i.e. 2N3906
The basic of the temperature sensor follows mathematical formula as below:
∆VBE
 1 + β1 

 Ic
β1  1
KT
Ie1 KT

=
× ln
=
× ln
q
Ie2
q
 1 + β2 

 Ic 2
 β2 
The F75367 measures temperature from the thermal diodes by the basic. In traditional case, the F75367
outputs dual currents to a thermal diode. Then the F75367 calculates the absolute temperature by △VBE.
For discrete transistor (i.e. 2N3906), the beta is normally very high such that the percent change in beta
is very small. For example, 15% variation in beta for two forced IE currents and the beta is 50 would
contribute about 0.32℃ error per 100℃. For Substrate PNP transistor (i.e. CPU), the beta is very small
such that the proportional beta variation will very high, and it will cause large error in temperature
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measurement. For example, 15% variation in beta for two forced IE currents and the beta is 0.5 would
contribute about 11.12℃ error per 100℃.
In Order to solve the second issue, the F75367 provides a beta compensation solution for accurate
temperature sensing. The F75367 can support the beta range over 0.2 for beta compensation. In this
new method, the F75367 will provide two IE currents, and feedback two IB currents. The F75367 will
auto-adjust IE (IE1 and IE2) current and feedback IB (IB1 and IB2) promptly for getting proper IC
proportion (IC1/ IC2), then calculates the accurate temperature. This algorithm of beta compensation is
suitable for substrate transistor or new generational CPU (i.e. 45nm CPU) because small beta and high
proportional beta variation.
6.4 SST Master
F75367 Support 6 external device inputs for temperature reading by SST and pass to host by I2C. It’s
really a SST to I2C bridge IC for some specific SST temperature sensors’ application. User can ready
SST temperature sensor by F75367 bridge function. For instance, user would like to read an external
SST temperature sensor by F75367. She could follow below list to read the SST Device Temperature.
If the address/index of SST device is 49h/00h.Before you read the temperature from SST
device. You should do below list:
1.
write register 49h to register 40h (Define external device0 address)
2.
write 00h to register 48h (Define external device0 index)
3.
write “1” to register 50h bit 0 (Enable external device0)
4. read register 78h to get the temperature value of SST device
Totally the F75367 can support 6 external device inputs by SST master. About the detail setting of register,
please refer the register description.
6.5 PCB Layout Guide
PCB can be electrically noisy environments, and the F75367 is measuring very small voltage from the
remote sensor, so care must be taken to minimize noise which is occurred at the sensor inputs. The
following guideline should be taken to reduce the measurement error of the temperature sensors:
Place the F75367 as close as practical to the remote sensing diode. In noisy environments, such as a
computer main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst
noise sources are avoided. Noise sources generally include clock generators, CRTs, memory buses and
PCI/ISA bus etc.
Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide
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a ground plane under the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the
CRT. And also don’t route the trace across fast digital signals which can easily induce bigger error.
GND
10MILS
DXP
10MILS
DXN
10MILS
MINIMUM
10MILS
GND
Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and
spacing is recommended.
Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where
copper/solder joints are used, make sure that they are in both the D+ and D- path and at the same
temperature. Thermocouple effects should not be a major problem as 1℃ corresponds to about 200µV. It
means that a copper-solder thermocouple exhibits 3µV/℃, and takes about 200µV of the voltage error at
D+ & D- to cause a 1℃ measurement error. Adding a few thermocouples causes a negligible error.
Place a 0.1µF bypass capacitor close to the VCC pin. In very noisy environments, place an external
2200pF input filter capacitors across D+, D- close to the F75367.
If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended.
It will work up to around 6 to 12 feet.
Because the measurement technique uses switched current sources, excessive cable and/or filter
capacitance will affect the measurement accuracy. When using long cables, the filter capacitor may be
reduced or removed. Cable resistance can also induce errors. 1 Ω series resistance introduces about
0.5℃ error.
7. Register Description
7.1. Configuration Register  Index 01h
Bit
Name
R/W Default
7-1
-
R/W
0
0
T_START
R/W
1
Description
Reserved
Set one to enable startup of temperature monitoring operations; a zero
puts the part in standby mode.
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7.2. Configuration Register  Index 0ah
Bit
Name
7
-
-
0
Reserved
6
SST_3V_EN
R/W
0
Enable SST master to output 3 volt signal
R/W
1
Reserved
5
-
R/W Default
Description
4-2
-
R/W
0
Reserved
1-0
-
R
0
Reserved
7.3. External Device Address Register Index 40h ~ 45h
Bit
Name
7-0
DEV_ADDR
R/W Default
R/W
0
Description
Device address of external device0 ~ device5 setting.
7.4. External Device Index Register Index 48h ~ 4dh
Bit
Name
7-0
DEV_INDEX
R/W Default
R/W
0
Description
Device index of external device0 ~ device5.
7.5. External Device Enable Register Index 50h
Bit
Name
R/W Default
Description
7-6
-
R/W
0
Reserved
5-0
DEV_EN
R/W
0
External device enable. (Bit mask)
7.6. External Device Monitoring Cycle Select Register 1  Index 52h
Bit
Name
R/W Default
7-6
CYC_SEL3
R/W
5-4
CYC_SEL2
R/W
3-2
CYC_SEL1
R/W
1-0
CYC_SEL0
R/W
Description
2’b11 Select device monitoring cycle:
2’b11 2’b11: 8hz
2’b10: 4hz
2’b11
2’b01: 2hz
2’b11
2’b00: 1hz
7.7. External Device Monitoring Cycle Select Register 2  Index 53h
Bit
Name
R/W Default
7-6
Reserved
R
5-4
Reserved
R/W
3-2
CYC_SEL5
R/W
1-0
CYC_SEL4
R/W
Description
0
Select device monitoring cycle:
2’b11 2’b11: 8hz
2’b11 2’b10: 4hz
2’b01: 2hz
2’b11 2’b00: 1hz
7.8. SST Device Reset Register  Index 55h
Bit
Name
R/W Default
Description
7
-
R/W
0
Reserved
6
RESET_SST_EN
R/W
0
Set this bit to reset SST device, this bit will be cleared after reset
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5
-
R/W
0
Reserved
4-2
RESET_DEV_SEL
R/W
0
Select which SST device to be reset
1
-
R/W
0
Reserved
0
-
R/W
0
Reserved
7.9. Temperature Interrupt Status Register  Index 61h (If DEV_BANK_EN is 0)
Bit
Name
R/W Default
Description
A one indicates at least one of TEMP3~TEMP8 temperature sensor has
7
DEV_T_EXC_STS
R
0
exceeded high limit or below the “high limit –hysteresis” limit. Write 1 to
clear this bit, write 0 will be ignored.
6-3
-
R
0
Reserved
A one indicates TEMP2 temperature sensor has exceeded high limit or
2
T2_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates TEMP1 temperature sensor has exceeded high limit or
1
T1_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates temperature sensor (local temperature) has exceeded the
0
LOCAL_EXC _STS R/W
0
high limit or below the “high limit –hysteresis” limit. Write 1 to clear this bit,
write 0 will be ignored.
7.10. Temperature Interrupt Status Register  Index 61h (If DEV_BANK_EN is 1)
Bit
Name
7-6
-
R/W Default
R
0
Description
Reserved
A one indicates TEMP8 temperature sensor has exceeded high limit or
5
T8_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates TEMP7 temperature sensor has exceeded high limit or
4
T7_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates TEMP6 temperature sensor has exceeded high limit or
3
T6_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates TEMP5 temperature sensor has exceeded high limit or
2
T5_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
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A one indicates TEMP4 temperature sensor has exceeded high limit or
1
T4_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
A one indicates TEMP3 temperature sensor has exceeded high limit or
0
T3_EXC _STS
R/W
0
below the “high limit –hysteresis” limit. Write 1 to clear this bit, write 0 will
be ignored.
7.11. Temperature Real Time Status Register  Index 62h (If DEV_BANK_EN is 0)
Bit
Name
R/W Default
7
DEV_T_EXC
R
0
6-3
-
R
0
2
T2_EXC
R
0
1
T1_EXC
R
0
0
LOCAL_EXC
R
0
Description
Set when one of TEMP3~TEMP8 exceeds the high limit. Clear when the
TEMP3~TEMP8 is below the “high limit –hysteresis” temperature.
Reserved
Set when the TEMP2 exceeds the high limit. Clear when the TEMP2 is
below the “high limit –hysteresis” temperature.
Set when the TEMP1 exceeds the high limit. Clear when the TEMP1 is
below the “high limit –hysteresis” temperature.
Set when the local temperature exceeds the high limit. Clear when the
local temperature is below the “high limit –hysteresis” temperature.
7.12. Temperature Real Time Status Register  Index 62h (If DEV_BANK_EN is 1)
Bit
Name
R/W Default
7-6
-
R
0
5
T8_EXC
R
0
4
T7_EXC
R
0
3
T6_EXC
R
0
2
T5_EXC
R
0
1
T4_EXC
R
0
0
T3_EXC
R
0
Description
Reserved
Set when the TEMP8 exceeds the high limit. Clear when the TEMP8 is
below the “high limit –hysteresis” temperature.
Set when the TEMP7 exceeds the high limit. Clear when the TEMP7 is
below the “high limit –hysteresis” temperature.
Set when the TEMP6 exceeds the high limit. Clear when the TEMP6 is
below the “high limit –hysteresis” temperature.
Set when the TEMP5 exceeds the high limit. Clear when the TEMP5 is
below the “high limit –hysteresis” temperature.
Set when the TEMP4 exceeds the high limit. Clear when the TEMP4 is
below the “high limit –hysteresis” temperature.
Set when the TEMP3 exceeds the high limit. Clear when the TEMP3 is
below the “high limit –hysteresis” temperature.
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7.13. Temperature Real Time Status Register  Index 65h
Bit
Name
R/W Default
Description
7-1
-
R
0
Reserved
0
DEV_BANK_EN
R/W
0
Set 1 to choose external device bank
7.14. Temperature Offset bank select Register  Index 67h
Bit
Name
7-2
Reserved
R/W Default
RO
0
Description
-This register is for device F75367 use, not for external device used.
1-0
OFFSET_SEL
R/W
0
0: CR68 is local temperature offset.
1: CR68 is temperature 1 offset.
2: CR68 is temperature 2 offset.
7.15. Temperature Offset Register  Index 68h
Bit
7
Name
-
R/W Default
RO
Description
0
Reserved
0
Temperature offset register. The real temperature value will be added by
this offset and then will be put into temperature reading (Index 70h~75h).
The offset ranges from -64ºC to +63ºC.
6-0
T_OFFSET
7’b011_1111: mean temperature + 63;
R/W
7’b000_0001: mean temperature + 1;
7’b000_0000: mean temperature + 0;
7’b111_1111: mean temperature - 1;
7’b100_0000: mean temperature - 64;
7.16. DIODE OPEN Status Register  Index 6Fh
Bit
7-4
Name
-
R/W Default
(If DEV_BANK_EN is 0)
Description
R
0
Reserved
4
DEV_OPEN
R
0
One of the diode of external device0-5 (T3~T8) is open or short
3
-
R
0
Reserved
2
T2_DIODE_OPEN
R
0h
External diode 2 is open or short
1
T1_DIODE_OPEN
R
0h
External diode 1 is open or short
0
T0_DIODE_OPEN
R
0h
Internal diode 0 is open or short
7.17. DIODE OPEN Status Register  Index 6Fh
Bit
Name
R/W Default
(If DEV_BANK_EN is 1)
Description
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7-6
-
R
0
Reserved
5
T8_DIODE_OPEN
R
0
The diode of T8 (External Device5) is open or short
4
T7_DIODE_OPEN
R
0
The diode of T7 (External Device4) is open or short
3
T6_DIODE_OPEN
R
0
The diode of T6 (External Device3) is open or short
2
T5_DIODE_OPEN
R
0
The diode of T5 (External Device2) is open or short
1
T4_DIODE_OPEN
R
0
The diode of T4 (External Device1) is open or short
0
T3_DIODE_OPEN
R
0
The diode of T3 (External Device0) is open or short
7.18. Temperature Register  Index 70h ~ 83h
Address
Attribute
Default
Value
Description
70h
RO
--
Local temperature[10:3] reading. The unit of reading is 1ºC.At the moment of
reading this register. (when open or short this byte will return 0)
71h
RO
--
CR71 bit7-bit5 are the Local temperature reading value[2:0]. The unit of reading
is 0.125ºC.
CR71 bit 0 is the sign bit of the Local temperature.
(when open or short this byte will return 1, “sign bit set to 1”)
72h
RO
--
Temperature 1 reading. The unit of reading is 1ºC.At the moment of reading this
register.
73h
RO
--
CR73 bit7-bit5 are the temperature 1 reading value[2:0]. The unit of reading is
0.125ºC.
CR73 bit 0 is the sign bit of the temperature 1.
(when open or short this byte will return 1, “sign bit set to 1”)
74h
RO
--
Temperature 2 reading. The unit of reading is 1ºC.At the moment of reading this
register.
75h
RO
--
CR75 bit7-bit5 are the temperature 2 reading value[2:0]. The unit of reading is
0.125ºC.
CR75 bit 0 is the sign bit of the temperature 2.
(when open or short this byte will return 1, “sign bit set to 1”)
78h
RO
--
T3_read (External Device 0) The unit of reading is 1ºC.At the moment of reading
this register.
79h
RO
--
T4_read (External Device 1) The unit of reading is 1ºC.At the moment of reading
this register.
7Ah
RO
--
T5_read (External Device 2) The unit of reading is 1ºC.At the moment of reading
this register.
7Bh
RO
--
T6_read (External Device 3) The unit of reading is 1ºC.At the moment of reading
this register.
7C
RO
--
T7_read (External Device 4) The unit of reading is 1ºC.At the moment of reading
this register.
7D
RO
--
T8_read (External Device 5) The unit of reading is 1ºC.At the moment of reading
this register.
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81h
R/W
3Ch
Local Temperature sensor high limit. The unit is 1ºC. (If DEV_BANK_EN is 0)
81h
R/W
55h
T3 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
83h
R/W
55h
Temperature sensor 1 high limit. The unit is 1ºC. (If DEV_BANK_EN is 0)
83h
R/W
55h
T4 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
85h
R/W
55h
Temperature sensor 2 high limit. The unit is 1ºC. (When DEV_BANK_EN is 0)
85h
R/W
55h
T5 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
87h
R/W
55h
T6 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
89h
R/W
55h
T7 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
8Bh
R/W
55h
T8 high limit. The unit is 1ºC. (If DEV_BANK_EN is 1)
7.19. Temperature Filter Select Register  Index 8Eh
Bit
7-6
Name
-
R/W Default
R
0
Description
Reserved
The queue time for second filter to quickly update values.
00: 8 times.
5-4
IIR-QUEUR2
R/W
1h
01: 16 times. (default).
10: 24 times.
11: 32 times.
The queue time for second filter to quickly update values.
00: 8 times.
3-2
IIR-QUEUR1
R/W
1h
01: 16 times. (default).
10: 24 times.
11: 32 times.
The queue time for second filter to quickly update values.
00: 8 times.
1-0
IIR-QUEUR-LOCAL
R/W
1h
01: 16 times. (default).
10: 24 times.
11: 32 times.
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8. Electrical characteristic
8.1 Absolute Maximum Ratings
PARAMETER
RATING
UNIT
-0.5 to 5.5
V
-0.5 to VCC+0.5
V
0 to 70
°C
-55 to 150
°C
Power Supply Voltage
Input Voltage
Operating Temperature
Storage Temperature
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of
the device
8.2 DC Characteristics
(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V )
Parameter
Temperature Error, Remote Diode
Temperature Error, Local Diode
Conditions
o
MIN
o
TYP
MAX
60 C < TD < 100 C, VCC = 3.0V to 3.6V
±1
-40 oC <TD < 60oC, 100 oC <TD < 127oC
±1
±3
±1
±3
3.3
3.6
o
o
0 C < TA < 100 C, VCC = 3.0V to 3.6V
Supply Voltage range
3.0
Unit
o
C
o
C
V
Average operating supply current
800
uA
Standby supply current
480
uA
Resolution
Power on reset threshold
Diode source current
o
0.125
2.2
2.4
C
V
High Level
95
uA
Low Level
10
uA
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(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V)
PARAMETER
SYM.
MIN.
TYP.
MAX.
UNIT
CONDITIONS
IN ts5v /OD12 - TTL level bi-directional pin with sink capability of 12 mA and schmitt-trigger level input with 5V
tolerance
Input Low Voltage
VIL
0.8
Input High Voltage
VIH
2.0
Output Low Current
IOL
10
Input High Leakage
ILIH
Input Low Leakage
ILIL
V
VCC = 3.3 V
V
VCC = 3.3 V
mA
VOL = 0.4V
+1
µA
VIN = VCC
-1
µA
VIN = 0V
12
IN ts5v /O12 - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input
with 5V tolerance
Input Low Threshold Voltage
Vt-
0.5
0.8
1.1
V
VCC = 3.3 V
Input High Threshold Voltage
Vt+
1.6
2.0
2.4
V
VCC = 3.3 V
Output Low Current
IOL
10
12
mA
VOL = 0.4 V
Output High Current
IOH
-10
mA
VOH = 2.4V
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0V
INts5v -
-12
TTL level Schmitt-triggered input pin with 5V tolerance
Input Low Threshold Voltage
Vt-
0.5
0.8
1.1
V
VCC = 3.3V
Input High Threshold Voltage
Vt+
1.6
2.0
2.4
V
VCC = 3.3V
Input High Leakage
ILIH
+1
µA
VIN = VCC
Input Low Leakage
ILIL
-1
µA
VIN = 0 V
I lv /OD8-S1 – Low voltage level bidirection pin with 8 mA source capability (Internal pull-down sink 1 mA)
Input Low Threshold Voltage
Vlvt-
0.4
V
VCC = 3.3V
Input High Threshold Voltage
Vlvt+
1.0
V
VCC = 3.3V
Input High Leakage
ILIHlv
µA
VIN = VCC
+1
I lv /OD8 – Low voltage level bidirection pin with 8 mA source capability
Input Low Threshold Voltage
Vlvt-
0.4
V
VCC = 3.3V
Input High Threshold Voltage
Vlvt+
1.0
V
VCC = 3.3V
Input High Leakage
ILIHlv
+1
µA
VIN = VCC
Input Low Leakage
ILILlv
-1
µA
VIN = 0 V
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8.3 AC Characteristics
t SCL
tR
tR
SCL
t HD;SDA
t SU;STO
t SU;DAT
SDA IN
VALID DATA
t HD;DAT
SDA OUT
Serial Bus Timing Diagram
Serial Bus Timing
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
t-SCL
2
-
uS
Start condition hold time
tHD;SDA
300
-
nS
Stop condition setup-up time
tSU;STO
300
-
nS
DATA to SCL setup time
tSU;DAT
50
-
nS
DATA to SCL hold time
tHD;DAT
5
-
nS
SCL and SDA rise time
tR
-
300
nS
SCL clock period
9. Ordering Information
Part Number
Package Type
Production Flow
F75367S
8 pin SOP Green Package
Commercial, 0°C to +70°C
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10. Package Dimensions
8
5
c
E
HE
L
4
1
0.25
D
O
A
Y
e
SEATING PLANE
GAUGE PLANE
A1
b
Control demensions are in milmeters .
SYMBOL
A
A1
b
c
E
D
e
HE
Y
L
θ
DIMENSION IN MM
MIN.
MAX.
1.35
1.75
0.10
0.25
0.51
0.33
0.19
0.25
3.80
4.00
4.80
5.00
1.27 BSC
6.20
5.80
0.10
0.40
1.27
0
10
DIMENSION IN INCH
MIN.
MAX.
0.053
0.069
0.010
0.004
0.013
0.020
0.008
0.010
0.150
0.157
0.188
0.196
0.050 BSC
0.228
0.016
0
0.244
0.004
0.050
10
Feature Integration Technology Inc.
Headquaters
Taipei Office
7F, No 31, Shintai Rd.,
Bldg K4, 7F, No. 700, Chung Cheng Rd.,
Jubei City, Hsinchu 302, Taiwan, R.O.C.
Chungho City, Taipei 235, Taiwan, R.O.C.
TEL : 886-3-6562727
TEL : 886-2-8227-8027
FAX : 886-3-6560537
FAX : 886-2-8227-8037
www: http://www.fintek.com.tw
Please note that all datasheet and specifications are subject to change without notice. All the trade
marks of products and companies mentioned in this datasheet belong to their respective owner
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