GULFSEMI SBYD17D

SBYD17D
SINTERED GLASS JUNCTION
SURFACE MOUNTED RECTIFIER
VOLTAGE:
:200V
CURRENT:
: 1.0A
FEATURE
GF1/ DO-214BA
For surface mounted application
High temperature metallurgic ally bonded
Sintered glass junction
Capability of meeting environmental standard of MIL-S-19500
High temperature soldering guaranteed
450℃/10sec/at terminal/complete device
Submersible temperature of 265℃ for 10sec
MECHANICAL DATA
Terminal:Plated Terminal, solderable per
MIL-STD 202, method 208C
Case:Molded with UL-94 class V-0 recognized
Flame Retardant Epoxy over Glass
Polarity:color band denotes cathode end
Mark:D17D
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated,
for capacitive load, derate current by 20%)
SYMBOL
SBYD17D
units
Maximum Recurrent Peak Reverse Voltage
Vrrm
200
V
Maximum RMS Voltage
Vrms
140
V
Maximum DC blocking Voltage
Vdc
200
V
Reverse avalanche breakdown voltage
at IR = 0.1 mA
Maximum Average Forward Rectified Current
V(BR)R
225min
V
If(av)
1.0
A
Peak Forward Surge Current 8.3ms single half
sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
current
Ta =25℃
Maximum DC Reverse Current
Ta =25℃
at rated DC blocking voltage
Ta =150℃
Non-Repetitive Peak Reverse Avalanche Energy
(Note 1)
Ifsm
30.0
A
Vf
1.05
V
Ir
1.0
50.0
µA
Ersm
7.0
mJ
Typical Junction Capacitance
(Note 2)
Cj
15.0
pF
Typical Thermal Resistance
(Note 3)
Rth(ja)
80.0
℃/W
Tst, Tj
-65 to +175
℃
Operating and Storage Temperature Range
Note:
1. L=120mH; Tj=Tjmax prior to surge; inductive load switched off
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient 6.0mm2 copper pad to each terminal
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES SBYD17D
Rev.A1
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