TS3V712E www.ti.com SCDS292 – JANUARY 2010 7-CHANNEL VIDEO SWITCH Check for Samples: TS3V712E FEATURES • • • • • • • • High Bandwidth (BW = 1.36 GHz) Designed for 7-Channel VGA Signals (R,G,B, Hsync, Vsync, DDC Dat, and DDC CLK) Separate Control Logic for Data and Control Signals Operating Voltage: 3.3 V ±10% Low and Flat ON-State Resistance – rON = 3 Ω – rON(flat) = 500 mΩ Low Crosstalk (XTALK = –49.76 dB Typ at 250 MHz) Low Input/Output Capacitance – CON = 7 pF, Typ ESD Performance Tested – 4-kV IEC61000-4-2, Contact Discharge on Switch IOs – 3-kV Human Body Model Per JESD22-A114E – 6-kV Human Body Model (Switch Pins to GND) Suitable for Both RGB and Composite-Video Switching 32-Pin Quad Flat Pack No-Lead QFN(RTG) Package APPLICATIONS • • Notebook Computers Analog VGA Peripheral Ports RTG PACKAGE (TOP VIEW) VDD GND SEL2 VDD GND • • B0 C0 B1 C1 VDD B2 C2 B3 C3 B4 C4 A0 A1 GND VDD A2 A3 A4 SEL1 A5 A6 GND B5 C5 B6 C6 VDD 1 The exposed center pad must be connected to GND. DESCRIPTION/ORDERING INFORMATION The TS3V712E is a high-bandwidth, 7-channel video multiplexer/demultiplexer for switching between multiple VGA sources or end points. The device is designed for ensuring video signal integrity and minimizing the video signal attenuation by providing high bandwidth of 1.36 GHz. The video signals are protected against high ESD with integrated diodes to VDD and GND that will support up to 6-kV of ESD HBM and 4-kV contact protection. The TS3V712E is available in a 32-pin QFN package and is characterized for operation over the free-air temperature range of –40°C to 85°C. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) QFN – RTG (2) Tape and reel ORDERABLE PART NUMBER TS3V712ERTGR TOP-SIDE MARKING TF712E Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TS3V712E SCDS292 – JANUARY 2010 www.ti.com LOGIC DIAGRAM A0 B0 A1 B1 A2 B2 A3 B3 A4 B4 C0 C1 C2 C3 C4 Control Logic SEL 1 A5 B5 A6 B6 C5 C6 Control Logic SEL 2 Table 1. FUNCTION TABLE 2 SEL1 SEL2 L L FUNCTION A0–A4 A5, A6 Hi-Z B0–B4 B5, B6 Cn L H B0–B4 C5, C6 C0–C4, B5, B6 H L C0–C4 B5, B6 B0–B4, C5, C6 H H C0–C4 C5, C6 Bn Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E TS3V712E www.ti.com SCDS292 – JANUARY 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 4.6 UNIT V SEL –0.5 7 V All I/O ports –0.5 7 V VDD Supply voltage range VIN Control input voltage range (2) VI/O Switch I/O voltage range (2) IIK Control input clamp current VIN < 0 V –50 mA II/OK I/O port clamp current VI/O < 0 V –50 mA II/O ON-state switch current (5) ON-state switch ±128 mA (3) (3) (4) Continuous current through VDD or GND qJA Package thermal impedance Tstg Storage temperature range (1) (2) (3) (4) (5) (6) RTG package (6) –65 ±100 mA 39.2 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-5 (High K with via). RECOMMENDED OPERATING CONDITIONS (1) MIN MAX VDD Supply voltage 3 3.6 V VIN Control input voltage (SEL) 0 5.5 V VIH High-level control input voltage (SEL) 2 VIL Low-level control input voltage (EN, IN) VI/O I/O voltage (all ports) TA Operating free-air temperature (1) UNIT V –0.5 0.8 V 0 VDD V –40 85 °C All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E 3 TS3V712E SCDS292 – JANUARY 2010 www.ti.com ELECTRICAL CHARACTERISTICS (1) for high-frequency switching over recommended operating free-air temperature range, VDD = 3.3 V ±0.3 V (unless otherwise noted) PARAMETER MIN TYP (2) MAX TEST CONDITIONS VIK SEL n VDD = 3.6 V, IIN = –18 mA IIH SEL n VDD = 3.6 V, VIN = VDD IIL SEL n –0.7 VDD = 3.6 V, VIN = GND IOFF VDD = 0 V, VO = 0 to 3.6 V, VI = 0, VIN = 0 ICC VDD = 3.6 V, II/O = 0, VIN = VDD or GND, Switch ON or OFF UNIT –1.2 V ±1 mA ±1 mA 1 mA 200 500 mA 2.7 3 pF 4 pF CIN SEL n f = 10 MHz VIN = 0, COFF 3 ports f = 10 MHz VIN = 0, Output open, Switch OFF 3 CON 3 ports f = 10 MHz VIN = 0, Output open, Switch ON 7 VDD = 3 V, 0 V ≤ VI ≤ 1.2 V, II/O = –40 mA 3 4 Ω VDD = 3 V, VI = 0 V and 1.2 V II/O = –40 mA 0.5 1 Ω VDD = 3 V, 0 V ≤ VI ≤ 1.2 V, II/O = –40 mA 0.1 1 Ω rON rON(flat) ΔrON (1) (2) (3) (4) (3) (4) pF VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. rON(flat) is the difference of rON in a given channel at specified voltages. ΔrON is the difference of rON from center port to any other ports. DYNAMIC CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ±0.3 V, RL = 50 Ω (unless otherwise noted) PARAMETER (1) TEST CONDITIONS TYP (1) UNIT dB XTALK RL = 50 Ω, f = 250 MHz, See Figure 8 –49.76 OIRR RL = 50 Ω, f = 250 MHz, See Figure 8 –37.51 BW See Figure 6 1.36 dB GHz All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ±0.3 V, RL = 50 Ω, TA = 25°C (unless otherwise noted) (see Figure 5) PARAMETER tpd (1) (2) (3) (4) (5) 4 (1) FROM (INPUT) TO (OUTPUT) MIN TYP MAX 0.25 UNIT An or Bn/Cn Bn/Cn or An tPZH, tPZL (2) ns SEL Bn or Cn 0.5 12 ns tPHZ, tPLZ (3) SEL Bn or Cn 0.5 11 ns tsk(o) (4) An, Bn, Cn 0.05 0.1 ns tsk(p) (5) An, Bn, Cn 0.05 0.1 ns The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Line enable time: SEL to input, output; also called as SEL to switch turn on time. Line disable time: SEL to input, output; also called as SEL to switch turn off time. Output skew between center port to any other ports. Skew between opposite transitions of the same output. |tPHL – tPLH| Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E TS3V712E www.ti.com SCDS292 – JANUARY 2010 TYPICAL CHARACTERISTICS 0 -1 Gain (dB) -2 -3 -4 -5 -6 -7 -8 1 10 100 1000 10000 1000 10000 Frequency (MHz) Figure 1. Gain vs Frequency 0 -10 Attenuation (dB) -20 -30 -40 -50 -60 -70 -80 -90 -100 1 10 100 Frequency (MHz) Figure 2. Off Isolation vs Frequency Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E 5 TS3V712E SCDS292 – JANUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) 0 Attenuation (dB) -20 -40 -60 -80 -100 -120 1 10 100 1000 10000 Frequency (MHz) Figure 3. Crosstalk vs Frequency 2.7 rON (W) 2.6 2.5 2.4 2.3 2.2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VCOM (V) Figure 4. . rON(Ω) vs VCOM(V) 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E TS3V712E www.ti.com SCDS292 – JANUARY 2010 PARAMETER MEASUREMENT INFORMATION VDD Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator S1 RL VO VI GND 50 Ω CL (see Note A) 50 Ω VG2 RL TEST VDD S1 RL Vin CL V∆ t PLZ/t PZL 3.3 V 2 × VDD 200 Ω GND 10 pF 0.3 V t PHZ/t PZH 3.3 V GND 200 Ω VDD 10 pF 0.3 V VI VO 2.5 V Output Control (VIN) 1.25 V 1.25 V 0V Output Waveform 1 S1 at 2 x VDD (see Note B) t PZL t PLZ VOH VDD/2 VOL + 0.3 V t PZH VO Open Output Waveform 2 S1 at GND (see Note B) VOL t PHZ VDD/2 VOH − 0.3 V VOH VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. Figure 5. Test Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E 7 TS3V712E SCDS292 – JANUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD 0B 1 A0 SEL DUT CL = 10 pF (see Note A) VSEL Figure 6. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at 0B11. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E TS3V712E www.ti.com SCDS292 – JANUARY 2010 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B 1 RL = 50 Ω A1 1B 1 0B 2 DUT A2 1B 2 2B 1 RL = 50 Ω A3 3B 1 2B 2 3B 2 SEL VSEL Figure 7. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1B. All unused analog input (D) ports and output (S) ports are connected to GND through 10-Ω and 50-Ω pulldown resistors, respectively. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E 9 TS3V712E SCDS292 – JANUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B 1 RL = 50 Ω A1 1B 1 DUT 0B 2 1B 2 SEL VSEL Figure 8. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel. For example, when VIN = VCC, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog input (D) ports are left open, and output (S) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3V712E PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TS3V712ERTGR ACTIVE WQFN RTG Pins Package Eco Plan (2) Qty 32 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. 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