TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE FEATURES 1 APPLICATIONS • • Routes Signals for USB 1.0, 1.1, and 2.0 Mobile Industry Processor Interface (MIPI) Signal Routing D1– D2– 7 6 5 D– VCC 9 4 GND S 10 3 D+ 1 2 D2+ 8 D1+ OE S 10 VCC 9 OE 8 D2+ RSW PACKAGE (BOTTOM VIEW) 1 2 7 6 D2– • • RSW PACKAGE (TOP VIEW) D1+ • • • • • VCC Operation at 3 V and 4.3 V 1.8-V Compatible Control-Pin Inputs IOFF Supports Partial Power-Down-Mode Operation ron = 10 Ω Max Δron <0.35 Ω Typ Cio(ON) = 7 pF Typ Low Power Consumption (1 µA Max) ESD Performance Tested Per JESD 22 – 6000-V Human-Body Model (HBM) (A114-B, Class II) – 1000-V Charged-Device Model (C101) – 250-V Machine Model (A115-A) –3-dB Bandwidth = 955 MHz Typ Packaged in 10-pin TQFN (1.4 mm × 1.8 mm) D1– • • • 3 D+ 4 GND 5 D– DESCRIPTION/ORDERING INFORMATION The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE TQFN – RSW (1) (2) Tape and reel ORDERABLE PART NUMBER TS3USB30RSWR TOP-SIDE MARKING L6O Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2008, Texas Instruments Incorporated TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable S Select input D+, D–, Dn+, Dn– Data ports TRUTH TABLE S OE FUNCTION X H Disconnect L L D = D1 H L D = D2 BLOCK DIAGRAM D1+ D+ D2+ D1– D– D2– S OE Control ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VIN Control input voltage range (2) (3) –0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) Dn+, Dn– –0.5 VCC + 0.3 D+, D– when VCC > 0 –0.5 VCC + 0.3 D+, D– when VCC = 0 –0.5 UNIT V 5.25 IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA II/O ON-state switch current (5) ±64 mA ±100 mA 150 °C Continuous current through VCC or GND Tstg (1) (2) (3) (4) (5) 2 Storage temperature range –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 PACKAGE THERMAL IMPEDANCE (1) θJA (1) Package thermal impedance RSW package TYP UNIT 175 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 3 TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) MIN MAX 3 4.3 VCC = 3 V to 3.6 V 1.3 VCC = 4.3 V 1.7 UNIT V V VCC = 3 V to 3.6 V 0.5 VCC = 4.3 V 0.7 V 0 VCC V –40 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK IIN IOZ Control inputs (3) IOFF D+ and D– ICC TEST CONDITIONS TYP (2) MAX UNIT –1.2 V VIN = 0 to 4.3 V ±1 µA VO = 0 to 3.6 V, Switch OFF ±2 µA VCC = 0 V, VI = 0, VO = 0 to 4.3 V, VIN = VCC or GND ±2 µA 1 µA 10 µA VCC = 3 V, II = –18 mA VCC = 4.3 V, 0 V, VCC = 4.3 V, VI = 0, VCC = 4.3 V, II/O = 0, ΔICC (4) Control inputs VCC = 4.3 V, VIN = 2.6 V Cin Control inputs MIN Switch ON or OFF VCC = 0 V, VIN = VCC or GND 1 pF Cio(OFF) VCC = 3.3 V, VI/O = 3.3 V or 0, Switch OFF 2 pF Cio(ON) VCC = 3.3 V, VI/O = 3.3 V or 0, Switch ON 7 ron (5) VCC = 3 V, VI = 0.4, IO = –8 mA 6 Δron VCC = 3 V, VI = 0.4, IO = –8 mA 0.35 Ω ron(flat) VCC = 3 V, VI = 0 V or 1 V, IO = –8 mA 2 Ω (1) (2) (3) (4) (5) pF Ω 10 VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS TYP (1) UNIT XTALK Crosstalk RL = 50 Ω, f = 240 MHz, See Figure 10 –56 OISO OFF isolation RL = 50 Ω, f = 240 MHz, See Figure 9 –39 dB BW Bandwidth (–3 dB) RL = 50 Ω, CL = 5 pF, See Figure 11 955 MHz (1) 4 dB For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS MIN RL = 50 Ω, CL = 5 pF, See Figure 12 (2) (3) TYP (1) MAX tpd Propagation delay tON Line enable time, SEL to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 30 ns tOFF Line disable time, SEL to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 25 ns tON Line enable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 30 ns tOFF Line disable time, OE to D, nD RL = 50 Ω, CL = 5 pF, See Figure 8 25 ns tSK(O) Output skew between center port to any other port (2) RL = 50 Ω, CL = 5 pF, See Figure 13 50 ps tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) RL = 50 Ω, CL = 5 pF, See Figure 13 20 ps tJ Total jitter (2) RL = 50 Ω, CL = 5 pF, tR = tF = 500 ps at 480 Mbps (PRBS = 215 – 1) 20 ps (1) (2) (3) 0.25 UNIT ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 5 TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com APPLICATION INFORMATION 0 –1 –2 Gain (dB) –3 –4 –5 –6 –7 –8 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 1.0E+9 10.0E+9 Frequency (Hz) Figure 1. Gain vs Frequency 0 –10 Attenuation (dB) –20 –30 –40 –50 –60 –70 –80 –90 100.0E+3 1.0E+6 10.0E+6 100.0E+6 Frequency (Hz) Figure 2. OFF Isolation 6 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 0 –10 Attenuation (dB) –20 –30 –40 –50 –60 –70 –80 –90 –100 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Figure 3. Crosstalk VCC TS3USB30 1D+ USB2.0 Controller D+ 1D– Set Top Box (STB) CPU or DSP Processor USB Connector D– 2D+ DVR or Mass Storage Controller 2D– Control S OE Figure 4. Application Diagram Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 7 TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Time (X 10–9) (s) Figure 5. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 6. Eye Pattern: 480-Mbps USB Signal With Switch NC Path 8 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Time (X 10–9) (s) Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch NO Path Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 9 TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 VIN D 1D or 2D VOUT2 (B) CL RL TEST RL CL VIN tON 50 Ω 5 pF VCC tOFF 50 Ω 5 pF VCC S OE VSEL(A) 1.8 V Logic RL Input (VSEL or V OE) CL(B) GND 50% 50% 0 tON VOE(A) Switch Output (VOUT1 or V OUT2) tOFF 90% 90% VOH VOL A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. B. CL includes probe and jig capacitance. Figure 8. Turn-On (tON) and Turn-Off Time (tOFF) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VSEL = VCC D Source Signal 50 W VIN 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VSEL S 50 W + GND DC Bias = 350 mV Figure 9. OFF Isolation (OISO) 10 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VSEL = VCC VOUT2 2D 50 W Network Analyzer Setup 50 W VSEL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 10. Crosstalk (XTALK) VCC Network Analyzer 50 W VOUT1 1D Channel ON: 1D to D D Source Signal VIN VCTRL = GND 2D Network Analyzer Setup 50 W VSEL Source Power = 0 dBm (632-mV P-P at 50-W load) S GND GND DC Bias = 350 mV Figure 11. Bandwidth (BW) 400 mV Figure 12. Propagation Delay Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 11 TS3USB30 SCDS237D – AUGUST 2007 – REVISED MAY 2008......................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VOH VOL Pulse Skew tSK(P) VOH VOL VOH VOL Output Skew tSK(P) Figure 13. Skew Test 12 Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 TS3USB30 www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D D + VIN Channel ON VOUT2 2D r on + VSEL IIN S VIN * VOUT2 or VOUT1 W IIN VSEL = VIH or VIL + GND Figure 14. ON-State Resistance (ron) VCC VOUT1 1D VIN D + VOUT2 2D VSEL + S OFF-State Leakage Current Channel OFF VSEL = VIH or VIL + GND Figure 15. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS VBIAS = VCC or GND VOUT2 2D VSEL = VCC or GND VIN D Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VSEL S GND Figure 16. Capacitance Submit Documentation Feedback Copyright © 2007–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB30 13 PACKAGE OPTION ADDENDUM www.ti.com 15-May-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TS3USB30RSWR ACTIVE QFN RSW Pins Package Eco Plan (2) Qty 10 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-May-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB30RSWR Package Package Pins Type Drawing QFN RSW 10 SPQ Reel Reel Diameter Width (mm) W1 (mm) 3000 179.0 8.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 1.7 2.1 0.7 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 15-May-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB30RSWR QFN RSW 10 3000 220.0 205.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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