HOPERF RFM42B-868-S1

RFM42B/43B
RFM42B/43B ISM T RANSMITTER
V1.0
Features

Frequency range
433/868/915MHz ISM bands

Output Power Range
+1 to +20dBm (RFM42B)
–8 to +13dBm (RFM43B)
Low Power Consumption
RFM42B
85 mA @ +20 dBm
RFM43B
30 mA @ +13 dBm
Data Rate = 0.123 to 256 kbps
FSK, GFSK, and OOK modulation
Power Supply = 1.8 to 3.6 V












Ultra low power shutdown mode
Wake-up timer
Integrated 32 kHz RC or 32 kHz
XTAL
Integrated voltage regulators
Configurable packet handler
TX 64 byte FIFO
Low battery detector
Temperature sensor and 8-bit ADC
–40 to +85 °C temperature range
Integrated voltage regulators
Frequency hopping capability
On-chip crystal tuning
14-PIN DIP & 16-PIN SMD package
Low cost
Power-on-reset (POR)






Remote meter reading
Remote keyless entry
Home automation
Industrial control
Sensor networks
Health monitors







RFM42B/43B
Applications






Remote control
Home security & alarm
Telemetry
Personal data logging
Toy control
Wireless PC peripherals
Description
HopeRF's RFM42B/43B are highly integrated, low cost,433/868/915MHZ
wireless ISM transmitters module.
The RFM42B/43B offers advanced radio features including adjustable power
output levels of –8 to +13dBm on the RFM43B and +1 to +20dBm
on the RFM42B.Power adjustments are made in 3dB steps.The RFM42B/43B's
high level of integration offers reduced BOM cost while simplifying the overall
system design. The RFM42B’s Industry leading +20dBm output power ensures
extended range and improved link performance.
Additional system features such as an automatic wake-up timer, low battery
detector, 64 byte TX FIFO, and automatic packet handling reduce overall current
consumption and allow the use of lower-cost system MCUs. An integrated
temperature sensor, general purpose ADC, power-on-reset (POR), and GPIOs
further reduce overall system cost and size.
The direct digital transmit modulation and automatic PA power ramping ensure
precise transmit modulation and reduced spectral spreading ensuring compliance
with global regulations including FCC,ETSI regulations.
An easy-to-use calculator is provided to quickly configure the radio settings,
simplifying customer's system design and reducing time to market.
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RFM42B/43B
TABLE O F C ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3. Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2. Operating Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4. System Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.5. Frequency Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
4. Modulation Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1. Modulation Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4.2. Modulation Data Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5. Internal Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.1. Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
5.2. Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.3. Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
5.4. Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6. Data Handling and Packet Handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
6.1. TX FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
6.2. Packet Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
6.3. Packet Handler TX Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
6.4. Data Whitening, Manchester Encoding, and CRC . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.5. Synchronization Word Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.6. TX Retransmission and Auto TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7. Auxiliary Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
7.1. Smart Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
7.2. Microcontroller Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
7.3. General Purpose ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
7.4. Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
7.5. Low Battery Detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
7.6. Wake-Up Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.7. GPIO Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8. Reference Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
9. Application Notes and Reference Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10. Pin Descriptions: RFM42B/43B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
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RFM42B/43B
11. Mechanical Dimension: RFM42B/ 43B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
12. Ordering Information: RFM42B/43B.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Contact Information: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
3
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RFM42B/43B
1. Electrical Specifications
Table 1. DC Characteristics
Parameter
Symbol
Supply Voltage Range
VDD
Power Saving Modes
IShutdown
TUNE Mode Current
TX Mode Current
—RFM42B
TX Mode Current
—RFM43B
Min
Typ
1.8
3.0
3.6
V
RC Oscillator, Main Digital Regulator,
and Low Power Digital Regulator OFF
—
15
50
nA
IStandby
Low Power Digital Regulator ON (Register values retained)
and Main Digital Regulator, and RC Oscillator OFF
—
450
800
nA
ISleep
RC Oscillator and Low Power Digital Regulator ON
(Register values retained) and Main Digital Regulator OFF
—
1
—
µA
ISensor-LBD
Main Digital Regulator and Low Battery Detector ON,
Crystal Oscillator and all other blocks OFF
—
1
—
µA
ISensor-TS
Main Digital Regulator and Temperature Sensor ON,
Crystal Oscillator and all other blocks OFF
—
1
—
µA
IReady
Crystal Oscillator and Main Digital Regulator ON,
all other blocks OFF. Crystal Oscillator buffer disabled
—
800
—
µA
ITune
Synthesizer and regulators enabled
—
8.5
—
mA
ITX_+20
txpow[2:0] = 111 (+20 dBm)
—
85
—
mA
ITX_+13
txpow[2:0] = 111 (+13 dBm)
—
30
—
mA
ITX_+1
txpow[2:0] = 011 (+1 dBm)
—
18
—
mA
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RFM42B/43B
Table 2. Synthesizer AC Electrical Characteristics
Parameter
Synthesizer Frequency
Range—RFM42B/43B
Synthesizer Frequency
Resolution
Symbol
Max
Units
868MHz band
413
848
453
888
MHz
MHz
915MHz band
901
929
MHz
FRES-LB
433MHz Band
—
156.25
—
Hz
FRES-HB
868/915MHz Band
—
312.5
—
Hz
FSYN
Conditions
Min
433MHz band
Typ
fREF_LV
When using external reference signal
driving XOUT pin, instead of using
crystal. Measured peak-to-peak (VPP)
0.7
—
1.6
V
Synthesizer Settling Time
tLOCK
Measured from exiting Ready mode with
XOSC running to any frequency.
Including VCO calibration.
—
200
—
µs
Residual FM
FRMS
Integrated over 250 kHz bandwidth
(500 Hz lower bound of integration)
—
2
4
kHzRMS
Phase Noise
L(fM)
F = 10 kHz
—
–80
—
dBc/Hz
F = 100 kHz
—
–90
—
dBc/Hz
F = 1 MHz
—
–115
—
dBc/Hz
F = 10 MHz
—
–130
—
dBc/Hz
Reference Frequency
Input Level
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RFM42B/43B
Table 3. Transmitter AC Electrical Characteristics
Parameter
TX Frequency
Range—RFM42B/43B
Symbol
FTX
Conditions
Min
433MHz band
Typ
Max
Units
868MHz band
413
848
453
888
MHz
MHz
915MHz band
901
929
MHz
FSK Data Rate
DRFSK
0.123
—
256
kbps
OOK Data Rate
DROOK
0.123
—
40
kbps
Modulation Deviation
Δf1
868/915MHz band
±0.625
±320
kHz
Δf2
433MHz band
±0.625
±160
kHz
ΔfRES
—
0.625
—
kHz
Output Power
Range —RFM42B
PTX
+1
—
+20
dBm
Output Power
Range—RFM43B
PTX
–8
—
+13
dBm
Modulation Deviation
Resolution
TX RF Output Steps
PRF_OUT
controlled by txpow[2:0]
—
3
—
dB
TX RF Output Level
Variation vs. Temperature
PRF_TEMP
–40 to +85 C
—
2
—
dB
TX RF Output Level
Variation vs. Frequency
PRF_FREQ
Measured across any one
frequency band
—
1
—
dB
B*T
Gaussian Filtering Bandwith Time
Product
—
0.5
—
POB-TX1
POUT = 13 dBm,
Frequencies <1 GHz
—
—
–54
dBm
POB-TX2
1–12.75 GHz, excluding harmonics
—
—
–54
dBm
Transmit Modulation
Filtering
Spurious Emissions
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RFM42B/43B
Table 4. Auxiliary Block Specifications
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Temperature Sensor
Accuracy
TSA
After calibrated via sensor offset
register tvoffs[7:0]
—
0.5
—
°C
Temperature Sensor
Sensitivity
TSS
—
5
—
mV/°C
Low Battery Detector
Resolution
LBDRES
—
50
—
mV
Low Battery Detector
Conversion Time
LBDCT
—
250
—
µs
Microcontroller Clock
Output Frequency
FMC
32.768K
—
30M
Hz
Configurable to 30 MHz,
15 MHz, 10 MHz, 4 MHz,
3 MHz, 2 MHz, 1 MHz, or
32.768 kHz
General Purpose ADC
Resolution
ADCENB
—
8
—
bit
General Purpose ADC Bit
Resolution
ADCRES
—
4
—
mV/bit
Temp Sensor & General
Purpose ADC Conversion
Time
ADCCT
—
305
—
µs
t30M
—
600
—
µs
30MRES
—
97
—
fF
t32k
—
6
—
sec
32 kHz XTAL Accuracy
using 32 kHz XTAL
32KRES
—
100
—
ppm
32 kHz Accuracy using
Internal RC Oscillator
32KRCRES
—
2500
—
ppm
POR Reset Time
tPOR
—
16
—
ms
Software Reset Time
tsoft
—
100
—
µs
30 MHz XTAL Start-Up time
30 MHz XTAL Cap
Resolution
32 kHz XTAL Start-Up Time
7
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RFM42B/43B
Table 5. Digital IO Specifications (SDO, SDI, SCLK, nSEL, and nIRQ)
Symbol
Conditions
Min
Typ
Max
Units
Rise Time
TRISE
0.1 x VDD to 0.9 x VDD, CL= 5 pF
—
—
8
ns
Fall Time
TFALL
0.9 x VDD to 0.1 x VDD, CL= 5 pF
—
—
8
ns
Parameter
Input Capacitance
CIN
—
—
1
pF
Logic High Level Input Voltage
VIH
VDD – 0.6
—
—
V
Logic Low Level Input Voltage
VIL
—
0.6
V
Input Current
IIN
0<VIN< VDD
–100
—
100
nA
Logic High Level Output
Voltage
VOH
IOH<1 mA source, VDD=1.8 V
VDD – 0.6
—
—
V
Logic Low Level Output Voltage
VOL
IOL<1 mA sink, VDD=1.8 V
—
—
0.6
V
Table 6. GPIO Specifications (GPIO_0, GPIO_1, and GPIO_2)
Symbol
Conditions
Min
Typ
Max
Units
Rise Time
TRISE
0.1 x VDD to 0.9 x VDD,
CL= 10 pF, DRV<1:0>=HH
—
—
8
ns
Fall Time
TFALL
0.9 x VDD to 0.1 x VDD,
CL= 10 pF, DRV<1:0>=HH
—
—
8
ns
1
pF
Parameter
Input Capacitance
CIN
—
—
Logic High Level Input Voltage
VIH
VDD – 0.6
—
Logic Low Level Input Voltage
VIL
—
—
0.6
V
Input Current
IIN
0<VIN< VDD
–100
—
100
nA
Input Current If Pullup is Activated
IINP
VIL=0 V
5
—
25
µA
IOmaxLL
DRV<1:0>=LL
0.1
0.5
0.8
mA
IOmaxLH
DRV<1:0>=LH
0.9
2.3
3.5
mA
IOmaxHL
DRV<1:0>=HL
1.5
3.1
4.8
mA
IOmaxHH
DRV<1:0>=HH
1.8
3.6
5.4
mA
Logic High Level Output Voltage
VOH
IOH< IOmax source,
VDD=1.8 V
VDD – 0.6
—
—
V
Logic Low Level Output Voltage
VOL
IOL< IOmax sink,
VDD=1.8 V
—
—
0.6
V
Maximum Output Current
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RFM42B/43B
Table 7. Absolute Maximum Ratings
Parameter
Value
Unit
VDD to GND
–0.3, +3.6
V
Instantaneous VRF-peak to GND on TX Output Pin
–0.3, +8.0
V
Sustained VRF-peak to GND on TX Output Pin
–0.3, +6.5
V
Voltage on Digital Control Inputs
–0.3, VDD + 0.3
V
Voltage on Analog Inputs
–0.3, VDD + 0.3
V
Operating Temperature Range (special crystal is used on the module) T S
–40 to +85
C
Operating Temperature Range (Normal crystal is used on the module) TN
–20 to +60
C
30
C/W
–55 to +125
C
Thermal Impedance JA
Storage Temperature Range TSTG
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Power Amplifier may be damaged if switched on without proper load or termination connected. TX
matching network design will influence TX VRF-peak on TX output pin. Caution: ESD sensitive device.
9
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RFM42B/43B
2. Functional Description
HopeRF's RFM42B/43B are highly integrated,low cost,433/868/915MHz wireless ISM transmitters module .
The wide operating voltage range of 1.8–3.6V and low current consumption makes the RFM42B/43B
an ideal solution for battery powered applications.
The RF carrier is generated by an integrated VCO and  Fractional-N PLL synthesizer. The synthesizer is
designed to support configurable data rates, output frequency, frequency deviation, and Gaussian filtering at
433MHz, 868MHz, 915MHz band. The transmit FSK data is modulated directly into the  data stream and can be
shaped by a Gaussian low-pass filter to reduce unwanted spectral content.
The RFM42B’s PA output power can be configured between
+1 and +20dBm in 3dB steps, while the RFM43B's
PA output power can be configured between –8 and +13 dBm in 3dB steps. The PA incorporates automatic
ramp-up and ramp-down control to reduce unwanted spectral spreading.
The RFM42B/43B is designed to work with a microcontroller to create a very low cost system. Voltage
regulators are integrated on-chip which allows for a wide operating supply voltage range from +1.8 to +3.6V.
A standard 4-pin SPI bus is used to communicate with an external microcontroller.
Three configurable general purpose I/Os are available. A complete list of the available GPIO functions is available
in “ RFM42B/43B Register Descriptions.”
2.1. Operating Modes
The RFM42B/43B provides several operating modes which can be used to optimize the power consumption for
a given application.
Table8 summarizes the operating modes of the RFM42B/43B. In general, any given operating mode may be
classified as an active mode or a power saving mode. The table indicates which block(s) are enabled (active) in
each corresponding mode. With the exception of the SHUTDOWN mode, all can be dynamically selected by
sending the appropriate commands over the SPI. An “X” in any cell means that, in the given mode of operation,
that block can be independently programmed to be either ON or OFF, without noticeably impacting the current
consumption. The SPI circuit block includes the SPI interface hardware and the device register space. The 32 kHz
OSC block includes the 32.768 kHz RC oscillator or 32.768 kHz crystal oscillator and wake-up timer. AUX
(Auxiliary Blocks) includes the temperature sensor, general purpose ADC, and low-battery detector.
Table 8. Operating Modes
Mode Name
SHUTDOWN
STANDBY
SLEEP
SENSOR
READY
TUNING
TRANSMIT
Circuit Blocks
32 kHz OSC AUX
Digital LDO
SPI
OFF
(Register contents
lost)
ON
(Register contents
retained)
OFF
OFF
ON
ON
ON
ON
ON
ON
OFF
ON
X
X
X
X
PLL
PA
IVDD
OFF
30 MHz
XTAL
OFF
OFF
OFF
15 nA
OFF
X
ON
X
X
X
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
OFF
ON
450 nA
1 µA
1 µA
800 µA
8.5 mA
30 mA*
*Note: Using RFM43B at +13dBm usin g recommended reference design.
10
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RFM42B/43B
3. Controller Interface
3.1. Serial Peripheral Interface (SPI)
The RFM42B/43B communicates with the host MCU over a standard 3-wire SPI interface: SCLK, SDI, and nSEL.
The host MCU can read data from the device on the SDO output pin. A SPI transaction is a 16-bit sequence which
consists of a Read-Write (R/W) select bit, followed by a 7-bit address field (ADDR), and an 8-bit data field (DATA)
as demonstrated in Figure 1. The 7-bit address field is used to select one of the 128, 8-bit control registers. The
R/W select bit determines whether the SPI transaction is a read or write transaction. If R/W = 1 it signifies a WRITE
transaction, while R/W = 0 signifies a READ transaction. The contents (ADDR or DATA) are latched into the
RFM42B/43B every eight clock cycles. The timing parameters for the SPI interface are shown in Table 9. The
SCLK rate is flexible with a maximum rate of 10 MHz.
Data
Address
MSB
SDI
LSB
RW A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 xx xx RW A7
SCLK
nSEL
Figure 1. SPI Timing
Table 9. Serial Interface Timing Parameters
Symbol
Parameter
Min (nsec)
tCH
Clock high time
40
tCL
Clock low time
40
tDS
Data setup time
20
tDH
Data hold time
20
tDD
Output data delay time
20
tEN
Output enable time
20
tDE
Output disable time
50
tSS
Select setup time
20
tSH
Select hold time
50
tSW
Select high period
80
Diagram
SCLK
tSS
tCL
tCH
tDS tDH
tDD
tSH
tDE
SDI
SDO
tEN
tSW
nSEL
To read back data from the RFM42B /43B, the R/W bit must be set to 0 followed by the 7-bit address of the register
from which to read. The 8 bit DATA field following the 7-bit ADDR field is ignored n the SDI pin when R/W = 0. The
next eight negative edge transitions of the SCLK signal will clock out the contents of the selected register. The data
read from the selected register will be available on the SDO output pin. The READ function is shown in Figure 2.
After the READ function is completed the SDO pin will remain at either a logic 1 or logic 0 state depending on the
last data bit clocked out (D0). When nSEL goes high the SDO output pin will be pulled high by internal pullup.
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RFM42B/43B
First Bit
SDI
RW
=0
Last Bit
D7
=X
A6 A5 A4 A3 A2 A1 A0
D6
=X
D5
=X
D4
=X
D3
=X
D2
=X
D1
=X
D0
=X
SCLK
First Bit
SDO
Last Bit
D7 D6 D5 D4 D3
D2 D1 D0
nSEL
Figure 2. SPI Timing—READ Mode
The SPI interface contains a burst read/write mode which allows for reading/writing sequential registers without
having to re-send the SPI address. When the nSEL bit is held low while continuing to send SCLK pulses, the SPI
interface will automatically increment the ADDR and read from/write to the next address. An example burst write
transaction is illustrated in Figure 3 and a burst read in Figure 4. As long as nSEL is held low, input data will be
latched into the RFM42B/43B every eight SCLK cycles.
First Bit
RW
=1
SDI
Last Bit
A6 A5 A4 A3 A2 A1 A0
D7
=X
D6
=X
D5
=X
D4
=X
D3
=X
D2
=X
D1
=X
D0
=X
D7
=X
D6
=X
D5
=X
D4
=X
D3
=X
D2
=X
D1
=X
D0
=X
SCLK
nSEL
Figure 3. SPI Timing—Burst Write Mode
First Bit
SDI
RW
=0
Last Bit
A6 A5 A4 A3 A2 A1 A0
D7
=X
D6
=X
D5
=X
D4
=X
D3
=X
D2
=X
D1
=X
D0
=X
SCLK
First Bit
SDO
D7 D6 D5 D4 D3
D2 D1 D0 D7 D6 D5 D4 D3
D2 D1 D0
nSEL
Figure 4. SPI Timing—Burst Read Mode
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RFM42B/43B
3.2. Operating Mode Control
There are three primary states in the RFM42B/43B radio state machine: SHUTDOWN, IDLE, and TX (see
Figure 5). The SHUTDOWN state completely shuts down the radio to minimize current consumption. There are five
different configurations/options for the IDLE state which can be selected to optimize the chip to the applications
needs. "Register 07h. Operating Mode and Function Control 1" controls which operating mode/state is selected
with the exception of SHUTDOWN which is controlled by SDN pin. The TX state may be reached automatically
from any of the IDLE states by setting the txon bit in "Register 07h. Operating Mode and Function Control 1."
Table 10 shows each of the operating modes with the time required to reach TX mode as well as the current
consumption of each mode.
The RFM42B/43B includes a low-power digital regulated supply (LPLDO) which is internally connected in parallel
to the output of the main digital regulator (and is available externally at the VR_DIG pin). This common digital
supply voltage is connected to all digital circuit blocks including the SPI and register space. The LPLDO has
extremely low quiescent current consumption but limited current supply capability; it is used only in the IDLESTANDBY and IDLE-SLEEP modes. The main digital regulator is automatically enabled in all other modes.
SHUTDOWN
DWN
SHUT
IDLE*
TX
*Five Different Options for IDLE
Figure 5. State Machine Diagram
Table 10. Operating Modes Response Time
State/Mode
Response Time to TX
Current in State/Mode [µA]
Shut Down State
16.8 ms
15 nA
Idle States:
Standby Mode
Sleep Mode
Sensor Mode
Ready Mode
Tune Mode
800 µs
800 µs
800 µs
200 µs
200 µs
450 nA
1 µA
1 µA
800 µA
8.5 mA
NA
RFM42B:
85 mA @ +20 dBm,
RFM43B:
30 mA @ +13 dBm
TX State
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RFM42B/43B
3.2.1. SHUTDOWN State
The SHUTDOWN state is the lowest current consumption state of the device with nominally less than 15 nA of
current consumption. The SHUTDOWN state may be entered by driving the SDN pin high. The SDN pin
should be held low in all states except the SHUTDOWN state. In the SHUTDOWN state, the contents of the
registers are lost and there is no SPI access.
When the chip is connected to the power supply, a POR will be initiated after the falling edge of SDN.
3.2.2. IDLE State
There are five different modes in the IDLE state which may be selected by "Register 07h. Operating Mode and
Function Control 1". All modes have a tradeoff between current consumption and response time to TX mode. This
tradeoff is shown in Table 10. After the POR event, SWRESET, or exiting from the SHUTDOWN state the chip will
default to the IDLE-READY mode. After a POR event the interrupt registers must be read to properly enter the
SLEEP, SENSOR, or STANDBY mode and to control the 32 kHz clock correctly.
3.2.2.1. STANDBY Mode
STANDBY mode has the lowest current consumption of the five IDLE states with only the LPLDO enabled to
maintain the register values. In this mode the registers can be accessed in both read and write mode. The
STANDBY mode can be entered by writing 0h to "Register 07h. Operating Mode and Function Control 1". If an
interrupt has occurred (i.e., the nIRQ pin = 0) the interrupt registers must be read to achieve the minimum current
consumption. Additionally, the ADC should not be selected as an input to the GPIO in this mode as it will cause
excess current consumption.
3.2.2.2. SLEEP Mode
In SLEEP mode the LPLDO is enabled along with the Wake-Up-Timer, which can be used to accurately wake-up
the radio at specified intervals. See "7.6. Wake-Up Timer" for more information on the Wake - Up - Timer.
SLEEP mode is entered by setting enwt = 1 (40h) in "Register 07h. Operating Mode and Function Control 1". If an
interrupt has occurred (i.e., the nIRQ pin = 0) the interrupt registers must be read to achieve the minimum current
consumption. Also, the ADC should not be selected as an input to the GPIO in this mode as it will cause excess
current consumption.
3.2.2.3. SENSOR Mode
In SENSOR Mode either the Low Battery Detector, Temperature Sensor, or both may be enabled in addition to the
LPLDO and Wake-Up-Timer. The Low Battery Detector can be enabled by setting enlbd = 1 in "Register 07h.
Operating Mode and Function Control 1". See "7.4. Temperature Sensor " and "7.5. Low Battery
Detector" for more information on these features. If an interrupt has occurred (i.e., the nIRQ pin = 0) the
interrupt registers must be read to achieve the minimum current consumption.
3.2.2.4. READY Mode
READY Mode is designed to give a fast transition time to TX mode with reasonable current consumption. In this
mode the Crystal oscillator remains enabled reducing the time required to switch to TX mode by eliminating the
crystal start-up time. READY mode is entered by setting xton = 1 in "Register 07h. Operating Mode and Function
Control 1". To achieve the lowest current consumption state the crystal oscillator buffer should be disabled in
“Register 62h. Crystal Oscillator Control and Test.”
3.2.2.5. TUNE Mode
In TUNE Mode the PLL remains enabled in addition to the other blocks enabled in the IDLE modes. This will give
the fastest response to TX mode as the PLL will remain locked but it results in the highest current consumption.
This mode of operation is designed for frequency hopping spread spectrum systems (FHSS). TUNE mode is
entered by setting pllon = 1 in "Register 07h. Operating Mode and Function Control 1". It is not necessary to set
xton to 1 for this mode, the internal state machine automatically enables the crystal oscillator.
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RFM42B/43B
3.2.3. TX State
The TX state may be entered from any of the IDLE modes when the txon bit is set to 1 in "Register 07h. Operating
Mode and Function Control 1". A built-in sequencer takes care of all the actions required to transition between
states from enabling the crystal oscillator to ramping up the PA. The following sequence of events will occur
automatically when going from STANDBY mode to TX mode by setting the txon bit.
1. Enable the main digital LDO and the Analog LDOs.
2. Start up crystal oscillator and wait until ready (controlled by an internal timer).
3. Enable PLL.
4. Calibrate VCO (this action is skipped when the vcocal bit is “0”, default value is “1”).
5. Wait until PLL settles to required transmit frequency (controlled by timer).
6. Activate power amplifier and wait until power ramping is completed (controlled by an internal timer).
7. Transmit packet.
Steps in this sequence may be eliminated depending on which IDLE mode the chip is configured to prior to setting
the txon bit. By default, the VCO and PLL are calibrated every time the PLL is enabled.
3.2.4. Device Status
Add R/W Function/Description
02
R
Device Status
D7
D6
D5
D4
D3
ffovfl
ffunfl
Reserved
Reserved
freqerr
D2
D1
D0
POR Def.
cps[1]
cps[0]
—
The operational status of the chip can be read from "Register 02h. Device Status".
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RFM42B/43B
3.3. Interrupts
The RFM42B/43B is capable of generating an interrupt signal when certain events occur. The chip notifies the
microcontroller that an interrupt event has occurred by setting the nIRQ output pin LOW = 0. This interrupt signal
will be generated when any one (or more) of the interrupt events (corresponding to the Interrupt Status bits) shown
below occur. The nIRQ pin will remain low until the microcontroller reads the Interrupt Status Register(s) (Registers
03h–04h) containing the active Interrupt Status bit. The nIRQ output signal will then be reset until the next change
in status is detected. The interrupts must be enabled by the corresponding enable bit in the Interrupt Enable
Registers (Registers 05h–06h). All enabled interrupt bits will be cleared when the microcontroller reads the
interrupt status register. If the interrupt is not enabled when the event occurs it will not trigger the nIRQ pin, but the
status may still be read at anytime in the Interrupt Status registers.
Add R/W Function/Descript
ion
03
R
Interrupt Status 1
04
R
Interrupt Status 2
05 R/W
Interrupt Enable 1
06 R/W
Interrupt Enable 2
D7
D6
D5
D4
ifferr
itxffafull
itxffaem
D3
Reserved iext
Reserved Reserved Reserved Reserved iwut
enfferr
D2
D1
D0
ipksent Reserved Reserved
ilbd
ichiprdy
ipor
entxffafull entxffaem Reserved enext enpksent Reserved Reserved
Reserved Reserved Reserved Reserved enwut
enlbd
enchiprdy
enpor
POR Def.
—
—
00h
01h
See “RFM42B/43B Register Descriptions” for a complete list of interrupts.
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RFM42B/43B
3.4. System Timing
The system timing for TX mode is shown in Figure 6. The figures demonstrate transitioning from STANDBY mode
to TX mode through the built-in sequencer of required steps. The user only needs to program the desired mode,
and the internal sequencer will properly transition the part from its current mode.
TX Packet
PA RAMP DOWN
PLLTS
PRE PA RAMP
PA RAMP UP
PLL CAL
XTAL Settling
Time
PLL T0
The VCO will automatically calibrate at every frequency change or power up. The PLL T0 time is to allow for bias
settling of the VCO. The PLL TS time is for the settling time of the PLL, which has a default setting of 100 µs. The
total time for PLL T0, PLL CAL, and PLL TS under all conditions is 200 µs. Under certain applications, the PLL T0
time and the PLL CAL may be skipped for faster turn-around time. Contact applications support if faster turnaround
time is desired.
Configurable 5-20us, Recommend 5us
1.5Bits @DR
Configurable 5-20us, Recommend 5us
6us, Fixed
Configurable 0-310us, Recommend 100us
50us, May be skipped
Configurable 0-70us, Default = 50us
600us
Figure 6. TX Timing
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RFM42B/43B
3.5. Frequency Control
For calculating the necessary frequency register settings it is recommended that customers use
the HOPERF Register Calculator worksheet (in Microsoft Excel) available on the product website.
These methods offe r a simple method to quickly determine the correct settings based on the
application requirements. The following information can be used to calculated these values manually.
3.5.1. Frequency Programming
In order to transmit an RF signal, the desired channel frequency, fcarrier, must be programmed into the
RFM42B/43B . Note that this frequency is the center frequency of the desired channel. The carrier frequency is
generated by a Fractional-N Synthesizer, using 10 MHz both as the reference frequency and the clock of the (3rd
order) ΔΣ modulator. This modulator uses modulo 64000 accumulators. This design was made to obtain the
desired frequency resolution of the synthesizer. The overall division ratio of the feedback loop consist of an integer
part (N) and a fractional part (F).In a generic sense, the output frequency of the synthesizer is as follows:
f OUT  10 MHz  ( N  F )
The fractional part (F) is determined by three different values, Carrier Frequency (fc[15:0]), Frequency Offset
(fo[8:0]), and Frequency Deviation (fd[7:0]). Due to the fine resolution and high loop bandwidth of the synthesizer,
FSK modulation is applied inside the loop and is done by varying F according to the incoming data; this is
discussed further in "3.5.4. Frequency Deviation" . Also, a fixed offset can be added to fine-tune the
carrier frequency and counteract crystal tolerance errors. For simplicity assume that only the fc[15:0] register will
determine the fractional component. The equation for selection of the carrier frequency is shown below:
f carrier  10 MHz  (hbsel  1)  ( N  F )
fTX  10 MHz * ( hbsel  1) * ( fb[4 : 0]  24 
Add R/W Function/Description
73
R/W
Frequency Offset 1
74
R/W
Frequency Offset 2
75
R/W Frequency Band Select
76
R/W
Nominal Carrier
Frequency 1
77
R/W
Nominal Carrier
Frequency 0
fc[15 : 0]
)
64000
D7
D6
D5
D4
D3
D2
fo[7]
fo[6]
fo[5]
fo[4]
fo[3]
fo[2]
D1
D0
POR Def.
fo[1] fo[0]
00h
fo[9] fo[8]
00h
sbsel
hbsel
fb[4]
fb[3]
fb[2]
fb[1] fb[0]
35h
fc[15]
fc[14]
fc[13]
fc[12]
fc[11]
fc[10]
fc[9] fc[8]
BBh
fc[7]
fc[6]
fc[5]
fc[4]
fc[3]
fc[2]
fc[1] fc[0]
80h
The integer part (N) is determined by fb[4:0]. Additionally, the output frequency can be halved by connecting a ÷2
divider to the output. This divider is not inside the loop and is controlled by the hbsel bit in "Register 75h.
Frequency Band Select". This effectively partitions the entire 240–960 MHz frequency range into two separate
bands: High Band (HB) for hbsel = 1, and Low Band (LB) for hbsel = 0. The valid range of fb[4:0] is from 0 to 23. If
a higher value is written into the register, it will default to a value of 23. The integer part has a fixed offset of 24
added to it as shown in the formula above. Table 11 demonstrates the selection of fb[4:0] for the corresponding
frequency band.
After selection of the fb (N) the fractional component may be solved with the following equation:


fTX
fc[15 : 0]  
 fb[4 : 0]  24  * 64000
 10 MHz * (hbsel  1)

fb and fc are the actual numbers stored in the corresponding registers.
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RFM42B/43B
Table 11. Frequency Band Selection
fb[4:0] Value
N
Frequency Band
hbsel=0
hbsel=1
0
24
240–249.9 MHz
480–499.9 MHz
1
25
250–259.9 MHz
500–519.9 MHz
2
26
260–269.9 MHz
520–539.9 MHz
3
27
270–279.9 MHz
540–559.9 MHz
4
28
280–289.9 MHz
560–579.9 MHz
5
29
290–299.9 MHz
580–599.9 MHz
6
30
300–309.9 MHz
600–619.9 MHz
7
31
310–319.9 MHz
620–639.9 MHz
8
32
320–329.9 MHz
640–659.9 MHz
9
33
330–339.9 MHz
660–679.9 MHz
10
34
340–349.9 MHz
680–699.9 MHz
11
35
350–359.9 MHz
700–719.9 MHz
12
36
360–369.9 MHz
720–739.9 MHz
13
37
370–379.9 MHz
740–759.9 MHz
14
38
380–389.9 MHz
760–779.9 MHz
15
39
390–399.9 MHz
780–799.9 MHz
16
40
400–409.9 MHz
800–819.9 MHz
17
41
410–419.9 MHz
820–839.9 MHz
18
42
420–429.9 MHz
840–859.9 MHz
19
43
430–439.9 MHz
860–879.9 MHz
20
44
440–449.9 MHz
880–899.9 MHz
21
45
450–459.9 MHz
900–919.9 MHz
22
46
460–469.9 MHz
920–939.9 MHz
23
47
470–479.9 MHz
940–960 MHz
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RFM42B/43B
3.5.2. Easy Frequency Programming for FHSS
While Registers 73h–77h may be used to program the carrier frequency of the RFM42B/43B, it is often easier to
think in terms of “channels” or “channel numbers” rather than an absolute frequency value in Hz. Also, there may
be some timing-critical applications (such as for Frequency Hopping Systems) in which it is desirable to change
frequency by programming a single register. Once the channel step size is set, the frequency may be changed by
a single register corresponding to the channel number. A nominal frequency is first set using Registers 73h–77h,
as described above. Registers 79h and 7Ah are then used to set a channel step size and channel number, relative
to the nominal setting. The Frequency Hopping Step Size (fhs[7:0]) is set in increments of 10 kHz with a maximum
channel step size of 2.56 MHz. The Frequency Hopping Channel Select Register then selects channels based on
multiples of the step size.
Fcarrier  Fnom  fhs[7 : 0]  ( fhch[7 : 0]  10kHz )
For example, if the nominal frequency is set to 900 MHz using Registers 73h–77h, the channel step size is set to
1 MHz using "Register 7Ah. Frequency Hopping Step Size," and "Register 79h. Frequency Hopping Channel
Select" is set to 5d, the resulting carrier frequency would be 905 MHz. Once the nominal frequency and channel
step size are programmed in the registers, it is only necessary to program the fhch[7:0] register in order to change
the frequency.
Add R/W
Function/Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
79
R/W Frequency Hopping Channel
Select
fhch[7] fhch[6] fhch[5] fhch[4] fhch[3] fhch[2] fhch[1]
fhch[0]
00h
7A
R/W
fhs[7]
fhs[0]
00h
Frequency Hopping Step
Size
fhs[6]
fhs[5]
fhs[4]
fhs[3]
fhs[2]
fhs[1]
3.5.3. Automatic State Transition for Frequency Change
If registers 79h or 7Ah are changed in TX mode, the state machine will automatically transition the chip back to
TUNE and change the frequency. This feature is useful to reduce the number of SPI commands required in a
Frequency Hopping System. This in turn reduces microcontroller activity, reducing current consumption. The
exception to this is during TX FIFO mode. If a frequency change is initiated during a TX packet, then the part will
complete the current TX packet and will only change the frequency for subsequent packets.
3.5.4. Frequency Deviation
The peak frequency deviation is configurable from ±0.625 to ±320 kHz. The Frequency Deviation (Δf) is controlled
by the Frequency Deviation Register (fd), address 71 and 72h, and is independent of the carrier frequency setting.
When enabled, regardless of the setting of the hbsel bit (high band or low band), the resolution of the frequency
deviation will remain in increments of 625 Hz. When using frequency modulation the carrier frequency will deviate
from the nominal center channel carrier frequency by ±Δf:
f  fd [8 : 0]  625Hz
f
fd [8 : 0] 
 f = peak deviation
625Hz
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RFM42B/43B
Frequency
f
fcarrier
Time
Figure 7. Frequency Deviation
The previous equation should be used to calculate the desired frequency deviation. If desired, frequency
modulation may also be disabled in order to obtain an unmodulated carrier signal at the channel center frequency;
see "4.1. Modulation Type" for further details.
Add R/W
Function/Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
71
R/W Modulation Mode Control 2 trclk[1] trclk[0] dtmod[1] dtmod[0] eninv fd[8] modtyp[1] modtyp[0]
00h
72
R/W
20h
Frequency Deviation
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fd[7]
fd[6]
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fd[5]
fd[4]
fd[3]
fd[2]
fd[1]
fd[0]
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21
RFM42B/43B
3.5.5. Frequency Offset Adjustment
A frequency offset can be adjusted manually by fo[9:0] in registers 73h and 74h. The frequency offset adjustment is
implemented by shifting the Synthesizer Local Oscillator frequency. This register is a signed register so in order to
get a negative offset it is necessary to take the twos complement of the positive offset number. The offset can be
calculated by the following:
DesiredOffset  156.25 Hz  (hbsel  1)  fo[9 : 0]
fo[9 : 0] 
DesiredOffset
156.25Hz  (hbsel  1)
The adjustment range in high band is ±160 kHz and in low band it is ±80 kHz. For example to compute an offset of
+50 kHz in high band mode fo[9:0] should be set to 0A0h. For an offset of –50 kHz in high band mode the fo[9:0]
register should be set to 360h.
Add R/W Function/Descript
ion
73
R/W
Frequency Offset
74
R/W
Frequency Offset
D7
D6
D5
D4
D3
D2
D1
D0
POR
Def.
fo[7]
fo[6]
fo[5]
fo[4]
fo[3]
fo[2]
fo[1]
fo[0]
00h
fo[9]
fo[8]
00h
3.5.6. TX Data Rate Generator
The data rate is configurable between 0.123–256 kbps. For data rates below 30 kbps the ”txdtrtscale” bit in register
70h should be set to 1. When higher data rates are used this bit should be set to 0.
The TX date rate is determined by the following formula in kbps:
txdr  15:0   1 MHzDR_TX (kbps) = -------------------------------------------------16 + 5  txdtrtscale
2
16 + 5  txdtrtscale
DR_TX(kbps)  2
txdr[15:0] = --------------------------------------------------------------------------------------1 MHz
Add R/W Function/Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
6E
R/W
TX Data Rate 1
txdr[15]
txdr[14] txdr[13] txdr[12] txdr[11]
txdr[10]
txdr[9]
txdr[8]
0Ah
6F
R/W
TX Data Rate 0
txdr[7]
txdr[6]
txdr[2]
txdr[1]
txdr[0]
AAh
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txdr[5]
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txdr[4]
txdr[3]
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RFM42B/43B
4. Modulation Options
4.1. Modulation Type
The RFM42B/43B supports three different modulation options: Gaussian Frequency Shift Keying (GFSK),
Frequency Shift Keying (FSK), and On-Off Keying (OOK). GFSK is the recommended modulation type as it
provides the best performance and cleanest modulation spectrum. Figure 8 demonstrates the difference between
FSK and GFSK for a Data Rate of 64 kbps. The time domain plots demonstrate the effects of the Gaussian filtering.
The frequency domain plots demonstrate the spectral benefit of GFSK over FSK. The type of modulation is
selected with the modtyp[1:0] bits in "Register 71h. Modulation Mode Control 2." Note that it is also possible to
obtain an unmodulated carrier signal by setting modtyp[1:0] = 00.
modtyp[1:0]
Modulation Source
00
Unmodulated Carrier
01
OOK
10
FSK
11
GFSK (enable TX Data CLK when direct mode is used)
TX Modulation Time Domain Waveforms -- FSK vs. GFSK
TX Modulation Spectrum -- FSK vs GFSK (Continuous PRBS)
-20
ModSpectrum_FSK
1.0
0.5
0.0
-0.5
-1.0
-40
-60
-80
-1.5
-100
1.0
-20
ModSpectrum_GFSK
SigData_GFSK[0,::]
SigData_FSK[0,::]
1.5
0.5
0.0
-0.5
-1.0
0
50
100
150
200
250
300
350
400
450
500
-40
-60
-80
-100
-250
-200
-150
-100
-50
0
50
100
150
200
250
freq, KHz
time, usec
DataRate
TxDev
64000.0
32000.0
BT_Filter
0.5
ModIndex
1.0
Figure 8. FSK vs. GFSK Spectrums
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23
RFM42B/43B
4.2. Modulation Data Source
The RFM42B/43B may be configured to obtain its modulation data from one of three different sources:FIFO mode,
Direct Mode, and from a PN9 mode. In Direct Mode, the TX modulation data may be obtained from several
different input pins. These options are set through the dtmod[1:0] field in "Register 71h. Modulation Mode Control
2."
Add R/W Function/Description
71
R/W
Modulation Mode
Control 2
D7
D6
D5
D4
D3
D2
D1
D0
trclk[1] trclk[0] dtmod[1] dtmod[0] eninv fd[8] modtyp[1] modtyp[0]
POR Def.
00h
Data Source
dtmod[1:0]
00
Direct Mode using TX Data via GPIO pin (GPIO configuration required)
01
Direct Mode using TX Data via SDI pin (only when nSEL is high)
10
FIFO Mode
11
PN9 (internally generated)
4.2.1. FIFO Mode
In FIFO mode, the transmit data is stored in integrated FIFO register memory. The FIFOs are accessed via
"Register 7Fh. FIFO Access," and are most efficiently accessed with burst read/write operation as discussed in
"3.1. Serial Peripheral Interface (SPI)".
In TX mode, the data bytes stored in FIFO memory are "packaged" together with other fields and bytes of
information to construct the final transmit packet structure. These other potential fields include the Preamble, Sync
word, Header, CRC checksum, etc. The configuration of the packet structure in TX mode is determined by the
Automatic Packet Handler (if enabled), in conjunction with a variety of Packet Handler Registers (see Table12).
If the Automatic Packet Handler is disabled, the entire desired packet structure should be loaded into
FIFO memory; no other fields (such as Preamble or Sync word are automatically added to the bytes stored in FIFO
memory). For further information on the configuration of the FIFOs for a specific application or packet size, see "6.
Data Handling and Packet Handler" .
When in FIFO mode, the chip will automatically exit the TX State when either the ipksent or ipkvalid interrupt
occurs. The chip will return to the IDLE mode state programmed in "Register 07h. Operating Mode and Function
Control 1". For example, the chip may be placed into TX mode by setting the txon bit, but with the pllon bit
additionally set. The chip will transmit all of the contents of the FIFO and the ipksent interrupt will occur. When this
interrupt event occurs, the chip will clear the txon bit and return to TUNE mode, as indicated by the set state of the
pllon bit. If no other bits are additionally set in register 07h (besides txon initially), then the chip will return to the
STANDBY state.
24
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RFM42B/43B
4.2.2. Direct Mode
For legacy systems that perform packet handling within an MCU or other baseband chip, it may not be desirable to
use the FIFO. For this scenario, a Direct Mode is provided which bypasses the FIFOs entirely.
In TX direct mode, the TX modulation data is applied to an input pin of the chip and processed in "real time" (i.e.,
not stored in a register for transmission at a later time). A variety of pins may be configured for use as the TX Data
input function.
Furthermore, an additional pin may be required for a TX Clock output function if GFSK modulation is desired (only
the TX Data input pin is required for FSK). Two options for the source of the TX Data are available in the dtmod[1:0]
field, and various configurations for the source of the TX Data Clock may be selected through the trclk[1:0] field.
trclk[1:0]
00
01
10
11
TX Data Clock Configuration
No TX Clock (only for FSK)
TX Data Clock is available via GPIO (GPIO needs programming accordingly as well)
TX Data Clock is available via SDO pin (only when nSEL is high)
TX Data Clock is available via the nIRQ pin
The eninv bit in SPI Register 71h will invert the TX Data; this is most likely useful for diagnostic and testing
purposes.
4.2.2.1. Direct Synchronous Mode
In TX direct mode, the chip may be configured for synchronous or asynchronous modes of modulation. In direct
synchronous mode, the RFIC is configured to provide a TX Clock signal as an output to the external device that is
providing the TX Data stream. This TX Clock signal is a square wave with a frequency equal to the programmed
data rate. The external modulation source (e.g., MCU) must accept this TX Clock signal as an input and respond
by providing one bit of TX Data back to the RFIC, synchronous with one edge of the TX Clock signal. In this
fashion, the rate of the TX Data input stream from the external source is controlled by the programmed data rate of
the RFIC; no TX Data bits are made available at the input of the RFIC until requested by another cycle of the TX
Clock signal. The TX Data bits supplied by the external source are transmitted directly in real-time (i.e., not stored
internally for later transmission).
All modulation types (FSK/GFSK/OOK) are valid in TX direct synchronous mode. As will be discussed in the next
section, there are limits on modulation types in TX direct asynchronous mode.
4.2.2.2. Direct Asynchronous Mode
In TX direct asynchronous mode, the RFIC no longer controls the data rate of the TX Data input stream. Instead,
the data rate is controlled only by the external TX Data source; the RFIC simply accepts the data applied to its TX
Data input pin, at whatever rate it is supplied. This means that there is no longer a need for a TX Clock output
signal from the RFIC, as there is no synchronous "handshaking" between the RFIC and the external data source.
The TX Data bits supplied by the external source are transmitted directly in real-time (i.e., not stored internally for
later transmission).
It is not necessary to program the data rate parameter when operating in TX direct asynchronous mode. The chip
still internally samples the incoming TX Data stream to determine when edge transitions occur; however, rather
than sampling the data at a pre-programmed data rate, the chip now internally samples the incoming TX Data
stream at its maximum possible oversampling rate. This allows the chip to accurately determine the timing of the bit
edge transitions without prior knowledge of the data rate. (Of course, it is still necessary to program the desired
peak frequency deviation.)
Only FSK and OOK modulation types are valid in TX Direct Asynchronous Mode; GFSK modulation is not available
in asynchronous mode. This is because the RFIC does not have knowledge of the supplied data rate, and thus
cannot determine the appropriate Gaussian lowpass filter function to apply to the incoming data.
One advantage of this mode that it saves a microcontroller pin because no TX Clock output function is required.
The primary disadvantage of this mode is the increase in occupied spectral bandwidth with FSK (as compared to
GFSK).
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RFM42B/43B
4.2.2.3. Direct Mode using SPI or nIRQ Pins
In certain applications it may be desirable to minimize the connections to the microcontroller or to preserve the
GPIOs for other uses. For these cases it is possible to use the SPI pins and nIRQ as the modulation clock and
data. The SDO pin can be configured to be the data clock by programming trclk = 10. If the nSEL pin is LOW then
the function of the pin will be SPI data output. If the pin is high and trclk[1:0] is 10 then during TX mode the data
clock will be available on the SDO pin. If trclk[1:0] is set to 11 and no interrupts are enabled in registers 05 or 06h,
then the nIRQ pin can also be used as the TX data clock.
The SDI pin can be configured to be the data source in TX mode if dtmod[1:0] = 01. In a similar fashion, if nSEL is
LOW the pin will function as SPI data-in. If nSEL is HIGH then in TX mode it will be the data to be modulated and
transmitted. Figure 9 demonstrates using SDI and SDO as the TX data and clock:
TX on
command
TX mode
TX off
command
TX on
command
TX mode
TX off
command
nSEL
SDI
SPI input
don’t care
SPI input
MOD input
SPI input
don’t care
SPI input
MOD output
SPI input
SDO
SPI output
don’t care
SPI output
Data CLK
Output
SPI output
don’t care
SPI output
Data CLK
Output
SPI output
Figure 9. Microcontroller Connections
If the SDO pin is not used for data clock then it may be programmed to be the interrupt function (nIRQ) by
programming Reg 0Eh bit 3.
4.2.3. PN9 Mode
In this mode the TX Data is generated internally using a pseudorandom (PN9 sequence) bit generator. The primary
purpose of this mode is for use as a test mode to observe the modulated spectrum without having to provide data.
26
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RFM42B/43B
5. Internal Functional Blocks
This section provides an overview some of the key blocks of the internal radio architecture.
5.1. Synthesizer
An integrated Sigma Delta (ΣΔ) Fractional-N PLL synthesizer capable of operating from 240–960 MHz is provided
on-chip. Using a ΣΔ synthesizer has many advantages; it provides flexibility in choosing data rate, deviation,
channel frequency, and channel spacing. The transmit modulation is applied directly to the loop in the digital
domain through the fractional divider which results in very precise accuracy and control over the transmit
deviation.
Depending on the part, the PLL and - modulator scheme is designed to support any desired frequency and
channel spacing in the range from 240–960 MHz with a frequency resolution of 156.25 Hz (Low band) or 312.5 Hz
(High band). The transmit data rate can be programmed between 0.123–256 kbps, and the frequency deviation
can be programmed between ±1–320 kHz. These parameters may be adjusted via registers as shown in "3.5.
Frequency Control".
Fref = 10 M
PFD
CP
Selectable
Divider
LPF
TX
VCO
N
TX
Modulation
DeltaSigma
Figure 10. PLL Synthesizer Block Diagram
The reference frequency to the PLL is 10 MHz. The PLL utilizes a differential L-C VCO, with integrated on-chip
inductors. The output of the VCO is followed by a configurable divider which will divide down the signal to the
desired output frequency band. The modulus of this divider stage is controlled dynamically by the output from the
- modulator. The tuning resolution is sufficient to tune to the commanded frequency with a maximum accuracy of
312.5 Hz anywhere in the range between 240–960 MHz.
5.1.1. VCO
The output of the VCO is automatically divided down to the correct output frequency depending on the hbsel and
fb[4:0] fields in "Register 75h. Frequency Band Select." The VCO integrates the resonator inductor, tuning varactor,
so no external VCO components are required.
The VCO uses a capacitance bank to cover the wide frequency range specified. The capacitance bank will
automatically be calibrated every time the synthesizer is enabled. In certain fast hopping applications this might not
be desirable so the VCO calibration may be skipped by setting the appropriate register.
5.2. Power Amplifier
The RFM42B contains an internal integrated power amplifier(PA) capable of transmitting at output levels between-1
and +20dBm. The RFM43B contains a PA which is capable of transmitting output levels between –8 to +13 dBm.
The PA can chang the output power by adjusting txpow[2:0] will scale both the output power and current but the
efficiency will not be constant. The PA output is ramped up and down to prevent unwanted spectral splatter.
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RFM42B/43B
5.2.1. Output Power Selection
With the RFM42B,the output power is configurable in 3 dB steps with the txpow[2:0] field in "Register 6Dh. TX
Power." Extra output power can allow the use of a cheaper, smaller antenna reducing the overall BOM cost. The
higher power setting of the chip achieves maximum possible range, but of course comes at the cost of higher TX
current consumption. However, depending on the duty cycle of the system, the effect on battery life may be
insignificant. Contact HOPERF Support for help in evaluating this tradeoff.
The +13 dBm output power of the RF43B is targeted at systems that require lower output power. The PA still
offers high efficiency and a range of output power from –8 to +13 dBm.
Add R/W Function/Description
6D
R/W
D7
D6
D5
D3
TX Power
txpow[2:0]
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+1 dBm
001
+2 dBm
010
+5 dBm
011
+8 dBm
100
+11 dBm
101
+14 dBm
110
+17 dBm
111
+20 dBm
D1
D0
POR Def.
txpow[2]
txpow[1]
txpow[0]
07h
RFM43B Output Power
000
–8 dBm
001
–5 dBm
010
–2 dBm
011
+1 dBm
100
+4 dBm
101
+7 dBm
110
+10 dBm
111
+13 dBm
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D2
RFM42B Output Power
000
txpow[2:0]
28
D4
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RFM42B/43B
5.3. Crystal Oscillator
The RFM42B/43B includes an integrated 30 MHz crystal oscillator with a fast start-up time of less than 600 µs
A parallel resonant 30MHz crystal is used on the module. Th e design is differential with the required
crystal load capacitance integrated on-chip to minimize the number of external components.
The crystal load capacitance can be digitally programmed to accommodate crystals with various load capacitance
requirements and to adjust the frequency of the crystal oscillator. The tuning of the crystal load capacitance is
programmed through the xlc[6:0] field of "Register 09h. 30 MHz Crystal Oscillator Load Capacitance." The total
internal capacitance is 12.5 pF and is adjustable in approximately 127 steps (97fF/step). The xtalshift bit is a
coarse shift in frequency but is not binary with xlc[6:0].
The crystal frequency adjustment can be used to compensate for crystal production tolerances. Utilizing the onchip temperature sensor and suitable control software, the temperature dependency of the crystal can be
canceled.
The typical value of the total on-chip capacitance Cint can be calculated as follows:
Cint = 1.8 pF + 0.085 pF x xlc[6:0] + 3.7 pF x xtalshift
Note that the coarse shift bit xtalshift is not binary with xlc[6:0]. The total load capacitance Cload seen by the crystal
can be calculated by adding the sum of all external parasitic PCB capacitances Cext to Cint. If the maximum value
of Cint (16.3pF) is not sufficient, an external capacitor can be added for exact tuning.
The crystal oscillator frequency is divided down internally and may be output to the microcontroller through one of
the GPIO pins for use as the System Clock. In this fashion, only one crystal oscillator is required for the entire
system and the BOM cost is reduced. The available clock frequencies and GPIO configuration are discussed
further in "7.2. Microcontroller Clock" .
Add R/W Function/Description
09
R/W
Crystal Oscillator Load
Capacitance
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
xtalshift
xlc[6]
xlc[5]
xlc[4]
xlc[3]
xlc[2]
xlc[1]
xlc[0]
40h
5.4. Regulators
There are a total of four regulators integrated onto the RFM42B/43B.With the exception of the digital regulator, all
regulators are designed to operate with only internal decoupling. All regulators are designed to operate with an
input supply voltage from +1.8 to +3.6V. A supply voltage should only be connected to the VDD pins.
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RFM42B/43B
6. Data Handling and Packet Handler
The internal modem is designed to operate with a packet including a 10101... preamble structure. To configure the
modem to operate with packet formats without a preamble or other legacy packet structures contact customer
support.
6.1. TX FIFO
A 64 byte FIFO is integrated into the chip for TX, as shown in Figure 11. "Register 7Fh. FIFO Access" is used to
access the FIFO. A burst write, as described in "3.1. Serial Peripheral Interface (SPI) " , to address 7Fh
will write data to the TX FIFO.
TX FIFO
TX FIFO Almost Full
Threshold
TX FIFO Almost Empty
Threshold
Figure 11. FIFO Threshold
The TX FIFO has two programmable thresholds. An interrupt event occurs when the data in the TX FIFO reaches
these thresholds. The first threshold is the FIFO almost full threshold, txafthr[5:0]. The value in this register
corresponds to the desired threshold value in number of bytes. When the data being filled into the TX FIFO crosses
this threshold limit, an interrupt to the microcontroller is generated so the chip can enter TX mode to transmit the
contents of the TX FIFO. The second threshold for TX is the FIFO almost empty Threshold, txaethr[5:0]. When the
data being shifted out of the TX FIFO drops below the almost empty threshold an interrupt will be generated. The
microcontroller will need to switch out of TX mode or fill more data into the TX FIFO. The transceiver can be
configured so that when the TX FIFO is empty it will automatically exit the TX state and return to one of the low
power states. When TX is initiated, it will transmit the number of bytes programmed into the packet length field
(Reg 3Eh). When the packet ends, the chip will return to the state specified in register 07h. For example, if 08h is
written to address 07h then the chip will return to the STANDBY state. If 09h is written then the chip will return to
the READY state.
30
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RFM42B/43B
Add R/W Function/D
escription
D7
D6
D5
D4
D3
Operating & Reserved Reserved Reserved Reserved
Function
Control 2
D1
Reserved Reserved
D0
POR Def.
ffclrtx
00h
08
R/W
7C
R/W
TX FIFO
Control 1
Reserved Reserved txafthr[5]
txafthr[3] txafthr[2] txafthr[1] txafthr[0]
37h
7D
R/W
TX FIFO
Control 2
Reserved Reserved txaethr[5] txaethr[4] txaethr[3] txaethr[2] txaethr[1] txaethr[0]
04h
txafthr[4]
autotx
D2
The TX FIFO may be cleared or reset with the ffclrtx bit in “Register 08h. Operating Mode and Function Control 2.”
All interrupts may be enabled by setting the Interrupt Enabled bits in "Register 05h. Interrupt Enable 1" and
“Register 06h. Interrup t Enable 2,”. If the interrupts are not enabled the function will not generate an
interrupt on the nIRQ pin but the bits will still be read correctly in the Interrupt Status registers.
6.2. Packet Configuration
When using the FIFO, automatic packet handling may be enabled for the TX mode. "Register 30h. Data Access
Control" through “Register 3Eh. Packet Length,” control the configuration for Packet Handling. The
usual fields for network communication (such as preamble, synchronization word, headers, packet length, and
CRC) can be configured to be automatically added to the data payload. The fields needed for packet generation
normally change infrequently and can therefore be stored in registers. Automatically adding these fields to the data
payload greatly reduces the amount of communication between the microcontroller and the RF 42B/43B and
reduces the required computational power of the microcontroller.
Data
CRC
1-4 Bytes
0 or 2
Bytes
0 or 1 Byte
0-4 Bytes
1-512 Bytes
Packet Length
Preamble
TX Header
Sync Word
The general packet structure is shown in Figure 12. The length of each field is shown below the field. The preamble
pattern is always a series of alternating ones and zeroes, starting with a zero. All the fields have programmable
lengths to accommodate different applications. The most common CRC polynominals are available for selection.
Figure 12. Packet Structure
An overview of the packet handler configuration registers is shown in Table 12.
6.3. Packet Handler TX Mode
If the TX packet length is set the packet handler will send the number of bytes in the packet length field before
returning to IDLE mode and asserting the packet sent interrupt. To resume sending data from the FIFO the
microcontroller needs to command the chip to re-enter TX mode. Figure 14 provides an example transaction where
the packet length is set to three bytes.
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31
RFM42B/43B
D ata
D ata
D ata
D ata
D ata
D ata
D ata
D ata
D ata
1
2
3
4
5
6
7
8
9
}
}
}
This w ill be sent in the first transm ission
This w ill be sent in the second transm ission
This w ill be sent in the third transm ission
Figure 13. Multiple Packets in TX Packet Handler
Table 12. Packet Handler Registers
Add
R/W
Function/Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
30
R/W
Data Access Control
Reserved
lsbfrst
crcdonly
skip2ph
enpactx
encrc
crc[1]
crc[0]
8Dh
31
R
EzMAC status
0
Reserved
Reserved
Reserved
Reserved
Reserved
pktx
pksent
—
32
Reserved
33
R/W
Header Control 2
skipsyn
hdlen[2]
hdlen[1]
hdlen[0]
fixpklen
synclen[1]
synclen[0]
prealen[8]
22h
34
R/W
Preamble Length
prealen[7]
prealen[6]
prealen[5]
prealen[4]
prealen[3]
prealen[2]
prealen[1]
prealen[0]
08h
36
R/W
Sync Word 3
sync[31]
sync[30]
sync[29]
sync[28]
sync[27]
sync[26]
sync[25]
sync[24]
2Dh
37
R/W
Sync Word 2
sync[23]
sync[22]
sync[21]
sync[20]
sync[19]
sync[18]
sync[17]
sync[16]
D4h
38
R/W
Sync Word 1
sync[15]
sync[14]
sync[13]
sync[12]
sync[11]
sync[10]
sync[9]
sync[8]
00h
39
R/W
Sync Word 0
sync[7]
sync[6]
sync[5]
sync[4]
sync[3]
sync[2]
sync[1]
sync[0]
00h
3A
R/W
Transmit Header 3
txhd[31]
txhd[30]
txhd[29]
txhd[28]
txhd[27]
txhd[26]
txhd[25]
txhd[24]
00h
3B
R/W
Transmit Header 2
txhd[23]
txhd[22]
txhd[21]
txhd[20]
txhd[19]
txhd[18]
txhd[17]
txhd[16]
00h
3C
R/W
Transmit Header 1
txhd[15]
txhd[14]
txhd[13]
txhd[12]
txhd[11]
txhd[10]
txhd[9]
txhd[8]
00h
3D
R/W
Transmit Header 0
txhd[7]
txhd[6]
txhd[5]
txhd[4]
txhd[3]
txhd[2]
txhd[1]
txhd[0]
00h
3E
R/W
Transmit Packet Length
pklen[7]
pklen[6]
pklen[5]
pklen[4]
pklen[3]
pklen[2]
pklen[1]
pklen[0]
00h
32
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RFM42B/43B
6.4. Data Whitening, Manchester Encoding, and CRC
Data whitening can be used to avoid extended sequences of 0s or 1s in the transmitted data stream to achieve a
more uniform spectrum. When enabled, the payload data bits are XORed with a pseudorandom sequence output
from the built-in PN9 generator. The generator is initialized at the beginning of the payload. The receiver recovers
the original data by repeating this operation. Manchester encoding can be used to ensure a dc-free transmission
and good synchronization properties. When Manchester encoding is used, the effective datarate is unchanged but
the actual datarate (preamble length, etc.) is doubled due to the nature of the encoding. The effective datarate
when using Manchester encoding is limited to 128 kbps. The implementation of Manchester encoding is shown in
Figure 15. Data whitening and Manchester encoding can be selected with "Register 70h. Modulation Mode Control
1". The CRC is configured via "Register 30h. Data Access Control". Figure 14 demonstrates the portions of the
packet which have Manchester encoding, data whitening, and CRC applied. CRC can be applied to only the data
portion of the packet or to the data, packet length and header fields. Figure 15 provides an example of how the
Manchester encoding is done and also the use of the Manchester invert (enmaniv) function.
Manchester
Whitening
CRC
CRC
(Over data only)
Preamble
Sync
Header/
Address
PK
Length
Data
CRC
Figure 14. Operation of Data Whitening, Manchester Encoding, and CRC
Data before Manchester
1
1
1
1
1
Preamble = 0xFF
1
1
1
0
0
0
1
0
First 4bits of the synch. word = 0x2
Data after Machester ( manppol = 1, enmaninv = 0)
Data after Machester ( manppol = 1, enmaninv = 1)
Data before Manchester
0
0
0
0
0
Preamble = 0x00
0
0
0
0
0
0
1
0
First 4bits of the synch. word = 0x2
Data after Machester ( manppol = 0, enmaninv = 0)
Data after Machester ( manppol = 0, enmaninv = 1)
Figure 15. Manchester Coding Example
6.5. Synchronization Word Configuration
The synchronization word length can be configured in Reg 33h, synclen[1:0]. The expected or transmitted sync
word can be configured from 1 to 4 bytes as defined below:
synclen[1:0] = 00—Transmitted Synchronization Word (sync word) 3.
 synclen[1:0] = 01—Transmitted Synchronization Word 3 first, followed by sync word 2.
 synclen[1:0] = 10—Transmitted Synchronization Word 3 first, followed by sync word 2, followed by sync word 1.
 synclen[1:0] = 1—Transmitted Synchronization Word 3 first, followed by sync word 2, followed by sync word 1,
followed by sync word 0.
The sync is transmitted in the following sequence: sync 3sync 2sync 1sync 0. The sync word values can be
programmed in Registers 36h–39h.

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RFM42B/43B
6.6. TX Retransmission and Auto TX
The RFM42B/43B is capable of automatically retransmitting the last packet loaded in the TX FIFO. Automatic
retransmission is set by entering the TX state with the txon bit without reloading the TX FIFO. This feature is useful
for beacon transmission or when retransmission is required due to the absence of a valid acknowledgement. Only
packets that fit completely in the TX FIFO can be automatically retransmitted.
An automatic transmission function is available, allowing the radio to automatically start or stop a transmission
depending on the amount of data in the TX FIFO.
When autotx is set in “Register 08. Operating & Function Control 2," the transceiver will automatically enter the TX
state when the TX FIFO almost full threshold is exceeded. Packets will be transmitted according to the configured
packet length. To stop transmitting, clear the packet sent or TX FIFO almost empty interrupts must be cleared by
reading register.
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RFM42B/43B
7. Auxiliary Functions
7.1. Smart Reset
The RFM42B/43B contains an enhanced integrated SMART RESET or POR circuit. The POR circuit contains both
a classic level threshold reset as well as a slope detector POR. This reset circuit was designed to produce a
reliable reset signal under any circumstances. Reset will be initiated if any of the following conditions occur:

Initial power on, VDD starts from gnd: reset is active till VDD reaches VRR (see table);

When VDD decreases below VLD for any reason: reset is active till VDD reaches VRR;
A software reset via “Register 08h. Operating Mode and Function Control 2,”: reset is active for time TSWRST
 VDD glitch when the supply voltage exceeds the following time functioned limit:

VDD nom.
VDD(t)
reset limit:
0.4V+t*0.2V/ms
actual VDD(t)
showing glitch
0.4V
Reset
TP
t
t=0,
VDD starts to rise
reset:
Vglitch>=0.4+t*0.2V/ms
Figure 16. POR Glitch Parameters
Table 13. POR Parameters
Parameter
Symbol
Comment
Min
Typ
Max
Unit
0.85
1.3
1.75
V
Release Reset Voltage
VRR
Power-On VDD Slope
SVDD
tested VDD slope region
0.03
—
300
V/ms
VLD
VLD<VRR is guaranteed
0.7
1
1.3
V
TSWRST
50
—
470
µs
Threshold Voltage
VTSD
—
0.4
—
V
Reference Slope
k
—
0.2
—
V/ms
5
15
40
ms
Low VDD Limit
Software Reset Pulse
VDD Glitch Reset Pulse
TP
Also occurs after SDN, and
initial power on
The reset will initialize all registers to their default values. The reset signal is also available for output and use by
the microcontroller by using the default setting for GPIO_0. The inverted reset signal is available by default on
GPIO_1.
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RFM42B/43B
7.2. Microcontroller Clock
The 30 MHz crystal oscillator frequency is divided down internally and may be output to the microcontroller through
GPIO2. This feature is useful to lower BOM cost by using only one crystal in the system. The system clock
frequency is selectable from one of 8 options, as shown below. Except for the 32.768 kHz option, all other
frequencies are derived by dividing the crystal oscillator frequency. The 32.768 kHz clock signal is derived from an
internal RC oscillator or an external 32 kHz crystal. The default setting for GPIO2 is to output the microcontroller
clock signal with a frequency of 1 MHz.
Add R/W
0A
R/W
D7
Function/Description
D6
Microcontroller Output Clock
D5
D4
D3
clkt[1]
clkt[0]
enlfc
mclk[2:0]
Clock Frequency
000
30 MHz
001
15 MHz
010
10 MHz
011
4 MHz
100
3 MHz
101
2 MHz
110
1 MHz
111
32.768 kHz
D2
D1
D0
mclk[2] mclk[1] mclk[0]
POR Def.
0Bh
If the microcontroller clock option is being used there may be the need of a system clock for the microcontroller
while the RFM42B/43B is in SLEEP mode. Since the crystal oscillator is disabled in SLEEP mode in order to save
current, the low-power 32.768 kHz clock can be automatically switched to become the microcontroller clock. This
feature is called enable low frequency clock and is enabled by the enlfc bit in “Register 0Ah. Microcontroller Output
Clock." When enlfc = 1 and the chip is in SLEEP mode then the 32.768 kHz clock will be provided to the
microcontroller as the system clock, regardless of the setting of mclk[2:0]. For example, if mclk[2:0] = 000, 30 MHz
will be provided through the GPIO output pin to the microcontroller as the system clock in all IDLE or TX states.
When the chip enters SLEEP mode, the system clock will automatically switch to 32.768 kHz from the RC oscillator
or 32.768 XTAL.
Another available feature for the microcontroller clock is the clock tail, clkt[1:0] in “Register 0Ah. Microcontroller
Output Clock." If the low frequency clock feature is not enabled (enlfc = 0), then the system clock to the
microcontroller is disabled in SLEEP mode. However, it may be useful to provide a few extra cycles for the
microcontroller to complete its operation prior to the shutdown of the system clock signal. Setting the clkt[1:0] field
will provide additional cycles of the system clock before it shuts off.
clkt[1:0]
Clock Tail
00
0 cycles
01
128 cycles
10
256 cycles
11
512 cycles
If an interrupt is triggered, the microcontroller clock will remain enabled regardless of the selected mode. As soon
as the interrupt is read the state machine will then move to the selected mode. The minimum current consumption
will not be achieved until the interrupt is read. For instance, if the chip is commanded to SLEEP mode but an
interrupt has occurred the 30 MHz XTAL will not be disabled until the interrupt has been cleared.
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RFM42B/43B
7.3. General Purpose ADC
An 8-bit SAR ADC is integrated for general purpose use, as well as for digitizing the on-chip temperature sensor
reading. Registers 0Fh "ADC Configuration", 10h "Sensor Offset" and 4Fh "Amplifier Offset" can be used to
configure the ADC operation.
Every time an ADC conversion is desired, bit 7 "adcstart/adcbusy" in “Register 1Fh. Clock Recovery Gearshift
Override” must be set to 1. This is a self clearing bit that will be reset to 0 at the end of the conversion cycle of the
ADC. The conversion time for the ADC is 350 µs. After this time or when the "adcstart/adcbusy" bit is cleared, then
the ADC value may be read out of “Register 11h. ADC Value."
The architecture of the ADC is shown in Figure 17. The signal and reference inputs of the ADC are selected by
adcsel[2:0] and adcref[1:0] in register 0Fh “ADC Configuration”, respectively. The default setting is to read out the
temperature sensor using the bandgap voltage (VBG) as reference. With the VBG reference the input range of the
ADC is from 0-1.02 V with an LSB resolution of 4 mV (1.02/255). Changing the ADC reference will change the LSB
resolution accordingly.
A differential multiplexer and amplifier are provided for interfacing external bridge sensors. The gain of the amplifier
is selectable by adcgain[1:0] in Register 0Fh. The majority of sensor bridges have supply voltage (VDD) dependent
gain and offset. The reference voltage of the ADC can be changed to either VDD/2 or VDD/3. A programmable VDD
dependent offset voltage can be added using soffs[3:0] in register 10h.
Diff. MUX
Diff. Amp.
…
…
Input MUX
aoffs [4:0]
adcsel [2:0]
adcgain [1:0]
…
GPIO0
GPIO1
GPIO2
soffs [3:0]
8-bit ADC
Temperature Sensor
Vin
adcsel [2:0]
Vref
0 -1020mV / 0-255
Ref MUX
…
VDD / 3
VDD / 2
VBG (1.2V)
adc [7:0]
adcref [1:0]
Figure 17. General Purpose ADC Architecture
Add
R/W
Function/Description
D7
0F
R/W
ADC Configuration
adcstart/adcbusy
10
R/W
Sensor Offset
11
R
ADC Value
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adc[7]
D6
D5
adcsel[2] adcsel[1]
adc[6]
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adc[5]
D4
D3
D2
adcsel[0]
adcref[1]
adcref[0]
soffs[3]
soffs[2]
soffs[1]
soffs[0]
00h
adc[3]
adc[2]
adc[1]
adc[0]
—
adc[4]
D1
D0
POR Def.
adcgain[1] adcgain[0]
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00h
37
RFM42B/43B
7.4. Temperature Sensor
An integrated on-chip analog temperature sensor is available. The temperature sensor will be automatically
enabled when the temperature sensor is selected as the input of the ADC or when the analog temp voltage is
selected on the analog test bus. The temperature sensor value may be digitized using the general-purpose ADC
and read out over the SPI through "Register 10h. ADC Sensor Amplifier Offset." The range of the temperature
sensor is configurable. Table 14 lists the settings for the different temperature ranges and performance.
To use the Temp Sensor:
1. Set the input for ADC to the temperature sensor, "Register 0Fh. ADC Configuration"—adcsel[2:0] = 000
2. Set the reference for ADC, "Register 0Fh. ADC Configuration"—adcref[1:0] = 00
3. Set the temperature range for ADC, "Register 12h. Temperature Sensor Calibration"—tsrange[1:0]
4. Set entsoffs = 1, "Register 12h. Temperature Sensor Calibration"
5. Trigger ADC reading, "Register 0Fh. ADC Configuration"—adcstart = 1
6. Read temperature value—Read contents of "Register 11h. ADC Value"
Add R/W Function/Description
12
R/W
Temperature
Sensor Control
13
R/W Temperature Value Offset
D7
D6
D5
D4
D3
D2
tsrange[1]
tsrange[0]
entsoffs
entstrim
tstrim[3]
tstrim[2]
tvoffs[7]
tvoffs[6]
tvoffs[5]
tvoffs[4]
tvoffs[3]
tvoffs[2]
D1
D0
POR Def.
vbgtrim[1] vbgtrim[0]
tvoffs[1]
tvoffs[0]
20h
00h
Table 14. Temperature Sensor Range
entoff
tsrange[1]
tsrange[0]
Temp. range
Unit
Slope
ADC8 LSB
1
0
0
–64 … 64
°C
8 mV/°C
0.5 °C
1
0
1
–64 … 192
°C
4 mV/°C
1 °C
1
1
0
0 … 128
°C
8 mV/°C
0.5 °C
1
1
1
–40 … 216
°F
4 mV/°F
1 °F
0*
1
0
0 … 341
°K
3 mV/°K
1.333 °K
*Note: Absolute temperature mode, no temperature shift. This mode is only for test purposes. POR value of
EN_TOFF is 1.
The slope of the temperature sensor is very linear and monotonic. For absolute accuracy better than 10 °C
calibration is necessary. The temperature sensor may be calibrated by setting entsoffs = 1 in “Register 12h.
Temperature Sensor Control” and setting the offset with the tvoffs[7:0] bits in “Register 13h. Temperature Value
Offset.” This method adds a positive offset digitally to the ADC value that is read in “Register 11h. ADC Value.” The
other method of calibration is to use the tstrim which compensates the analog circuit. This is done by setting
entstrim = 1 and using the tstrim[2:0] bits to offset the temperature in “Register 12h. Temperature Sensor Control.”
With this method of calibration, a negative offset may be achieved. With both methods of calibration better than
±3 °C absolute accuracy may be achieved.
The different ranges for the temperature sensor and ADC8 are demonstrated in Figure 18. The value of the ADC8
may be translated to a temperature reading by ADC8Value x ADC8 LSB + Lowest Temperature in Temp Range.
For instance for a tsrange = 00, Temp = ADC8Value x 0.5 – 64.
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RFM42B/43B
Temperature Measurement with ADC8
300
250
ADC Value
200
Sensor Range 0
Sensor Range 1
150
Sensor Range 2
Sensor Range 3
100
50
0
-40
-20
0
20
40
60
80
100
Temperature [Celsius]
Figure 18. Temperature Ranges using ADC8
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RFM42B/43B
7.5. Low Battery Detector
A low battery detector (LBD) with digital read-out is integrated into the chip. A digital threshold may be programmed
into the lbdt[4:0] field in "Register 1Ah. Low Battery Detector Threshold." When the digitized battery voltage
reaches this threshold an interrupt will be generated on the nIRQ pin to the microcontroller. The microcontroller can
confirm source of the interrupt by reading "Register 03h. Interrupt/Status 1" and “Register 04h. Interrupt/Status 2,”
If the LBD is enabled while the chip is in SLEEP mode, it will automatically enable the RC oscillator which will
periodically turn on the LBD circuit to measure the battery voltage. The battery voltage may also be read out
through "Register 1Bh. Battery Voltage Level" at any time when the LBD is enabled. The low battery detect function
is enabled by setting enlbd=1 in "Register 07h. Operating Mode and Function Control 1".
Ad
R/W
Function/Description
1A
R/W
Low Battery Detector Threshold
1B
R
Battery Voltage Level
D7
0
D6
0
D5
0
D4
D3
D2
D1
D0
POR Def.
lbdt[4]
lbdt[3]
lbdt[2]
lbdt[1]
lbdt[0]
14h
vbat[4] vbat[3] vbat[2] vbat[1] vbat[0]
—
The LBD output is digitized by a 5-bit ADC. When the LBD function is enabled, enlbd = 1 in "Register 07h.
Operating Mode and Function Control 1", the battery voltage may be read at anytime by reading "Register 1Bh.
Battery Voltage Level." A battery voltage threshold may be programmed in “Register 1Ah. Low Battery Detector
Threshold." When the battery voltage level drops below the battery voltage threshold an interrupt will be generated
on the nIRQ pin to the microcontroller if the LBD interrupt is enabled in “Register 06h. Interrupt Enable 2,”
The microcontroller will then need to verify the interrupt by reading the interrupt status register, addresses 03
and 04h. The LSB step size for the LBD ADC is 50 mV, with the ADC range demonstrated in the table below. If the
LBD is enabled the LBD and ADC will automatically be enabled every 1 s for approximately 250 µs to measure the
voltage which minimizes the current consumption in Sensor mode. Before an interrupt is activated four consecutive
readings are required.
BatteryVoltage  1.7  50mV  ADCValue
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ADC Value
VDD Voltage [V]
0
< 1.7
1
1.7–1.75
2
1.75–1.8
…
…
29
3.1–3.15
30
3.15–3.2
31
> 3.2
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RFM42B/43B
7.6. Wake-Up Timer
The chip contains an integrated wake-up timer which can be used to periodically wake the chip from SLEEP mode.
The wake-up timer runs from the internal 32.768 kHz RC Oscillator. The wake-up timer can be configured to run
when in SLEEP mode. If enwt = 1 in "Register 07h. Operating Mode and Function Control 1" when entering SLEEP
mode, the wake-up timer will count for a time specified defined in Registers 14–16h, "Wake Up Timer Period." At
the expiration of this period an interrupt will be generated on the nIRQ pin if this interrupt is enabled. The
microcontroller will then need to verify the interrupt by reading the Registers 03h–04h, "Interrupt Status 1 & 2". The
wake-up timer value may be read at any time by the wtv[15:0] read only registers 13h–14h.
The formula for calculating the Wake-Up Period is the following:
WUT 
4  M  2R
ms
32 . 768
WUT Register
Description
wtr[3:0]
R Value in Formula
wtd[1:0]
D Value in Formula
wtm[15:0]
M Value in Formula
Use of the D variable in the formula is only necessary if finer resolution is required than can be achieved by using
the R value.
Add R/W Function/Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
wtr[3]
wtr[2]
wtr[1]
wtr[0]
wtd[1]
wtd[0]
00h
14
R/W
Wake-Up Timer Period 1
15
R/W
Wake-Up Timer Period 2
wtm[15] wtm[14] wtm[13] wtm[12] wtm[11] wtm[10] wtm[9] wtm[8]
00h
16
R/W
Wake-Up Timer Period 3
wtm[7]
wtm[6]
wtm[5]
wtm[4]
wtm[3]
wtm[2]
wtm[1] wtm[0]
00h
17
R
Wake-Up Timer Value 1
wtv[15]
wtv[14]
wtv[13]
wtv[12]
wtv[11]
wtv[10]
wtv[9]
wtv[8]
—
18
R
Wake-Up Timer Value 2
wtv[7]
wtv[6]
wtv[5]
wtv[4]
wtv[3]
wtv[2]
wtv[1]
wtv[0]
—
There are two different methods for utilizing the wake-up timer (WUT) depending on if the WUT interrupt is enabled
in “Register 06h. Interrupt Enable 2,”. If the WUT interrupt is enabled then nIRQ pin will go low when
the timer expires. The chip will also change state so that the 30 MHz XTAL is enabled so that the microcontroller
clock output is available for the microcontroller to use to process the interrupt. The other method of use is to not
enable the WUT interrupt and use the WUT GPIO setting. In this mode of operation the chip will not change state
until commanded by the microcontroller. The different modes of operating the WUT and the current consumption
impacts are demonstrated in Figure 19.
A 32 kHz XTAL may also be used for better timing accuracy. By setting the x32 ksel bit in “Register 07h. Operating
& Function Control 1," GPIO0 is automatically reconfigured so that an external 32 kHz XTAL may be connected to
this pin. In this mode, the GPIO0 is extremely sensitive to parasitic capacitance, so only the XTAL should be
connected to this pin with the XTAL physically located as close to the pin as possible. Once the x32 ksel bit is set,
all internal functions such as WUT, microcontroller clock, and LDC mode will use the 32 kHz XTAL and not the
32 kHz RC oscillator.
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RFM42B/43B
Interrupt Enable enwut =1 ( Reg 06h)
WUT Period
GPIOX =00001
nIRQ
SPI Interrupt
Read
Chip State
Sleep
Current
Consumption
Ready
Sleep
Ready
1.5 mA
Sleep
1.5 mA
Sleep
1.5 mA
1 uA
1 uA
Ready
1 uA
Interrupt Enable enwut =0 ( Reg 06h)
WUT Period
GPIOX =00001
nIRQ
SPI Interrupt
Read
Chip State
Sleep
Current
Consumption
1 uA
Figure 19. WUT Interrupt and WUT Operation
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RFM42B/43B
7.7. GPIO Configuration
Three general purpose IOs (GPIOs) are available. Numerous functions such as specific interrupts, TRSW control,
Microcontroller Output, etc. can be routed to the GPIO pins as shown in the tables below. When in Shutdown mode
all the GPIO pads are pulled low.
Note: The ADC should not be selected as an input to the GPIO in Standby or Sleep Modes and will cause excess current consumption.
Add R/W
Function/
Description
D7
D6
D5
D4
D3
D2
D1
D0
POR Def.
0B
R/W
GPIO0
Configuration
gpio0drv[1] gpio0drv[0]
pup0
gpio0[4] gpio0[3] gpio0[2] gpio0[1] gpio0[0]
00h
0C
R/W
GPIO1
Configuration
gpio1drv[1] gpio1drv[0]
pup1
gpio1[4] gpio1[3] gpio1[2] gpio1[1] gpio1[0]
00h
0D
R/W
GPIO2
Configuration
gpio2drv[1] gpio2drv[0]
pup2
gpio2[4] gpio2[3] gpio2[2] gpio2[1] gpio2[0]
00h
0E
R/W
I/O Port
Configuration
extitst[2]
extitst[1] extitst[0]
itsdo
dio2
dio1
dio0
00h
The GPIO settings for GPIO1 and GPIO2 are the same as for GPIO0 with the exception of the 00000 default
setting. The default settings for each GPIO are listed below:
GPIO
00000—Default Setting
GPIO0
POR
GPIO1
POR Inverted
GPIO2
Microcontroller Clock
For a complete list of the available GPIO's see “ RFM42B/43B Register Descriptions.”
The GPIO drive strength may be adjusted with the gpioXdrv[1:0] bits. Setting a higher value will increase the drive
strength and current capability of the GPIO by changing the driver size. Special care should be taken in setting the
drive strength and loading on GPIO2 when the microcontroller clock is used. Excess loading or inadequate drive
may contribute to increased spurious emissions.
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RFM42B/43B
8. Reference Design
Freq. band RDC LC C0 L0 CM LM CM2 LM2 CM3
[MHz] [Ohm] [nH] [pF] [nH] [pF] [nH] [pF] [nH] [pF]
Figure 20A.RFM42B Reference Design Schematic
Figure 20B.RFM43B Reference Design Schematic
44
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RFM42B/43B
9. Register Table and Descriptions
Table 15. Register Descriptions
Add
R/W
Function/Desc
D7
0
ffovfl
ifferr
Reserved
enfferr
Reserved
swres
Reserved
xtalshft
D6
0
ffunfl
itxffafull
Reserved
entxffafull
Reserved
enlbd
Reserved
xlc[6]
Reserved
gpio0drv[1]
gpio1drv[1]
gpio2drv[1]
Reserved
adcstart/adcdone
Reserved
adc[7]
tsrange[1]
tvoffs[7]
Reserved
wtm[15]
wtm[7]
wtv[15]
wtv[7]
Reserved
gpio0drv[0]
gpio1drv[0]
gpio2drv[0]
extitst[2]
adcsel[2]
R/W Low Battery Detector Threshold
R
Battery Voltage Level
Reserved
0
Reserved
0
R/W
R
Data Access Control
EzMAC status
Reserved
0
lsbfrst
Reserved
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Header Control 2
Preamble Length
Sync Word 3
Sync Word 2
Sync Word 1
Sync Word 0
Transmit Header 3
Transmit Header 2
Transmit Header 1
Transmit Header 0
Transmit Packet Length
ADC8 Control
Reserved
prealen[7]
sync[31]
sync[23]
sync[15]
sync[7]
txhd[31]
txhd[23]
txhd[15]
txhd[7]
pklen[7]
Reserved
hdlen[2]
prealen[6]
sync[30]
sync[22]
sync[14]
sync[6]
txhd[30]
txhd[22]
txhd[14]
txhd[6]
pklen[6]
Reserved
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
pwst[2]
papeakval
txdr[15]
txdr[7]
Reserved
trclk[1]
fd[7]
fo[7]
Reserved
Reserved
fc[15]
fc[7]
fhch[7]
pwst[1]
papeaken
txdr[14]
txdr[6]
Reserved
trclk[0]
fd[6]
fo[6]
Reserved
sbsel
fc[14]
fc[6]
fhch[6]
fhs[7]
Reserved
Reserved
fhs[6]
Reserved
Reserved
fifod[7]
fifod[6]
01
02
03
04
05
06
07
08
09
R
R
R
R
R/W
R/W
R/W
R/W
R/W
0A
0B
0C
0D
0E
0F
R/W
R/W
R/W
R/W
R/W
R/W
Device Version
Device Status
Interrupt Status 1
Interrupt Status 2
Interrupt Enable 1
Interrupt Enable 2
Operating & Function Control 1
Operating & Function Control 2
Crystal Oscillator Load
Capacitance
Microcontroller Output Clock
GPIO0 Configuration
GPIO1 Configuration
GPIO2 Configuration
I/O Port Configuration
ADC Configuration
10
11
12
13
14
15
16
17
18
19
1A
1B
1C-2F
30
31
32
33
34
36
37
38
39
3A
3B
3C
3D
3E
4F
60
62
6D
6E
6F
70
71
72
73
74
75
76
77
79
R/W
R
R/W
R/W
R/W
R/W
R/W
R
R
ADC Sensor Amplifier Offset
ADC Value
Temperature Sensor Control
Temperature Value Offset
Wake-Up Timer Period 1
Wake-Up Timer Period 2
Wake-Up Timer Period 3
Wake-Up Timer Value 1
Wake-Up Timer Value 2
7A
7C
7D
7E
7F
R/W
R/W
R/W
Crystal Oscillator/Control Test
TX Power
TX Data Rate 1
TX Data Rate 0
Modulation Mode Control 1
Modulation Mode Control 2
Frequency Deviation
Frequency Offset 1
Frequency Offset 2
Frequency Band Select
Nominal Carrier Frequency 1
Nominal Carrier Frequency 0
Frequency Hopping Channel
Select
Frequency Hopping Step Size
TX FIFO Control 1
TX FIFO Control 2
R/W
FIFO Access
Reserved
adc[6]
tsrange[0]
tvoffs[6]
Reserved
wtm[14]
wtm[6]
wtv[14]
wtv[6]
itxffaem
Reserved
entxffaem
Reserved
enwt
Reserved
xlc[5]
Data
D4
vc[4]
Reserved
Reserved
Reserved
Reserved
Reserved
x32ksel
Reserved
xlc[4]
D3
vc[3]
reserved
iext
iwut
enext
enwut
txon
autotx
xlc[3]
D2
vc[2]
reserved
ipksent
ilbd
enpksent
enlbd
Reserved
enldm
xlc[2]
D1
vc[1]
cps[1]
Reserved
ichiprdy
Reserved
enchiprdy
pllon
Reserved
xlc[1]
D0
vc[0]
cps[0]
Reserved
ipor
Reserved
enpor
xton
ffclrtx
xlc[0]
POR
Default
06h
—
—
—
00h
03h
01h
00h
7Fh
clkt[1]
pup0
pup1
pup2
extitst[1]
adcsel[1]
clkt[0]
gpio0[4]
gpio1[4]
gpio2[4]
extitst[0]
adcsel[0]
enlfc
gpio0[3]
gpio1[3]
gpio2[3]
itsdo
adcref[1]
mclk[2]
gpio0[2]
gpio1[2]
gpio2[2]
dio2
adcref[0]
mclk[1]
gpio0[1]
gpio1[1]
gpio2[1]
dio1
adcgain[1]
mclk[0]
gpio0[0]
gpio1[0]
gpio2[0]
dio0
adcgain[0]
06h
00h
00h
00h
00h
00h
adcoffs[3]
adc[3]
tstrim[3]
tvoffs[3]
wtr[3]
wtm[11]
wtm[3]
wtv[11]
wtv[3]
adcoffs[2]
adc[2]
tstrim[2]
tvoffs[2]
wtr[2]
wtm[10]
wtm[2]
wtv[10]
wtv[2]
adcoffs[1]
adc[1]
tstrim[1]
tvoffs[1]
wtr[1]
wtm[9]
wtm[1]
wtv[9]
wtv[1]
adcoffs[0]
adc[0]
tstrim[0]
tvoffs[0]
wtr[0]
wtm[8]
wtm[0]
wtv[8]
wtv[0]
00h
—
20h
00h
03h
00h
01h
—
—
lbdt[3]
vbat[3]
lbdt[2]
vbat[2]
lbdt[1]
vbat[1]
lbdt[0]
vbat[0]
14h
—
enpactx
Reserved
encrc
Reserved
crc[1]
pktx
crc[0]
pksent
8Dh
—
fixpklen
prealen[3]
sync[27]
sync[19]
sync[11]
sync[3]
txhd[27]
txhd[19]
txhd[11]
txhd[3]
pklen[3]
adc8[3]
synclen[1]
prealen[2]
sync[26]
sync[18]
sync[10]
sync[2]
txhd[26]
txhd[18]
txhd[10]
txhd[2]
pklen[2]
adc8[2]
synclen[0]
prealen[1]
sync[25]
sync[17]
sync[9]
sync[1]
txhd[25]
txhd[17]
txhd[9]
txhd[1]
pklen[1]
adc8[1]
prealen[8]
prealen[0]
sync[24]
sync[16]
sync[8]
sync[0]
txhd[24]
txhd[16]
txhd[8]
txhd[0]
pklen[0]
adc8[0]
22h
08h
2Dh
D4h
00h
00h
00h
00h
00h
00h
00h
10h
enbias2x
Ina_sw
txdr[11]
txdr[3]
manppol
eninv
fd[3]
fo[3]
Reserved
fb[3]
fc[11]
fc[3]
fhch[3]
enamp2x
txpow[2]
txdr[10]
txdr[2]
enmaninv
fd[8]
fd[2]
fo[2]
Reserved
fb[2]
fc[10]
fc[2]
fhch[2]
bufovr
txpow[1]
txdr[9]
txdr[1]
enmanch
modtyp[1]
fd[1]
fo[1]
fo[9]
fb[1]
fc[9]
fc[1]
fhch[1]
enbuf
txpow[0]
txdr[8]
txdr[0]
enwhite
modtyp[0]
fd[0]
fo[0]
fo[8]
fb[0]
fc[8]
fc[0]
fhch[0]
24h
18h
0Ah
3Dh
0Ch
00h
20h
00h
00h
75h
BBh
80h
00h
fhs[3]
txafthr[3]
txaethr[3]
fhs[2]
txafthr[2]
txaethr[2]
fhs[1]
txafthr[1]
txaethr[1]
fhs[0]
txafthr[0]
txaethr[0]
00h
37h
04h
fifod[3]
fifod[2]
fifod[1]
fifod[0]
—
D5
0
Reserved
Reserved
adc[5]
adc[4]
entsoffs
entstrim
tvoffs[5]
tvoffs[4]
Reserved
wtr[4]
wtm[13]
wtm[12]
wtm[5]
wtm[4]
wtv[13]
wtv[12]
wtv[5]
wtv[4]
Reserved
Reserved
lbdt[4]
0
vbat[4]
Reserved
crcdonly
Reserved
Reserved
Reserved
Reserved
hdlen[1]
hdlen[0]
prealen[5]
prealen[4]
sync[29]
sync[28]
sync[21]
sync[20]
sync[13]
sync[12]
sync[5]
sync[4]
txhd[29]
txhd[28]
txhd[21]
txhd[20]
txhd[13]
txhd[12]
txhd[5]
txhd[4]
pklen[5]
pklen[4]
adc8[5]
adc8[4]
Reserved
pwst[0]
clkhyst
papeaklvl[1] papeaklvl[0]
txdr[13]
txdr[12]
txdr[5]
txdr[4]
txdtrtscale
enphpwdn
dtmod[1]
dtmod[0]
fd[5]
fd[4]
fo[5]
fo[4]
Reserved
Reserved
hbsel
fb[4]
fc[13]
fc[12]
fc[5]
fc[4]
fhch[5]
fhch[4]
fhs[5]
fhs[4]
txafthr[5]
txafthr[4]
txaethr[5]
txaethr[4]
Reserved
fifod[5]
fifod[4]
Note: Detailed register descriptions are available in “RFM42B/43B Register Descriptions.”
45
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RFM42B/43B
10. Pin Descriptions: RFM42B/43B
RFM42B/43B-S1
RFM42B/43B-S2
RFM42B/43B-D
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46
RFM42B/43B
VCC
S
+1.8 to +3.6 V supply voltage. The recommended VCC supply voltage is +3.3 V.
GND
S
Ground reference.
GPIO_0
I/O
GPIO_1
I/O
GPIO_2
I/O
SDO
O
General Purpose Digital I/O that may be configured through the registers to perform various
functions including: Microcontroller Clock Output, FIFO status, POR, Wake-Up timer, Low
Battery Detect, TRSW, AntDiversity control, etc. See the SPI GPIO Configuration Registers,
Address 0Bh, 0Ch, and 0Dh for more information.
0–VCC V digital output that provides a serial readback function of the internal control
registers.
Serial Data input. 0–VCC V digital input. This pin provides the serial data stream for the 4-line
SDI
I
serial data bus.
Serial Clock input. 0–VDD V digital input. This pin provides the serial data clock function for
SCLK
I
the 4-line serial data bus. Data is clocked into the RFM42/43 on positive edge transitions.
Serial Interface Select input. 0– VCC V digital input. This pin provides the Select/Enable
nSEL
I
function for the 4-line serial data bus. The signal is also used to signify burst read/write mode.
General Microcontroller Interrupt Status output. When the RFM42/43 exhibits anyone of the
Interrupt Events the nIRQ pin will be set low=0. Please see the Control Logic registers
nIRQ
O
section for more information on the Interrupt Events. The Microcontroller can then determine
the state of the interrupt by reading a corresponding SPI Interrupt Status Registers, Address
03h and 04h.
I
SDN
Shutdown input pin. 0–VCC V digital input. SDN should be = 0 in all modes except Shutdown
mode. When SDN =1 the chip will be completely shutdown and the contents of the registers
will be lost.
ANT
NC
47
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I/O
RF signal output/input.(50 OHM output /input Impedance)
No Connection
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RFM42B/43B
12. Mechanical Dimension:RFM42B/43B
SMD PACKAGE(S1)
SMD PACKAGE(S2)
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48
RFM42B/43B
DIP PACKAGE(D)
49
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RFM42B/43B
13. Ordering Information
Part Number=module type—operation band—package type
RFM42B/43B—433—D
module type
operation band
Package
example:1,RFM43B module at 433MHz band, DIP : RFM43B-433-D。
2,RFM42B module at 868MHZ band, SMD, thickness at 4.9mm: RFM42B-868-S1。
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50
RFM42B/43B
This document may contain preliminary information and is subject to change by
Hope Microelectronics without notice. Hope Microelectronics assumes no
HOPE MICROELECTRONICS CO.,LTD
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Industrial
responsibility or liability for any use of the information contained herein. Nothing
Area,
in this document shall operate as an express or implied license or indemnity
Huaqiaocheng, Shenzhen, Guangdong, China
under the intellectual property rights of Hope Microelectronics or third parties.
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The products described in this document are not intended for use in
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implantation or other direct life support applications where malfunction may
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result in the direct physical harm or injury to persons. NO WARRANTIES OF
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