EUDYNA FMM5715X

FMM5715X
60GHz Power Amplifier
FEATURES
•High Output Power; P1dB = 16 dBm (Typ.) @ f = 60 GHz
•High Linear Gain: |S21| = 17 dB(Typ) @ f = 60 GHz
•Wide Frequency Band : 57 - 64 GHz
•Impedance Matched Zin/Zout = 50Ω
Device photo
DESCRIPTION
The FMM5715X is a power amplifier MMIC designed for applications
in the 57-64 GHz frequency range. This product is well suited for
wireless LAN and point-to-point radio.
Eudyna’s stringent Quality Assurance Program assures the highest
reliability and consistent performance.
o
ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 C)
Item
Symbol
Rating
Unit
DC Input Voltage
DC Input Voltage
Input Power
Storage Temperature
V
V
dBm
o
C
V DD
V GG
Pin
Tstg
+4
-3
3
-55 to +125
o
RECOMMENDED OPERATING CONDITION (Case Temperature Tc=25 C)
Item
Symbol
Condition
DC Input Voltage
Backside Temperature
V DD
TB
Unit
V
C
3
o
-45 to +85
o
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C)
Limit
Item
Symbol
Condition
Min. Typ. Max.
Output Power at 1dB G.C.P.
Unit
P1dB
V DD=3V
12
16
-
dBm
Linear Gain
|S21|
V GG=0V
14
18
-
dB
Total Drain Current
Input Return Loss
Output Return Loss
IDDt
|S11|
|S22|
f = 57~64 GHz
-
150
8
8
-
mA
dB
dB
These values are representative for CW on chip measurements that are made without bonding wires at the RF ports.
ESD
Class 0
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ)
Edition 2.1
Dec. 2005
1
~ 199V
FMM5715X
60GHz Power Amplifier MMIC
Output Power vs. Input Power
Bias Conditions: VDD = 3V, VGG = 0 V
18
Output Power vs. Frequency
Bias Conditions: VDD = 3V, VGG = 0 V
18
f=57GHz
14
16
Pin = 2 dBm
f=64GHz
f=60GHz
P1dB
14
Pout (dBm)
Output Power (dBm)
16
12
Pin = 0 dBm
12
Pin = -2 dBm
10
Pin = -4 dBm
8
8
Pin = -6 dBm
6
6
Pin = -8 dBm
4
-14
4
10
-12
-10
-8
-6
-4
-2
0
2
4
Pin= -10 dBm
54
Input Power (dBm)
56
58
60
62
64
66
Freq (GHz)
Typical on chip measurements
2
68
FMM5715X
60GHz Power Amplifier
Linear Gain vs. Frequency
Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
VGG = 0 V, IDD = 150 mA
20
18
16
|S 2 1 | (d B )
14
12
VGG = -0.1 V, IDD = 130 mA
10
8
VGG = -0.2 V, IDD = 100 mA
6
4
2
0
50
55
60
65
70
Frequency (GHz)
Input Return Loss vs. Frequency
Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
0
VGG = 0 V, IDD = 150 mA
VGG = -0.1 V, IDD = 130 mA
-5
-5
-10
-10
|S 2 2 | (d B )
|S 1 1 | (d B )
0
Output Return Loss vs. Frequency
Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V
-15
VGG = -0.2 V, IDD = 100 mA
-15
VGG = -0.1 V, IDD = 130 mA
-20
-20
VGG = -0.2 V, IDD = 100 mA
VGG = 0 V, IDD = 150 mA
-25
-25
50
55
60
65
50
70
55
60
Frequency (GHz)
Frequency (GHz)
Typical on chip measurements
3
65
70
FMM5715X
60GHz Power Amplifier MMIC
S-PARAMETERS
VDD = 3V, VGG = 0V, IDD = 150 mA
30
0
S11
20
-5
|S 1 1 |, |S 2 2 | (d B )
|S 2 1 | (d B )
10
0
-10
-20
S22
-10
-15
-20
-30
-25
-40
0
20
40
60
80
0
100
20
40
60
80
Frequency (GHz)
Frequency (GHz)
Typical on chip measurements
4
100
FMM5715X
60GHz Power Amplifier
S-PARAMETERS
VDD = 3V, VGG = 0V, IDD= 150 mA
Freq.
GHz
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
S11
MAG
0.621
0.594
0.557
0.523
0.496
0.472
0.451
0.436
0.425
0.419
0.416
0.415
0.416
0.420
0.426
0.431
0.439
0.449
0.457
0.465
0.477
0.488
0.501
0.513
0.525
0.541
0.551
0.565
0.578
0.599
0.615
0.636
0.655
0.671
0.693
0.708
0.723
0.733
0.752
0.764
0.775
0.782
0.788
0.787
0.785
0.776
0.759
0.730
0.680
0.620
ANG
-14.4
-27.8
-39.5
-49.5
-57.9
-65.8
-72.3
-77.8
-82.9
-87.5
-91.7
-95.6
-99.0
-102.4
-105.7
-108.9
-111.8
-115.0
-118.3
-120.9
-123.9
-126.5
-129.5
-132.1
-135.2
-137.9
-141.2
-144.1
-146.8
-150.1
-153.4
-157.1
-160.8
-165.2
-169.3
-173.5
-178.4
176.6
171.3
165.7
159.6
153.3
146.0
138.6
130.4
121.7
110.9
99.9
87.9
75.0
S21
MAG
0.017
0.031
0.075
0.170
0.290
0.237
0.153
0.110
0.086
0.071
0.056
0.056
0.074
0.063
0.048
0.030
0.026
0.044
0.135
0.254
0.424
0.668
0.995
1.341
1.607
1.713
1.633
1.530
1.431
1.355
1.284
1.241
1.223
1.221
1.249
1.277
1.349
1.432
1.544
1.702
1.878
2.114
2.388
2.779
3.178
3.717
4.379
5.101
5.891
6.554
ANG
-120.8
163.7
95.4
10.6
-71.5
-153.2
164.6
139.6
122.5
109.1
101.6
112.7
90.6
70.8
59.9
63.3
110.9
150.1
142.7
122.9
99.8
73.6
42.7
8.8
-27.4
-62.7
-93.4
-118.8
-141.8
-161.5
-179.5
164.4
148.5
133.4
118.5
105.4
91.1
77.2
63.4
49.2
34.0
19.3
3.2
-14.0
-32.0
-50.8
-71.9
-93.8
-118.2
-143.2
S12
MAG
0.00014
0.00010
0.00029
0.00060
0.00072
0.00037
0.00018
0.00012
0.00007
0.00017
0.00015
0.00035
0.00032
0.00026
0.00017
0.00059
0.00032
0.00101
0.00121
0.00060
0.00019
0.00028
0.00055
0.00103
0.00193
0.00154
0.00174
0.00157
0.00233
0.00132
0.00094
0.00089
0.00098
0.00110
0.00084
0.00137
0.00151
0.00222
0.00159
0.00181
0.00218
0.00182
0.00176
0.00248
0.00156
0.00149
0.00133
0.00158
0.00239
0.00188
ANG
-72.6
99.9
65.9
-7.4
-95.9
-155.0
155.9
118.3
-41.9
-169.4
-161.2
177.6
36.7
8.6
-4.8
-101.0
-106.7
-142.6
147.0
93.4
167.5
-175.4
-99.4
-157.2
168.1
159.5
149.5
115.7
105.5
94.0
64.0
83.0
118.6
117.8
100.7
97.6
101.2
84.0
75.6
85.4
51.3
70.5
47.2
60.8
37.4
38.9
123.7
65.1
89.0
97.9
S22
MAG
0.997
0.994
0.952
0.851
0.867
0.884
0.913
0.930
0.939
0.944
0.938
0.904
0.916
0.938
0.945
0.943
0.934
0.913
0.909
0.881
0.834
0.765
0.664
0.540
0.424
0.355
0.340
0.321
0.304
0.291
0.279
0.268
0.264
0.266
0.269
0.274
0.282
0.294
0.301
0.313
0.321
0.327
0.331
0.337
0.341
0.340
0.333
0.321
0.299
0.275
Freq.
ANG
GHz
-11.7
51
-23.8
52
-37.4
53
-43.9
54
-50.7
55
-57.2
56
-65.9
57
-74.8
58
-83.6
59
-92.3
60
-101.0
61
-108.5
62
-113.1
63
-120.7
64
-128.4
65
-136.1
66
-144.1
67
-151.4
68
-159.4
69
-168.6
70
-178.2
71
171.7
72
162.6
73
155.6
74
154.7
75
160.3
76
165.3
77
166.5
78
168.0
79
170.1
80
172.7
81
174.8
82
177.4
83
-179.6
84
-178.2
85
-177.0
86
-176.1
87
-176.7
88
-177.0
89
-178.1
90
179.6
91
177.2
92
174.1
93
170.8
94
166.8
95
162.1
96
155.8
97
148.7
98
142.1
99
134.2 100
S11
MAG
0.539
0.474
0.406
0.360
0.327
0.306
0.280
0.272
0.260
0.250
0.238
0.258
0.319
0.417
0.529
0.608
0.662
0.678
0.685
0.672
0.652
0.644
0.628
0.619
0.609
0.605
0.611
0.608
0.600
0.602
0.599
0.594
0.592
0.591
0.596
0.592
0.594
0.588
0.591
0.584
0.593
0.584
0.586
0.583
0.582
0.584
0.582
0.589
0.587
0.595
ANG
63.0
51.1
40.2
29.1
17.3
3.3
-11.1
-26.2
-41.3
-52.8
-58.3
-59.3
-62.2
-70.1
-82.9
-99.0
-114.1
-127.9
-139.7
-149.3
-158.2
-165.6
-171.6
-177.6
177.7
172.2
167.2
161.8
156.2
150.6
145.5
139.6
134.8
129.0
122.6
116.9
110.4
103.9
97.1
90.6
82.6
75.9
68.4
59.6
53.5
45.5
37.5
30.9
23.4
15.9
S21
MAG
7.091
7.366
7.559
7.621
7.686
7.781
7.841
7.938
8.046
8.118
8.218
8.207
8.059
7.527
6.591
5.437
4.272
3.252
2.512
1.962
1.543
1.209
1.007
0.827
0.675
0.562
0.497
0.420
0.367
0.328
0.288
0.262
0.233
0.214
0.179
0.180
0.174
0.157
0.149
0.139
0.133
0.123
0.125
0.113
0.115
0.104
0.091
0.078
0.082
0.057
ANG
-170.0
164.1
138.8
113.2
89.6
64.9
41.7
17.2
-7.1
-32.4
-59.3
-86.5
-117.0
-148.2
-179.3
150.7
122.6
98.8
77.2
58.0
39.8
23.7
7.4
-8.1
-21.7
-34.4
-47.0
-60.0
-72.4
-84.8
-96.8
-112.8
-123.3
-136.8
-147.9
-162.7
-175.5
168.8
154.2
137.5
123.7
108.4
91.0
72.3
52.9
27.2
13.9
-13.9
-34.7
-63.6
S12
MAG
0.00306
0.00443
0.00442
0.00520
0.00858
0.00716
0.00672
0.00558
0.00725
0.00711
0.00784
0.00681
0.00671
0.00818
0.00671
0.00734
0.00429
0.00629
0.00633
0.00578
0.00716
0.00683
0.00710
0.00660
0.00819
0.00823
0.00701
0.01034
0.00994
0.00836
0.00812
0.00798
0.00873
0.01010
0.00993
0.00722
0.00510
0.00493
0.00488
0.00399
0.00317
0.00200
0.00256
0.00254
0.00210
0.00369
0.00491
0.00359
0.00488
0.00667
ANG
86.8
77.6
66.8
48.4
35.4
3.4
-5.2
-17.1
-22.4
-57.6
-84.1
-108.3
-137.5
-168.1
149.7
112.2
98.2
70.4
70.3
61.1
52.8
33.0
25.4
20.9
19.7
14.0
-4.7
-3.8
-20.5
-20.5
-35.3
-44.6
-59.2
-62.9
-79.3
-97.1
-117.5
-104.3
-92.7
-97.3
-136.6
-111.8
-104.6
14.5
-8.0
-8.0
-9.6
-27.7
-22.7
-38.3
S22
MAG
0.239
0.203
0.170
0.140
0.114
0.092
0.076
0.087
0.114
0.156
0.214
0.282
0.377
0.475
0.562
0.608
0.643
0.651
0.647
0.652
0.652
0.656
0.659
0.663
0.658
0.665
0.667
0.663
0.673
0.674
0.675
0.676
0.680
0.683
0.679
0.683
0.688
0.697
0.699
0.703
0.714
0.712
0.721
0.735
0.737
0.743
0.739
0.731
0.715
0.717
ANG
126.3
119.0
112.6
104.9
94.2
73.9
47.1
14.3
-12.7
-29.2
-39.9
-49.9
-60.3
-73.7
-87.0
-100.5
-111.5
-120.4
-127.7
-133.5
-138.5
-143.0
-147.5
-151.0
-154.5
-158.0
-160.9
-163.9
-166.8
-169.3
-172.2
-174.6
-177.4
-179.3
178.1
176.0
174.2
172.0
169.4
167.0
164.4
162.3
159.8
157.6
154.5
151.1
147.0
144.9
142.2
141.6
Typical on chip measurements
5
FMM5715X
60GHz Power Amplifier MMIC
CHIP OUTLINE
VDD1
VDD2
VDD3
RFin
RFout
VGG1
VGG3
VGG2
Bonding Pad Locations (Dimension in Micron Meters)
490
1105
1860
800
460
120
0
0
80
540
1010
1305
Pad Dimensions
DC Pads; 80 x 80 µm
RF Pads; 80 x 60 µm
6
2110
Unit; µm
Chip size; 2190 x 920 µm
Chip Thickness; 70 µm
FMM5715X
60GHz Power Amplifier MMIC
Assembly Diagrams
To DC Power Supply (VDD)
Recommendation assembly
Single Layer Capacitor ≥100 pF
RF In
*1
*1
RF Out
Z0 = 50Ω
Z0 = 50Ω
*2
*1; RF Wire Length = 150 µm
*2; DC Wire Length ≤ 1000 µm
DC Power Supply for a Custom Application
To DC Power Supply (VDD)
Single Layer Capacitor ≥100 pF
*2
RF In
RF Out
*1
*1
Z0 = 50Ω
Z0 = 50Ω
*2
Single Layer Capacitors ≥100 pF
VGG1 (AMP)
VGG2(AMP)
7
VGG3(AMP)
FMM5715X
60GHz Power Amplifier MMIC
MTTF vs. Backside Temperature
1.E+12
1.E+11
Ea=1.02eV
MTTF (hrs)
1.E+10
1.E+09
1.E+08
1.E+07
1.E+06
1.E+05
20
40
60
80
100
120
140
BacksideTemperature (degC)
8
160
180
FMM5715X
60GHz Power Amplifier MMIC
DIE ATTACH
1) The die-attach station must have accurate temperature control, and an inert forming gas should
be used.
2)Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Perform Volume : per next Figure
Volume of Au-Sn Perform (10 -3/mm 3)
500
400
300
FMM5715X
200
100
0
0
1
2
3
4
5
Area of Chip Back Surface (mm^2)
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N +/- 0.0196 N
Stage Temperature : 215 deg.C +/- 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
9
FMM5715X
60GHz Power Amplifier MMIC
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
CAUTION
Eudyna Devices Inc. products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
•Do not put these products into the mouth.
•Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or
swallowed.
•Observe government laws and company regulations when
discarding this product. This product must be discarded in
accordance with methods specified by applicable hazardous waste
procedures.
Eudyna Devices Inc. reserves the right to change products and
specifications without notice.The information does not convey any
license under rights of Eudyna Devices Inc. or others.
Eudyna Devices Asia Pte. Ltd.
Hong Kong Branch
Suite 1906B, Tower 6, China Hong Kong City
33 Canton Road, Tsimshatsui, Kowloon
Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
© 2005 Eudyna Devices USA Inc.
Printed in U.S.A.
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL +81-45-853-8156
FAX +81-45-853-8170
8