FMM5715X 60GHz Power Amplifier FEATURES •High Output Power; P1dB = 16 dBm (Typ.) @ f = 60 GHz •High Linear Gain: |S21| = 17 dB(Typ) @ f = 60 GHz •Wide Frequency Band : 57 - 64 GHz •Impedance Matched Zin/Zout = 50Ω Device photo DESCRIPTION The FMM5715X is a power amplifier MMIC designed for applications in the 57-64 GHz frequency range. This product is well suited for wireless LAN and point-to-point radio. Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance. o ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 C) Item Symbol Rating Unit DC Input Voltage DC Input Voltage Input Power Storage Temperature V V dBm o C V DD V GG Pin Tstg +4 -3 3 -55 to +125 o RECOMMENDED OPERATING CONDITION (Case Temperature Tc=25 C) Item Symbol Condition DC Input Voltage Backside Temperature V DD TB Unit V C 3 o -45 to +85 o ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C) Limit Item Symbol Condition Min. Typ. Max. Output Power at 1dB G.C.P. Unit P1dB V DD=3V 12 16 - dBm Linear Gain |S21| V GG=0V 14 18 - dB Total Drain Current Input Return Loss Output Return Loss IDDt |S11| |S22| f = 57~64 GHz - 150 8 8 - mA dB dB These values are representative for CW on chip measurements that are made without bonding wires at the RF ports. ESD Class 0 Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ) Edition 2.1 Dec. 2005 1 ~ 199V FMM5715X 60GHz Power Amplifier MMIC Output Power vs. Input Power Bias Conditions: VDD = 3V, VGG = 0 V 18 Output Power vs. Frequency Bias Conditions: VDD = 3V, VGG = 0 V 18 f=57GHz 14 16 Pin = 2 dBm f=64GHz f=60GHz P1dB 14 Pout (dBm) Output Power (dBm) 16 12 Pin = 0 dBm 12 Pin = -2 dBm 10 Pin = -4 dBm 8 8 Pin = -6 dBm 6 6 Pin = -8 dBm 4 -14 4 10 -12 -10 -8 -6 -4 -2 0 2 4 Pin= -10 dBm 54 Input Power (dBm) 56 58 60 62 64 66 Freq (GHz) Typical on chip measurements 2 68 FMM5715X 60GHz Power Amplifier Linear Gain vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V VGG = 0 V, IDD = 150 mA 20 18 16 |S 2 1 | (d B ) 14 12 VGG = -0.1 V, IDD = 130 mA 10 8 VGG = -0.2 V, IDD = 100 mA 6 4 2 0 50 55 60 65 70 Frequency (GHz) Input Return Loss vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V 0 VGG = 0 V, IDD = 150 mA VGG = -0.1 V, IDD = 130 mA -5 -5 -10 -10 |S 2 2 | (d B ) |S 1 1 | (d B ) 0 Output Return Loss vs. Frequency Bias Conditions: VDD = 3V, VGG = 0, -0.1, -0.2 V -15 VGG = -0.2 V, IDD = 100 mA -15 VGG = -0.1 V, IDD = 130 mA -20 -20 VGG = -0.2 V, IDD = 100 mA VGG = 0 V, IDD = 150 mA -25 -25 50 55 60 65 50 70 55 60 Frequency (GHz) Frequency (GHz) Typical on chip measurements 3 65 70 FMM5715X 60GHz Power Amplifier MMIC S-PARAMETERS VDD = 3V, VGG = 0V, IDD = 150 mA 30 0 S11 20 -5 |S 1 1 |, |S 2 2 | (d B ) |S 2 1 | (d B ) 10 0 -10 -20 S22 -10 -15 -20 -30 -25 -40 0 20 40 60 80 0 100 20 40 60 80 Frequency (GHz) Frequency (GHz) Typical on chip measurements 4 100 FMM5715X 60GHz Power Amplifier S-PARAMETERS VDD = 3V, VGG = 0V, IDD= 150 mA Freq. GHz 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 S11 MAG 0.621 0.594 0.557 0.523 0.496 0.472 0.451 0.436 0.425 0.419 0.416 0.415 0.416 0.420 0.426 0.431 0.439 0.449 0.457 0.465 0.477 0.488 0.501 0.513 0.525 0.541 0.551 0.565 0.578 0.599 0.615 0.636 0.655 0.671 0.693 0.708 0.723 0.733 0.752 0.764 0.775 0.782 0.788 0.787 0.785 0.776 0.759 0.730 0.680 0.620 ANG -14.4 -27.8 -39.5 -49.5 -57.9 -65.8 -72.3 -77.8 -82.9 -87.5 -91.7 -95.6 -99.0 -102.4 -105.7 -108.9 -111.8 -115.0 -118.3 -120.9 -123.9 -126.5 -129.5 -132.1 -135.2 -137.9 -141.2 -144.1 -146.8 -150.1 -153.4 -157.1 -160.8 -165.2 -169.3 -173.5 -178.4 176.6 171.3 165.7 159.6 153.3 146.0 138.6 130.4 121.7 110.9 99.9 87.9 75.0 S21 MAG 0.017 0.031 0.075 0.170 0.290 0.237 0.153 0.110 0.086 0.071 0.056 0.056 0.074 0.063 0.048 0.030 0.026 0.044 0.135 0.254 0.424 0.668 0.995 1.341 1.607 1.713 1.633 1.530 1.431 1.355 1.284 1.241 1.223 1.221 1.249 1.277 1.349 1.432 1.544 1.702 1.878 2.114 2.388 2.779 3.178 3.717 4.379 5.101 5.891 6.554 ANG -120.8 163.7 95.4 10.6 -71.5 -153.2 164.6 139.6 122.5 109.1 101.6 112.7 90.6 70.8 59.9 63.3 110.9 150.1 142.7 122.9 99.8 73.6 42.7 8.8 -27.4 -62.7 -93.4 -118.8 -141.8 -161.5 -179.5 164.4 148.5 133.4 118.5 105.4 91.1 77.2 63.4 49.2 34.0 19.3 3.2 -14.0 -32.0 -50.8 -71.9 -93.8 -118.2 -143.2 S12 MAG 0.00014 0.00010 0.00029 0.00060 0.00072 0.00037 0.00018 0.00012 0.00007 0.00017 0.00015 0.00035 0.00032 0.00026 0.00017 0.00059 0.00032 0.00101 0.00121 0.00060 0.00019 0.00028 0.00055 0.00103 0.00193 0.00154 0.00174 0.00157 0.00233 0.00132 0.00094 0.00089 0.00098 0.00110 0.00084 0.00137 0.00151 0.00222 0.00159 0.00181 0.00218 0.00182 0.00176 0.00248 0.00156 0.00149 0.00133 0.00158 0.00239 0.00188 ANG -72.6 99.9 65.9 -7.4 -95.9 -155.0 155.9 118.3 -41.9 -169.4 -161.2 177.6 36.7 8.6 -4.8 -101.0 -106.7 -142.6 147.0 93.4 167.5 -175.4 -99.4 -157.2 168.1 159.5 149.5 115.7 105.5 94.0 64.0 83.0 118.6 117.8 100.7 97.6 101.2 84.0 75.6 85.4 51.3 70.5 47.2 60.8 37.4 38.9 123.7 65.1 89.0 97.9 S22 MAG 0.997 0.994 0.952 0.851 0.867 0.884 0.913 0.930 0.939 0.944 0.938 0.904 0.916 0.938 0.945 0.943 0.934 0.913 0.909 0.881 0.834 0.765 0.664 0.540 0.424 0.355 0.340 0.321 0.304 0.291 0.279 0.268 0.264 0.266 0.269 0.274 0.282 0.294 0.301 0.313 0.321 0.327 0.331 0.337 0.341 0.340 0.333 0.321 0.299 0.275 Freq. ANG GHz -11.7 51 -23.8 52 -37.4 53 -43.9 54 -50.7 55 -57.2 56 -65.9 57 -74.8 58 -83.6 59 -92.3 60 -101.0 61 -108.5 62 -113.1 63 -120.7 64 -128.4 65 -136.1 66 -144.1 67 -151.4 68 -159.4 69 -168.6 70 -178.2 71 171.7 72 162.6 73 155.6 74 154.7 75 160.3 76 165.3 77 166.5 78 168.0 79 170.1 80 172.7 81 174.8 82 177.4 83 -179.6 84 -178.2 85 -177.0 86 -176.1 87 -176.7 88 -177.0 89 -178.1 90 179.6 91 177.2 92 174.1 93 170.8 94 166.8 95 162.1 96 155.8 97 148.7 98 142.1 99 134.2 100 S11 MAG 0.539 0.474 0.406 0.360 0.327 0.306 0.280 0.272 0.260 0.250 0.238 0.258 0.319 0.417 0.529 0.608 0.662 0.678 0.685 0.672 0.652 0.644 0.628 0.619 0.609 0.605 0.611 0.608 0.600 0.602 0.599 0.594 0.592 0.591 0.596 0.592 0.594 0.588 0.591 0.584 0.593 0.584 0.586 0.583 0.582 0.584 0.582 0.589 0.587 0.595 ANG 63.0 51.1 40.2 29.1 17.3 3.3 -11.1 -26.2 -41.3 -52.8 -58.3 -59.3 -62.2 -70.1 -82.9 -99.0 -114.1 -127.9 -139.7 -149.3 -158.2 -165.6 -171.6 -177.6 177.7 172.2 167.2 161.8 156.2 150.6 145.5 139.6 134.8 129.0 122.6 116.9 110.4 103.9 97.1 90.6 82.6 75.9 68.4 59.6 53.5 45.5 37.5 30.9 23.4 15.9 S21 MAG 7.091 7.366 7.559 7.621 7.686 7.781 7.841 7.938 8.046 8.118 8.218 8.207 8.059 7.527 6.591 5.437 4.272 3.252 2.512 1.962 1.543 1.209 1.007 0.827 0.675 0.562 0.497 0.420 0.367 0.328 0.288 0.262 0.233 0.214 0.179 0.180 0.174 0.157 0.149 0.139 0.133 0.123 0.125 0.113 0.115 0.104 0.091 0.078 0.082 0.057 ANG -170.0 164.1 138.8 113.2 89.6 64.9 41.7 17.2 -7.1 -32.4 -59.3 -86.5 -117.0 -148.2 -179.3 150.7 122.6 98.8 77.2 58.0 39.8 23.7 7.4 -8.1 -21.7 -34.4 -47.0 -60.0 -72.4 -84.8 -96.8 -112.8 -123.3 -136.8 -147.9 -162.7 -175.5 168.8 154.2 137.5 123.7 108.4 91.0 72.3 52.9 27.2 13.9 -13.9 -34.7 -63.6 S12 MAG 0.00306 0.00443 0.00442 0.00520 0.00858 0.00716 0.00672 0.00558 0.00725 0.00711 0.00784 0.00681 0.00671 0.00818 0.00671 0.00734 0.00429 0.00629 0.00633 0.00578 0.00716 0.00683 0.00710 0.00660 0.00819 0.00823 0.00701 0.01034 0.00994 0.00836 0.00812 0.00798 0.00873 0.01010 0.00993 0.00722 0.00510 0.00493 0.00488 0.00399 0.00317 0.00200 0.00256 0.00254 0.00210 0.00369 0.00491 0.00359 0.00488 0.00667 ANG 86.8 77.6 66.8 48.4 35.4 3.4 -5.2 -17.1 -22.4 -57.6 -84.1 -108.3 -137.5 -168.1 149.7 112.2 98.2 70.4 70.3 61.1 52.8 33.0 25.4 20.9 19.7 14.0 -4.7 -3.8 -20.5 -20.5 -35.3 -44.6 -59.2 -62.9 -79.3 -97.1 -117.5 -104.3 -92.7 -97.3 -136.6 -111.8 -104.6 14.5 -8.0 -8.0 -9.6 -27.7 -22.7 -38.3 S22 MAG 0.239 0.203 0.170 0.140 0.114 0.092 0.076 0.087 0.114 0.156 0.214 0.282 0.377 0.475 0.562 0.608 0.643 0.651 0.647 0.652 0.652 0.656 0.659 0.663 0.658 0.665 0.667 0.663 0.673 0.674 0.675 0.676 0.680 0.683 0.679 0.683 0.688 0.697 0.699 0.703 0.714 0.712 0.721 0.735 0.737 0.743 0.739 0.731 0.715 0.717 ANG 126.3 119.0 112.6 104.9 94.2 73.9 47.1 14.3 -12.7 -29.2 -39.9 -49.9 -60.3 -73.7 -87.0 -100.5 -111.5 -120.4 -127.7 -133.5 -138.5 -143.0 -147.5 -151.0 -154.5 -158.0 -160.9 -163.9 -166.8 -169.3 -172.2 -174.6 -177.4 -179.3 178.1 176.0 174.2 172.0 169.4 167.0 164.4 162.3 159.8 157.6 154.5 151.1 147.0 144.9 142.2 141.6 Typical on chip measurements 5 FMM5715X 60GHz Power Amplifier MMIC CHIP OUTLINE VDD1 VDD2 VDD3 RFin RFout VGG1 VGG3 VGG2 Bonding Pad Locations (Dimension in Micron Meters) 490 1105 1860 800 460 120 0 0 80 540 1010 1305 Pad Dimensions DC Pads; 80 x 80 µm RF Pads; 80 x 60 µm 6 2110 Unit; µm Chip size; 2190 x 920 µm Chip Thickness; 70 µm FMM5715X 60GHz Power Amplifier MMIC Assembly Diagrams To DC Power Supply (VDD) Recommendation assembly Single Layer Capacitor ≥100 pF RF In *1 *1 RF Out Z0 = 50Ω Z0 = 50Ω *2 *1; RF Wire Length = 150 µm *2; DC Wire Length ≤ 1000 µm DC Power Supply for a Custom Application To DC Power Supply (VDD) Single Layer Capacitor ≥100 pF *2 RF In RF Out *1 *1 Z0 = 50Ω Z0 = 50Ω *2 Single Layer Capacitors ≥100 pF VGG1 (AMP) VGG2(AMP) 7 VGG3(AMP) FMM5715X 60GHz Power Amplifier MMIC MTTF vs. Backside Temperature 1.E+12 1.E+11 Ea=1.02eV MTTF (hrs) 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 20 40 60 80 100 120 140 BacksideTemperature (degC) 8 160 180 FMM5715X 60GHz Power Amplifier MMIC DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2)Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Perform Volume : per next Figure Volume of Au-Sn Perform (10 -3/mm 3) 500 400 300 FMM5715X 200 100 0 0 1 2 3 4 5 Area of Chip Back Surface (mm^2) WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N +/- 0.0196 N Stage Temperature : 215 deg.C +/- 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond 9 FMM5715X 60GHz Power Amplifier MMIC Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: •Do not put these products into the mouth. •Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. •Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 © 2005 Eudyna Devices USA Inc. Printed in U.S.A. Eudyna Devices Inc. Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170 8