TI PCA9515B

PCA9515B
www.ti.com
SCPS232 – MARCH 2012
DUAL BIDIRECTIONAL I2C BUS AND SMBus REPEATER
Check for Samples: PCA9515B
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
Two-Channel Bidirectional Buffers
I2C Bus and SMBus Compatible
Active-High Repeater-Enable Input
Open-Drain I2C I/O
5.5-V Tolerant I2C I/O and Enable Input Support
Mixed-Mode Signal Operation
Lockup-Free Operation
Accommodates Standard Mode, Fast Mode I2C
Devices, and Multiple Masters
Supports Arbitration and Clock Stretching
Across Repeater
Powered-Off High-Impedance I2C Pins
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class I
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DGK PACKAGE
(TOP VIEW)
NC
1
8
VCC
SCL0
SDA0
2
3
7
6
SCL1
SDA1
GND
4
5
EN
NC – No internal connection
DESCRIPTION
The PCA9515B is a BiCMOS integrated circuit intended for I2C bus and SMBus systems applications. The
device contains two identical bidirectional open-drain buffer circuits that enables I2C and similar bus systems to
be extended without degrading system performance. The dual bidirectional I2C buffer is operational at 2.3-V to
3.6-V VCC.
The PCA9515B buffers both the serial data (SDA) and serial clock (SCL) signals on the I2C bus, while retaining
all the operating modes and features of the I2C system. This feature allows two buses, of 400-pF bus
capacitance, to be connected in an I2C application.
The I2C bus capacitance limit of 400 pF restricts the number of interfaced devices and bus length. Using the
PCA9515B, a system designer can isolate two halves of a bus, thus accommodating more I2C devices or longer
trace lengths.
The PCA9515B has an active-high enable (EN) input with an internal pull-up. This allows users to select when
the repeater is active and isolate malfunctioning slaves on power-up reset. States should never be changed
during an I2C operation. Disabling during a bus operation will hang the bus and enabling part way through a bus
cycle may confuse the I2C parts being enabled. The EN input should only change state when the global bus and
the repeater port are in an idle state to prevent system failures.
The PCA9515B can also be used to operate two buses, one at 5-V interface levels and the other at 3.3-V
interface levels. The buses may also function at 400-kHz or 100-kHz operating frequency. If the two buses are
operating at different frequencies, the 100-kHz bus must be isolated if the operation of the 400-kHz bus is
required. If the master is running at 400-kHz, the maximum system operating frequency may be less than
400 kHz due to the delays added by the repeater.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
PCA9515B
SCPS232 – MARCH 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
(2)
(3)
MSOP – DGK
(2)
Reel of 2500
ORDERABLE PART NUMBER
PCA9515BDGKR
TOP-SIDE MARKING (3)
7SA
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DGK: The actual top-side marking has one additional character that designates the assembly/test site.
The low level outputs for each internal buffer are approximately 0.5 V; however, the input voltage of each internal
buffer must be 70 mV or more below the low level output when the output is driven low internally. This prevents a
lockup condition from occurring when the input low condition is released.
Two or more PCA9515B devices cannot be used in series. Since there is no direction pin, different valid lowvoltage levels are used to avoid lockup conditions between the input and the output of each repeater. A valid low,
applied at the input of a PCA9515B, is propagated as a buffered low with a higher value on the enabled outputs.
When this buffered low is applied to another PCA9515B-type device in series, the second device does not
recognize it as a valid low and does not propagate it as a buffered low.
The device contains a power-up control circuit that sets an internal latch to prevent the output circuits from
becoming active until VCC is at a valid level (VCC = 2.3 V).
As with the standard I2C system, pullup resistors are required to provide the logic high levels on the buffered bus.
The PCA9515B has standard open-collector configuration of the I2C bus. The size of the pullup resistors depend
on the system; however, each side of the repeater must have a pullup resistor. The device is designed to work
with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only
specify a 3 mA termination current in a generic I2C system where Standard Mode devices and multiple masters
are possible. Under certain conditions, high termination currents can be used.
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
PCA9515B
www.ti.com
SCPS232 – MARCH 2012
TERMINAL FUNCTIONS
NO.
NAME
DESCRIPTION
1
NC
2
SCL0
No internal connection
Serial clock bus 0
3
SDA0
Serial data bus 0
4
GND
Supply ground
5
EN
6
SDA1
Serial data bus 1
7
SCL1
Serial clock bus 1
8
VCC
Active-high repeater enable input
Supply power
Table 1. FUNCTION TABLE
INPUT
EN
FUNCTION
L
Outputs disabled
H
SDA0 = SDA1,
SCL0 = SCL1
LOGIC DIAGRAM (POSITIVE LOGIC)
VCC
8
PCA9515B
SDA0
SCL0
3
6
2
7
SDA1
SCL1
Pullup
Resistor
EN
5
4
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
3
PCA9515B
SCPS232 – MARCH 2012
www.ti.com
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
7
V
VI
Enable input voltage range (2)
–0.5
7
V
VI/O
I2C bus voltage range (2)
–0.5
7
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
172
°C/W
150
°C
Continuous current through VCC or GND
θJA
Package thermal impedance
Tstg
Storage temperature range
(1)
(3)
DGK package
–65
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
(2)
(3)
Recommended Operating Conditions
VCC
Supply voltage
VIH
High-level input voltage
VIL
VILc
(1)
(1)
3.6
0.7 × VCC
5.5
2
5.5
SDA and SCL inputs
–0.5
0.3 × VCC
EN input
–0.5
0.8
–0.5
0.4
EN input
SDA and SCL low-level input voltage contention
Low-level output current
TA
Operating free-air temperature
4
MAX
2.3
SDA and SCL inputs
Low-level input voltage
IOL
(1)
MIN
VCC = 2.3 V
6
VCC = 3 V
6
–40
85
UNIT
V
V
V
V
mA
°C
VIL specification is for the EN input and the first low level seen by the SDAx and SCLx lines. VILc is for the second and subsequent low
levels seen by the SDAx and SCLx lines. VILc must be at least 70 mV below VOL.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
PCA9515B
www.ti.com
SCPS232 – MARCH 2012
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
Input diode clamp voltage
II = –18 mA
2.3 V to 3.6 V
2.3 V to 3.6 V
2.3 V to 3.6 V
VOL
Low-level output voltage
SDAx,
IOL = 20 μA or 6 mA
SCLx
VOL – VILc
Low-level input voltage below
low-level output voltage
SDAx,
II = 10 μA
SCLx
ICC
Quiescent supply current
II
–1.2
V
0.6
V
70
mV
0.5
0.5
3
3.6 V
0.5
3
Both channels low,
SDA0 = SCL0 = GND and
SDA1 = SCL1 = open; or
SDA0 = SCL0 = open and
SDA1 = SCL1 = GND
2.7 V
1
4
3.6 V
1
4
In contention,
SDAx = SCLx = GND
2.7 V
1
4
3.6 V
1
mA
4
±1
3
2.3 V to 3.6 V
–10
Leakage current
SDAx, VI = 3.6 V
SCLx VI = GND
EN = L or H
0V
II(ramp)
Leakage current during
power up
SDAx,
VI = 3.6 V
SCLx
EN = L or H
0 V to 2.3 V
Cin
Input capacitance
μA
±1
VI = 0.2 V
Ioff
(1)
UNIT
2.7 V
VI = VCC
EN
0.4
MAX
Both channels high,
SDAx = SCLx = VCC
SDAx, VI = 3.6 V
SCLx VI = 0.2 V
Input current
MIN TYP (1)
VCC
–20
0.5
μA
0.5
μA
1
EN
3.3 V
7
9
SDAx, VI = 3 V or GND
EN = H
SCLx
3.3 V
7
9
pF
All typical values are at nominal supply voltage (VCC = 2.5 V or 3.3 V) and TA = 25°C.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
MIN
VCC = 3.3 V
± 0.3 V
MAX
MIN
UNIT
MAX
tsu
Setup time, EN↑ before Start condition
100
100
ns
th
Hold time, EN↓ after Stop condition
130
100
ns
Switching Characteristics
over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted)
PARAMETER
tPZL
tPLZ
ttHL
ttLH
(1)
(2)
Propagation delay time (2)
VCC = 2.5 V ± 0.2 V
VCC = 3.3 V ± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
SDA0, SCL0 or
SDA1, SCL1
SDA1, SCL1 or
SDA0, SCL0
80%
20%
57
58
20%
80%
148
147
Output transition time (2)
(SDAx, SCLx)
TYP (1)
MAX
MIN
45
82
130
33
113
190
MIN
TYP (1)
MAX
45
68
120
33
102
180
UNIT
ns
ns
All typical values are at nominal supply voltage (VCC = 2.5 V or 3.3 V) and TA = 25°C.
Different load resistance and capacitance alter the RC time constant, thereby changing the propagation delay and transition times.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
5
PCA9515B
SCPS232 – MARCH 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VIN
VCC
VOUT
PULSE
GENERATOR
RL = 1.35 kΩ
S1
DUT
GND
CL = 50 pF
(see Note B)
RT
(see Note A)
TEST
S1
tPLZ/tPZL
VCC
TEST CIRCUIT FOR OPEN-DRAIN OUTPUT
Input
VCC
1.5 V
1.5 V
0V
tPZL
Output
tPLZ
80%
1.5 V
1.5 V
20%
20%
80%
ttHL
VCC
VOL
ttLH
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
A.
RT termination resistance should be equal to ZOUT of pulse generators.
B.
CL includes probe and jig capacitance.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
slew rate ≥ 1 V/ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
tPLH and tPHL are the same as tpd.
F.
tPLZ and tPHZ are the same as tdis.
G.
tPZL and tPZH are the same as ten.
Figure 1. Test Circuit and Voltage Waveforms
6
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
PCA9515B
www.ti.com
SCPS232 – MARCH 2012
APPLICATION INFORMATION
A typical application is shown in Figure 2. In this example, the system master is running on a 3.3-V bus, while the
slave is connected to a 5-V bus. Both buses run at 100 kHz, unless the slave bus is isolated. If the slave bus is
isolated, the master bus can run at 400 kHz. Master devices can be placed on either bus.
3.3 V
5V
SDA
SDA0
SDA1
SDA
SCL
SCL0
SCL1
SCL
PCA9515B
I2C BUS MASTER
400 kHz
I2C BUS SLAVE
100 kHz
EN
BUS 0
BUS 1
Figure 2. Typical Application
The PCA9515B is 5.5-V tolerant, so it does not require any additional circuitry to translate between the different
bus voltages.
When one side of the PCA9515B is pulled low by a device on the I2C bus, a CMOS hysteresis-type input detects
the falling edge and causes an internal driver on the other side to turn on, thus causing the other side also to go
low. The side driven low by the PCA9515B has a typical value of VOL = 0.5 V.
Figure 3 and Figure 4 show the waveforms that are seen in a typical application. If the bus master in Figure 2
writes to the slave through the PCA9515B, Bus 0 has the waveform shown in Figure 3. The waveform looks like
a normal I2C transmission until the falling edge of the eighth clock pulse. At that point, the master releases the
data line (SDA) while the slave pulls it low through the PCA9515B. Because the VOL of the PCA9515B typically is
around 0.5 V, a step in the SDA is seen. After the master has transmitted the ninth clock pulse, the slave
releases the data line.
9th Clock Pulse
SCL
SDA
VOL of Master
VOL of PCA9515B
Figure 3. Bus 0 Waveforms
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
7
PCA9515B
SCPS232 – MARCH 2012
www.ti.com
9th Clock Pulse
SCL
SDA
VOL of PCA9515B
VOL of Slave
Figure 4. Bus 1 Waveforms
On the Bus 1 side of the PCA9515B, the clock and data lines have a positive offset from ground equal to the VOL
of the PCA9515B. After the eighth clock pulse, the data line is pulled to the VOL of the slave device, which is very
close to ground in the example.
8
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): PCA9515B
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2012
PACKAGING INFORMATION
Orderable Device
PCA9515BDGKR
Status
(1)
ACTIVE
Package Type Package
Drawing
MSOP
DGK
Pins
Package Qty
8
2500
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Mar-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
PCA9515BDGKR
Package Package Pins
Type Drawing
MSOP
DGK
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.3
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Mar-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PCA9515BDGKR
MSOP
DGK
8
2500
346.0
346.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated