IXYS IXFX360N15T2

Advance Technical Information
IXFK360N15T2
IXFX360N15T2
GigaMOSTM TrenchT2
HiperFETTM
Power MOSFET
VDSS
ID25
=
=
150V
360A
Ω
4.0mΩ
150ns
RDS(on) ≤
≤
trr
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-264 (IXFK)
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGS = 1MΩ
150
150
V
V
VGSS
VGSM
Continuous
Transient
± 20
± 30
V
V
ID25
IL(RMS)
IDM
TC = 25°C (Chip Capability)
External Lead Current Limit
TC = 25°C, Pulse Width Limited by TJM
360
160
900
A
A
A
IA
EAS
TC = 25°C
TC = 25°C
100
TBD
A
J
PD
TC = 25°C
1670
W
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 175°C
20
V/ns
-55 ... +175
175
-55 ... +175
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
20..120 /4.5..27
N/lb.
10
6
g
g
TJ
TJM
Tstg
TL
TSOLD
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Md
Mounting Torque (TO-264)
FC
Mounting Force
Weight
TO-264
PLUS247
(PLUS247)
G
(TAB)
G = Gate
S = Source
BVDSS
VGS = 0V, ID = 3mA
150
VGS(th)
VDS = VGS, ID = 8mA
2.5
IGSS
VGS = ± 20V, VDS = 0V
IDSS
VDS = VDSS, VGS= 0V
RDS(on)
VGS = 10V, ID = 60A, Note 1
5.0
± 200
z
z
z
z
z
TJ = 150°C
Easy to Mount
Space Savings
High Power Density
V
Applications
V
z
z
z
50 μA
5 mA
z
4.0 mΩ
z
z
z
z
© 2009 IXYS CORPORATION, All Rights Reserved
International Standard Packages
High Current Handling Capability
Fast Intrinsic Diode
Avalanche Rated
Low RDS(on)
Advantages
z
nA
D = Drain
TAB = Drain
Features
z
Characteristic Values
Min.
Typ.
Max.
(TAB)
S
PLUS247 (IXFX)
z
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
D
Synchronous Recification
DC-DC Converters
Battery Chargers
Switched-Mode and Resonant-Mode
Power Supplies
DC Choppers
AC Motor Drives
Uninterruptible Power Supplies
High Speed Power Switching
Applications
DS100181(08/09)
IXFK360N15T2
IXFX360N15T2
Symbol
Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
140
VDS = 10V, ID = 60A, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
td(on)
td(off)
tf
S
47.5
nF
pF
665
pF
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 100A
RG = 1Ω (External)
Qg(on)
Qgs
230
3060
Crss
tr
TO-264 (IXFK) Outline
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
50
ns
170
ns
115
ns
265
ns
715
nC
185
nC
200
nC
0.09
RthJC
RthCS
°C/W
°C/W
0.15
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
ISM
Repetitive, Pulse Width Limited by TJM
VSD
IF = 60A, VGS = 0V, Note 1
trr
QRM
IRM
360
A
1440
A
1.2
V
150
IF = 160A, -di/dt = 100A/μs
VR = 60V, VGS = 0V
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
μC
9.00
A
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
5,049,961
5,063,307
5,187,117
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
PLUS 247TM (IXFX) Outline
Dim.
4,931,844
5,017,508
5,034,796
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32 20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Inches
Min.
Max.
ns
0.50
Note 1. Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
Millimeter
Min.
Max.
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
A
A1
A2
b
b1
b2
C
D
E
e
L
L1
Q
R
Millimeter
Min. Max.
4.83
5.21
2.29
2.54
1.91
2.16
1.14
1.40
1.91
2.13
2.92
3.12
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
Inches
Min. Max.
.190 .205
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFK360N15T2
IXFX360N15T2
Fig. 1. Output Characteristics
Fig. 2. Extended Output Characteristics
@ T J = 25ºC
@ T J = 25ºC
350
350
VGS = 15V
10V
8V
7V
300
250
250
200
ID - Amperes
ID - Amperes
VGS = 10V
7V
6V
300
6V
150
100
200
150
5V
100
50
50
5V
4V
0
0
0.0
0.2
0.4
0.6
0.8
1.0
0
1.2
1
2
3
4
VDS - Volts
Fig. 3. Output Characteristics
350
7
8
9
10
3.0
VGS = 10V
8V
7V
VGS = 10V
2.6
R DS(on) - Normalized
250
ID - Amperes
6
Fig. 4. RDS(on) Normalized to ID = 180A Value vs.
Junction Temperature
@ T J = 150ºC
300
5
VDS - Volts
6V
200
5V
150
100
4V
50
2.2
I D = 360A
1.8
I D = 180A
1.4
1.0
0.6
0
0.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
-25
0
25
VDS - Volts
50
75
100
125
150
175
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 180A Value vs.
Drain Current
Fig. 6. Drain Current vs. Case Temperature
180
3.4
VGS = 10V
3.0
160
External Lead Current Limit
2.6
TJ = 175ºC
120
ID - Amperes
R DS(on) - Normalized
140
2.2
1.8
100
80
60
1.4
40
TJ = 25ºC
1.0
20
0.6
0
0
50
100
150
200
ID - Amperes
© 2009 IXYS CORPORATION, All Rights Reserved
250
300
350
-50
-25
0
25
50
75
100
TC - Degrees Centigrade
125
150
175
IXFK360N15T2
IXFX360N15T2
Fig. 7. Input Admittance
Fig. 8. Transconductance
200
450
180
400
160
120
25ºC
g f s - Siemens
ID - Amperes
350
TJ = 150ºC
25ºC
- 40ºC
140
TJ = - 40ºC
100
80
60
300
250
150ºC
200
150
40
100
20
50
0
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
20
40
60
80
VGS - Volts
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
120
140
160
180
200
220
Fig. 10. Gate Charge
10
350
VDS = 75V
9
300
I D = 180A
8
250
I G = 10mA
7
VGS - Volts
IS - Amperes
100
ID - Amperes
200
150
6
5
4
TJ = 150ºC
3
100
TJ = 25ºC
2
50
1
0
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0
100
200
300
VSD - Volts
400
500
600
700
800
QG - NanoCoulombs
Fig. 11. Capacitance
Fig. 12. Forward-Bias Safe Operating Area
100,000
1,000.0
RDS(on) Limit
25µs
100µs
External Lead Limit
100.0
10,000
ID - Amperes
Capacitance - PicoFarads
Ciss
Coss
10.0
1ms
1,000
10ms
1.0
TJ = 175ºC
Crss
100ms
DC
TC = 25ºC
f = 1 MHz
Single Pulse
0.1
100
0
5
10
15
20
25
30
35
40
VDS - Volts
1
10
100
1,000
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF:F_360N15T2(9V)8-19-09
IXFK360N15T2
IXFX360N15T2
Fig. 13. Resistive Turn-on
Rise Time vs. Junction Temperature
Fig. 14. Resistive Turn-on
Rise Time vs. Drain Current
300
340
RG = 1Ω , VGS = 10V
VDS = 75V
260
260
I
D
t r - Nanoseconds
t r - Nanoseconds
RG = 1Ω , VGS = 10V
VDS = 75V
300
= 100A
220
180
I
140
D
= 200A
220
TJ = 25ºC
180
TJ = 125ºC
140
100
60
100
25
35
45
55
65
75
85
95
105
115
40
125
60
80
100
TJ - Degrees Centigrade
VDS = 75V
400
600
150
500
120
300
90
200
60
I D = 100A
100
30
0
2
3
4
5
6
7
8
9
td(off) - - - -
VDS = 75V
180
400
160
I D = 200A
200
120
100
100
25
10
35
45
RG = 1Ω, VGS = 10V
75
85
95
105
115
80
125
180
TJ = 125ºC
ID - Amperes
© 2009 IXYS CORPORATION, All Rights Reserved
600
600
I D = 200A, 100A
300
300
120
200
200
100
200
100
TJ = 25ºC
180
700
400
140
160
VDS = 75V
700
400
200
140
800
500
160
0
td(off) - - - -
TJ = 125ºC, VGS = 10V
500
300
100
tf
800
220
200
900
100
1
2
3
4
5
6
RG - Ohms
7
8
9
10
t d(off) - Nanoseconds
VDS = 75V
500
120
65
900
t f - Nanoseconds
td(off) - - - -
t d(off) - Nanoseconds
t f - Nanoseconds
600
100
55
Fig. 18. Resistive Turn-off
Switching Times vs. Gate Resistance
240
tf
80
140
TJ - Degrees Centigrade
700
60
I D = 100A
300
Fig. 17. Resistive Turn-off
Switching Times vs. Drain Current
40
200
RG = 1Ω, VGS = 10V
RG - Ohms
400
200
220
tf
0
0
1
180
t d(off) - Nanoseconds
I D = 200A
180
t d(on) - Nanoseconds
t r - Nanoseconds
td(on) - - - -
TJ = 125ºC, VGS = 10V
500
160
700
210
t f - Nanoseconds
700
tr
140
Fig. 16. Resistive Turn-off
Switching Times vs. Junction Temperature
Fig. 15. Resistive Turn-on
Switching Times vs. Gate Resistance
600
120
ID - Amperes
IXFK360N15T2
IXFX360N15T2
Fig. 19. Maximum Transient Thermal Impedance
1.000
Fig. 19. Maximium Transient Thermal Impedance
.sadgsfgsf
0.200
Z (th)JC - ºC / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF:F_360N15T2(9V)8-19-09