MICROSEMI APT2X101D60J

2
1
3
4
2
1
3
4
Anti-Parallel
Parallel
APT2X100D60J
APT2X101D60J
2
3
1
4
SO
2
T-
27
"UL Recognized"
ISOTOP ®
APT2X101D60J
APT2X100D60J
600V 100A
600V 100A
file # E145592
DUAL DIE ISOTOP® PACKAGE
ULTRAFAST SOFT RECOVERY RECTIFIER DIODE
PRODUCT APPLICATIONS
PRODUCT FEATURES
PRODUCT BENEFITS
• Anti-Parallel Diode
• Ultrafast Recovery Times
• Low Losses
• Soft Recovery Characteristics
• Low Noise Switching
• Popular SOT-227 Package
• Cooler Operation
• Low Forward Voltage
• Higher Reliability Systems
• High Blocking Voltage
• Increased System Power
•
•
•
•
•
-Switchmode Power Supply
-Inverters
Free Wheeling Diode
-Motor Controllers
-Converters
Snubber Diode
Uninterruptible Power Supply (UPS)
Induction Heating
High Speed Rectifiers
• Low Leakage Current
All Ratings: TC = 25°C unless otherwise specified.
MAXIMUM RATINGS
Symbol
VR
Density
Characteristic / Test Conditions
APT2X100_101D60J
VRRM
Maximum Peak Repetitive Reverse Voltage
VRWM
Maximum Working Peak Reverse Voltage
IF(AV)
Maximum Average Forward Current (TC = 90°C, Duty Cycle = 0.5)
100
RMS Forward Current (Square wave, 50% duty)
160
IF(RMS)
IFSM
TJ,TSTG
TL
UNIT
Maximum D.C. Reverse Voltage
600
Volts
Amps
1000
Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3ms)
-55 to 175
Operating and StorageTemperature Range
°C
300
Lead Temperature for 10 Sec.
STATIC ELECTRICAL CHARACTERISTICS
Forward Voltage
IRM
Maximum Reverse Leakage Current
CT
Junction Capacitance, VR = 200V
TYP
MAX
IF = 100A
1.6
2.0
IF = 200A
1.7
IF = 100A, TJ = 125°C
1.4
Volts
VR = 600V
250
VR = 600V, TJ = 125°C
500
Microsemi Website - http://www.microsemi.com
170
UNIT
μA
pF
9-2009
VF
MIN
053-6007 Rev H
Symbol
DYNAMIC CHARACTERISTICS
Symbol
Characteristic
Test Conditions
MIN
TYP
MAX
UNIT
trr
Reverse Recovery Time I = 1A, di /dt = -100A/μs, V = 30V, T = 25°C
F
F
R
J
-
34
trr
Reverse Recovery Time
-
180
Qrr
Reverse Recovery Charge
-
390
-
5
-
220
ns
-
1450
nC
-
13
-
110
-
2550
-
40
MIN
TYP
IRRM
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IF = 100A, diF/dt = -200A/μs
VR = 400V, TC = 125°C
Maximum Reverse Recovery Current
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
VR = 400V, TC = 25°C
Maximum Reverse Recovery Current
trr
IRRM
IF = 100A, diF/dt = -200A/μs
IF = 100A, diF/dt = -1000A/μs
VR = 400V, TC = 125°C
Maximum Reverse Recovery Current
ns
nC
-
-
Amps
Amps
ns
nC
Amps
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic / Test Conditions
RθJC
Junction-to-Case Thermal Resistance
.42
RθJA
Junction-to-Ambient Thermal Resistance
20
WT
Torque
Package Weight
29.2
g
0.9
0.7
0.30
0.25
0.5
Note:
0.20
PDM
Z JC, THERMAL IMPEDANCE (°C/W)
θ
0.45
0.35
0.3
0.15
t
Duty Factor D = 1/t2
Peak TJ = PDM x ZθJC + TC
0.1
0.05
0
t1
t2
0.10
SINGLE PULSE
0.05
10-5
10-4
10-3
10-2
0.1
°C/W
oz
Maximum Terminal & Mounting Torque
0.40
UNIT
1.03
Microsemi Reserves the right to change, without notice, the specifications and information contained herein.
1
RECTANGULAR PULSE DURATION (seconds)
FIGURE 1. MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION
053-6007 Rev H 9-2009
MAX
10
lb•in
1.1
N•m
APT2X101_100D60J
TYPICAL PERFORMANCE CURVES
250
300
T =125°C
J
V =400V
IF, FORWARD CURRENT
(A)
250
200
150
TJ = 150°C
100
50
0
TJ = 25°C
TJ = 125°C
trr, REVERSE RECOVERY TIME
(ns)
200A
100A
50A
150
100
50
0
0
0.5
1
1.5
2
2.5
VF, ANODE-TO-CATHODE VOLTAGE (V)
Figure 2. Forward Current vs. Forward Voltage
400
600
800 1000 1200
-diF /dt, CURRENT RATE OF CHANGE(A/μs)
Figure 3. Reverse Recovery Time vs. Current Rate of Change
0
200
50
T =125°C
J
V =400V
200A
R
2500
100A
2000
1500
50A
1000
500
0
0
200
400
600
800
1000 1200
-diF /dt, CURRENT RATE OF CHANGE (A/μs)
Figure 4. Reverse Recovery Charge vs. Current Rate of Change
IRRM, REVERSE RECOVERY CURRENT
(A)
Qrr, REVERSE RECOVERY CHARGE
(nC)
R
TJ = -55°C
3000
T =125°C
J
V =400V
200A
R
40
30
100A
20
50A
10
0
400
600
800
1000 1200
-diF /dt, CURRENT RATE OF CHANGE (A/μs)
Figure 5. Reverse Recovery Current vs. Current Rate of Change
0
200
160
1.4
Qrr
1.2
trr
1.0
trr
0.8
IRRM
0.6
Duty cycle = 0.5
T =150°C
J
140
120
IF(AV) (A)
Kf, DYNAMIC PARAMETERS
(Normalized to 1000A/μs)
200
100
80
60
Qrr
0.4
0.2
0.0
40
20
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Dynamic Parameters vs. Junction Temperature
0
25
50
75
100
125
150
Case Temperature (°C)
Figure 7. Maximum Average Forward Current vs. CaseTemperature
1400
1200
1000
800
600
400
200
0
.4
1
10
100 200
VR, REVERSE VOLTAGE (V)
Figure 8. Junction Capacitance vs. Reverse Voltage
053-6007 Rev H 9-2009
CJ, JUNCTION CAPACITANCE
(pF)
1600
APT2X101_100D60J
Vr
diF /dt Adjust
+18V
APT60M75L2LL
0V
D.U.T.
30μH
trr/Qrr
Waveform
PEARSON 2878
CURRENT
TRANSFORMER
Figure 9. Diode Test Circuit
1
IF - Forward Conduction Current
2
diF /dt - Rate of Diode Current Change Through Zero Crossing.
3
IRRM - Maximum Reverse Recovery Current.
4
trr - Reverse Recovery Time, measured from zero crossing where diode
current goes from positive to negative, to the point at which the straight
line through IRRM and 0.25 IRRM passes through zero.
5
1
4
Zero
5
0.25 IRRM
3
2
Qrr - Area Under the Curve Defined by IRRM and trr.
Figure 10, Diode Reverse Recovery Waveform and Definitions
SOT-227 Package Outline
11.8 (.463)
12.2 (.480)
31.5 (1.240)
31.7 (1.248)
7.8 (.307)
8.2 (.322)
r = 4.0 (.157)
(2 places)
8.9 (.350)
9.6 (.378)
Hex Nut M4 H100
(4 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
25.2 (0.992)
0.75 (.030) 12.6 (.496) 25.4 (1.000)
0.85 (.033) 12.8 (.504)
4.0 (.157)
4.2 (.165)
(2 places)
3.3 (.129)
3.6 (.143)
14.9 (.587)
15.1 (.594)
30.1 (1.185)
30.3 (1.193)
1.95 (.077)
2.14 (.084)
Anti-parallel
Parallel
APT2X100D60J
APT2X101D60J
Anode 2
Cathode 1 Cathode 1
Anode 1
Anode 1
Anode 2
053-6007 Rev H 9-2009
38.0 (1.496)
38.2 (1.504)
Dimensions in Millimeters and (Inches)
Cathode 2
Cathode 2
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. US and Foreign patents pending. All Rights Reserved.