IC IC SMD Type HEXFET Power MOSFET KRF7706 TSSOP-8 Unit: mm Features Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile ( 1.2mm) 1,5,8: Drain Available in Tape & Reel 2,3,6,7: Source 4: Gate Absolute Maximum Ratings Ta = 25 Parameter Drain- Source Voltage Symbol Rating Unit V VDS -30 Continuous Drain Current, VGS @ -10V @ Ta = 25 ID -7 Continuous Drain Current, VGS @ -10V @ Ta = 70 ID -5.7 Pulsed Drain Current *1 A IDM -28 Power Dissipation *2 @Ta= 25 PD 1.51 W Power Dissipation *2 @Ta = 70 PD 0.96 W 0.01 W/ 20 V Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range Maximum Junction-to-Ambient *2 VGS TJ, TSTG R JA -55 to + 150 83 /W *1 Repetitive rating; pulse width limited by max. junction temperature. *2 Surface mounted on 1 in square Cu board www.kexin.com.cn 1 IC IC SMD Type KRF7706 Electrical Characteristics Ta = 25 Parameter Symbol Drain-to-Source Breakdown Voltage V(BR)DSS Breakdown Voltage Temp. Coefficient V(BR)DSS/ Static Drain-to-Source On-Resistance RDS(on) Gate Threshold Voltage Forward Transconductance Gate-to-Source Forward Leakage VGS = 0V, ID = -250 A Min 22 36 m gfs VDS = -10V, ID = -7.0A*1 6.9 -2.5 VDS = -24V, VGS = 0V -15 VDS = -24V, VGS = 0V, TJ = 70 -25 VGS = -20V -100 VGS = 20V 100 Qg ID = -7.0A 48 Qgs VDS = -15V 8.5 Gate-to-Drain ("Miller") Charge Qgd VGS = -10V 8.4 Turn-On Delay Time td(on) VDD = -15V,VGS=-10V 17 ID = -1.0A 46 td(off) RG = 6 244 tf Turn-Off Delay Time RD=15 122 Input Capacitance Ciss VGS = 0V 2211 Output Capacitance Coss VDS = -25V 339 Reverse Transfer Capacitance Crss f = 1.0MHz 207 Fall Time Continuous Source Current Body Diode) V S Total Gate Charge tr V/ VGS = -10V, ID = -7.0A*1 Gate-to-Source Charge Rise Time Unit V VGS = -4.5V, ID = -5.6A*1 -1.0 Gate-to-Source Reverse Leakage Max 0.015 TJ ID = -1mA,Reference to 25 VDS = VGS, ID = -250 A IGSS Typ -30 VGS(th) IDSS Drain-to-Source Leakage Current Testconditons A nA 72 nC ns pF IS -1.5 ISM -28 A Pulsed Source Current Body Diode) *2 Diode Forward Voltage VSD Reverse Recovery Time trr TJ = 25 , IF =-1.5A Reverse RecoveryCharge Qrr di/dt = -100A/ *1 Pulse width 300 s; duty cycle 2%. *2 Repetitive rating; pulse width limited by max. junction temperature. 2 www.kexin.com.cn -1.2 V 34 51 ns 32 48 TJ = 25 , IS = -1.5A, VGS = 0V*1 s*1 C