TI 74ACT11544

SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
•
•
•
•
•
•
•
DW PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
3-State Inverted Outputs
Back-to-Back Registers for Storage
Flow-Through Architecture Optimizes
PCB Layout
Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
EPICt (Enhanced-Performance Implanted
CMOS) 1-mm Process
500-mA Typical Latch-Up Immunity
at 125°C
CEBA
A1
A2
A3
A4
GND
GND
GND
GND
A5
A6
A7
A8
CEAB
description
This 8-bit registered transceiver contains two sets
of D-type latches for temporary storage of data
flowing in either direction. Separate latch enable
(LEAB or LEBA) and output enable (GAB or GBA)
inputs are provided for each register to permit
independent control in either direction of data flow.
The 74ACT11544 inverts data in both directions.
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
GBA
LEBA
B1
B2
B3
B4
VCC
VCC
B5
B6
B7
B8
LEAB
GAB
The A-to-B enable (CEAB) input must be low in order to enter data from A or to output data to B. Having CEAB
low and LEAB low makes the A-to-B latches transparent; a subsequent low-to-high transition of LEAB puts the
A latches in the storage mode. With CEAB and GAB both low, the 3-state B outputs are active and reflect the
data present at the output of the A latches. Data flow from B-to-A is similar, but requires the use of CEBA, LEBA,
and GBA inputs.
The 74ACT11544 is characterized for operation from − 40°C to 85°C.
FUNCTION TABLE
CEAB
LEAB
GAB
LATCH
STATUS
A TO B†
H
X
X
Storing
X
H
INPUTS
OUTPUT BUFFERS
B1 THRU B8
Z
Storing
X
H
Z
L
L
L
Transparent
L
H
L
Storing
Current A Data
Previous} A Data
† A-to-B data flow is shown: B-to-A flow control is the same except uses
CEBA, LEBA, and GBA.
‡ Data present before low-to-high transition of LEAB.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright  1993, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2−1
SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
logic symbol†
GBA
CEBA
LEAB
GAB
CEAB
LEAB
A1
A2
A3
A4
A5
A6
A7
A8
28
1
27
15
14
16
logic diagram (positive logic)
1 EN3
G1
CEBA
1C5
2 EN4
LEBA
G2
GAB
2C6
2
3
GBA
3
6D
5D
4
26
25
4
24
5
23
10
20
11
19
12
18
13
17
B1
B2
CEAB
LEAB
B3
A1
28
1
27
15
14
16
2
C1
1D
26
B1
B4
B5
C1
1D
B6
B7
B8
To Seven Other Transceivers
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 200 mA
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
recommended operating conditions
MIN
NOM
MAX
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
IOL
Dt /Dv
TA
Operating free-air temperature
2−2
High-level input voltage
2
UNIT
V
V
0.8
V
VCC
VCC
V
High-level output current
−24
mA
Low-level output current
24
mA
0
10
ns/ V
− 40
85
°C
Input transition rise or fall rate
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• DALLAS, TEXAS 75265
V
SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
electrical characteristics over recommended operating free-air temperature range
PARAMETER
TEST CONDITIONS
VCC
IOH = − 50 mA
A
VOH
II
IOZ
ICC
Ci
Control inputs
4.4
4.4
5.5 V
5.4
5.4
3.94
3.8
5.5 V
4.94
4.8
IOH = − 75 mA†
5.5 V
MAX
UNIT
V
3.85
4.5 V
0.1
0.1
5.5 V
0.1
0.1
4.5 V
0.36
0.44
5.5 V
0.36
0.44
V
IOL = 75 mA†
VI = VCC or GND
5.5 V
5.5 V
± 0.1
±1
mA
VO = VCC or GND
VI = VCC or GND,
5.5 V
± 0.5
±5
mA
5.5 V
8
80
mA
5.5 V
0.9
1
mA
IO = 0
One input at 3.4 V,
Other inputs at GND or VCC
DICC§
4.5 V
4.5 V
IOL = 24 mA
Control inputs
A or B ports‡
MIN
IOH = − 24 mA
IOL = 50 mA
A
VOL
TA = 25°C
MIN
TYP
MAX
VI = VCC or GND
VO = VCC or GND
5V
1.65
4.5
pF
Co
A or B ports
5V
12
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ For I/O ports, the parameter IOZ includes the input leakage current.
§ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
pF
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration, LEAB or LEBA low
Data before LEAB or LEBA↑
tsu
Setup time
th
Hold time
Data before CEAB or CEBA↑
Data after LEAB or LEBA↑
Data after CEAB or CEBA↑
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• DALLAS, TEXAS 75265
MIN
4
4
2.5
2.5
3
3
2
2
1.5
1.5
MAX
UNIT
ns
ns
ns
2−3
SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPLH
tPHL
LEBA or LEAB
A or B
tPZH
tPZL
CEBA or CEAB
A or B
tPHZ
tPLZ
CEBA or CEAB
A or B
tPZH
tPZL
GBA or GAB
A or B
tPHZ
tPLZ
GBA or GAB
A or B
MIN
TA = 25°C
TYP
MAX
MIN
MAX
2.4
5.7
8.2
2.4
8.9
4.1
7.3
9.3
4.1
10.3
2.6
6
8.7
2.6
9.5
3.4
7.1
10.1
3.4
11
3.3
6.7
9.5
3.3
10.4
3.6
8.2
11.2
3.6
13
4.8
7.6
9.7
4.8
10.4
4.7
7.6
9.5
4.7
10.2
3
6.4
9
3
9.9
3.5
7.8
10.8
3.5
12.5
4.6
7.3
9.3
4.6
9.9
4.6
7.2
9.2
4.6
9.7
UNIT
ns
ns
ns
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
Outputs enabled
Cpd
2−4
Power dissipation capacitance per transceiver
Outputs disabled
POST OFFICE BOX 655303
TYP
UNIT
47
CL = 50 pF,
• DALLAS, TEXAS 75265
f = 1 MHz
14
pF
SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
500 Ω
LOAD CIRCUIT
3V
Timing Input
(see Note B)
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
1.5 V
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
Input
(see Note B)
1.5 V
1.5 V
0V
tPHL
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
50% VCC
3V
VOH
50% VCC
VOL
Output
Waveform 2
S1 at GND
(see Note C)
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note C)
tPLH
tPHL
Out-of-Phase
Output
VOLTAGE WAVEFORMS
50% VCC
20% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
[ VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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• DALLAS, TEXAS 75265
2−5
SCAS133 − D3609, JULY 1990 − REVISED APRIL 1993
2−6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ACT11544DW
OBSOLETE
SOIC
DW
28
TBD
Call TI
Call TI
74ACT11544NT
OBSOLETE
PDIP
NT
28
TBD
Call TI
Call TI
74ACT11544NT
OBSOLETE
PDIP
NT
28
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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