E-pHEMT MMIC AE417 (Preliminary) Product Features Application • Small size • Higher linearity • SOT89 SMD Type package • Higher productivity • Lower manufacturing cost • -63dBc CSO 135 Channels @ +30dBmV/ch • -74dBc CTB 135 Channels @ +30dBmV/ch • -73dBc XMD 135 Channels @ +30dBmV/ch • Low Noise Amplifier for CATV, Satellite • Cable Modem • FTTH (G-PON, GE-PON) • Optical node Package : SOT-89 Description AE417 is designed as low cost drive amplifiers for many applications including FTTH, CATV System. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise. The data in this spec sheet is valid only for 75 ohm application. Specifications PARAMETER UNIT Frequency MHz 50 ~ 1000 Gain dB 11 Input Return Loss dB -19 Output Return Loss dB -18 Output IP3 dBm 38 41 At 500MHz/10dBm 2tone 1dB Compression Point dBm 22 24.8 At 500MHz Noise Figure dB 4 5 dBc -63 -58 135 channel, +30dBmV/ch dBc -74 -69 135 channel, +30dBmV/ch dBc -73 -68 135 channel, +30dBmV/ch mA 115 CSO CTB 30 ~ 870MHz XMOD DC Current MIN TYP MAX Condition Vdd = 8.0V NOTE 1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=8V, 75Ω system 2. OIP3 measured with 2 tones at an output power of +10dBm/tone separated by 1MHz, Test Freq = 500MHz Absolute Minimum and Maximum Ratings PARAMETER UNIT Device Voltage VDC Operating Temperature ℃ -40 +85 Storage Temperature ℃ -40 +150 MIN TYP MAX +8 +9 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2 AE417 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 50MHz ~ 1000MHz, 75ohm System 4.7uF (Tantal) +8V 100nF 820nH (Wirewround Type) 6.8nH Input 8.2nH 10 nF 1Kohm Output 10 nF 1 pF AE417 1 pF 10 nF ◎ Typical RF Performance: VDD=8V, IDS=115mA, T=25℃, 75ohm System Noise Figure vs Frequency S-Parameter S21 5 5 10 4 0 0 S22 S11 -10 -5 -10 0.0 0.2 0.4 0.6 0.8 1.0 Return Loss(dB) Gain(dB) 10 20 NF(dB) 15 3 2 -20 1 -30 0 1.2 10 200 400 Freq(GHz) 600 800 1000 Freq(MHz) ◎ Multi-Tone Test 135CH_FLAT@Output Power +30dBmV/Ch Level: +30dBmV FRQ Tilt: 135CH_FLAT XMD(NCTA) CTB_RAW CTB_COR N-FLR CSU_RAW CSU_COR CSU_FRQ CSL_RAW CSL_COR CSL_FRQ 55.25 73.8 74.8 79.1 75.6 75.4 79.8 56.09 63.4 63.6 54 77.25 75.2 75 79.3 75.6 63.9 64.2 77.99 75.3 79.7 76.45 109.25 75.9 74.8 79.1 75.8 75.1 79.4 110 64 64.3 107.99 211.25 75.1 74.6 78.9 75.8 75 79.3 211.98 64.2 64.4 209.99 331.25 75.9 72.8 77.1 74 72.7 77 331.99 64.2 64.6 329.99 445.25 74.9 73.5 77.8 75.6 72.9 76.5 446.49 64.5 64.9 443.99 547.25 73.9 71.9 76.2 73 70.6 74.2 548.49 64.2 64.8 545.99 637.25 74.4 71.6 75.9 73.3 69.4 71.6 638.49 65.3 66.1 635.98 745.25 74.5 71.6 76 73.7 67.8 69.2 746.49 67.4 68.7 743.99 859.25 73.9 70.3 74.6 71.2 66.2 67.8 860.49 70.3 74.6 858.49 Min 73.8 70.3 74.6 71.2 63.9 64.2 56.09 63.4 63.6 54 Max 75.9 75 79.3 75.8 75.4 79.8 860.49 75.3 79.7 858.49 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2 E-pHEMT MMIC AE417 (Preliminary) ESD Protection For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being handled. Here are some recommended precautions; - Person at a workbench should be earthed via a wrist strap and a resistor. - All mains-powered equipment should be connected to the mains via an earth-leakage switch. - Equipment cases should be grounded. - Relative humidity should be maintained between 40% and 50%. - An ionizer is recommended. - Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench Dimensions PCB Pad Layout Pin No Function 1 Input 2 Ground 3 Output/Bias 4 Ground Recommended Mounting Configuration Mounting Configuration Notes 1.Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters. RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders, employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC’s liability under or arising out of damages, claims of whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC. ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.2