E-pHEMT MMIC AE362 (Preliminary) Product Features Application • 50 ~ 6000MHz • GaAs E-pHEMT MMIC • Higher linearity • Low Noise Figure • High Max input power • SOT-89 SMD Type package • Higher productivity • Lower manufacturing cost • Pb Free / RoHS Standard • Cellular, GSM • PCS, W-CDMA • Wibro, WiMax Package : SOT-89 Description AE362 is a drive or pre-drive amplifier designed in a low cost SOT-89 package. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current and high IP3. It is designed as driver devices for infrastructure equipment in the 50~6000MHz Wireless technologies such as Cellular, GSM, PCS, W-CDMA, Wibro, WiMax System. The data in this spec sheet is valid only for 50 ohm application. Specifications PARAMETER UNIT MIN TYP Frequency Range MHz 50 ~ 6000 Gain dB 15.5 Input Return Loss dB -13 Output Return Loss dB -12 Output IP3 dBm 29 32 1dB Compression Point dBm 18 21 W-CDMA Power (4FA) dBm 8.5 Noise Figure dB 1.3 DC Current mA 45 Supply Voltage V 4.5 MAX Remark 1.8 NOTE 1. Test conditions unless otherwise noted. Freq=1900~2200MHz, Vdd=+4.5V, Ta=25℃, 50Ω system 2. OIP3 measured with 2 tones at an output power of +0dBm/tone separated by 1MHz 3. Test Model 1, 64DPCH, 3.84MHz BW, @±5MHz and ±10MHz offset Absolute Minimum and Maximum Ratings PARAMETER UNIT MIN TYP MAX Device Voltage V +5 +6 Operating Temperature ℃ -40 +85 Storage Temperature ℃ -40 +150 ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 AE362 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 800MHz ~ 900MHz, 50ohm System ◎ Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25℃, 50ohm System Noise Figure vs Frequency S-parameter 25 20 S21 20 3.0 10 2.5 Gain(dB) 2.0 15 0 10 -10 1.5 1.0 5 0 0.70 S22 -20 S11 0.75 0.80 0.85 0.90 0.95 -30 1.00 Freq(GHz) 0.5 0.0 800 820 840 860 880 900 880 900 Freq(MHz) OIP3 vs Frequency 36.0 24.0 34.0 22.0 32.0 20.0 30.0 18.0 28.0 16.0 26.0 P1dB vs Frequency 14.0 800 820 840 860 880 900 800 820 Freq(MHz) 840 860 Freq(MHz) ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 AE362 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 1900MHz ~ 2200MHz, 50ohm System ◎ Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25℃, 50ohm System S-parameter 30 3.00 20 2.50 10 2.00 S21 S11 S22 0 1.50 -10 1.00 -20 0.50 -30 1.8 1.9 2.0 2.1 freq, GHz 2.2 2.3 0.00 1900 22.0 32.0 20.0 30.0 18.0 28.0 16.0 1940 1980 2020 2060 Freq(MHz) 1980 2020 2060 2100 2140 2180 2100 P1dB vs Frequency 24.0 34.0 26.0 1900 1940 Freq(MHz) OIP3 vs Frequency 36.0 Noise Figure vs Frequency 2140 2180 14.0 1900 1940 1980 2020 2060 2100 2140 2180 Freq(MHz) ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 AE362 (Preliminary) E-pHEMT MMIC ◎ Application Circuit: 2400MHz ~ 2600MHz, 50ohm System ◎ Typical RF Performance: VDD=4.5V, IDS=45mA, TA=25℃, 50ohm System S - parameter 30 20 2.5 10 2.0 0 1.5 S21 S11 S22 -10 Noise Figure vs Frequency 3.0 1.0 -20 0.5 -30 2.3 2.4 2.5 2.6 2.7 0.0 2400 2440 2480 freq, GHz OIP3 vs Frequency 24.0 34.0 22.0 32.0 20.0 30.0 18.0 28.0 16.0 26.0 14.0 2440 2480 2520 2560 2600 P1dB vs Frequency 36.0 2400 2520 Freq(MHz) 2560 2600 2400 2440 2480 2520 2560 2600 Freq(MHz) Freq(MHz) ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3 E-pHEMT MMIC AE362 (Preliminary) ESD Protection For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being handled. Here are some recommended precautions; - Person at a workbench should be earthed via a wrist strap and a resistor. - All mains-powered equipment should be connected to the mains via an earth-leakage switch. - Equipment cases should be grounded. - Relative humidity should be maintained between 40% and 50%. - An ionizer is recommended. - Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench Dimensions PCB Pad Layout Pin No Function 1 Input 2 Ground 3 Output/Bias 4 Ground Recommended Mounting Configuration Mounting Configuration Notes 1.Ground / thermal via holes are critical for the proper performance of this device. 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts the heatsink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters. RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders, employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC’s liability under or arising out of damages, claims of whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC. ▪ Tel : 82-31-250-5011 ▪ All specifications may change without notice. ▪ [email protected] ▪ Version 0.3