TI TSU6111A

TSU6111A
SCDS331 – FEBRUARY 2012
www.ti.com
USB Port SP2T Switch Supports USB & UART
Check for Samples: TSU6111A
FEATURES
•
1
•
•
•
•
Switch Matrix
– USB
– UART Supports USB 2.0 High Speed
Charger Detection
– USB BCDv1.1 Compliant
– VBUS Detection
– Data Contact Detection
– Primary and Secondary Detection
Compatible Accessories
– USB Chargers (DCP, CDP)
– Factory Cable
Additional Features
– I2C Interface with Host Processor
– Switches Controlled by Automatic
Detection or Manual Control
– Interrupts Generated for Plug/Unplug
– Support Control Signals used In
Manufacturing (JIG, BOOT)
Max Voltage
– 28V VBUS rating
ESD Performance Tested Per JESD 22
– 5000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
IEC ESD Performance
– ±8kV Contact Discharge (IEC 61000-4-2) for
VBUS/DP_CON/DM_CON/ID_CON to GND
Surge Protection on VBUS/DP_CON/DM_CON
– USB Connector Pins Without External
Component
•
•
•
APPLICATIONS
•
•
•
•
•
Cell Phones and Smart Phones
Tablet PCs
Digital Cameras and Camcorders
GPS Navigation Systems
Micro USB interface with USB/UART
TYPICAL APPLICATION DIAGRAM
BATTERY
IEC ESD
VBAT
inside
DP_HT
DP_CON
DM_HT
USB2.0 High
Speed
DM_CON
TSU6111
MIC
VBUS
DP_CON
DM_CON
ID_CON
VDDIO
ID_CON
JIG
BOOT
INTB
I2C
Control
I2C_SDA
I2C_SCL
UART
TxD
RxD
USB CONNECTOR
VBUS
USB
outside
ORDERING INFORMATION (1)
TA
–40°C to 85°C
(1)
(2)
PACKAGE (2)
uQFN 0.4-mm pitch – RSV
Tape and Reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TSU6111RSVR
ZTC
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TSU6111A
SCDS331 – FEBRUARY 2012
www.ti.com
DESCRIPTION
The TSU6111A is a high performance differential autonomous SP2T switch with impedance detection. The
switch supports the detection of various accessories that are attached through DP, DM, and ID. The charger
detection satisfies USB charger specification v1.1 and VBUS_IN has a 28V tolerance to eliminate the need for
external protection. Power for this device is supplied through VBAT of the system or through VBUS_IN when
attached to a charger.
The SP2T switch is controlled by the automatic detection logic or through manual configuration of the I2C. JIG
and BOOT pins are used when a USB or UART JIG cable is used to test the device in the development and
manufacturing. TSU6111A has open-drain JIG output (active low).
BLOCK DIAGRAM
VDDIO
I2C
Interface
SCL
SDA
I2C Interface
&
Hardware
Control
Switches
USB_DP
USB_DM
TxD
INTB
JIG
RxD
Switch
Ctrl
State Machine
BOOT
Buffers and/or
Comparators
VBUS
DP
DM
ID
Charger
Detection
Sources
And
Comp’s
Accessory
ID
Detection
ADC
SWITCH MATRIX
USB
DM_HT
TSU6111 SWITCH
MATRIX
VBUS
DP_HT
DM_CON
Micro
USB
UART
TxD
DP_CON
RxD
ID_CON
2
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ID_CON
DP_CON
DM_CON
VBUS_IN
PINOUT DIAGRAM (TOP VIEW)
16
15
14
13
GND
DP_HOST
2
11
SDA
TxD
3
10
SCL
RxD
4
9
INTB
6
7
8
VDDIO
5
JIG
12
BOOT
1
VBAT
DM_HOST
PIN FUNCTIONS
PIN
NO.
NAME
I/O
DESCRIPTION
1
DM_HOST
I/O
USB DM connected to host
2
DP_HOST
I/O
USB DP connected to host
3
TxD
I/O
UART Tx
4
RxD
I/O
UART Rx
5
VBAT
I
Connected to battery
6
BOOT
O
BOOT mode out (push-pull). Used for factory test modes.
7
JIG
O
JIG detection JIG detection (Open-drain). Used for factory test modes
8
VDDIO
O
I/O voltage reference
9
INTB
O
Interrupt to host (push-pull)
10
SCL
I
I2C clock
11
SDA
I/O
I2C data
12
GND
13
VBUS_IN
I
14
DM_CON
I/O
USB DM connected to USB receptacle
15
DP_CON
I/O
USB DP connected to USB receptacle
16
ID_CON
I/O
USB ID connected to USB receptacle
Ground
VBUS connected to USB receptacle
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ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VBUS
Supply voltage from USB connector
–0.5
28
VBAT
Supply voltage from battery
–0.5
6.0
VDDIO
Logic supply voltage
–0.5
4.6
V
VID_CON
ID Connector voltage
–0.5
VBAT+0.5
V
VUSBIO
Switch I/O voltage range
USB Switch
–0.5
VBAT+0.5
V
VUARTIO
Switch I/O voltage range
UART Switch
–0.5
VBAT+0.5
V
VJIG
JIG voltage
–0.5
VBAT+0.5
V
VLOGIC_O
Voltage applied to logic output (SCL, SDA, INTB, BOOT)
–0.5
4.6
V
IK
Analog port diode current
–50
50
mA
ISW-DC
ON-state continuous switch current
–60
60
mA
ISW
ON-state peak switch current PEAK
–150
150
mA
IIK
Digital logic input clamp current
–50
mA
ILOGIC_O
Continuous current through logic output (SCL, SDA, INTB, BOOT)
50
mA
IGND
Continuous current through GND
100
mA
Tstg
Storage temperature range
150
°C
(1)
(2)
VDDIO < 0
–50
–65
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
4
Package thermal impedance
RSV package
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184
°C/W
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SUMMARY OF TYPICAL CHARACTERISTICS
AMBIENT TEMPERATURE = 25°C
USB/UART PATH
Number of channels
2
8Ω
ON-state resistance (ron)
0.5 Ω
ON-state resistance match (Δron)
ON-state resistance flatness (ron(flat))
0.5 Ω
95 µs/ 3.5 µs
Turn-on/turn-off time (tON/tOFF)
Bandwidth (BW)
920 MHz
OFF isolation (OISO)
–26 dB at 250 MHz
Crosstalk (XTALK)
–32 dB at 250 MHz
Leakage current (IIO(ON))
50 nA
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
VBUS_IN
VBUS voltage
4.0
6.5
V
VBAT
VBAT voltage
3.0
4.4
V
VDDIO
VDDIO voltage
1.65
3.6
V
ID_CON_Cap
ID_CON capacitance
1
nF
USB_I/O
USB path signal range
Temperature
Operating Temperature
0
3.6
V
–40
85
°C
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TSU6111A
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ELECTRICAL SPECIFICATION
over operating free-air temperature range (unless otherwise noted)
PARAMETERS
TEST CONDITIONS
MIN
MAX
UNIT
DIGITAL SIGNALS – I2C INTERFACE (SCL and SDA)
VDDIO
Logic and I/O supply voltage
1.65
3.6
V
VIH
High-level input voltage
VDDIO × 0.7
VDDIO
V
VIL
Low-level input voltage
0
VDDIO × 0.3
V
VOH
High-level output voltage
IOH = –3 mA
VOL
Low-level output voltage
IOL = 3 mA
fSCL
SCL frequency
VDDIO × 0.7
V
0.4
V
400
kHz
0.5
V
1.16
VDDIO
V
0
0.33
V
JIG OUTPUT (TSU6111A – OPEN-DRAIN OUTPUT, ACTIVE LOW)
VOL
Low-level output voltage
IOL = 10 mA, VBAT = 3.0 V
INTB AND BOOT (PUSH-PULL OUTPUT)
VOH
High-level output voltage
IOH = –4 mA , VDDIO = 1.65 V
VOL
Low-level output voltage
IOL = 4 mA , VDDIO = 1.65 V
ELECTRICAL SPECIFICATIONS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TOTAL SWITCH CURRENT CONSUMPTION
IBAT(Standby)
VBAT Standby current consumption
VBUS = 0 V, Idle state
25
30
µA
IDD(Operating)
VBAT Operating current consumption
VBUS_IN = 0 V, USB switches ON
45
75
µA
VOLTAGE PROTECTION
VVBUS_UVLO
VVBAT_UVLO
VVDDIO_UVLO
(1)
6
VBUS under voltage +
Voltage is rising
2.85
VBUS under voltage–
Voltage is falling
2.55
VBUS under voltage +
Voltage is rising
2.65
VBUS under voltage–
Voltage is falling
2.45
VBUS under voltage +
Voltage is rising
1.30
VBUS under voltage–
Voltage is falling
1.05
V
V
V
VO is equal to the asserted voltage on DP_CON and DM_CON pins. VI is equal to the asserted voltage on DP_HT and DM_HT pins. IO
is equal to the current on the DP_CON and DM_CON pins. II is equal to the current on the DP_HT and DM_HT pins.
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USB AND UART SWITCH ELECTRICAL CHARACTERISTICS (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
0
VBAT
V
8
15
Ω
VI = 0.4 V, IO = –2 mA, VBAT = 3.0 V
0.5
2
Ω
VI = 0 V to 3.6 V, IO = –2 mA,
VBAT = 3.0 V
0.5
2
Ω
ANALOG SWITCH
VUSBIO
Analog signal range
DM_HT, DP_HT,
DM_CON, DP_CON
VI = 0 V to 3.6 V, IO = –2 mA,
VBAT = 3.0 V
rON
ON-state resistance
ΔrON
ON-state resistance
DM_HT, DP_HT,
match between channels DM_CON, DP_CON
rON(flat)
ON-state resistance
flatness
IIO(OFF)
VI or VO OFF leakage current
VI = 0.3 V, VO = 2.7 V or
VI = 2.7 V, VO = 0.3 V,
VBAT = 4.4 V, Switch OFF
45
200
nA
IIO(ON)
VO ON leakage current
VI = OPEN, VO = 0.3 V or 2.7 V,
VBAT = 4.4 V, Switch ON
50
200
nA
DM_HT, DP_HT,
DM_CON, DP_CON
DYNAMIC
tON
Turn-ON time
From receipt of I2C ACK
bit
VI or VO = VBAT, RL = 50 Ω, CL = 35 pF
95
µs
tOFF
Turn-OFF time
From receipt of I2C ACK
bit
VI or VO = VBAT, RL = 50 Ω, CL = 35 pF
3.5
µs
CI(OFF)
VI OFF capacitance
DC bias = 0 V or 3.6 V, f = 10 MHz,
Switch OFF
4
pF
CO(OFF)
VO OFF capacitance
DC bias = 0 V or 3.6 V, f = 10 MHz,
Switch OFF
7
pF
CI(ON),
CO(ON)
VI, VO ON capacitance
DC bias = 0 V or 3.6 V, f = 10 MHz,
Switch ON
9
pF
BW
Bandwidth
RL = 50 Ω, Switch ON
920
MHz
OISO
OFF Isolation
f = 240 MHz, RL = 50 Ω, Switch OFF
–26
dB
XTALK
Crosstalk
f = 240 MHz, RL = 50 Ω
–32
dB
(1)
VO is equal to the asserted voltage on DP_CON and DM_CON pins. VI is equal to the asserted voltage on DP_HT and DM_HT pins. IO
is equal to the current on the DP_CON and DM_CON pins. II is equal to the current on the DP_HT and DM_HT pins.
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GENERAL OPERATION
The TSU6111A will automatically detect accessories plugged into the phone via the mini/micro USB 5 pin
connector. The type of accessory detected will be stored in I2C registers within the TSU6111A for retrieval by the
host. The TSU6111A has a network of switches that are automatically opened and closed based on the
accessory detection. See Table 1 for details of which switches are open during each mode of operation. The
TSU6111A also offers a manual switching mode that allows the host processor to decide which switches should
be opened and closed. The manual switching settings are executed through the I2C interface.
STANDBY MODE
Standby mode is the default mode upon power up and occurs when no accessory has been detected. During this
mode, the VBUS and ID lines are continually monitored through comparators to determine when an accessory is
inserted. Power consumption is minimal during standby mode.
POWER SUPERVISOR
TSU6111A uses VBAT as the primary supply voltage. VBUS is the secondary supply. VDDIO is used for I2C
communication.
Table 1. Function Table
TSU6111A
VBAT
8
VBUS
VDDIO
DETECTION
I2C
COMMENTS
Yes
No
No
Enabled
Not enabled
VBAT is supply
Yes
Yes
No
Enabled
Not enabled
VBAT is supply
Yes
No
Yes
Enabled
Enabled
VBAT is supply
Yes
Yes
Yes
Enabled
Enabled
VBAT is supply
No
Yes
No
Enabled
Not enabled
VBUS is supply
No
Yes
Yes
Not valid
No
No
Yes
Not valid
No
No
No
Power Down Reset
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EYE DIAGRAM USB 2.0 HIGH SPEED
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ACCESSORY ID DETECTION
If VBUS_IN is high and the attachment is not a charger, then determine the impedance on the ID pin. If VBUS_IN is
low and an accessory is attached, then use an ADC for impedance sensing on the ID pin to identify which
accessory is attached.
IMPEDANCE BUCKETS FOR EACH ACCESSORY
In order to implement ID detection, each accessory should contain a ID impedance resistor value (refer
toTable 2) which has a 5% tolerance accuracy.
Table 2. Accessory ID and Switch States
ACCCESSORY
DETECTED
IMPEDANCE
ON ID
SWITCH STATE
RESISTOR
TOLERANCE
(%)
ADC
VALUE
DP/DM
USB
UART
FACTORY CABLE
JIG
BOOT
OTG
0
—
0
ON
OFF
OFF
OFF
MHL
1K
5%
0
OFF
OFF
OFF
OFF
Audio Device Type 3
28.7K
5%
1110
OFF
OFF
OFF
OFF
Reserved Accessory #1
34K
5%
1111
OFF
OFF
OFF
OFF
Reserved Accessory #2
40.2K
5%
10000
OFF
OFF
OFF
OFF
Reserved Accessory #3
49.9K
5%
10001
OFF
OFF
OFF
OFF
Reserved Accessory #4
64.9K
5%
10010
OFF
OFF
OFF
OFF
Audio Device Type 2
80.27K
5%
10011
OFF
OFF
OFF
OFF
Phone Powered Device
102K
5%
10100
OFF
ON
OFF
OFF
TTY Converter
121K
5%
10101
OFF
OFF
OFF
OFF
UART Cable
150K
5%
10110
OFF
ON
OFF
OFF
Type 1 Charger
200K
5%
10111
OFF
OFF
OFF
OFF
Factory Mode Cable - Boot Off USB
255K
5%
11000
ON
OFF
ON
OFF
Factory Mode Cable - Boot On USB
301K
5%
11001
ON
OFF
ON
ON
Audio/Video Cable
365K
5%
11010
OFF
OFF
OFF
OFF
Type 2 Charger
442K
5%
11011
OFF
OFF
OFF
OFF
Factory Mode Cable - Boot Off UART
523K
5%
11100
OFF
ON
ON
OFF
Factory Mode Cable - Boot On UART
619K
5%
11101
OFF
ON
ON
ON
Stereo Headset with Remote (Audio Device Type 1)
1000.07K
10%
11110
OFF
OFF
OFF
OFF
Mono/Stereo Headset (Audio Device Type 1)
1002K
10%
11110
OFF
OFF
OFF
OFF
No ID
—
—
11111
OFF
OFF
OFF
OFF
USB Standard Downstream Port
—
—
11111
ON
OFF
OFF
OFF
USB Charging Downstream Port
—
—
11111
ON
OFF
OFF
OFF
Dedicated Charging Port
—
—
11111
OFF
OFF
OFF
OFF
10
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Power-On Reset
When power (from 0 V) is applied to VBAT, an internal power-on reset holds the TSU6111A in a reset condition
until VBAT has reached VPOR. Once VBAT has reached VPOR, the reset condition is released, and the TSU6111A
registers and I2C state machine initialize to their default states.
After the initial power-up phase, VBAT must be lowered to below 0.2 V and then back up to the operating voltage
(VDDIO) for a power-reset cycle.
Software Reset
The TSU6111A has software reset feature.
• Hold low both I2C_SCL and I2C_SDA for more than 30ms to reset digital logic of the TSU6111A.
After resetting the digital logic, INTB will keep low until INT_Mask bit of Control register (0x02) is cleared.
Figure 1. Software Reset
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Standard I2C Interface Details
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. The SCL and SDA lines
must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by the master sending a START condition, a high-to-low transition
on the SDA input/output while the SCL input is high (see Figure 2). After the start condition, the device address
byte is sent, MSB first, including the data direction bit (R/W). This device does not respond to the general call
address. After receiving the valid address byte, the device responds with an ACK, a low on the SDA input/output
during the high of the ACK-related clock pulse.
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 2. Definition of Start and Stop Conditions
The data byte follows the address ACK. The R/W bit is kept low for transfer from the master to the slave. The
data byte is followed by an ACK sent from this device. Data is sent only if complete bytes are received and
acknowledged. The output data is valid at time (tpv) after the low-to-high transition of SCL, during the clock cycle
for the ACK.
On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control
commands (START or STOP, see Figure 3).
SDA
SCL
Data Line
Charge
Figure 3. Bit Transfer
A Stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the
master (see Figure 2).
The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the
receiver can send an ACK bit.
A slave receiver address must generate an ACK after the reception of each byte. The device that acknowledges
has to pull down the SDA line during the ACK clock pulse so that the SDA line is stable low during the high pulse
of the ACK-related clock period (see Figure 4). Setup and hold times must be taken into account.
12
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Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
2
8
9
Clock Pulse for
Acknowledgment
Start
Condition
Figure 4. Acknowledgment on I2C Bus
Writes
Data is transmitted to the TSU6111A by sending the device slave address and setting the LSB to a logic 0 (see
Figure 5 for device address). The command byte is sent after the address and determines which register
receives the data that follows the command byte. The next byte is written to the specified register on the rising
edge of the ACK clock pulse.
SCL
Slave Address
SDA
ST 0
1
0
0
Start
1
Sub Address
0
1
0
A
0
0
0
0
0
Date Byte
0
1
0
Register Address
(Control Reg)
W/R
Ack. from slave
Auto-Inc.
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A SP
Ack
from
slave
Data to Control
Register
Ack
from
slave
Data to Control Register Ack Stop
from
slave
Figure 5. Repeated Data Write to a Single Register
Slave Address
SDA
ST
Start
0
1
0
0
1
Sub Address
0
1
0
A
1
W/R
Ack. from slave
Auto-Inc.
0
0
0
1
0
Date Byte
0
Register Address
(Timing Set 1 Reg)
0
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 A
Ack
from
slave
Data to Timing Set 1
Register
Ack
from
slave
Data to Timing Set 2
Register
Figure 6. Burst Data Write to Multiple Registers
Reads
The bus master must first send the TSU6111A slave address with the LSB set to logic 0. The command byte is
sent after the address and determines which register is accessed. After a restart, the device slave address is
sent again but, this time, the LSB is set to logic 1. Data from the register defined by the command byte then is
sent by the TSU6111A. Data is clocked into the SDA output shift register on the rising edge of the ACK clock
pulse (See Figure 7).
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Slave Address
SDA
ST 0
1
0
0
1
Start
0
Sub Address
1
0
A
0
0
0
W/R
Ack. from slave
Auto-Inc.
0
0
Slave Address
0
1
1
Register Address
(Interrupt 1 Reg)
A RS 0
1
0
0
1
Ack Re-Start
from
slave
Continued
Date Byte
Date Byte
0
1
1
A D7 D6 D5 D4 D3 D2 D1 D0
W/R
Ack. from slave
Data from Interrupt 1 Reg.
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 NA SP
Data from Interrupt 1 Reg.
Ack. from master
Data from Interrupt 1 Reg.
Stop
No Ack. from master (message ends)
Ack. from master
Figure 7. Repeated Data Read from a Single Register – Combined Mode
SCL
Slave Address
SDA
ST 0
1
0
0
1
Start
0
Sub Address
1
0
A
1
0
0
0
0
Slave Address
0
1
1
Register Address
(Interrupt 1 Reg)
W/R
Ack. from slave
Auto-Inc.
A RS 0
Ack Re-Start
from
slave
Date Byte
1
0
0
1
Date Byte
0
1
1
A D7 D6 D5 D4 D3 D2 D1 D0
W/R
Ack. from slave
Data from Interrupt 1 Reg.
Continued
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 NA SP
Data from Interrupt 2 Reg.
Ack. from master
Data from Int Mask 1 Reg.
Stop
No Ack. from master (Message ends)
Ack. from master
Figure 8. Burst Data Read from Multiple Registers – Combined Mode
Slave Address
SDA
ST 0
Start
1
0
0
1
Sub Address
0
1
0
A
0
0
W/R
Ack. from slave
Auto-Inc.
0
0
0
0
Slave Address
1
Register Address
(Interrupt 1 Reg)
1
A SP ST 0
Ack
Start
from Stop
slave
Date Byte
1
0
0
1
0
Date Byte
1
1
A D7 D6 D5 D4 D3 D2 D1 D0
W/R
Ack. from slave
Data from Interrupt 1 Reg.
Continued
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 NA SP
Data from Interrupt 1 Reg.
Ack. from master
Data from Interrupt 1 Reg.
Ack. from master
Stop
No Ack. from master (Message ends)
Figure 9. Repeated Data Read from a Single Register – Split Mode
14
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SCL
Slave Address
SDA ST 0
Start
1
0
0
1
Sub Address
0
1
0
A
1
0
W/R
Ack. from slave
Auto-Inc.
0
0
0
0
Slave Address
1
Register Address
(Interrupt 1 Reg)
1
A SP ST 0
Ack
Start
from Stop
slave
Date Byte
1
0
0
1
0
Date Byte
1
1
A D7 D6 D5 D4 D3 D2 D1 D0
W/R
Ack. from slave
Data from Interrupt 1 Reg.
Continued
Date Byte
A D7 D6 D5 D4 D3 D2 D1 D0 A D7 D6 D5 D4 D3 D2 D1 D0 NA SP
Data from Interrupt 2 Reg.
Ack. from master
Data from Int Mask 1 Reg.
Ack. from master
Stop
No Ack. from master (Message ends)
Figure 10. Burst Data Read from Multiple Registers – Split Mode
Notes (Applicable to Figure 5–Figure 10):
• SDA is pulled low on Ack. from slave or Ack. from master.
• Register writes always require sub-address write before first data byte.
• Repeated data that writes to a single register continues indefinitely until a Stop or a Re-Start.
• Repeated data reads from a single register continues indefinitely until No Ack. from master.
• Burst data writes start at the specified register address, then advance to the next register address, even to
the read-only registers. For these registers, data write appears to occur; however, no data is changed by the
writes. After register 14h is written, writing resumes to register 01h and continues until a Stop or a Re-Start.
• Burst data reads starts at the specified register address, then advances to the next register address. Once
register 14h is read, reading resumes from register 01h and continues until No Ack. from master.
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I2C Register Map (1) (2) (3)
TYPE
RESET
VALUE
Device ID
R
00001010
Control
R/W
xxx11111
Wait
INT Mask
Interrupt 1
R
xxxxxx00
Detach
Attach
ADC_Change
Reserved_
Attach
Charging_A/V
ADC_Change
ADDR
REGISTER
01h
02h
03h
BIT7
BIT6
BIT5
BIT4
BIT3
BIT2
Switch Open
Raw Data
Manual S/W
Version ID
BIT1
BIT0
Vendor ID
04h
Interrupt 2
R
xx0xx000
05h
Interrupt Mask 1
R/W
xxxxxx00
Detach
Attach
R/W
xx0xx000
Reserved_
Attach
Charging_A/V
06h
Interrupt Mask 2
CONNECT
CONNECT
07h
ADC
R
xxx11111
08h
Timing Set 1
R/W
xxxx0000
ADC Value
09h
Timing Set 2
R/W
0000xxxx
0Ah
Device Type 1
R
00000000
USG OTG
Device Wake Up
Switching Wait
DCP
CDP
UART
USG
Audio Type2
Audio Type1
TTY
JIG_UART_
OFF
JIG_UART_
ON
JIG_USB_OFF
JIG_USB_ON
0Bh
Device Type 2
R
00000000
Audio
Type3
0Ch
Button 1
R
00000000
7
6
5
4
3
2
1
Send_End
0Dh
Button 2
R
x0000000
Unknown
Error
12
11
10
9
8
13h
Manual S/W 1
R/W
000000xx
D– Switching
14h
Manual S/W 2
R/W
xxxx00xx
15h
Device Type 3
R
xxxxxx00
VBUS
MHL
(1)
(2)
(3)
16
Audio/Video
PPD
D+ Switching
BOOT_SW
JIG-ON
Do not use blank register bits.
Write “0” to the blank register bits.
Values read from the blank register bits are not defined and invalid.
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Slave Address
NAME
SIZE
(BITS)
Slave address
8
BIT 7
0
BIT 6
1
BIT 5
0
DESCRIPTION
BIT 4
BIT 3
0
1
BIT 2
0
BIT 1
1
BIT 0
R/W
Device ID
Address: 01h
Reset Value: 00010010
Type: Read
BIT NO.
NAME
SIZE (BITS)
DESCRIPTION
2-0
Vendor ID
3
A unique number for vendor 010 for Texas Instruments
7-3
Version ID
5
A unique number for chip version 00001b for TSU6111A
Control
Address: 02h
Reset Value: xxx11111
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
0
INT Mask
1
DESCRIPTION
0: Unmask interrupt
1: Mask interrupt
1
Wait
1
0: Wait until host re-sets this bit(WAIT bit) high
1: Wait until Switching timer is expired
2
Manual S/W
1
0: Manual Switching
1: Automatic Switching
3
RAW Data
1
0: Report the status changes on ID to Host
1: Don't report the status changes on ID
4
Switch Open
1
0: Open all Switches
1: Automatic Switching by accessory status
7-5
Reserved
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Interrupt 1
Address: 03h
Reset Value: xxxxxx00
Type: Read and Clear
BIT NO.
NAME
SIZE (BITS)
0
Attach
1
DESCRIPTION
1: Accessory is attached
1
Detach
1
1: Accessory is detached
7-2
Unused
6
Unused
Interrupt 2
Address: 04h
Reset Value:xx0xx000
Type: Read and Clear
BIT NO.
18
NAME
SIZE (BITS)
DESCRIPTION
0
Charging_A/V
1
1: Charger detected when A/V cable is attached
1
Reserved_Attach
1
1: Reserved Device is attached
2
ADC_Change
1
1: ADC value is changed when RAW data is enabled
4-3
Unused
2
5
Connect
1
7-6
Unused
2
1: Switch is connected(closed)
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Interrupt Mask 1
Address: 05h
Reset Value:xxxxxx00
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
0
Attach
1
DESCRIPTION
0: Unmask Attach Interrupt
1: Mask Attach Interrupt
1
Detach
1
0: Unmask Key press Interrupt
1: Mask Detach Interrupt
7-2
Unused
6
Unused
Interrupt Mask 2
Address: 06h
Reset Value:xx0xx000
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
0
Charging_A/V
1
DESCRIPTION
0: Unmask A/V_Charging Interrupt
1: Mask A/V_Charging Interrupt
1
Reserved_Attach
1
0: Unmask Reserved_Attach Interrupt
1: Mask Reserved_Attach Interrupt
2
ADC_Change
1
0: Unmask ADC_Change Interrupt
1: Mask ADC_Change Interrrupt
4-3
Unused
2
5
Connect
1
7-6
Unused
2
0: Unmask Connect Interrupt
1: Mask Connect Interrupt
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ADC Value
Address: 07h
Reset Value: xxx11111
Type: Read
BIT NO.
NAME
SIZE (BITS)
4-0
ADC value
5
7-5
Unused
3
DESCRIPTION
ADC value read from ID
Timing Set 1
Address: 08h
Reset Value: xxxx0000
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
3-0
Device Wake Up
4
7-4
Unused
4
DESCRIPTION
Device wake up duration
Timing Set 2
Address: 09h
Reset Value: 0000xxxx
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
3-0
Unused
4
7-4
Switching wait
4
DESCRIPTION
Waiting duration before switching
Time Table (1)
(1)
20
SETTING VALUE
DEVICE WAKE UP
SWITCHING WAIT
0000
50 ms
10 ms
0001
100 ms
30 ms
0010
150 ms
50 ms
0011
200 ms
70 ms
0100
300 ms
90 ms
0101
400 ms
110 ms
0110
500 ms
130 ms
0111
600 ms
150 ms
1000
700 ms
170 ms
1001
800 ms
190 ms
1010
900 ms
210 ms
1011
1000 ms
–
1100
–
–
1101
–
–
1110
–
–
1111
–
–
Maximum variation of these timing is ±20%
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Device Type 1
Address: 0Ah
Reset Value: 00000000
Type: Read
BIT NO.
NAME
SIZE (BITS)
0
Audio type 1
1
DESCRIPTION
Audio device type 1
1
Audio type 2
1
Audio device type 2
2
USB
1
USB host
3
UART
1
UART
4
Unused
1
Unused
5
CDP
1
Charging Downstream Port (USB Host Hub Charger)
6
DCP
1
Dedicated Charging Port
7
USB OTG
1
USB on-the-go device
Device Type 2
Address: 0Bh
Reset Value:00000000
Type: Read
BIT NO.
NAME
SIZE (BITS)
0
JIG_USB_ON
1
DESCRIPTION
Factory mode cable
1
JIG_USB_OFF
1
Factory mode cable
2
JIG_UART_ON
1
Factory mode cable
3
JIG_UART_OFF
1
Factory mode cable
4
PPD
1
Phone-powered device
5
TTY
1
TTY converter
6
Audio/Video
1
A/V cable
7
Audio type 3
1
Audio device type 3
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Button 1
Address: 0Ch
Reset Value: 00000000
Type: Read and Clear
BIT NO.
NAME
SIZE (BITS)
0
Send_End
1
DESCRIPTION
Send_End key is pressed
1
1
1
Number 1 key is pressed
2
2
1
Number 2 key is pressed
3
3
1
Number 3 key is pressed
4
4
1
Number 4 key is pressed
5
5
1
Number 5 key is pressed
6
6
1
Number 6 key is pressed
7
7
1
Number 7 key is pressed
Button 2
Address: 0Dh
Reset Value:x0000000
Type: Read and Clear
BIT NO.
NAME
SIZE (BITS)
0
8
1
Number 8 key is pressed
1
9
1
Number 9 key is pressed
2
10
1
Number 10 key is pressed
3
11
1
Number 11 key is pressed
4
12
1
Number 12 key is pressed
5
Error
1
Error key is pressed
6
Unknown
1
Unknown key is pressed
7
Unused
22
DESCRIPTION
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Manual S/W 1
Address: 13h
Reset Value: 000000xx
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
1-0
Unused
2
DESCRIPTION
4-2
D+ Switching
3
000:
001:
010:
011:
Open all switch
D+ is connected to D+ of USB port
Open all switch
D+ is connected to RxD of UART
7-5
D– Switching
3
000:
001:
010:
011:
Open all switch
D– is connected to D– of USB port
Open all switch
D– is connected to TxD of UART
Manual S/W 2
Address: 14h
Reset Value: xxxx00xx
Type: Read/Write
BIT NO.
NAME
SIZE (BITS)
1-0
Unused
2
DESCRIPTION
2
JIG
1
TSU6111A:
0: High Impedance
1: GND
3
BOOT
1
0: Low
1: High
7-4
Unused
4
Device Type 3
Address: 15h
Reset Value: xxxxxx00
Type: Read
BIT NO.
NAME
SIZE (BITS)
DESCRIPTION
0
MHL
2
MHL device
1
VBUS
1
VBUS valid
7-1
Unused
7
Unused
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APPLICATION SCHEMATIC
VDDIO
VBAT
1k Ω ~
10kΩ
AP OR
BASEBAND
1 kΩ ~
10k Ω
VBAT
1kΩ ~
10kΩ
SCL
SCL
SDA
SDA
JIG
JIG
VDDIO
0.1µF
VBUS
INTB
INTB
TxD
TxD
RxD
RxD
TSU6111A
DM_HOST
DM_HOST
DP_HOST
DP_HOST
BOOT
Battery
1µF~
10µF
0.1µF
2.2 Ω
DM_CON
2.2 Ω
DP_CON
1µF~
10µF
1 pF~
10pF 0.1µF
ESD
1p F
ESD
1.7 ~ 3.6V
V+
1 µF~
10µF
MICRO
USB
DN
DP
1p F
ESD
2.2 Ω
ID_CON
1pF
ESD
ID
BOOT
GND
PIN NAME
PIN NO.
GND
CRITICAL COMPONENT
1µF~10µF
VBUS_IN
13
ESD Protection Diode
0.1µF
VDDIO
8
1µF~10µF
0.1µF
1µF~10µF
VBAT
5
Battery
Jig
7
1kΩ
SCL
10
1kΩ
SDA
11
1kΩ
DM_CON
14
DP_CON
15
ID_CON
16
0.1µF
(1)
24
2.2Ω
ESD Protection Diode
2.2Ω
ESD Protection Diode
2.2Ω (1)
ESD Protection Diode
Optional components
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SCHEMATIC GUIDELINES
1. VBUS_IN, VDDIO, and VBAT require 1µF~10µF and 0.1µF decoupling capacitors to reduce noise from circuit
elements. The capacitors act as a shunt to block off the noise. The 0.1µF capacitor smoothes out high
frequencies and has a lower series inductance. The 1µF~10µF capacitors smoothes out the lower
frequencies and has a much higher series inductance. Placing both capacitors will provide better load
regulation across the frequency spectrum.
2. JIG is an open-drain output and therefore requires a 1kΩ ~ 10kΩ pull-up resistor to VBAT.
3. SCL and SDA require 1kΩ ~ 10kΩ pull-up resistors to VDDIO to prevent floating inputs.
4. VBUS_IN, DM_CON, and DP_CON are recommended to have an external resistor 2.2Ω to provide extra
ballasting to protect the chip and internal circuitry.
(a) For ID_CON, if there is less stress on the ID pin then the external 2.2Ω resistor is optional.
5. DM_CON, DP_CON, and ID_CON are recommended to have a 1pF external ESD Protection Diode rated for
8kV IEC protection to prevent failure in case of an 8kV IEC contact discharge.
6. VBUS_IN is recommended to have a 1pF ~ 10pF external ESD Protection Diode rated for 8kV IEC protection
to prevent failure in case of an 8kV IEC contact discharge.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
VBUS_IN
VBUS voltage
4.0
6.5
V
VBAT
VBAT voltage
3.0
4.4
V
VDDIO
VDDIO voltage
1.65
3.6
V
ID_CON_Cap
ID_CON capacitance
1
nF
USB_I/O
USB path signal range
0
3.6
V
Temperature
Operating Temperature
–40
85
°C
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PCB ROUTING GUIDELINES
Routing Guidelines for USB Signal Integrity
1. All the USB lines DP_CON, DM_CON, DP_HT, DM_HT, TxD, and RxD
– Must have 45Ω single ended characteristic impedance
– Must have 90Ω differential ended impedance
– To fulfill USB 2.0 requirements
2. TSU6111A location
– Close to the USB connector as possible
– Keep the distance between the USB controller and the device less than 1 inch
– Shortening the length of the trace will reduce effect of stray noise and radiate less EMI
3. Minimize use of VIAs for USB related signals
– Differential transmission lines should be matched as close as possible
– For optimum USB2.0 performance, use no VIAs
DUT PAD
DECOUPLING
CAPACITORS
45 Degree Turns
on USB signals
MICRO USB
CONNECTOR
USB DP & DM lines
length matched
Place the USB connector as close as
possible to the DUT
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2012
PACKAGING INFORMATION
Orderable Device
TSU6111ARSVR
Status
(1)
ACTIVE
Package Type Package
Drawing
UQFN
RSV
Pins
Package Qty
16
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TSU6111ARSVR
Package Package Pins
Type Drawing
UQFN
RSV
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
12.4
Pack Materials-Page 1
2.1
B0
(mm)
K0
(mm)
P1
(mm)
2.9
0.75
4.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TSU6111ARSVR
UQFN
RSV
16
3000
203.0
203.0
35.0
Pack Materials-Page 2
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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www.ti.com/audio
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amplifier.ti.com
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www.ti.com/computers
DLP® Products
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dsp.ti.com
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interface.ti.com
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logic.ti.com
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www.ti.com/security
Power Mgmt
power.ti.com
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www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
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