TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com Infrared Thermopile Sensor in Chip-Scale Package Check for Samples: TMP006 FEATURES DESCRIPTION • The TMP006 is the first in a series of temperature sensors that measure the temperature of an object without the need to make contact with the object. This sensor uses a thermopile to absorb the infrared energy emitted from the object being measured and uses the corresponding change in thermopile voltage to determine the object temperature. 1 23 • • • • • Complete Solution in 1,6 mm × 1,6 mm Wafer Chip-Scale Package (WCSP) IC (DSBGA) Digital Output: – Sensor Voltage: 7 μV/°C – Local Temperature: –40°C to +125°C SMBus™ Compatible Interface Pin-Programable Interface Addressing Low Supply Current: 240 μA Low Minimum Supply Voltage: 2.2 V Infrared sensor voltage range is specified from –40°C to +125°C to enable use in a wide range of applications. Low power consumption along with low operating voltage makes the part suitable for battery-powered applications. The low package height of the chip-scale format enables standard high volume assembly methods, and can be useful where limited spacing to the object being measured is available. APPLICATIONS • • • • Notebook Case Temperature Comfort Index Measurement Motor Case Temperature Server Farm Power Management Histogram 20 TObject = 20°C TLocal = 20°C 15 Count -3 s +3 s 10 5 0 -3 -2 -1 0 1 2 3 TObject Error (°C) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SMBus is a trademark of Intel Corporation. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com V+ Gain IR Thermopile Sensor 16-Bit DS ADC Digital Control SMBus Compatible Sensor Amplifier Local Temperature DRDY ADR0 ADR1 SCL SDA Voltage Reference TMP006 AGND 2 DGND Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE INFORMATION (1) (1) PRODUCT PACKAGE DESCRIPTION TWO-WIRE ADDRESS PACKAGE DESIGNATOR TMP006YZF WCSP-8 1,6 mm × 1,6 mm WCSP 1000XXX YZF For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) TMP006 MIN Supply voltage V+ Input voltage ADR1 pins Input voltage SDA, SCL, DRDY, ADR0 pins MAX UNIT 7 V –0.5 VS + 0.5 V –0.5 7 V 10 mA Input current Operating temperature range –55 +125 °C Storage temperature range –65 +150 °C +150 °C Junction temperature (TJ max) Human body model (HBM) ESD rating: (1) 2000 V Charged device model (CDM) 500 V Machine model (MM) 200 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. THERMAL INFORMATION TMP006YZF THERMAL METRIC (1) YZF UNITS 8 PINS θJA Junction-to-ambient thermal resistance θJCtop Junction-to-case (top) thermal resistance 69 θJB Junction-to-board thermal resistance 103 ψJT Junction-to-top characterization parameter 4.7 ψJB Junction-to-board characterization parameter 55 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) 123.8 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 3 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com ELECTRICAL CHARACTERISTICS At TA = +25°C, V+ = 3.3 V, and conversion time = 1 sec, unless otherwise specified. TMP006 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT ERROR Ambient temperature sensor Power-supply rejection ratio TA = 0°C to +60°C, V+ = 2.2 V to 5.5 V ±0.5 ±1 TA = –40°C to +125°C, V+ = 2.2 V to 5.5 V ±0.5 ±1.5 Calculate object temperature (1) Field of view °C 0.1 °C/V TObject = +40°C to +60°C, TA = 0°C to +60°C 7 μV/°C TA = +20°C to +60°C, TObject – TA = –10°C to +30°C, V+ = 2.2 V to 5.5 V ±1 50% responsivity 90 Degrees CR2 = 0, CR1 = 0, CR0 = 0 0.25 Seconds CR2 = 0, CR1 = 0, CR0 = 1 0.5 Seconds CR2 = 0, CR1 = 1, CR0 = 0 1 Seconds CR2 = 0, CR1 = 1, CR0 = 1 2 Seconds CR2 = 1, CR1 = 0, CR0 = 0 4 Seconds PSRR Sensor voltage °C ±3 °C TEMPERATURE MEASUREMENT Conversion time Resolution Local temperature sensor Thermopile sensor resolution 0.03125 °C 156.25 nV SMBus COMPATIBLE INTERFACE Logic input high voltage (SCL, SDA) VIH Logic input low voltage (SCL, SDA) VIL 2.1 Hysteresis Output low voltage (SDA) V 0.8 100 VOL IOUT = 6 mA Output low sink current (SDA) 0.15 0.4 6 Logic input current Forced to 0.4 V +1 µA 3.4 MHz 30 35 ms 3 Clock frequency 0.001 Interface timeout 25 V mA –1 Input capacitance (SCL, SDA, A0, A1) V mV pF DIGITAL OUTPUTS Output low voltage (DRDY pin) VOL IOUT = 4 mA 0.15 0.4 V High-level output leakage current IOH VOUT = VDD 0.1 1 µA Output low sink current (DRDY) Forced to 0.4 V 4 mA POWER SUPPLY Power-on reset V+ T = –40°C to +125°C Specified voltage range V+ T = –40°C to +125°C Quiescent current IQ 1.6 2.2 V 5.5 V Continuous conversion; see Table 9 240 325 µA Serial bus inactive, shutdown mode 0.5 1.0 µA Serial bus active, fS = 400 kHz, shutdown mode 90 µA TEMPERATURE RANGE Specified range –40 +125 °C Storage range –65 +150 °C (1) 4 This parameter is tested in a fully-settled setup with no transients, in front of an ideal black body, with specified layout constraints, and after system calibration. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com PIN CONFIGURATION Rows YZF PACKAGE WCSP-8 (Top View, Not to Scale) A A1 A2 A3 B B1 Sensor B3 C C1 C2 C3 2 3 1 Columns PIN DESCRIPTIONS PIN NAME A1 DGND Digital ground A2 AGND Analog ground A3 V+ B1 ADR1 B3 SCL DESCRIPTION Positive supply (2.2 V to 5.5 V) Address select pin Serial clock line for SMBus, open-drain; requires a pull-up resistor to V+ C1 ADR0 Address select pin C2 DRDY Data ready, active low, open-drain; requires a pull-up resistor to V+ C3 SDA Serial data line for SMBus, open-drain; requires a pull-up resistor to V+ Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 5 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and VS = 3.3 V, unless otherwise noted. TYPICAL LOCAL TEMPERATURE ERROR TYPICAL OBJECT TEMPERATURE ERROR 3 4 2.2 V 3.3 V 5.5 V 2.5 2 2 TObject Error (°C) 1.5 3 TA (°C) 1 0.5 0 -0.5 -1 0 -1 -2 -1.5 -2 TA = 20°C TA = 40°C -3 -2.5 -3 1 -40 -25 -10 5 -4 20 35 50 65 80 95 110 125 -20 0 -10 Bath Temperature (°C) 10 20 30 40 TObject - TA (°C) Figure 1. Figure 2. RESPONSIVITY vs ANGLE 100 Responsivity (%) 80 60 Field of View 40 20 0 -20 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (°) Figure 3. 6 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com OVERVIEW The TMP006 is a digital temperature sensor that is optimal for thermal management and thermal protection applications where remote non-contact sensing is desired. The TMP006 is two-wire and SMBus interface compatible, and is specified over the ambient temperature range of –40°C to +125°C. The TMP006 measures object temperatures over a temperature range of –40°C to +125°C. The TMP006 contains registers for holding configuration information, temperature measurement results, and sensor voltage measurement. The ambient temperature measurement and the sensor voltage measurement are used to calculate the object temperature. Refer to the TMP006 User Guide (SBOU107) for more details. The SCL and SDA interface pins require pull-up resistors (10 kΩ, typical) as part of the communication bus, while DRDY is an open-drain output that must also use a pull-up resistor. DRDY may be shared with other devices if desired for a wired-OR implementation. A 0.01-μF power-supply bypass capacitor is recommended, as shown in Figure 4. V+ A3 CF > 0.01 mF B3 SCL B1 Device ADR1 C3 SDA C1 ADR0 C2 DRDY A2 A1 AGND DGND Figure 4. Typical Connection Diagram The TMP006 provides both local temperature and the thermopile sensor voltage outputs in a WCSP. The local temperature sensor in the TMP006 is integrated on-chip; the thermal path runs through the WCSP solder balls. The low thermal resistance of the solder balls provides the thermal path to maintain the chip at the temperature of the local environment. The top side of the WCSP must face the object that is being measured with an unobstructed view in order to accurately measure the temperature. Refer to the user guide TMP006 Layout and Assembly Guidelines (SBOU108) for more details. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 7 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com The TMP006 initially starts up with typical settings consisting of a conversion rate of 1 conversion/second (as specified in the Electrical Characteristics). The internal structure of the digital interface is shown in Figure 5. Pointer Register Result Registers SCL I/O Control Interface Configuration Registers SDA ADR0 ADR1 DRDY Figure 5. Internal Structure SERIAL BUS ADDRESS To communicate with the TMP006, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits and a direction bit that indicates the intent to execute a read or write operation. The TMP006 features two address pins to allow up to eight devices to be addressed on a single bus. Table 1 describes the pin logic levels used to properly connect up to eight devices. The state of the ADR0 and ADR1 pins is sampled on every bus communication and should be set before any activity on the interface occurs. The address pin is read at the start of each communication event. Table 1. TMP006 Address Pins and Slave Addresses ADR1 ADR0 SMBus Address 0 0 1000000 0 1 1000001 0 SDA 1000010 0 SCL 1000011 1 0 1000100 1 1 1000101 1 SDA 1000110 1 SCL 1000111 INTERNAL REGISTERS The TMP006 contains data registers that hold configuration information, temperature measurement results, and status information. Table 2. Register Map (1) POINTER (HEX) (1) 8 REGISTER D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 00h VOBJECT V15 V14 V13 V12 V11 V10 V9 V8 V7 V6 V5 V4 V3 V2 V1 V0 01h TAMBIENT T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 0 02h Configuration RST MOD3 MOD2 MOD1 CR3 CR2 CR1 EN DRDY 0 0 0 0 0 0 0 FEh Manufacturer ID ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 FFh Device ID ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Registers in bold are read-only. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com POINTER REGISTER The TMP006 has an 8-bit pointer used to address a given data register, as shown in Table 3. The pointer identifies which of the data registers should respond to a read or write command on the two-wire bus. This register is set with every write command. A write command must be issued to set the proper value in the pointer before executing a read command. The power-on reset (POR) value of the pointer is 00h; this value selects the thermopile sensor voltage, VOBJECT. Table 3. Pointer Register (Write-Only) Register P7 P6 P5 P4 P3 P2 P1 P0 Reset value 0 0 0 0 0 0 0 0 SENSOR VOLTAGE REGISTER (VOBJECT) The Sensor Voltage Register is a 16-bit result register in binary twos complement format. One least significant bit (LSB) is 156.25 nV. The full-scale value is a ±5.12 mV signal. Data from this register (Table 4) are used in conjunction with the data from the Temperature Register to calculate the object temperature. Table 4 summarizes the Sensor Voltage Register. The equation for the resultant object temperature is discussed in the TMP006 User Guide (SBOU107). Table 4. Sensor Voltage Register (Read-Only) POINTER (HEX) 00h REGISTER D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 VOBJECT V15 V14 V13 V12 V11 V10 V9 V8 V7 V6 V5 V4 V3 V2 V1 V0 Reset value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 9 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com SENSOR VOLTAGE FORMAT The TMP006 provides 16 bits of data in binary twos complement format. The positive full-scale input produces an output code of 7FFFh and the negative full-scale input produces an output code of 8000h. The output clips at these codes for signals that exceed full-scale. Table 5 summarizes the ideal output codes for different input signals. Figure 6 illustrates code transitions versus input voltage. Full-scale is a 5.12 mV signal. The LSB size is 156.25 nV. Table 5. Input Signal versus Ideal Output Code (1) SENSOR SIGNAL OUTPUT CODE FS (215 – 1)/215 (5.12 mV) 7FFFh 15 +FS/2 (1) (156.25 nV) 0001h 0 0 –FS/215 (–156.25 nV) FFFFh –FS (–5.12 mV) 8000h FS = Full-scale value. 7FFFh 0001h 0000h FFFFh ¼ Output Code ¼ 7FFEh 8001h 8000h -FS ¼ 0 ¼ FS Sensor Voltage (AINP - AINN) 15 15 2 -1 2 -1 -FS FS 15 15 2 2 Figure 6. Code Transition Diagram 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com TEMPERATURE REGISTER (TAMBIENT) The Temperature Register of the TMP006 is configured as a 14-bit, read-only register, as shown in Table 6, that stores the result of the most recent conversion for the local die temperature TAMBIENT. Following power-up or a software reset, the Temperature Register reads 0°C (0000h) until the first conversion is complete. Table 6. Temperature Registers (Read Only) POINTER (HEX) 01h REGISTER D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 TAMBIENT T13 T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 0 Reset value 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TEMPERATURE FORMAT The Temperature Register data format of the TMP006 is reported in a binary twos complement signed integer format, as Table 7 shows, with 1 LSB = 1/32°C = 0.03125. Table 7. Temperature Data Format TEMPERATURE (°C) DIGITAL OUTPUT (BINARY) SHIFTED HEX 150 0100 1011 0000 0000 12CO 125 0011 1110 1000 0000 0FA0 100 0011 0010 0000 0000 0C80 80 0010 1000 0000 0000 0A00 75 0010 0101 1000 0000 0960 50 0001 1001 0000 0000 0640 25 0000 1100 1000 0000 0320 0.03125 0000 0000 0000 0100 0001 0 0000 0000 0000 0000 0000 –0.03125 1111 1111 1111 1100 FFFC –0.0625 1111 1111 1111 1000 FFF8 –25 1111 0011 0111 0000 F370 –40 1110 1011 1111 1100 EBFC –55 1110 0100 0111 1100 E47C Converting the integer temperature result of the TMP006 to physical temperature is done by right-shifting the last two LSBs followed by a divide-by-32 of TREG to obtain the physical temperature result in degrees Celsius. TREG is the 14-bit signed integer contained in the corresponding register. The sign of the temperature is the same as the sign of the integer read form the TMP006. In twos complement notation, the MSB is the sign bit. If the MSB is '1', the integer is negative and the absolute value can be obtained by inverting all bits and adding '1'. An alternative method of calculating the absolute value of negative integers is abs(i) = i xor FFFFh + 1. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 11 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com CONFIGURATION REGISTER Table 8 describes the Configuration Register. This register determines the operational modes, conversion rate, DRDY control, initiates a single conversion, performs a software reset, or puts the device into shutdown mode. This register is read/write, and the pointer address is 02h. Table 8. Configuration Register (Read/Write) POINTER (HEX) REGISTER D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Configuration RST MOD2 MOD1 MOD0 CR2 CR1 CR0 EN DRDY 0 0 0 0 0 0 0 Reset value 0 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 02h Bit [15] RST: Software reset bit 0 = Normal operation, this bit self clears 1 = Software reset Bits [14:12] MOD[2:0]: Mode of operation 000 = Power-down 111 = Sensor and ambient continuous conversion (MOD) Bits [11:9] CR[2:0]: ADC conversion rate See Table 9. Bit [8] EN: DRDY enable bit 0 = DRDY pin disabled 1 = DRDY pin enabled Bit [7] DRDY: Data ready bit 0 = Conversion in progress 1 = Object voltage and ambient temperature results are ready to read. A temperature or sensor voltage read or a write to the Configuration Register is required to clear the condition. Bits [6:0] Unused [6:0] The TMP006 can operate in two modes: continuous and shutdown. A software reset function is also available. Selecting the desired operating mode is done by writing to the Configuration Register conversion mode select bits MOD[2:0]. The duration of the analog-to-digital (A/D) conversion is determined by the conversion rate bits CR[2:0] and is listed in Table 9. Continuous mode, on the other hand, performs an A/D conversion followed by a low-power delay in order to reduce the average power consumption. Multiple options for the conversion time and delay time are available in order to select the desired power/noise performance. Initiating power-down has an immediate effect; it aborts the current conversion and puts the device into a low-power shutdown mode. RST, or software reset, is also immediate and initializes all memory locations with the respective reset values. Table 9. Conversion Rate 12 CR2 CR1 CR0 CONVERSION RATE (conv/sec) TOTAL NUMBER OF AVERAGED SAMPLES AVERAGE IQ (μA) 0 0 0 4 1 240 0.5 0 0 1 2 2 240 0.35 0 1 0 1 4 240 0.25 (default) 0 1 1 0.5 8 240 0.18 1 0 0 0.25 16 240 0.125 Submit Documentation Feedback PEAK-PEAK NOISE OF THE TObject RESULT (°C) Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com MANUFACTURER AND DEVICE ID REGISTERS The TMP006 has two registers for identification: manufacturer ID (pointer address FEh) and device ID (pointer address FFh). The manufacturer ID reads 5449h and the device ID is 0060h. Table 10 summarizes these two values. Table 10. Manufacturer and Device ID (Read-Only) POINTER (HEX) FEh FFh REGISTER D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Manufacturer ID ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Reset value 0 1 0 1 0 1 0 0 0 1 0 0 1 0 0 1 Device ID ID15 ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Reset value 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 SERIAL INTERFACE The TMP006 operates only as a slave device on either the two-wire bus or the SMBus interface. Connections to either bus are made via the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP006 supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 3.4 MHz) modes. All data bytes are transmitted MSB first. SERIAL BUS ADDRESS To communicate with the TMP006, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits, and a direction bit that indicate the intent to execute a read or write operation. READ/WRITE OPERATIONS Accessing a particular register on the TMP006 is accomplished by writing the appropriate value to the Pointer Register. The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write operation to the TMP006 requires a value for the pointer (see Figure 7). When reading from the TMP006, the last value stored in the pointer by a write operation is used to determine which register is read by a read operation. To change the register pointer for a read operation, a new value must be written to the pointer. This transaction is accomplished by issuing a slave address byte with the R/W bit low, followed by the pointer byte. No additional data are required. The master can then generate a START condition and send the slave address byte with the R/W bit high to initiate the read command. If repeated reads from the same register are desired, it is not necessary to continually send the pointer bytes because the TMP006 retains the pointer value until it is changed by the next write operation. Note that register bytes are sent MSB first, followed by the LSB. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 13 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com TIMING DIAGRAMS The TMP006 is two-wire and SMBus-compatible. Figure 7 and Figure 8 illustrate the timing for the various operations on the TMP006. Parameters for Figure 7 are defined in Table 11. Bus definitions are given below. Table 11. Timing Diagram Definitions FAST MODE PARAMETER HIGH-SPEED MODE TEST CONDITIONS MIN MAX MIN MAX UNIT SCL operating frequency, VS > 1.7 V 0.001 0.4 0.001 3.4 MHz fSCL SCL operating frequency, VS < 1.7 V 0.001 0.4 0.001 2.75 MHz tBUF Bus free time between STOP and START condition 600 160 ns tHDSTA Hold time after repeated START condition. After this period, the first clock is generated. 100 100 ns tSUSTA Repeated START condition setup time 100 100 ns tSUSTO STOP condition setup time 100 100 ns tHDDAT Data hold time 0 (1) 0 (2) ns tSUDAT Data setup time 100 10 ns tLOW SCL clock low period, VS > 1.7 V 1300 160 ns tLOW SCL clock low period, VS < 1.7 V 1300 200 ns tHIGH SCL clock high period 600 60 ns fSCL tF Clock/data fall time 300 tR Clock/data rise time 300 tR Clock/data rise time for SCLK ≤ 100 kHz 1000 (1) (2) ns 160 ns ns For cases with fall time of SCL less than 20 ns and/or the rise or fall time of SDA less than 20 ns, the hold time should be greater than 20 ns. For cases with a fall time of SCL less than 10 ns and/or the rise or fall time of SDA less than 10 ns, the hold time should be greater than 10 ns. Bus Idle: Both SDA and SCL lines remain high. Start Data Transfer: A change in the state of the SDA line from high to low while the SCL line is high defines a START condition. Each data transfer is initiated with a START condition. Stop Data Transfer: A change in the state of the SDA line from low to high while the SCL line is high defines a STOP condition. Each data transfer terminates with a STOP or a repeated START condition. Data Transfer: The number of data bytes transferred between a START and a STOP condition is not limited and is determined by the master device. The receiver acknowledges the transfer of data. Acknowledge: Each receiving device, when addressed, is obliged to generate an Acknowledge bit. A device that acknowledges must pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the Acknowledge clock pulse. Setup and hold times must be taken into account. On a master receive, data transfer termination can be signaled by the master generating a Not-Acknowledge on the last byte that has been transmitted by the slave. In order for the two-wire bus to operate at frequencies above 400 kHz, the master device must issue a High-speed mode (Hs-mode) master code (0000100X) as the first byte after a START condition to switch the bus to high-speed operation. The TMP006 does not acknowledge this byte, but switches the input filters on SDA and SCL and the output filter on SDA to operate in Hs-mode, allowing transfers at up to 3.4 MHz. After the Hs-mode master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. The bus continues to operate in Hs-mode until a STOP condition occurs on the bus. Upon receiving the STOP condition, the TMP006 switches the input and output filter back to fast-mode operation. 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com 1 9 9 1 SCL ¼ SDA 1 0 0 0 0 0 0 (1) R/W Start By Master P7 P6 P5 P4 P3 P2 P1 P0 ACK By TMP006 ¼ ACK By TMP006 Frame 2 Pointer Register Byte Frame 1 Two-Wire Slave Address Byte 1 9 1 9 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 ACK By TMP006 ACK By TMP006 Frame 3 MSB Stop By Master Frame 4 LSB (1) Slave address 1000000 shown. Slave address changes for the TMP006 depend on the ADR1 and ADR0 pin connection. See Package Information for more details. Figure 7. Two-Wire Timing Diagram for Write Word Format 1 9 1 9 SCL 1 SDA 0 0 0 0 0 0 (1) R/W Start By Master P7 P6 P5 P4 P3 P2 P1 P0 ACK By TMP006 ACK By TMP006 Frame 2 Pointer Register Byte Frame 1 Two-Wire Slave Address Byte 1 9 1 9 SCL (Continued) 1 SDA 0 0 0 0 0 0 (1) R/W Start By Master D7 D6 ACK By TMP006 Frame 3 Two-Wire Slave Address Byte 1 D5 D4 D3 D2 D1 D0 From TMP006 ACK By Master Frame 4 MSB 9 SCL SDA D7 D6 D5 D4 D3 D2 From TMP006 D1 D0 NACK By Master (2) Stop By Master Frame 5 LSB (1) Slave address 1000000 shown. (2) Master must leave SDA high to terminate a two-byte read operation. Figure 8. Two-Wire Timing Diagram for Two-Byte Read Format Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 15 TMP006 SBOS518A – MAY 2011 – REVISED JULY 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (May, 2011) to Revision A Page • Added specifications for ambient temperature sensor parameter over 0°C to +60°C .......................................................... 4 • Revised Table 1 .................................................................................................................................................................... 8 16 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP006 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMP006AIYZFR ACTIVE DSBGA YZF 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-2-260C-1 YEAR TMP006AIYZFT ACTIVE DSBGA YZF 8 250 Green (RoHS & no Sb/Br) SNAGCU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TMP006AIYZFR DSBGA YZF 8 3000 180.0 8.4 TMP006AIYZFT DSBGA YZF 8 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.65 1.65 0.81 4.0 8.0 Q1 1.65 1.65 0.81 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Sep-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP006AIYZFR DSBGA YZF 8 3000 210.0 185.0 35.0 TMP006AIYZFT DSBGA YZF 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connctivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated