101782e.pdf

DATA SHEET
CX77107 PA Module for CDMA / PCS (1850–1910 MHz)
Applications
• Personal Communications
Services (PCS)
• Wireless local loop (WLL)
Features
• Low voltage positive supply
- 3.2 V to 4.2 V
• Good linearity
• High efficiency
• Large dynamic range
• 10-pin package
- 4 mm x 4 mm x 1.5 mm
• Power down control
• Low power-state control
• InGaP
• IS95/CDMA2000
The CX77107 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount module
developed for Personal Communications Service (PCS) and Wireless Local Loop (WLL) applications.
This small and efficient Power Amplifier packs full 1850–1910 MHz bandwidth coverage into a single
compact package. The CX77107 meets the stringent spectral linearity requirements of Code Division
Multiple Access (CDMA) PCS transmission, with high power added efficiency for power output of up to
28 dBm. A low current (VCONT) pin is provided to improve efficiency for the low RF power range of
operation.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage
matching circuits. The output match is realized off-chip within the module package to optimize
efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’
GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply
operation while maintaining high efficiency and good linearity. Primary bias to the CX77107 is
supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output
in the 3 to 4 volt range. Power down is accomplished by setting the voltage on the low current
reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.
• Full U.S. PCS coverage
Figure 1. Functional Block Diagram
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101782E • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • March 3, 2005
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the
CX77107 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 shows the recommended operating
conditions to achieve the performance characteristics listed in
Table 4. Table 3 presents a truth table for the power ranges.
Table 1. Absolute Maximum Ratings (1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
PIN
—
0.0
7.0
dBm
Supply Voltage
VCC
—
3.4
6.0
Volts
Reference Voltage
VREF
—
3.0
3.1
Volts
Case Operating Temperature
TC
–30
25
+110
°C
Storage Temperature
TSTG
–55
—
+125
°C
Maximum
Unit
(1)
No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Minimum
Nominal
Supply Voltage
VCC
3.2
3.4
4.2
Volts
Reference Voltage
VREF
2.95
3.0
3.05
Volts
VCONT
2.5
—
3.0
Volts
Control voltage
Low Mode
High Mode
VCONT
0.0
—
0.5
Volts
Operating Frequency
FO
1850.0
1880.0
1910.0
MHz
Case Operating Temperature
TC
–30
+25
+85
°C
Table 3. Power Range Truth Table
Power Mode
VREF
VCONT
Range
High Power
3.0 V
0.0 V–0.5 V
16 dBm–28 dBm
Low Power
3.0 V
2.5 V–3.0 V
≤ 16 dBm
Shut Down
0.0 V
0.0 V
—
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics
Gain conditions
Symbol
Condition
Min.
Typical
Max.
GLOW
VCONT ≥ 2.5 V
PO = 16 dBm
22.0
24.0
26.5
GHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
26.5
28.0
30.0
PAELOW
VCONT ≥ 2.5 V
PO = 16 dBm
7.5
9.0
—
PAEHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
37.0
39.0
—
ICC_LOW
PO = 16 dBm
—
125
150
ICC_HIGH
PO = 28 dBm
—
475
500
IQ_LOW
VCONT ≥ 2.5 V
—
50
—
IQ_HIGH
VCONT ≤ 0.5 V
—
90
—
Digital Mode
Power Added Efficiency
Digital Mode
Total Supply current
Quiescent current
Unit
dB
%
mA
mA
Reference Current
IREF
—
—
6.0
—
mA
Control Current
ICTRL
VCONT = 2.5 V
—
140
—
µA
Total Supply current in Power-down Mode
IPD
VCC = 3.4V
VREF = 0 V
—
3.0
5.0
µA
ACP1LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–48.0
–45.0
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–50.0
–48.0
ACP3LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–73.0
–58.0
ACP3HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–58.5
–56.5
Second
fO2
PO ≤ 28 dBm
—
–40.0
–35.0
Third
fO3
PO ≤ 28 dBm
—
–55.0
–40.0
Noise Power in RX Band 1930-1990 MHz
RxBN
PO ≤ 28 dBm
—
–138.0
–137.0
dBm/Hz
Noise Figure
NF
—
—
4.0
5.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
—
2.0:1
—
Stability (Spurious output)
S
5:1 VSWR All phases
—
—
–70.0
dBc
Ruggedness – No damage (4)
Ru
PO ≤ 28 dBm
10:1
—
—
VSWR
1.25 MHz offset
Adjacent Channel Power
(2) (3)
2.25 MHz offset
Harmonic Suppression
dBc
dBc
(1)
VCC = +3.4 V, VREF = +3.0 V, Freq = 1880 MHz, TC = 25 °C, unless otherwise specified
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB back-off in output power is
required.
(4)
All phases, time = 10 seconds.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101782E • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • March 3, 2005
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics
Symbol
Condition
Minimum
Maximum
29.5
GLOW
VCONT ≥ 2.5 V
PO = 16 dBm
21.0
GHIGH
VCONT ≤ 0.5 V
PO = 28 dBm
24.5
33.0
ACP1LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–44
ACP1HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–44
ACP3LOW
VCONT ≥ 2.5 V
PO ≤ 16 dBm
—
–56
ACP3HIGH
VCONT ≤ 0.5 V
PO ≤ 28 dBm
—
–56
Second
fO2
PO ≤ 28 dBm
—
–30
Third
fO3
PO ≤ 28 dBm
—
–40
Noise Power in RX Band 1840-1895 MHz
RxBN
PO ≤ 28 dBm
—
–136.0
dBm/Hz
Noise Figure
NF
—
—
7.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
2.5:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
–70.0
dBc
Ruggedness – No damage (5)
Ru
PO ≤ 28 dBm
10:1
—
VSWR
Gain conditions
Digital Mode
1.25 MHz offset
Adjacent Channel Power
(2) (3) (4)
2.25 MHz offset
Harmonic Suppression
dB
dBc
dBc
(1)
Per Table 2, unless otherwise specified.
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB back-off in output power is
required.
(4)
Worst case ACPR is –43dBc at +85 °C, VCC = 3.2 V.
(5)
All phases, time = 10 seconds.
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Unit
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Characterization Data
The graphs from Figure 2 through Figure 10 illustrate the
characteristics of a typical CX77107 power amplifier designed for
operation in the PCS frequency band (1850–1910 MHz). This
amplifier was selected by characterizing a group of devices and
choosing a part with average electrical performance for both
nominal and the full range of recommended operating conditions,
including worst case limits.
The graphs illustrate the digital signal characteristics of the
CX77107. Shown are power sweep characteristics for key
performance parameters over temperature and frequency, up to
28.5 dBm output power. The data was taken up to and including
16 dBm output power with the bias mode control pin setting of
VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set
to zero volts.
Figure 2. Digital Mode Gain vs. Output Power
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Figure 3. Primary Bias Current vs. Output Power
Figure 4. Power Added Efficiency vs. Output Power
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Figure 5. ACP for 1.25 MHz Offset vs. Output Power
Figure 6. ACP for 2.25 MHz Offset vs. Output Power
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Figure 7. Second Harmonic Rejection vs. Output Power
Figure 8. Third Harmonic Rejection vs. Output Power
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Figure 9. Noise Figure as Function of Operating Conditions
Figure 10. Input VSWR as Function of Operating Conditions
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
CX77107, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 11 is the
basic schematic of the board for the 1850 MHz to 1910 MHz
range and Figure 12 is a diagram of the board assembly.
Figure 11. CX77107 Evaluation Board Schematic
Figure 12. CX77107 Evaluation Board Assembly Diagram
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Package Dimensions and Pin Descriptions
The CX77107 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 13 is a mechanical
drawing of the pad layout for this package. Figure 14 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals. Figure 15 illustrates typical case markings. Figure 16
shows the pin numbering convention, which starts with pin 1 in
the upper left and increments counter-clockwise around the
package. Table 6 lists each pin function and description.
Figure 13. CX77107 Package Drawing
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Figure 14. Phone PCB Layout for 4 x 4 mm Package –CX77105
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PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
DATA SHEET • CX77107
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
Figure 15 Typical Case Markings (Top View)
The CX77107 is capable of withstanding an MSL3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 240 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 16. Pin Configuration (Top View)
Table 6. Pin Names and Descriptions
PIN Number
(1)
Function
(1)
Description
1
VCC1
2
RF_IN
RF Input
3
GND
Ground
4
VCONT
Control voltage
5
VREF
Reference voltage
6
GND
Ground
7
GND
Ground
8
RF_OUT
RF Output
9
GND
Ground
10
VCC2
GND PAD
GND
(1)
Connect to battery or DC supply
Connect to battery or DC supply
Ground pad on underside of package
All supply pins may be connected together at the supply.
The CX77107 is a Class I device. Figure 17 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pin of the
CX77107 product. The numbers in Figure 17 specify the ESD
threshold level for each non-ground pin where the I-V curve
between the pin and ground starts to show degradation.
The ESD testing was performed in compliance with MIL-STD883E Method 3015.7 using the Human Body Model. If ESD
damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely nonfunctional”. Skyworks employs most stringent criteria; fails
devices as soon as the pin begins to show any degradation on a
curve tracer. To avoid ESD damage, both latent and visible, it is
very important that the product assembly and test areas follow
the Class-1 ESD handling precautions listed in Table 7.
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DATA SHEET • CX77107
PA MODULE FOR CDMA / PCS (1850–1910 MHZ)
Table 7. Precautions for Handling GaAs IC-based Products to
Avoid Induced Damage
Figure 17. ESD Sensitivity Areas (Top View)
Personnel Grounding
Wrist Straps
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Facility
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Static Sensors
Protective Packaging
and Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Protective Work Order Holders
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Ordering Information
Model Number
Manufacturing Part Number
Product Revision
Package
Operating Temperature
CX77107
CX77107-14P
-14P
4x4LM–10
–30 °C to +85 °C
Level
Date
Revision History
Revision
Description
A
July 3, 2003
Initial Release
B
April 29, 2004
Revise: Table 4
C
September 27, 2004
Add: Product Revision
D
December 8, 2004
Revise: Figure 11
E
March 3, 2005
Add: Figure 14
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel Information–RF Modules, Document Number 101568
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020
© 2001–2005, Skyworks Solutions, Inc. All Rights Reserved.
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used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product
descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties
arising from future changes to its products and product descriptions.
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