AVAGO HDJD-S822

HDJD-S822-QR999
RGB Color Sensor
Data Sheet
Description
Features
HDJD-S822-QR999 is a high performance, small in size,
cost effective light to voltage converting sensor. The
sensor combines a photodiode array and three transimpedance amplifiers in a single monolithic CMOS IC
solution. With a Red (R), Green (G) and Blue (B) color filters
coated over the photodiode array, the sensor converts
RGB light to analog voltage outputs, denoted by VROUT,
VGOUT and VBOUT, respectively. The sensor is packaged
in a 5x5x0.75 [mm] surface mount QFN-16 package.
• Convert light to R,G,B voltage output
Applications
• Ideal choice of for open loop and closed loop color
identification
• Potential applications are such as general color
detection, industrial process, environmental lighting,
cabin lighting, decorative lighting and etc.
• Monolithic CMOS IC solution comprises of an array
of photodiode coated with R,G, B color filter and
integrated with trans-impedance amplifier
• Independent gain selection options for each R,G,B
channel
• Uniform photodiode array design to minimize
the effect of contamination and optical aperture
misalignment
• Robust package and small in size (5x 5x 0.75 mm)
Package Dimensions
Note: Dimensions are in millimeters (mm)
Part Numbering Systems
HDJD-S 8 X X - X X X X X
Gain Selection (GS) Option
999: GS 00, 01, 10 or 11
Packing Type
R: Tape and Reel
Product Packaging
Q: QFN
Product ID
2: 2 Component without IR filter
Pin Out for HDJD-S822-QR999
Pin
Pin Name
Normal Operation
Pin 1
VDD5
5 V DC Supply
Pin 2
GND
Ground
Pin 3
GSGRN0
Gain Selection Green bit 0
Pin 4
VDD3
3.3V DC output test pin. To be connected to a decoupling capacitor of 100nF to ground is recommended
Pin 5
TEST_EN
Tie to VDD3 via a 10kΩ pull up resistor
Pin 6
GSRED1
Gain Selection Red bit 1
Pin 7
NC
No connection
Pin 8
GSGRN1
Gain Selection Green bit 1
Pin 9
VR OUT
Analog output voltage for RED
Pin 10
VG OUT
Analog output voltage for GREEN
Pin 11
GSBLUE0
Gain Selection Blue bit 0
Pin 12
VB OUT
Analog output voltage for BLUE
Pin 13
GSBLUE1
Gain Selection Blue bit 1
Pin 14
NC
No connection
Pin 15
NC
No connection
Pin 16
GSRED0
Gain Selection Red bit 0
Theory of Operation
The integral R,G,B color filters on the photodiode array detect the R,G,B components of the light falling on the sensor.
The photodiode convert the R,G,B light components into photocurrents. The integrated transimpedence amplifiers
for R,G,B components then converts the photocurrent to analog voltage outputs. The voltage output of each R,G,B
channel increases linearly with increasing light intensity.
Sensor IC Block Diagram
Absolute Maximum Ratings [1,2]
Parameter
Symbol
Min
Max
Unit
Supply Voltage
VDD5
4.5
5.5
V
Storage Temperature
TS
-20
85
°C
Operating Temperature
TA
-20
85
°C
Human Body Model ESD Rating
ESD HBM
2
kV
Notes
Reference to JESD22-A114-B
Note:
1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2. Unless otherwise specified, voltages are referenced to ground.
Recommended Operating Conditions
Parameter
Symbol.
Min
Typ
Max
Units
Operating Temperature
TA
0
25
70
°C
Supply Voltage
VDD
5.0
Note
V
A decoupling capacitor of 100nF
between VDD and ground is
recommended.
Operating Conditions and Electrical Requirements
Electrical Characteristics at VDD = 5V, TA = 25°C, RL = 68kW
Parameter
Symbol
Conditions
Dark voltage
VD
Ee = 0
Maximum output voltage swing
VO MAX
Supply current
IDD
Ee = 0
Parameter
Symbol
Remark
Re
GS:00 lP = 460 nm [1]
1.54
GS:00 lP = 542 nm [2]
(Green Channel)
2.05
GS:00 lP = 645 nm [3]
(Red Channel)
2.73
GS:11 lP = 460 nm [1]
(Blue Channel)
0.77
GS:11 lP = 542 nm [2]
(Green Channel)
1.03
GS:11 lP = 645 nm [3]
(Red Channel)
1.37
GS:01 lP = 460 nm [1]
(Blue Channel)
0.39
GS:01 lP = 542 nm [2]
(Green Channel)
0.51
GS:01 lP = 645 nm [3]
(Red Channel)
0.68
GS:10 lP = 460 nm [1]
(Blue Channel)
0.21
GS:10 lP = 542 nm [2]
(Green Channel)
0.27
GS:10 lP = 645 nm [3]
(Red Channel)
0.36
Irradiance Responsivity
Min
Min
Typ
Max
Unit
15
mV
3
V
3
mA
Typ
Max
Unit
V/(mW/cm2)
(Blue Channel)
Irradiance Responsivity
Irradiance Responsivity
Irradiance Responsivity
Re
Re
Re
V/(mW/cm2)
V/(mW/cm2)
V/(mW/cm2)
Parameter
Symbol
Saturation Irradiance [4]
Saturation Irradiance [4]
Saturation Irradiance [4]
Saturation Irradiance [4]
Output Rise Time
tr
Output Fall Time
tf
Remark
Min
Typ
GS:00 lP = 460 nm [1]
(Blue Channel)
1.95
GS:00 lP = 542 nm [2]
(Green Channel)
1.46
GS:00 lP = 645 nm [3]
(Red Channel)
1.10
GS:11 lP = 460 nm [1]
(Blue Channel)
3.90
GS:11 lP = 542 nm [2]
(Green Channel)
2.93
GS:11 lP = 645 nm [3]
(Red Channel)
2.20
GS:01 lP = 460 nm [1]
(Blue Channel)
7.79
GS:01 lP = 542 nm [2]
(Green Channel)
5.85
GS:01 lP = 645 nm [3]
(Red Channel)
4.40
GS:10 lP = 460 nm [1]
(Blue Channel)
14.61
GS:10 lP = 542 nm [2]
(Green Channel)
10.98
GS:10 lP = 645 nm [3]
(Red Channel)
8.24
GS:10 to GS11
Test Condition: Refer to note [5]
15
GS:00
Test Condition: Refer to note [5]
110
GS:10 to GS11
Test Condition: Refer to note [5]
15
GS:00
Test Condition: Refer to note [5]
120
Notes:
1. Test condition: using blue diffuse light of peak wavelength (lP)
460nm and spectral half width (Δl½) 20nm as light source.
2. Test condition: using green diffuse light of peak wavelength (lP)
542nm and spectral half width (Δl½) 35nm as light source.
3. Test condition: using red diffuse light of peak wavelength (lP)
645nm and spectral half width (Δl½) 20nm as light source.
4. Saturation irradiance = (Max output voltage swing)/(Irradiance
responsivity)
5. Test condition: The rise and fall time is measured with RC lowpass
filter added to sensor output:
Gain Selection
Rext
Cext
GS:01 to GS:11
3.6kΩ
1nF
GS:00
36kΩ
1nF
Max
Unit
mW/cm2
mW/cm2
mW/cm2
mW/cm2
ms
ms
Test Circuit
RED CHANNEL
R
RED CHANNEL
SIGNAL
GENERATOR
+
+
-
C
VRout
Rext
LED
RC LOWPASS FILTER
TEST CIRCUIT
FOR ILLUSTRATION PURPOSE, ONLY RED CHANNEL IS SHOWN.
THE SAME CIRCUIT APPLIES TO GREEN AND BLUE CHANNELS.
Remarks: For illustration purpose, only red channel is shown. The same
circuit applies to green and blue channel.
Vout
Cext
Gain Selection Feedback Resistor Table
GSRED1
GSRED0
GSGRN1
GSGRN0
GSBLUE1
GSBLUE0
Feedback Resistor
0
0
0
0
0
0
3.00 MΩ
0
1
0
1
0
1
0.75 MΩ
1
0
1
0
1
0
0.40 MΩ
1
1
1
1
1
1
1.50 MΩ
Notes:
1. Gains selections, GS: Bit 1 Bit 0 are applicable for each Red, Green and blue Channel.
2. Gain selections for each channel can be selected independently of each other.
3. Feedback resistor value is proportional to responsivity. Refer to block diagram below.
4. 0 indicates that the pin is connected to ground. 1 indicates no connection.
FEEDBACK RESISTOR
GS (1:0)
RF
CF
+
TRANSIMPEDANCE AMP
Typical Characteristics
1
Red
RELATIVE RESPONSITIY
0.8
Green
0.6
Blue
0.4
0.2
0
400
450
500
550
600
WAVELENGTH (nm)
Figure 1. Spectral Responsivity
Note:
Test condition is when Gain Selection Jumpers are set to
GSBLUE1 = 0
GSGRN1 = 0
GSRED1 = 0
GSBLUE0 = 0
GSGRN0 = 0
GSRED0 = 0
In which 0 = connect to Ground, 1 = no connection.
Refer to Gain Selection Feedback Resistor Table.
650
700
750
20
3
16
14
12
10
8
6
4
-20
0
20
40
60
TA - Operating Temperature (°C)
GS:01
1.5
GS:10
1
0
80
3
3
Voltage Output - Vo (V)
GS:01
1.5
GS:10
1
0.5
0
4
GS:00
2.5
GS:11
2
2
6
8
10
12
14
Figure 3. Voltage output of blue channel vs irradiance (lp = 460 nm)
GS:00
2.5
0
Irradiance - Ee (mW/cm 2 )
Figure 2. Dark Voltage vs Operating Temperature
Voltage Output - Vo (V)
GS:11
2
0.5
2
0
GS:00
2.5
Voltage Output - Vo (V)
V D - Dark Voltage (mV)
18
GS:11
GS:01
2
GS:10
1.5
1
0.5
0
2
4
6
8
10
0
12
Irradiance - Ee (mW/cm 2 )
0
2
4
6
Irradiance - Ee (mW/cm 2 )
8
10
Figure 5. Voltage output of red channel vs irradiance (lp = 645 nm)
Figure 4. Voltage output of green channel vs irradiance (lp = 542 nm)
Recommended Reflow Profile
It is recommended that Henkel Pb- free solder paste LF310 be used for soldering HDJD-S822-QR999. Below is the recommended reflow profile.
T-peak
T-reflow
230 ± 5°C
218°C
TEMPERATURE
DELTA-FLUX = 2 °C/sec. max.
T-max.
T-min.
DELTA-COOLING = 2°C/sec. max.
160°C
120°C
DELTA-RAMP =
1°C/sec. max.
40-60 sec. max.
20-40 sec. max.
t-pre
t-reflow
TIME
Figure 6. Recommmended Reflow Soldering Profile
16 Lead QFN Recommended PCB Land Pad Design
IPC-SM-782 is used as the standard for the PCB land pad design. Recommended PCB finishing is Gold.
0.8 mm
0.4 mm
0.8 mm
3.19 mm
5.5 mm
3.19 mm
3.9 mm
5.5 mm
16 Lead QFN Recommended Stencil Design
A stencil thickness of 2.18mm (6 mils) for this QFN package is recommended.
0.8 mm
0.4 mm
0.8 mm
∅ 2.18 mm
Recommendations for Handling and Storage of HDJD-S822-QR999
This product is qualified as Moisture Sensitive Level 4
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note
AN5305 Handling Of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
• Unopened moisture barrier bag (MBB) can be stored
at 30°C and 90%RH or less for maximum 1 year
• It is not recommended to open the MBB prior to
assembly (e.g. for IQC)
• It should also be sealed with a moisture absorbent
material (Silica Gel) and an indicator card (cobalt
chloride) to indicate the moisture within the bag
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of MBB
C. Control for unfinished reel
• For any unused components, they need to be stored
in sealed MBB with desiccant or desiccator at <5%RH
D. Control of assembled boards
• If the PCB soldered with the components is to be
subjected to other high temperature processes, the
PCB need to be stored in sealed MBB with desiccant or
desiccator at <5%RH to ensure no components have
exceeded their floor life of 72hrs
E. Baking is required if:
• “10%” or “15%” HIC indicator turns pink
• The components are exposed to condition of
>30°C/60%RH at any time.
• The components floor life exceeded 72hrs
• Recommended baking condition (in component form):
125°C for 24hrs
• The components must be kept at <30°C/60%RH at
all time and all high temperature related process
including soldering, curing or rework need to be
completed within 72hrs
Package Tape & Reel Dimensions
4.00 ± 0.10
SEE NOTE #2
∅1.55 ± 0.05
2.00 ± 0.05
SEE NOTE #2
B
R 0.50 TYP.
1.75 ± .10
5.50 ± 0.05
12.00 ± 0.10
Bo
A
Ko
A
8.00 ± 0.10
B
∅1.50 (MIN.)
SECTION B-B
Ao
0.30 ± 0.05
SECTION A-A
NOTES:
1. A o AND B o MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULA TIVE TOLERANCE IS ± 0.2 mm.
3. DIMENSIONS ARE IN MILLIMETERS (mm).
10
A o:
B o:
Ko:
PITCH:
WIDTH:
5.30
5.30
2.20
8.00
12.00
65°
+1.5*
12.4 -0.0
45°
R10.65
R5.2
45°
� 55.0 ± 0.5
∅ 178.0 ± 0.5
� 176.0
EMBOSSED RIBS
RAISED: 0.25 mm
WIDTH: 1.25 mm
BACK VIEW
∅ 512
NOTES:
1. *MEASURED A T HUB AREA.
2. ALL FLANGE EDGES TO BE ROUNDED.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0110EN - February 27, 2007
18.0 MAX.*