HDJD-J822 Color Management System Feedback Controller Data Sheet Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC. Avago Technologies tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago Technologies parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: TJ(°C) = TA(°C) + θJAPAVG where: TA = ambient temperature in °C θJA = thermal resistance of junction-to-ambient in °C/ Watt PAVG = average power dissipated in Watt The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.7eV. Table 1. Life Tests Demonstrated Performance Test Name High Temperature Operating Life Performance in Time (60% confidence) Stress Test Conditions Total Device Hrs Units Tested Units Failed MTBF [1] Failure Rate [2] (FIT) TA = 85°C, AVdd = 5.5V, DVdd = 5.5V 231,000 231 0 2.52 x 105 3968 Table 2. Performance in Time (60% Confidence) Performance in Time (90% Confidence) Ambient Temperature (°C) Junction Temperature [3] (°C) MTBF [1] (hrs) Failure Rate [2] (FIT) MTBF (hrs) Failure Rate (FIT) 85 87 2.52 x 105 3968 1.00 x 105 9970 75 82 4.81 x 105 2080 1.91 x 105 5225 65 77 9.52 x 105 1050 3.79 x 105 2638 55 57 1.97 x 106 508 7.83 x 105 1277 45 47 4.25 x 106 235 1.69 x 106 591 35 37 9.65 x 106 104 3.84 x 106 260 27 2.32 x 107 43 9.22 x 106 108 25 Notes: 1. The 60% or 90% confidence MTBF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples. The confidence level is established based on the chi-square distribution. 2. Failure rate (FIT) is 1/MTBF x 109, assuming the failures are exponentially distributed. 3. Calculated from data generated at 85°C biased at DVdd 5.5V, AVdd 5.5V and θJA = 45°C/watt Table 3. Environmental Tests Test Name Test Conditions Units Tested Units Failed Temperature Cycle -65°C/+150°C, 500 cycles 231 0 HAST 130°C/85%RH, 96 hrs 231 0 Autoclave 121°C, 15psig, 96 hrs 231 0 High Temperature Storage 150°C, 1000hrs 45 0 Table 4. Electrostatic Discharge (ESD) Classification Test Results: Test Name Reference Results ESD Human Body Model MILSTD 883, Method 3015 2000V ESD Machine Model MILSTD 883, Method 3015 200V Latch up at 125°C AEC-Q100-004 Pass (+/-100mA) Moisture Sensitivity Classification: Class 3 Pre-conditioning per JESD22-A113-A class 3 was performed on all devices prior to reliability testing except for High Temperature Operating Life and electrical verification test. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. 5989-4106EN - April 21, 2006