3 V SILICON MMIC L-BAND FREQUENCY DOWN CONVERTER FEATURES UPC8112TB INTERNAL BLOCK DIAGRAM • HIGH DENSITY SURFACE MOUNTING: 6 Pin Super Minimold or SOT-363 Package IF Output RF Input • BROADBAND OPERATION: RF = 0.8 to 2.0 GHz IF = 100 to 300 MHz • INPUT IP3: -7 dBm • POWER SAVE FUNCTION POWER SAVE • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V DESCRIPTION LO Input NEC's UPC8112TB is a silicon RFIC manufactured using the NESAT III process. This device consists of a mixer, an IF amplifier and a LO buffer amplifier. This device is suitable as a 1st IF downconverter for the receiver stage of cellular and other wireless systems. The UPC8112TB is pin compatible and has comparable performance as the larger UPC8112T, so VCC GND it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = VPS = 3.0 V, PLO = -10 dBm) SYMBOLS ICC fRFin fIFout CG NF P1dB PSAT IIP3 LORF LOIF RFLO RTH(JA) PART NUMBER PACKAGE OUTLINE PARAMETERS AND CONDITIONS Circuit Current (no input signal) VCC = 3.0 V VPS = 0.5 V RF Frequency Response IF Frequency Response1 Conversion Gain fRFin = 900 MHz, fLOin = 1000 MHz fRFin = 1.5 GHz, fLOin = 1.6 GHz fRFin = 1.9 GHz, fLOin = 1.66 GHz Single Side Band Noise Figure (SSB) fRFin = 900 MHz, fLOin = 1000 MHz fRFin = 1.5 GHz, fLOin = 1.6 GHz fRFin = 1.9 GHz, fLOin = 1.66 GHz Output Power at 1 dB gain compression, fRFin = 1.9 GHz fLOin = 1.66 GHz Saturated Output Power fRFin = 900 MHz, fLOin = 1000 MHz fRFin = 1.9 GHz, fLOin = 1.66 GHz (PRFin = -10 dBm) Input 3rd Order Intercept Point, fRFIN = 900 MHz, fLOIN = 1000 MHz fRFin = 1.5 GHz, fLOin = 1.6 GHz fRFin = 1.9 GHz, fLOin = 1.66 GHz LO Leakage at RF pin, fRFin = 900 MHz, fLOin = 1000 MHz fRFin = 1.5 GHz, fLOin = 1.6 GHz fRFin = 1.9 GHz, fLOin = 1.66 GHz LO Leakage at IF pin, fRFin = 900 MHz, fLOin = 1000 MHz fRFin = 1.5 GHz, fLOin = 1.6 GHz fRFin = 1.9 GHz, fLOin = 1.66 GHz UNITS mA µA GHz MHz dB dB dB MIN 4.9 0.8 100 11.5 9.5 dB dB dB dBm dBm dBm UPC8112TB S06 TYP 8.5 1.9 250 15 13 13 9.0 11 11.2 -6.5 -7 15.5 11 13.2 -5 -2.5 -3 dBm dBm dBm dBm dBm dBm dBm dBm dBm -10 -9 -7 -45 -46 -45 -32 -33 -30 RF Leakage at LO Pin fRFin = 900 MHz, fLOin = 1000 MHz2 fRFin = 1.5 GHz, fLOin = 1.6 GHz2 fRFin = 1.9 GHz, fLOin = 1.66 GHz2 dBm dBm dBm -80 -57 -55 Thermal Resistance (Junction to Ambient) Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB °C/W Notes: 1. External matching required. MAX 11.7 0.1 2.0 300 17.5 325 2. PRFin = -30 dBm California Eastern Laboratories UPC8112TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS PARAMETERS UNITS RATINGS RECOMMENDED OPERATING CONDITIONS VCC Supply Voltage V 3.6 SYMBOLS ICC Circuit Current mA 77.7 VCC Supply Voltage Dissipation2 PD Power TOP Operating Temperature TSTG Storage Temperature PARAMETERS UNITS MIN V TYP MAX 2.7 3.0 3.3 +85 mW 200 TOP Operating Temperature °C -40 +25 °C -40 to +85 PLOin LO Input Level dBm -15 -10 0 -55 to +150 fRFin RF Input Frequency GHz 0.8 1.9 2.0 fIFout IF Output Frequency MHz 100 250 300 °C Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C). PIN FUNCTIONS Pin No. Symbol Pin Voltage 5 VCC 2.7 ~ 3.3 Supply Voltage pin. Connect a bypass capacitor (e.g., 1000 pF) to minimize ground impedance. 6 IFOUT Same as VCC voltage through external inductor IF output pin is an open collector with high impedance. External LC matching circuit is required. 1 RFIN Description 1.2 RF input pin to mixer. Mixer is a double balanced Gilbert cell type. Input RF signal to the pin with a 50 Ω source impedance through a coupling capacitor. Ground pin. Must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 2 GND 0 3 LOIN 1.4 LO input pin to a differential buffer amplifier. Input LO signal through a coupling capacitor. Recommended input level: -15 to 0 dBm. Internal Equivalent Circuit 5 6 from LO AMP 1 2 5 } tomixer 3 2 4 VPS VCC or GND Power-save control pin. Voltage on this pin controls ON/OFF operation as follows: 5 4 Operation VPS ON OFF ≥2.5 V 0-0.5 V 2 UPC8112TB TYPICAL APPLICATION EXAMPLE PCS or DIGITAL CELLULAR µ PC8112T RX DEMOD .. N VCO PLL I Q PLL SW I 90˚ TX PA Q TEST CIRCUIT (TOP VIEW) 50 Ω POWER SAVE 3 LOin PS 4 2 GND Vcc 5 C2 3V C3 L1 50 Ω 1 C1 RFin IFout 50 Ω 6 C4 Note: 1. C1, C2, C3 are 1,000 pF capacitors. 2. L1 and C4 are matching elements. L1 = 100nH and C4 = 2.7 pF for fIF = 240 MHz UPC8112TB LEAD CONNECTIONS OUTLINE DIMENSIONS (Units in mm) (Top View) PACKAGE OUTLINE S06 (Bottom View) 3 1.25±0.1 2.0±0.2 0.65 3 4 0.65 2 5 0.2 +0.1 -0 2 1.3 C2K 2.1±0.1 1 1 4 4 3 5 5 2 6 6 1 6 DOT ON BOTTOM SIDE 0.9 ± 0.1 1. RFIN 2. GND 3. LOIN 4. PS 5. VCC 6. IFOUT 0.7 +0.1 0.15 -0.5 0 ~0.1 RECOMMENDED P.C.B. LAYOUT (Units in mm) Note: All dimensions are typical unless otherwise specified. ORDERING INFORMATION PART NUMBER UPC8112TB-E3-A QTY 3K/Reel Note: 3.10 Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out direction. 4 3 0.95 2 5 1 6 0.5 MIN 1.0 MIN 1.0 MIN Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM PRINTED IN USA ON RECYCLED PAPER -1/99 DATA SUBJECT TO CHANGE WITHOUT NOTICE 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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