CEL UPG158TB

NEC's ½W
UPG158TB
L, S-BAND SPDT SWITCH
FEATURES
DESCRIPTION
• SWITCH CONTROL VOLTAGE:
Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
NEC's UPG158TB is a GaAs MMIC L, S-band SPDT (Single
Pole Double Throw) switch developed for mobile phone and
L, S-band applications.
• LOW INSERTION LOSS:
LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V
LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0 V
LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
• HIGH ISOLATION:
ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V
ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
This device can operate from 0.5 to 2.5 GHz, with low insertion
loss and high isolation.
This device is housed in a 6-pin super minimold package. And
this package is able to high-density surface mounting.
APPLICATIONS
• L-band digital cellular or cordless telephone
• POWER HANDLING:
Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V
• PCS, W-LAN, WLL and BluetoothTM
• Short Range Wireless
• HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
ORDERING INFORMATION
Part Number
Package
Marking
UPG158TB-E3
6-pin super minimold
G1M
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales ofÞce.
Part number for sample order: UPG158TB
Caution
Observe precautions when handling, because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
UPG158TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
4 3
G1M
3
(Top View)
2
1
(Bottom View)
4 4
5 2
3
5 5
6 1
2
6 6
1
TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
High
ON
OFF
High
Low
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise speciÞed)
Parameter
Switch Control Voltage
Symbol
Ratings
Unit
Vcont
−6.0 to +6.0 Note 1
V
Input Power
Pin
+28
dBm
Power Dissipation
PD
150 Note 2
mW
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Notes 1. | Vcont1 − Vcont2 | ≤ 6.0 V
2. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB,
TA = +85°C
RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise speciÞed)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.5
3.0
5.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont2
5
INPUT
6
Vcont1
UPG158TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞed)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
LINS1
f = 0.5 to 1.0 GHz
−
0.30
0.55
dB
Insertion Loss 2
LINS2
f = 2.0 GHz
−
0.40
0.65
dB
Insertion Loss 3
LINS3
f = 2.0 to 2.5 GHz
−
−
0.90
dB
Isolation 1
ISL1
f = 0.5 to 2.0 GHz
22
27
−
dB
Isolation 2
ISL2
f = 2.0 to 2.5 GHz
18
−
−
dB
Input Return Loss 1
RLin1
f = 0.5 to 2.0 GHz
13
19
−
dB
Input Return Loss 2
RLin2
f = 2.0 to 2.5 GHz
11
−
−
dB
Output Return Loss 1
RLout1
f = 0.5 to 2.0 GHz
13
19
−
dB
Output Return Loss 2
RLout2
f = 2.0 to 2.5 GHz
11
−
−
dB
1 dB Loss Compression
Input Power Note
Pin (1 dB)
f = 1.0 GHz
+22.0
+26.5
−
dBm
Switch Control Speed
tSW
−
50
200
ns
Switch Control Current
Icont
−
0.5
10
A
Note Pin (1 dB) is measured the input power level when the insertion loss increases 1 dB more than that of linear range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞed)
Parameter
0.1 dB Loss Compression
Input Power Note
Symbol
Pin (0.1 dB)
Test Conditions
f = 1.0 GHz
MIN.
TYP.
MAX.
Unit
−
+23.0
−
dBm
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases 0.1 dB more than that of linear range.
Caution
It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching
speed and the condition with the actual board of your system. The range of recommended DC blocking capacitor value is
less than 100 pF.
UPG158TB
EVALUATION CIRCUIT
(Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF)
Vcont2
INPUT
Vcont1
51 pF
1 000 pF
4
3
51 pF
OUTPUT2
5
2
1 000 pF
6
1
51 pF
OUTPUT1
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
UPG158TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont1
6pin SMM SPDT SW
Vc1
OUTPUT1
C2
C
2
C
4
OUT 1
C1
G1M
INPUT
C3
C1
C1
IN
C
C
1
5
C2
OUT 2
OUTPUT2
Vc2
Vcont2
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
51 pF
1 000 pF
5-144
UPG158TB
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, Pin = 0 dBm, unless otherwise speciÞed)
OUT1
IN
OUT2
50 Ω
IN-OUT1
INPUT RETURN LOSS vs. FREQUENCY
10 dB/ REF 0 dB
MARKER 1
1 GHz
0
1
-20
4
-30
3
0
-10
-20
1
2
-40
STOP 3.300 000 000 GHz
START 0.300 000 000 GHz
3
4
STOP 3.300 000 000 GHz
Frequency f (GHz)
IN-OUT1
INSERTION LOSS vs. FREQUENCY
IN-OUT1
OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/ REF 0 dB
CH1 S22
1: -0.574 dB
1 GHz
2: -0.662 dB
1.5 GHz
3: -0.795 dB
2 GHz
4: -1.111 dB
2.5 GHz
MARKER 1
1 GHz
-1
1: -28.047 dB
1 GHz
2: -28.565 dB
1.5 GHz
3: -25.835 dB
2 GHz
4: -22.507 dB
2.5 GHz
Frequency f (GHz)
CH1 S21
0
10 dB/ REF 0 dB
-30
2
START 0.300 000 000 GHz
log MAG
MARKER 1
1 GHz
-10
-40
Insertion Loss LINS (dB)
CH1 S21
1: -23.433 dB
1 GHz
2: -30.102 dB
1.5 GHz
3: -25.504 dB
2 GHz
4: -16.018 dB
2.5 GHz
Isolation ISL (dB)
log MAG
1
2
3
-2
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1
ISOLATION vs. FREQUENCY
4
-3
-4
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
log MAG
10 dB/ REF 0 dB
1: -22.502 dB
1 GHz
2: -28.139 dB
1.5 GHz
3: -25.867 dB
2 GHz
4: -15.601 dB
2.5 GHz
MARKER 1
1 GHz
0
-10
-20
-30
1
4
2
3
-40
START 0.300 000 000 GHz
STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution Data includes loss of the test fixture.
Remark The graphs indicate nominal characteristics.
5-145
UPG158TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
–0.05
0.65
0.65
1.3
5-146
0.15+0.1
–0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0±0.2
1.25±0.1
UPG158TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales ofÞce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reßow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reßow processes
Maximum chlorine content of rosin ßux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reßow processes
Maximum chlorine content of rosin ßux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
WS260
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of ßow processes
: 1 time
Maximum chlorine content of rosin ßux (% mass)
: 0.2%(Wt.) or below
Partial Heating
Caution
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin ßux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
03/08/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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