Spec. No. : C332CY Issued Date : 2004.04.16 Revised Date : Page No. : 1/1 CYStech Electronics Corp. 75V/150mA SURFACE MOUNT SWITCHING DIODE CDSS355CY Features: ● Designed for mounting on small surface ● Extremely thin / leadless package ● High mounting capability, strong surge withstand, high reliability Mechanical data: ● Case: 0603(1608) standard package, molded plastic, JEDEC SOD-523 ● Terminals : Gold plated, solderable per MIL-STD-750, method 2026. ● Polarity: Indicated by cathode band ● Mounting position: Any ● Weight: 0.003 gram (approximately) Absolute Maximum Ratings(At Ta=25℃, unless otherwise noted) Characteristics Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current Peak Forward Surge Current @ tp=1µs @ tp=1ms Repetitive Peak Forward Current Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM VR IO Min - IFSM - IFRM PD Tj Tstg -40 -40 Typ 4 1 - Max 100 75 150 Unit V V mA - A 300 150 +125 +125 mA mW °C °C Electrical Characteristics ( At Ta=25°C, unless otherwise noted) Parameter Forward Voltage Reverse Current Diode Capacitance Reverse Recovery Time CDSS355CY Conditions IF=50mA VR=20V VR=75V VR=0V, f=1MHz IF=IR=10mA, RL=100Ω, Irr=1mA Symbol VF Min - Typ - IR - - CD trr - - Max 1 25 2.5 4 4 Unit V nA µA pF ns CYStek Product Specification Spec. No. : C332CY Issued Date : 2004.04.16 Revised Date : Page No. : 2/2 CYStech Electronics Corp. Characteristic Curves Reverse Leakage Current vs Temperature Forward Current vs Forward Voltage 10000 Reverse Leakage Current---IR(nA) Forward Current---IF(mA) 1000 125℃ 100 75℃ 25℃ -25℃ 10 125℃ 1000 75℃ 100 25℃ 10 1 1 0 0.2 0.4 0.6 0.8 1 0 1.2 10 30 40 50 60 70 80 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Diode Capacitance vs Reverse Voltage Forward Current vs Ambient Temperature 125 Percentage of Peak Average Forward Current(%) 5 Diode Capacitance---CD(pF) 20 f=1MHz Ta=25℃ 4 3 2 1 0 Mounting on glass epoxy PCBs 100 75 50 25 0 0 2 4 6 8 10 Reverse Voltage---VR(V) CDSS355CY 12 14 0 25 50 75 100 125 150 Ambient Temperature---Ta(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C332CY Issued Date : 2004.04.16 Revised Date : Page No. : 3/3 SOD-523(0603) Dimension SOD-523(0603) Plastic Surface Mounted Package CYStek Package Code : CY *:Typical Inches Min. Max. 0.063 0.071 0.031 0.039 0.010(typ) DIM A B C Millimeters Min. Max. 1.6 1.8 0.8 1.0 0.25(typ) DIM D E F Inches Min. Max. 0.027 0.033 0.012(typ) 0.014(typ) Millimeters Min. Max. 0.70 0.85 0.30(typ) 0.35(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CDSS355CY CYStek Product Specification