CYStech Electronics Corp. Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 1/ 6 3.0Amp. Surface Mount Schottky Barrier Diodes SK320SC-SK3150SC Series Features For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 Mechanical Data Case: Molded plastic, SMC/JEDEC DO-214AB. Terminals: Solder plated, solderable per MIL-STD-750 method 2026 Polarity: Indicated by cathode band. Mounting Position : Any. Weight: 0.195 gram, 0.00585 ounce Ordering Information Device SK320SC- 0-T6-G SK340SC- 0-T6-G SK360SC- 0 -T6-G SK3100SC-0-T6-G SK3150SC-0-T6-G Package Shipping SMC (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel Marking SK32 SK34 SK36 S310 S315 Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T6 : 3000 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name SK320SC-SK3150SC CYStek Product Specification Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 2/ 6 CYStech Electronics Corp. Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. ) Parameter Symbol Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=3A Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃ VR=VRRM,TA=125℃ Maximum thermal resistance, Junction to ambient Maximum thermal resistance, Junction to lead Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage Storage temperature Operating temperature VRRM VRMS VR VF Type Units SK320 SK340 SK360 SK3100 SK3150 20 40 60 100 150 V 14 28 42 70 105 V 20 40 60 100 150 V 0.50 0.50 0.7 0.85 0.9 V IO 3 A IFSM 80 A IR 0.5 50 55 17 (Note) Rth,JA Rth,JL CJ Tstg TJ 250(typ) -55 ~ +125 -55 ~ +150 -55 ~ +150 mA mA ℃/W pF ℃ ℃ Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area. Recommended soldering footprint SK320SC-SK3150SC CYStek Product Specification Peak F or w ar d Su rg e C ur r en t- - - I F SM( A ) CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve Average Forward Current---Io(A) 3.5 3 SK360-3150 2.5 2 1.5 SK320-340 1 0.5 Maxim um Non-Repetitive Forward Surge Cur 90 80 Tj=25℃, 8. 3ms Single Ha lf Sine Wave JEDEC me thod 70 60 50 40 30 20 10 0 0 0 50 100 150 1 200 10 100 Number of Cycles at 60Hz Ambient Temperature---TA(℃) Forward Current vs Forward Voltage Junction Capacitance vs Reverse Voltage 700 100 Junction Capacitance---CJ(pF) SK320-340 Forward Current---IF(A) Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 3/ 6 SK360 10 1 SK3100-3150 Tj=25℃, Pulse width=300μs, 1% Duty cycle 0.1 0.01 0.1 0.3 0.5 0.7 0.9 1.1 Forward Voltage---VF(V) 1.3 1.5 600 500 400 300 200 100 0 0.01 0.1 1 10 100 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Reverse Leakage Current---IR(m A) 100 10 1 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) SK320SC-SK3150SC CYStek Product Specification CYStech Electronics Corp. Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 4/ 6 Reel Dimension Carrier Tape Dimension SK320SC-SK3150SC CYStek Product Specification CYStech Electronics Corp. Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 5/ 6 Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. SK320SC-SK3150SC CYStek Product Specification CYStech Electronics Corp. Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2015.05.19 Page No. : 6/ 6 DO-214AB/SMC Dimension DO-214AB/SMC Plastic Surface Mounted Package CYStek Package Code : SC *:Typical Inches Min. Max. 0.110 0.126 0.220 0.245 0.260 0.283 0.078 0.103 DIM A B C D Millimeters Min. Max. 2.80 3.20 5.59 6.22 6.60 7.20 1.98 2.62 DIM E F G H Inches Min. Max. 0.006 0.012 0.002 0.008 0.030 0.060 0.305 0.320 Millimeters Min. Max. 0.15 0.31 0.05 0.20 0.76 1.52 7.75 8.13 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SK320SC-SK3150SC CYStek Product Specification