DALLAS DS1251Y-120

DS1251Y
DS1251Y
4096K NV SRAM with Phantom Clock
FEATURES
PIN ASSIGNMENT
• Real time clock keeps track of hundredths of seconds,
minutes, hours, days, date of the month, months, and
years
• 512K x 8 NV SRAM directly replaces volatile static
A18/RST
1
32
VCC
A16
2
31
A15
A14
3
30
A17
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
25
A11
A3
9
24
OE
A2
10
23
A10
A1
11
22
CE
A0
12
21
DQ7
DQ0
13
20
DQ6
DQ1
14
19
DQ5
DQ2
15
18
DQ4
GND
16
17
DQ3
RAM or EEPROM
• Embedded lithium energy cell maintains calendar operation and retains RAM data
• Watch function is transparent to RAM operation
• Month and year determine the number of days in each
month; valid up to 2100
• Standard 32–pin JEDEC pinout
• Full 10% operating range
• Operating temperature range 0°C to 70°C
• Accuracy is better than ±1 minute/month @ 25°C
32–PIN ENCAPSULATED PACKAGE
740 MIL FLUSH
• Over
10 years of data retention in the absence of
power
• Available in 120 ns and 150 ns access time
ORDERING INFORMATION
DS1251Y–120
DS1251Y–150
120 ns access
150 ns access
PIN DESCRIPTION
A0–A18
CE
GND
DQ0–DQ7
VCC
WE
OE
RST
–
–
–
–
–
–
–
–
Address Inputs
Chip Enable
Ground
Data In/Data Out
Power (+5V)
Write Enable
Output Enable
Reset
DESCRIPTION
The DS1251Y 4096K NV SRAM with Phantom Clock is
a fully static nonvolatile RAM (organized as 512K words
by 8 bits) with a built–in real time clock. The DS1251Y
has a self–contained lithium energy source and control
circuitry which constantly monitors VCC for an out–of–
tolerance condition. When such a condition occurs, the
lithium energy source is automatically switched on and
write protection is unconditionally enabled to prevent
garbled data in both the memory and real time clock.
Copyright 1997 by Dallas Semiconductor Corporation.
All Rights Reserved. For important information regarding
patents and other intellectual property rights, please refer to
Dallas Semiconductor data books.
The Phantom Clock provides timekeeping information
including hundredths of seconds, seconds, minutes,
hours, day, date, month, and year information. The date
at the end of the month is automatically adjusted for
months with less than 31 days, including correction for
leap years. The Phantom Clock operates in either
24–hour or 12–hour format with an AM/PM indicator.
032697 1/12
DS1251Y
RAM READ MODE
PHANTOM CLOCK OPERATION
The DS1251Y executes a read cycle whenever WE
(Write Enable) is inactive (high) and CE (Chip Enable) is
active (low). The unique address specified by the 17 address inputs (A0–A18) defines which of the 512K bytes
of data is to be accessed. Valid data will be available to
the eight data output drivers within tACC (Access Time)
after the last address input signal is stable, providing
that CE and OE (Output Enable) access times and
states are also satisfied. If OE and CE access times are
not satisfied, then data access must be measured from
the later occurring signal (CE or OE) and the limiting parameter is either tCO for CE or tOE for OE rather than address access.
Communication with the Phantom Clock is established
by pattern recognition on a serial bit stream of 64 bits
which must be matched by executing 64 consecutive
write cycles containing the proper data on DQ0. All accesses which occur prior to recognition of the 64–bit pattern are directed to memory.
RAM WRITE MODE
The DS1251Y is in the write mode whenever the WE
and CE signals are in the active (low) state after address
inputs are stable. The latter occurring falling edge of CE
or WE will determine the start of the write cycle. The
write cycle is terminated by the earlier rising edge of CE
or WE. All address inputs must be kept valid throughout
the write cycle. WE must return to the high state for a
minimum recovery time (tWR) before another cycle can
be initiated. The OE control signal should be kept inactive (high) during write cycles to avoid bus contention.
However, if the output bus has been enabled (CE and
OE active) then WE will disable the outputs in tODW from
its falling edge.
DATA RETENTION MODE
The DS1251Y provides full functional capability for VCC
greater than 4.5 volts and write protects by approximately 4.0 volts. Data is maintained in the absence of
VCC without any additional support circuitry. The nonvolatile static RAM constantly monitors VCC. Should the
supply voltage decay, the RAM automatically write protects itself. All inputs to the RAM become “don’t care”
and all outputs are high impedance. As VCC falls below
approximately 3.0 volts, the power switching circuit connects the lithium energy source to RAM to retain data.
During power–up, when VCC rises above approximately
3.0 volts, the power switching circuit connects external
VCC to the RAM and disconnects the lithium energy
source. Normal RAM operation can resume after VCC
exceeds 4.5 volts.
032697 2/12
After recognition is established, the next 64 read or write
cycles either extract or update data in the Phantom
Clock, and memory access is inhibited.
Data transfer to and from the timekeeping function is accomplished with a serial bit stream under control of Chip
Enable (CE), Output Enable (OE), and Write Enable
(WE). Initially, a read cycle to any memory location using the CE and OE control of the Phantom Clock starts
the pattern recognition sequence by moving a pointer to
the first bit of the 64–bit comparison register. Next, 64
consecutive write cycles are executed using the CE and
WE control of the SmartWatch. These 64 write cycles
are used only to gain access to the Phantom Clock.
Therefore, any address to the memory in the socket is
acceptable. However, the write cycles generated to
gain access to the Phantom Clock are also writing data
to a location in the mated RAM. The preferred way to
manage this requirement is to set aside just one address location in RAM as a Phantom Clock scratch pad.
When the first write cycle is executed, it is compared to
bit 0 of the 64–bit comparison register. If a match is
found, the pointer increments to the next location of the
comparison register and awaits the next write cycle. If a
match is not found, the pointer does not advance and all
subsequent write cycles are ignored. If a read cycle occurs at any time during pattern recognition, the present
sequence is aborted and the comparison register pointer is reset. Pattern recognition continues for a total of 64
write cycles as described above until all the bits in the
comparison register have been matched (this bit pattern
is shown in Figure 1). With a correct match for 64–bits,
the Phantom Clock is enabled and data transfer to or
from the timekeeping registers can proceed. The next
64 cycles will cause the Phantom Clock to either receive
or transmit data on DQ0, depending on the level of the
OE pin or the WE pin. Cycles to other locations outside
the memory block can be interleaved with CE cycles
without interrupting the pattern recognition sequence or
data transfer sequence to the Phantom Clock.
DS1251Y
PHANTOM CLOCK
REGISTER INFORMATION
bits within a register could produce erroneous results.
These read/write registers are defined in Figure 2.
The Phantom Clock information is contained in eight
registers of 8–bits, each of which is sequentially accessed one bit at a time after the 64–bit pattern recognition sequence has been completed. When updating the
Phantom Clock registers, each register must be handled in groups of 8–bits. Writing and reading individual
Data contained in the Phantom Clock register is in
binary coded decimal format (BCD). Reading and writing the registers is always accomplished by stepping
through all eight registers, starting with bit 0 of register 0
and ending with bit 7 of register 7.
PHANTOM CLOCK REGISTER DEFINITION Figure 1
HEX
VALUE
7
6
5
4
3
2
1
0
BYTE 0
1
1
0
0
0
1
0
1
C5
BYTE 1
0
0
1
1
1
0
1
0
3A
BYTE 2
1
0
1
0
0
0
1
1
A3
BYTE 3
0
1
0
1
1
1
0
0
5C
BYTE 4
1
1
0
0
0
1
0
1
C5
BYTE 5
0
0
1
1
1
0
1
0
3A
BYTE 6
1
0
1
0
0
0
1
1
A3
BYTE 7
0
1
0
1
1
1
0
0
5C
NOTE:
The pattern recognition in Hex is C5, 3A, A3, 5C, C5, 3A, A3, 5C. The odds of this pattern being accidentally duplicated and causing inadvertent entry to the Phantom Clock is less than 1 in 1019. This pattern is sent to the Phantom
Clock LSB to MSB.
032697 3/12
DS1251Y
PHANTOM CLOCK REGISTER DEFINITION Figure 2
REGISTER
RANGE
(BCD)
7
6
0
5
4
3
0.1 SEC
2
1
0.01 SEC
0
00–99
1
0
10 SEC
SECONDS
00–59
2
0
10 MIN
MINUTES
00–59
3
12/24
0
HOUR
01–12
00–23
4
0
0
5
0
0
6
0
0
7
10
A/P
OSC
HR
RST
10 DATE
0
10
MONTH
10 YEAR
AM-PM/12/24 MODE
Bit 7 of the hours register is defined as the 12– or
24–hour mode select bit. When high, the 12–hour mode
is selected. In the 12–hour mode, bit 5 is the AM/PM bit
with logic high being PM. In the 24–hour mode, bit 5 is
the second 10-hour bit (20–23 hours).
0
DAY
01–07
DATE
01–31
MONTH
01–12
YEAR
00–99
to logic 0, a low input on the RESET pin will cause the
Phantom Clock to abort data transfer without changing
data in the watch registers. Bit 5 controls the oscillator.
When set to logic 1, the oscillator is off. When set to logic 0, the oscillator turns on and the watch becomes operational. These bits are shipped from the factory set to
a logic 1.
OSCILLATOR AND RESET BITS
Bits 4 and 5 of the day register are used to control the
RESET and oscillator functions. Bit 4 controls the
RESET (pin 1). When the RESET bit is set to logic 1, the
RESET input pin is ignored. When the RESET bit is set
032697 4/12
ZERO BITS
Registers 1, 2, 3, 4, 5, and 6 contain one or more bits
which will always read logic 0. When writing these locations, either a logic 1 or 0 is acceptable.
DS1251Y
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground
Operating Temperature
Storage Temperature
Soldering Temperature
–0.3V to +7.0V
0°C to 70°C
–40°C to +70°C
260°C for 10 seconds (See Note 13)
* This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER
(0°C to 70°C)
SYMBOL
MIN
TYP
MAX
UNITS
Power Supply Voltage
VCC
4.5
5.0
5.5
V
Input Logic 1
VIH
2.2
VCC+0.3
V
Input Logic 0
VIL
–0.3
+0.8
V
(0°C to 70°C; VCC = 5V ± 10%)
DC ELECTRICAL CHARACTERISTICS
PARAMETER
NOTES
SYMBOL
MIN
Input Leakage Current
IIL
I/O Leakage Current
CE VIH VCC
TYP
MAX
UNITS
NOTES
–1.0
+1.0
µA
12
IIO
–1.0
+1.0
µA
Output Current @ 2.4 volts
IOH
–1.0
mA
Output Current @ 0.4 volts
IOL
2.0
mA
Standby Current CE = 2.2 volts
ICCS1
5.0
10
mA
Standby Current CE =
VCC – 0.5 volts
ICCS2
3.0
5.0
mA
Operating Current tCYC = 200 ns
ICC01
85
mA
DC TEST CONDITIONS
Outputs are open; all voltages are referenced to ground.
CAPACITANCE
PARAMETER
(tA = 25°C)
SYMBOL
MIN
TYP
MAX
UNITS
Input Capacitance
CIN
5
10
pF
Input/Output Capacitance
CI/O
5
10
pF
NOTES
032697 5/12
DS1251Y
(0°C to 70°C; VCC = 5.0V ± 10%)
MEMORY AC ELECTRICAL CHARACTERISTICS
PARAMETER
DS1251Y-120
DS1251Y-150
MIN
MIN
SYMBOL
UNITS
MAX
120
Read Cycle Time
tRC
Access Time
tACC
120
150
ns
OE to Output Valid
tOE
60
70
ns
CE to Output Valid
tCO
120
150
ns
OE or CE to Output Active
tCOE
Output High Z from Deselection
tOD
Output Hold from Address
Change
toH
5
5
ns
Write Cycle Time
tWC
120
150
ns
Write Pulse Width
tWP
90
100
ns
Address Setup Time
tAW
0
0
ns
Write Recovery Time
tWR
20
20
ns
tODW
Output Active from WE
tOEW
5
Data Setup Time
tDS
Data Hold Time from WE
tDH
50 pF + 1TTL Gate
0–3 volts
Timing Measurement Reference Levels
Input:
1.5 volts
Output:
1.5 volts
Input Pulse Rise and Fall Times:
032697 6/12
70
40
AC TEST CONDITIONS
5 ns
ns
5
40
Output High Z from WE
Output Load:
Input Pulse Levels:
150
5
NOTES
MAX
70
ns
5
ns
5
3
ns
5
5
ns
5
50
60
ns
4
20
20
ns
4
DS1251Y
PHANTOM CLOCK AC ELECTRICAL CHARACTERISTICS
PARAMETER
TYP
(0°C to 70°C; VCC = 4.5 to 5.5V)
SYMBOL
MIN
MAX
UNITS
NOTES
Read Cycle Time
tRC
120
CE Access Time
tCO
100
ns
OE Access Time
tOE
100
ns
CE to Output Low Z
tCOE
10
ns
OE to Output Low Z
tOEE
10
ns
CE to Output High Z
tOD
40
ns
5
OE to Output High Z
tODO
40
ns
5
ns
Read Recovery
tRR
20
ns
Write Cycle Time
tWC
120
ns
Write Pulse Width
tWP
100
ns
Write Recovery
tWR
20
ns
10
Data Setup Time
tDS
40
ns
11
Data Hold Time
tDH
10
ns
11
CE Pulse Width
tCW
100
ns
RESET Pulse Width
tRST
200
ns
CE High to Power–Fail
tPF
0
ns
MAX
UNITS
POWER-DOWN/POWER-UP TIMING
PARAMETER
SYMBOL
MIN
CE at VIH before Power–Down
tPD
0
µs
VCC Slew from 4.5V to 0 volts
(CE at VIH)
tF
300
µs
VCC Slew from 0V to 4.5 volts
(CE at VIH)
tR
0
µs
CE at VIH after Power–Up
TYP
tREC
2
NOTES
ms
(tA = 25°C)
PARAMETER
Expected Data Retention Time
SYMBOL
MIN
tDR
10
TYP
MAX
UNITS
NOTES
years
9
WARNING:
Under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery backup mode.
032697 7/12
DS1251Y
MEMORY READ CYCLE (NOTE 1)
tRC
ADDRESSES
VIH
VIL
VIH
VIL
VIH
VIL
ÏÏÏÏÏÏ
ÌÌÌÌÌÌÌÌ
ÏÏÏÏÏÏ
ÌÌÌÌÌÌÌÌ
ÏÏÏÏÏÏÏ
ÌÌÌÌÌÌÌÌÌ
ÏÏÏÏÏÏÏ
ÌÌÌÌÌÌÌÌÌ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
tOH
tACC
VIH
CE
VIH
tCO
VIL
tOD
VIH
tOE
VIH
OE
VIL
tCOE
tOD
tCOE
VOH
VOL
DOUT
VOH
VOL
OUTPUT
DATA VALID
MEMORY WRITE CYCLE 1 (NOTES 2, 6, AND 7)
tWC
ADDRESS
VIH
VIL
VIH
VIL
ÏÏÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÌÌÌÌÌÌÌÌ
ÌÌÌÌÌÌÌÌ
tAW
CE
WE
VIL
VIL
tWP
tWR
VIH
VIH
tOEW
tODW
HIGH IMPEDANCE
tDS
DQ0–DQ7
VIH
VIL
032697 8/12
VIH
VIL
DATA IN
STABLE
tDH
VIH
VIL
DS1251Y
MEMORY WRITE CYCLE 2 (NOTES 2 AND 8)
WE = VIH
tWC
ADDRESSES
VIH
VIL
VIH
VIL
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏÏÏ
VIH
VIL
tAW
CE
tWR
tWP
VIH
VIH
VIL
WE
VIL
ÌÌÌÌÌÌÌÌ
ÌÌÌÌÌÌÌÌ
tOEW
VIL
VIL
tODW
tCOE
tDS
DQ0–DQ7
VIH
VIL
tDH
DATA IN
STABLE
VIH
VIL
RESET FOR PHANTOM CLOCK
tRST
RST
READ CYCLE TO PHANTOM CLOCK
tRC
tRR
tCO
CE
tOD
tOE
OE
tODO
tOEE
tCOE
Q
ÌÌÌ
ÌÌÌ
OUTPUT DATA VALID
ÌÌÌ
ÌÌÌ
032697 9/12
DS1251Y
WRITE CYCLE TO PHANTOM CLOCK
OE = VIH
tWC
tWR
tWP
WE
tWR
tCW
CE
ÌÌÌÌÌÌÌ
ÌÌÌÌÌÌÌ
tDH
tDS
D
tDH
DATA IN STABLE
ÌÌÌÌÌÌ
ÌÌÌÌÌÌ
POWER-DOWN/POWER-UP CONDITION
VCC
4.50V
3.2V
tF
tR
tPD
tREC
CE
LEAKAGE CURRENT IL
SUPPLIED FROM LITHIUM
CELL
032697 10/12
DATA RETENTION TIME
tDR
DS1251Y
NOTES:
1. WE is high for a read cycle.
2. OE = VIH or VIL. If OE = VIH during write cycle, the output buffers remain in a high impedance state.
3. tWP is specified as the logical AND of CE and WE. tWP is measured from the latter of CE or WE going low to the
earlier of CE or WE going high.
4. tDH, tDS are measured from the earlier of CE or WE going high.
5. These parameters are sampled with a 50 pF load and are not 100% tested.
6. If the CE low transition occurs simultaneously with or later than the WE low transition in Write Cycle 1, the output
buffers remain in a high impedance state during this period.
7. If the CE high transition occurs prior to or simultaneously with the WE high transition, the output buffers remain
in a high impedance state during this period.
8. If WE is low or the WE low transition occurs prior to or simultaneously with the CE low transition, the output buffers
remain in a high impedance state during this period.
9. The expected tDR is defined as accumulative time in the absence of VCC with the clock oscillator running.
10. tWR is a function of the latter occurring edge of WE or CE.
11. tDH and tDS are a function of the first occurring edge of WE or CE.
12. RST (Pin1) has an internal pull–up resistor.
13. Real–Time Clock Modules can be successfully processed through conventional wave–soldering techniques as
long as temperature exposure to the lithium energy source contained within does not exceed +85°C. Post solder
cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used.
032697 11/12
DS1251Y
DS1251Y 4096K NV SRAM WITH PHANTOM CLOCK
PKG
1
A
C
F
D
K
J
E
H
B
032697 12/12
G
32–PIN
DIM
MIN
MAX
A IN.
MM
1.720
43.69
1.740
44.20
B IN.
MM
0.720
18.29
0.740
18.80
C IN.
MM
0.395
10.03
0.415
10.54
D IN.
MM
0.090
2.29
0.120
3.05
E IN.
MM
0.017
0.43
0.030
0.76
F IN.
MM
0.120
3.05
0.160
4.06
G IN.
MM
0.090
2.29
0.110
2.79
H IN.
MM
0.590
14.99
0.630
16.00
J IN.
MM
0.008
0.20
0.012
0.30
K IN.
MM
0.015
0.38
0.021
0.53