AGILENT ADA-4543-TR1

Agilent ADA-4543
Silicon Bipolar Darlington Amplifier
Data Sheet
Features
• Small Signal gain amplifier
• Operating frequency DC – 2.5 GHz
The Darlington feedback structure provides inherent broad
bandwidth performance, resulting in useful operating frequency
up to 2.5 GHz. This is an ideal
device for small-signal gain
cascades or IF amplification.
ADA-4543 is fabricated using
Agilent’s HP25 silicon bipolar
process, which employs a doublediffused single polysilicon
process with self-aligned
submicron emitter geometry. The
process is capable of simultaneous high fT and high NPN
breakdown (25 GHz fT at 6V
BVCEO). The process utilizes
industry standard device oxide
isolation technologies and
submicron aluminum multilayer
interconnect to achieve superior
performance, high uniformity,
and proven reliability.
• Unconditionally stable
Surface Mount Package
SOT-343
• 50 Ohms input & output
• Flat, Broadband Frequency
Response up to 1 GHz
• Operating Current: 10 to 30 mA
• Industry standard SOT-343 package
• Lead-free option available
Pin Connections and
Package Marking
RFout
& Vd
Specifications
900 MHz, 3.4V, 15 mA (typ.)
GND
• 15.1 dB associated gain
GND
1Tx
Description
Agilent Technologies’ ADA-4543
is an economical, easy-to-use,
general purpose silicon bipolar
RFIC gain block amplifiers
housed in a 4-lead SC-70
(SOT-343) surface mount plastic
package which requires only half
the board space of a SOT-143
package.
• 1.9 dBm P1dB
• 15 dBm OIP3
RFin
• 3.7 dB noise figure
Note:
Top View. Package marking provides orientation
and identification.
• Single supply, typical Id = 15 mA
“1T” = Device Code
“x” = Date code character
identifies month of manufacture.
Applications
• Cellular/PCS/WLL base stations
Typical Biasing Configuration
• Wireless data/WLAN
VCC = 5 V
V -V
Rc = cc d
Id
Rc
• VSWR < 2 throughput operating
frequency
C bypass
• Fiber-optic systems
• ISM
RFC
C block
RF
input
1Tx
C block
Vd = 3.4 V
RF
output
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 1B)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
ADA-4543 Absolute Maximum Ratings [1]
Symbol
Parameter
Units
Absolute
Maximum
Id
Device Current
mA
40
Pdiss
Total Power Dissipation [2]
mW
145
Pin max.
RF Input Power
dBm
13
Tj
Channel Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to 150
θjc
Thermal Resistance [3]
°C/W
152
Notes:
1. Operation of this device above any one of
these parameters may cause permanent
damage.
2. Ground lead temperature is 25°C. Derate
6.6 mW/°C for TL >128°C.
3. Junction-to-case thermal resistance
measured using 150°C Liquid Crystal
Measurement method.
ADA-4543 Electrical Specifications
TA = 25°C, Zo=50Ω, Pin = -25 dBm, Id = 15 mA (unless specified otherwise)
Symbol
Parameter and Test Condition:
Id = 15 mA, Zo = 50Ω
Vd
Device Voltage Id = 15 mA
Gp
2
Power Gain (|S21|
Frequency
Units
Min.
Typ.
Max.
V
3.1
3.4
3.8
13.5
15.7
15.1
16.5
100 MHz
900 MHz[1,2]
dB
100 to 900 MHz
0.1 to 2 GHz
dB
0.4
1.5
GHz
3.6
∆Gp
Gain Flatness
F3dB
3 dB Bandwidth
VSMRin
Input Voltage Standing Wave Ratio
0.1 to 6 GHz
1.7:1
VSMRout
Output Voltage Standing Wave Ratio
0.1 to 6 GHz
1.3:1
NF
50Ω Noise Figure
100 MHz
900 MHz[1,2]
dB
3.6
3.7
P1dB
Output Power at 1dB Gain Compression
100 MHz
900 MHz[1,2]
dBm
2.5
1.9
OIP3
Output 3rd Order Intercept Point
100 MHz[3]
900 MHz[1,2,3]
dBm
14.6
15.0
DV/dT
Device Voltage Temperature Coefficient
mV/°C
-5.6
Notes:
1. Typical value determined from a sample size of 500 parts from 3 wafers.
2. Measurement obtained using production test board described in the block diagram below.
3. I) 900 MHz OIP3 test condition: F1 = 900 MHz, F2 = 905 MHz and Pin = -25 dBm per tone.
II) 100 MHz OIP3 test condition: F1 = 100 MHz, F2 = 105 MHz and Pin = -25 dBm per tone.
Input
50 Ohm
Transmission
(0.5 dB loss)
DUT
50 Ohm
Transmission
including Bias
(0.5 dB loss)
Output
Block diagram of 900 MHz production test board used for Vd, Gain, P1dB, OIP3, and NF measurements.
Circuit losses have been de-embedded from actual measurements.
2
Std. Dev.
0.16
0.18
Product Consistency Distribution Charts at 900 MHz, Id = 15 mA
400
240
200
300
160
200
120
80
100
40
0
0
13
14
15
16
3
17
3.2
3.4
3.6
3.8
4
Vd (V)
GAIN (dB)
Figure 1. Gain distribution @ 15 mA.
LSL = 13.5, Nominal = 15.1, USL = 16.5
Figure 2. Vd distribution @ 15 mA.
LSL = 3.1, Nominal = 3.4, USL = 3.8
Notes:
1. Statistics distribution determined from a sample size of 500 parts taken from 3 different wafers.
2. Future wafers allocated to this product may have typical values anywhere between the minimum and maximum specification limits.
10
20
15
5
15
10
OIP3 (dBm)
20
P1dB (dBm)
GAIN (dB)
ADA-4543 Typical Performance Curves (at 25°C, unless specified otherwise)
0
5
-5
5
0
-10
0
0
1
2
3
4
5
0
6
1
2
3
4
5
0
6
Figure 3. Gain vs. Frequency at Id = 15 mA.
2
4
5
6
Figure 5. OIP3 vs. Frequency at Id =15 mA.
35
18
30
5
3
FREQUENCY (GHz)
Figure 4. P1dB vs. Frequency at Id =15 mA.
6
17
25
4
20
16
GAIN (dB)
Id (mA)
-40°C
NF (dB)
1
FREQUENCY (GHz)
FREQUENCY (GHz)
25°C
85°C
15
0
0
1
2
3
4
5
FREQUENCY (GHz)
Figure 6. NF vs Frequency at Id =15 mA.
6
-40°C
25°C
85°C
13
5
2
15
14
10
3
3
10
0
1
2
3
4
Vd (V)
Figure 7. Id vs. Vd and Temperature.
5
12
0
10
20
30
40
Id (mA)
Figure 8. Gain vs. Id and Temperature at 900 MHz.
30
6
10
25
5
5
20
4
0
-40°C
-5
15
85°C
85°C
20
30
10
20
Figure 9. P1dB vs. Id and Temperature
at 900 MHz.
18
2.0
2.5
3
14
4
5
12
6
0.1
0.5
0.9
1.5
2.0
2.5
3
4
10
5
40
5
6
25
0.1
0.5
0.9
1.5
2.0
2.5
20
3
4
15
5
6
10
5
0
10
20
Id (mA)
30
0
40
10
20
Figure 13. P1dB vs. Id and Frequency (GHz).
5
6
30
40
Id (mA)
Id (mA)
Figure 12. Gain vs. Id and Frequency (GHz).
40
30
-10
30
30
0
8
20
20
Figure 11. NF vs. Id and Temperature
at 900 MHz.
-5
10
10
Id (mA)
15
P1dB (dBm)
GAIN (dB)
0
20
10
Figure 14. OIP3 vs. Id and Frequency (GHz).
0
-5
-5
-10
-10
-15
4
IRL (dB)
4
3
2.5
2.0
1.5
0.9
0.5
0.1
ORL (dB)
5
4.5
-15
-20
Id=12 mA
Id=15 mA
Id=20 mA
Id=30 mA
-25
3.5
-30
10
20
30
40
Figure 15. NF vs. Id and Frequency (GHz).
-20
-25
Id=12 mA
Id=15 mA
Id=20 mA
Id=30 mA
-30
-35
-35
0
Id (mA)
4
40
Figure 10. OIP3 vs. Id and Temperature
at 900 MHz.
0.1
0.5
0.9
1.5
16
NF (dB)
30
Id (mA)
Id (mA)
0
85°C
0
0
40
OIP3 (dBm)
10
25°C
1
0
0
3
-40°C
2
25°C
5
-15
3
-40°C
10
25°C
-10
NF (dB)
15
OIP3 (dBm)
P1dB (dBm)
ADA-4543 Typical Performance Curves (at 25°C, unless specified otherwise), continued
-40
0
2
4
6
8
FREQUENCY (GHz)
Figure 16. Input Return Loss vs. Id
and Frequency (GHz).
10
12
0
2
4
6
8
10
FREQUENCY (GHz)
Figure 17. Output Return Loss vs. Id
and Frequency (GHz).
12
ADA-4543 Typical Scattering Parameters, TA = 25°C, Id = 12 mA
Freq.
GHz
Mag.
S11
Ang.
0.1
0.071
4.9
14.38
5.234
176.2
0.125
-0.9
0.146
-3.2
1.1
0.5
0.112
24.8
14.24
5.15
162.1
0.123
-4.6
0.15
-3.8
1.1
0.9
0.184
24.2
13.98
4.998
148.3
0.12
-7.6
0.183
-6
1.1
dB
S21
Mag.
S12
Ang.
Mag.
S22
Ang.
Mag.
K
Ang.
1.0
0.198
21.6
13.90
4.956
144.9
0.119
-8.3
0.191
-7.7
1.1
1.5
0.257
5.9
13.51
4.735
129.3
0.116
-10.9
0.207
-18.7
1.1
1.9
0.282
-4.5
13.15
4.547
117.1
0.113
-12.6
0.213
-27.2
1.2
2.0
0.29
-7.8
13.09
4.513
114.2
0.113
-13.1
0.212
-29.1
1.2
2.5
0.307
-19.4
12.72
4.326
99.8
0.111
-14.8
0.203
-38
1.2
3.0
0.31
-30.7
12.40
4.168
85.9
0.109
-16.1
0.185
-46.8
1.2
3.5
0.303
-43.3
12.07
4.013
72.2
0.109
-17.2
0.162
-57
1.3
4.0
0.287
-58
11.74
3.865
58.5
0.109
-18
0.139
-69.3
1.3
4.5
0.273
-74.8
11.45
3.736
45
0.111
-18.5
0.12
-87
1.3
5.0
0.258
-94.3
11.05
3.568
31.4
0.113
-19.2
0.11
-106.9
1.4
5.5
0.253
-116.3
10.67
3.416
18.2
0.118
-19.8
0.114
-126.3
1.4
6.0
0.259
-136.7
10.24
3.251
5
0.125
-21
0.122
-144.9
1.3
6.5
0.254
-156.4
9.83
3.101
-7.7
0.135
-22.8
0.121
-163.1
1.3
7.0
0.25
-177.8
9.43
2.961
-20.5
0.148
-26.1
0.116
173.8
1.3
7.5
0.25
157
8.97
2.81
-33.5
0.161
-31.1
0.116
143.7
1.2
8.0
0.266
131
8.45
2.645
-46.4
0.172
-37.1
0.134
111.8
1.2
8.5
0.294
106.9
7.79
2.453
-59.1
0.181
-43.2
0.171
87.5
1.2
9.0
0.346
87.1
7.17
2.284
-71
0.192
-49
0.223
71.6
1.2
9.5
0.399
70.1
6.39
2.088
-83.5
0.204
-55.7
0.281
60.3
1.1
10.0
0.454
57.4
5.73
1.935
-94.8
0.213
-62.9
0.339
50.8
1.1
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The
output reference plane is at the end of the output lead.
5
ADA-4543 Typical Scattering Parameters, TA = 25°C, Id = 15 mA
Freq.
GHz
Mag.
S11
Ang.
0.1
0.023
141.7
15.60
0.5
0.083
76.9
15.46
0.9
0.165
51.8
15.20
1.0
0.18
46.4
1.5
0.238
22.4
1.9
0.265
2.0
dB
S21
Mag.
S12
S22
K
Ang.
Mag.
Ang.
Mag.
Ang.
6.026
176
0.114
-0.6
0.051
-0.8
1.1
5.928
161.4
0.113
-3.2
0.068
18.9
1.1
5.753
147
0.111
-5.6
0.118
15.2
1.1
15.12
5.702
143.4
0.111
-6.2
0.129
12.3
1.1
14.63
5.389
127
0.109
-8.7
0.155
-2.1
1.1
8.8
14.19
5.12
114.3
0.108
-10.3
0.166
-12.2
1.1
0.272
5.1
14.09
5.066
111.3
0.107
-10.7
0.167
-14.2
1.1
2.5
0.292
-8.2
13.58
4.776
96.7
0.106
-12.2
0.166
-23.6
1.2
3.0
0.295
-20.7
13.13
4.532
82.8
0.105
-13.4
0.154
-32.4
1.2
3.5
0.291
-33.3
12.69
4.309
69.3
0.105
-14.3
0.135
-42
1.2
4.0
0.273
-47.8
12.28
4.112
56
0.106
-14.8
0.113
-54.4
1.3
4.5
0.256
-64.9
11.93
3.947
42.9
0.108
-15
0.092
-73.9
1.3
5.0
0.238
-84.7
11.48
3.75
29.6
0.111
-15.5
0.081
-98.8
1.3
5.5
0.23
-106.8
11.07
3.578
16.8
0.117
-15.9
0.084
-124.6
1.3
6.0
0.233
-128.8
10.63
3.399
3.9
0.125
-17.2
0.095
-148
1.3
6.5
0.229
-149.2
10.20
3.237
-8.6
0.137
-19.2
0.098
-170
1.3
7.0
0.223
-171.8
9.79
3.088
-21.2
0.151
-22.8
0.1
162.6
1.2
7.5
0.224
162
9.33
2.927
-34
0.164
-28.1
0.112
130
1.2
8.0
0.241
133.6
8.81
2.757
-46.8
0.177
-34.4
0.143
100
1.2
8.5
0.272
108.9
8.19
2.566
-59.2
0.187
-40.9
0.188
78.8
1.2
9.0
0.329
88.1
7.57
2.39
-71.1
0.199
-47.1
0.244
64.9
1.1
9.5
0.381
71.2
6.77
2.18
-83.5
0.211
-54.3
0.304
54.5
1.1
10.0
0.444
57.5
6.07
2.012
-95.2
0.22
-61.8
0.362
45.7
1.0
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The
output reference plane is at the end of the output lead.
6
ADA-4543 Typical Scattering Parameters, TA = 25°C, Id = 20 mA
Freq.
GHz
Mag.
S11
0.1
0.1
168
16.54
6.714
175.9
0.104
-0.2
0.032
168.8
1.1
0.5
0.122
115
16.40
6.61
160.9
0.104
-1.8
0.052
100.8
1.1
0.9
0.188
73.6
16.16
6.427
146
0.105
-3.5
0.096
54
1.0
1.0
0.194
67.9
16.06
6.352
142.3
0.105
-4
0.104
46.9
1.0
1.5
0.244
37.8
15.50
5.955
125
0.104
-6.3
0.132
21.5
1.0
1.9
0.266
21.1
14.99
5.614
112.1
0.104
-7.9
0.145
7.7
1.1
2.0
0.273
16.9
14.87
5.537
109
0.103
-8.3
0.147
5
1.1
2.5
0.29
1.5
14.24
5.152
94.4
0.103
-9.9
0.151
-6.9
1.1
3.0
0.296
-11.5
13.69
4.838
80.6
0.102
-11
0.142
-16.6
1.2
3.5
0.288
-25.1
13.16
4.552
67.3
0.102
-11.8
0.125
-26.1
1.2
4.0
0.268
-39.4
12.71
4.319
54.4
0.103
-12.1
0.102
-38.2
1.3
4.5
0.248
-56.2
12.31
4.125
41.5
0.106
-12.2
0.077
-57.8
1.3
5.0
0.226
-75.8
11.83
3.904
28.6
0.11
-12.5
0.061
-87.1
1.3
5.5
0.214
-98.9
11.41
3.719
16
0.117
-12.9
0.062
-122.1
1.3
6.0
0.214
-121.9
10.96
3.531
3.3
0.126
-14.3
0.076
-151.9
1.3
6.5
0.209
-143
10.52
3.357
-9
0.138
-16.4
0.084
-177.5
1.3
7.0
0.204
-166.2
10.11
3.202
-21.5
0.153
-20.2
0.093
152.3
1.2
7.5
0.202
165.3
9.64
3.035
-34.2
0.167
-25.7
0.115
120.1
1.2
8.0
0.22
134.5
9.15
2.869
-47.1
0.181
-32.2
0.154
92.3
1.1
8.5
0.256
109.2
8.48
2.656
-59.3
0.192
-39
0.206
74
1.1
9.0
0.312
88.5
7.87
2.474
-71.1
0.204
-45.6
0.265
61.2
1.1
Ang.
dB
S21
Mag.
S12
Ang.
Mag.
S22
Ang.
Mag.
K
Ang.
9.5
0.368
71.2
7.11
2.266
-83.4
0.217
-53.1
0.327
51.2
1.1
10.0
0.432
57.1
6.37
2.082
-95.1
0.227
-60.9
0.386
42.6
1.0
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The
output reference plane is at the end of the output lead.
7
ADA-4543 Typical Scattering Parameters, TA = 25°C, Id = 30 mA
Freq.
GHz
Mag.
S11
Ang.
dB
S21
Mag.
Ang.
Mag.
S12
Ang.
S22
0.1
0.17
171.3
17.29
7.32
175.8
0.096
0.1
0.105
173.1
1.1
0.5
0.179
129.9
17.15
7.206
160.6
0.097
-0.3
0.108
133.8
1.0
0.9
0.223
89.4
16.92
7.017
145.3
0.099
-1.3
0.12
87.2
1.0
Mag.
K
Ang.
1.0
0.226
82.7
16.82
6.931
141.5
0.099
-1.7
0.123
78.5
1.0
1.5
0.257
48.6
16.19
6.449
123.5
0.1
-3.9
0.137
45.2
1.0
1.9
0.277
30.9
15.61
6.035
110.5
0.1
-5.6
0.147
27.3
1.0
2.0
0.283
26.4
15.48
5.941
107.4
0.1
-6
0.15
23.6
1.0
2.5
0.298
9.4
14.77
5.478
92.7
0.1
-7.7
0.153
8.6
1.1
3.0
0.299
-4.6
14.14
5.095
79.1
0.1
-8.9
0.145
-2.7
1.1
3.5
0.289
-18.1
13.56
4.766
65.9
0.101
-9.6
0.128
-12.6
1.2
4.0
0.266
-32.3
13.07
4.502
53.3
0.102
-9.9
0.104
-24
1.2
4.5
0.244
-49
12.64
4.284
40.6
0.105
-9.9
0.074
-41.4
1.3
5.0
0.22
-68.7
12.14
4.048
27.9
0.109
-10.2
0.051
-71
1.3
5.5
0.204
-91.9
11.70
3.848
15.5
0.116
-10.5
0.047
-116
1.3
6.0
0.201
-115.7
11.25
3.651
2.9
0.126
-12
0.062
-154.1
1.3
6.5
0.196
-137.6
10.80
3.468
-9.3
0.139
-14.3
0.075
176.7
1.2
7.0
0.188
-162.3
10.38
3.305
-21.6
0.154
-18.2
0.091
145.3
1.2
7.5
0.189
167.9
9.93
3.137
-34.2
0.17
-23.8
0.12
114.5
1.1
8.0
0.205
135.4
9.43
2.962
-47
0.184
-30.6
0.165
88.8
1.1
8.5
0.24
109.5
8.75
2.739
-59.3
0.196
-37.6
0.221
71.7
1.1
9.0
0.303
88.3
8.17
2.561
-71
0.208
-44.3
0.282
59.4
1.1
9.5
0.361
70.9
7.38
2.339
-83.4
0.221
-52
0.345
49.6
1.0
10.0
0.429
57.2
6.69
2.161
-94.8
0.231
-60
0.405
40.9
1.0
Notes:
1. S-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of the input lead. The
output reference plane is at the end of the output lead.
8
Ordering Information
Part Number
No. of Devices
Container
ADA-4543-TR1
3000
7” Reel
ADA-4543-TR2
10000
13” Reel
ADA-4543-BLK
100
antistatic bag
ADA-4543-TR1G
3000
7” Reel
ADA-4543-TR2G
10000
13” Reel
ADA-4543-BLKG
100
antistatic bag
Note: For lead-free option, the part number will have the character “G” at the end.
Recommended PCB Pad Layout for
Agilent’s SC70 4L/SOT-343 Products
Package Dimensions
Outline 43
SOT-343 (SC70 4-lead)
1.30
0.051
1.30 BSC
1.00
0.039
HE
E
2.00
0.079
0.60
0.024
b1
.090
0.035
D
1.15
0.045
A2
A
Dimensions in inches
mm
A1
b
L
C
DIMENSIONS (mm)
SYMBOL
E
D
HE
A
A2
A1
b
b1
c
L
9
MIN.
1.15
1.85
1.80
0.80
0.80
0.00
0.25
0.55
0.10
0.10
MAX.
1.35
2.25
2.40
1.10
1.00
0.10
0.40
0.70
0.20
0.46
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
Device Orientation
REEL
TOP VIEW
END VIEW
4 mm
CARRIER
TAPE
8 mm
USER
FEED
DIRECTION
COVER TAPE
Tape Dimensions
For Outline 4T
P
P2
D
P0
E
F
W
C
D1
t1 (CARRIER TAPE THICKNESS)
Tt (COVER TAPE THICKNESS)
K0
10° MAX.
A0
DESCRIPTION
B0
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 ± 0.10
4.00 ± 0.10
1.75 ± 0.10
0.061 + 0.002
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 + 0.30 - 0.10
0.254 ± 0.02
0.315 + 0.012
0.0100 ± 0.0008
COVER TAPE
WIDTH
TAPE THICKNESS
C
Tt
5.40 ± 0.10
0.062 ± 0.001
0.205 + 0.004
0.0025 ± 0.0004
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
For product information and a complete list of Agilent
contacts and distributors, please go to our web site.
www.agilent.com/semiconductors
E-mail: [email protected]
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-9272EN
December 1, 2004
5989-1974EN
10° MAX.