RMB2S thru RMB4S Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers Reverse Voltage 200 to 400 Volts Forward Current 0.5 Ampere Features Plastic package has UL Flammability Classification 94V-0 Glass passivated chip junctions Saves space on printed circuit boards Fast recovery, low switching loss High temperature soldering guaranteed: 260oC/10 seconds at 5 lbs. (2.3kg) tension Mechanical Data Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.078 oz, 0.22g Package outline dimensions in inches (millimeters) Maximum Ratings and Electrical Characteristics (TA=25oC unless otherwise noted) Parameter Symbols RMB2S RMB4S Maximum repetitive peak reverse voltag VRRM 200 400 Volts Maximum RMS voltage VRMS 140 280 Volts Maximum DC blocking voltage V DC 200 400 Volts Maximum average forward output rectified current at TA=30oC on glass-epoxy P.C.B. on aluminum substrate IF(AV) 0.5 0.8 Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30.0 Amps I2t 5.0 A 2 se c VF 1.0 Volt IR 5.0 100 uA 150 nS Rating for fusing (t < 8.3ms) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg TA = 25oC TA = 125oC Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range Notes: trr RθJA RθJA RθJL 85 70 20 (1) Units Amp (2) (1) (2) o C/W (1) CJ 13 TJ, TSTG -55 to +150 pF o C 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad 409 RATINGS AND CHARACTERISTIC CURVES (TA = 25oC unless otherwise noted) 410