ETC SMLC6.5C-2

05105
SMLC6.5C-2
thru
SMLC12C-2
Only One Name Means ProTek’Tion™
LOW CAPACITANCE TVS ARRAY
APPLICATIONS
✔ T1/E1
✔ RS-422, RS-423 & RS-485
✔ SDH/SONET, ATM Equipment & Systems
✔ Industrial Controls & Monitoring
✔ Cable Modem Intra-Building Protection
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
✔ 61000-4-5 (Surge): 8/20µs - 95A, L4(Line-Gnd) & 48A, L4(Line-Line) & 83A, L2(Power)
SO-16
FEATURES
✔ 3,600 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ 600 Watts Peak Pulse Power per Line (tp=10/1000µs)
✔ 100A (2/10µs) per Bellcore GR-1089 (Intra-Building)
✔ Bidirectional Configuration
✔ High Surge Capability: 80A (10/1000µs)
✔ Available in 2 Voltages: 6.5V & 12V
✔ Protects Two (2) Bidirectional Lines
✔ LOW CAPACITANCE: < 30pF per LINE PAIR
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SO-16 Package
✔ Weight 0.15 grams (Approximate)
✔ Flammability rating UL 94V-0
✔ 16mm Tape and Reel Per EIA Standard 481
✔ Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package
PIN CONFIGURATION
05105.R3 8/03
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
1
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp = 8/20µs)
PPP
3,600
Watts
Peak Pulse Power (tp = 10/1000µs) - See Figure 1
PPP
600
Watts
TJ
-55°C to 150°C
°C
TSTG
-55°C to 150°C
°C
Operating Temperature
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
SMLC6.5C-2
SMLC12C-2
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
TYPICAL
CAPACITANCE
@ VWM
ID
µA
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IPP = 10A
VC
VOLTS
VWM
VOLTS
@ 1mA
V(BR)
VOLTS
6.5
12.0
7.2
13.3
300
2
12.4
19.9
30
30
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10
600W 10/1000µs Waveform
1
0.1
0.1
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10
100
1,000
td - Pulse Duration - µs
10,000
100,000
@0V, 1MHz
C
pF
FIGURE 2
PULSE WAVE FORM
100
IPP - Peak Pulse Current - % of IPP
100
PPP - Peak Pulse Power - kW
RATED
STAND-OFF
VOLTAGE
TEST
WAVEFORM
PARAMETERS
tf = 10µs
td = 1,000µs
tf
Peak Value IPP
td = t I /2
PP
50
e-t
0
0
1
2
3
t - Time - µs
2
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GRAPHS
FIGURE 3
POWER DERATING CURVE
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SMLC6.5C-2
100
35
Peak Pulse Power
10/1000µs
5 Volts per Division
% Of Rated Power
80
60
40
25
15
5
20
-5
Average Power
0
0
25
50
75
100
125
TL - Lead Temperature - °C
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
150
VC - Clamping Voltage - Volts
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SMLC6.5C-2
16
12
8
4
0
0
10
20
30
IPP - Peak Pulse Current - Amps
FIGURE 6
INSERTION LOSS - SMLC6.5C-2
FIGURE 7
RETURN LOSS - SMLC6.5C-2
20 db
10 db per Division
10 db per Division
20 db
Ref 0 db
-20 db
Ref 0 db
-20 db
-50 db
-50 db
100 MHz per Division
100 MHz per Division
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SMLC12C-2
APPLICATION NOTE
The SMLCxxC-2 Series are low capacitance, bidirectional TVS arrays that are designed to protect I/O or high speed data lines from the damaging
effects of ESD or EFT. This product series has a surge capability of 600 Watts PPP per line for an 10/1000µs waveform and ESD protection > 40kV.
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION(Figure 1)
Ideal for use multimode transceiver I/O lines, telecommunications and wireless circuits, the SMLCxxC-2 Series provides up to two (2) line pairs of
protection in a differential-mode T1/E1 application as depicted in Figure 1.
Circuit connectivity is as follows:
✔ Line 1 is connected to Pins 1,
✔ Line 2 is connected to Pins 3,
✔ Line 3 is connected to Pins 5,
✔ Line 4 is connected to Pins 7,
2,
4,
6,
8,
15 & 16.
13 & 14.
11, & 12.
9 & 10.
Figure 1. Differential-Mode Protection For T1/E1 Applications
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔
✔
✔
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
1
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
✔
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
05105.R3 8/03
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16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
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SMLC12C-2
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
SO-16
-A-
9
16
-B- P
1
0.010” (0.25 MM)
M B M
8 PL
8
PACKAGE DIMENSIONS
DIM
G
R X 45º
C
0º - 7º
-TK
16 PL
0.010” (0.25 MM)
M
F
D
M T B S
A S
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
5.80
0.25
INCHES
MIN
MAX
0.393
10.00
0.386
4.00
0.150
0.157
0.068
1.75
0.054
0.49
0.014
0.019
1.25
0.016
0.049
1.27 BSC 0.05 BSC 0.05 BSC
0.25
0.008
0.009
0.009
0.25
0.004
6.20
0.229
0.244
0.50
0.010
0.019
NOTES
MOUNTING PAD
0.050” TYP
0.030” ± 0.005”
0.160” ± 0.005”
J
A
B
C
D
F
G
J
K
P
R
MILLIMETERS
MIN
MAX
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold
protrusions.
4. Maximum mold protrusion is 0.015” (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
0.245” MIN
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape,
i.e., SMLC6.5C-2-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape,
i.e., SMLC6.5C-2-T13.
4. No Suffix = Product Shipped in Tubes of 37 pcs per Tube.
0.045” ± 0.005”
Outline & Dimensions: Rev 1 - 11/01, 06007
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
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