SEMICONDUCTOR KPF500G02 ~ KPF102G02 TECHNICAL DATA Semiconductor Pressure Sensor FEATURES Broad Pressure Range : 50~1,000kPa. High Sensitivity, Excellent Linearity. Highly Stable in Temperature Change. APPLICATIONS Medical Deivces. Industrial Instrumentations. Pressure Switch, Water Height Control, Pneumatic Devices etc. Home Appliances. MODEL NUMBER FOR ORDERING KP F 000 G 00 A Package Pin Configuration No Mark : Standard A : Type 1 Silicon Pressure Sensor ON/OFF Chip N:ON Chip (Amplified) Rated Pressure F:OFF Chip (Not Amplified) 123 12 103=12,000kPa Measuring Pressure A : Absolute Pressure D : Differential Pressure G : Gage Pressure Package Type 00 : Die 01~ : Package Series PIP2 MAXIMUM RATING ITEM SPEC. UNIT Model No. KPF500G02 KPF101G02 KPF201G02 KPF401G02 KPF601G02 KPF801G02 KPF102G02 - Classification 500 101 201 401 601 801 102 - 50 100 200 400 600 800 1000 kPa 0.51 1.02 2.04 4.08 6.12 8.16 10.20 -50 ~ 50 -100 ~ 100 -100 ~ 200 -100 ~ 400 -100 ~ 600 -100 ~ 800 -100 ~ 1000 Rated Pressure Measurable Pressure Range Maximum Pressure Load Twice of Rated Pressure 1.5 Times of Reated Pressure Bridge Impedance 3000 ~ 6000 Operating Temperature -20 ~ 100 Storage Temperature -40 ~ 120 kgf/ kPa kPa(kgf/ ) ELECTRICAL CHARACTERISTICS ITEM SPEC. Classification Test Condition 500 101 201 Operating Input Current 1.5 401 601 801 constant, Ambient Temperature Ta=25 Compensational Temperature Range 0 ~ 50 Full Scale Voltage 60 ~ 140 Offset Voltage UNIT 102 - mV 20 mV Linearity 0.3 %FS Pressure Hysteresis 0.5 %FS 2 msec Temperature Coefficient Of Offset (TCO) 5.0 %FS Temperature Coefficient Of Sensitivity (TCS) 2.5 %FS Mechanical Response Time Comment) 1. Operating humidity 25~80%RH. (unless otherwise noted) 2. Please, consult us when you use any other pressure media except air. 2007. 6. 15 Revision No : 9 1/4 KPF500G02 ~ KPF102G02 RELIABILITY TEST ITEMS TEST CONDITIONS High Temp. Storage 120 Low Temp. Storage -40 , 1000hrs Steady State Operating 25 Life Test , 1000hrs 5 , 1 million times, Rated Pressure Low Temp. Operating -20 , 1 million times, Rated Pressure High Temp. Operating 100 Temperature / Humidity Operating 40 Heat Resistance 260 Environment Test Temp. Cycle , 1 million times, Rated Pressure , 90%RH, 1 million times, Rated Voltage , 10 seconds -40 ~120 , 30minutes/1Cycle, 100Cycles Amplitude : 1.5mm, Frequency : 10~55Hz, X, Y, Z(3-directions), 2 hrs each direction Vibration Drop 75cm height, 2 times Mechanical Test Lead Fatigue Tensile Strength : 9.8N(1kgf), 10seconds Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time Solderability 230 , 5 seconds CHARACTERISTIC GRAPHS 2. Temperature Coefficient of Offset (TCO) Operating Input Current : 1.5mA, Spec. : +_ 5.0 %FS 120 80 TCO (%FS) Full Scale Voltage (mV) 100 60 40 20 0 5.0 2.5 4.0 2.0 3.0 1.5 2.0 1.0 1.0 0 -1.0 0 1/2Pr 0.5 0 -0.5 -2.0 -1.0 -3.0 -1.5 -4.0 -2.0 -5.0 -20 3. Temperature Coefficient of Sensitivity (TCS) Operating Input Current : 1.5mA, Spec. : +_ 2.5%FS TCS (%FS) 1. Full Scale Voltage Characteristics Operating Input Current : 1.5mA, Temperature : 25 C Pr -2.5 0 Rated Pressure (kPa) 25 Temperature ( C) 50 0 25 50 Temperature ( C) 4. High Temperature continuous Operating Test 100°C, 1 million times : After testing, offset and full scale voltage variation is very small. Offset Voltage Variation Full Scale Voltage Variation 3 Full Scale Voltage Variation (%FS) Offset Voltage Variation (%FS) 3 2 1 0 -1 -2 -3 2 1 0 -1 -2 -3 0 500,000 1,000,000 Pressure Cycle 2007. 6. 15 0 500,000 1,000,000 Pressure Cycle Revision No : 9 2/4 KPF500G02 ~ KPF102G02 PACKAGE DIMENSIONS AND PC BOARD PATTERN (Unit :mm) Pressure Inlet Φ1.1 7.2 7.2 _ 1.5 9.5 + _ 0.25 2.5 + Φ4 _ 0.25 2.5 + _ 0.1 0.5 + Φ2.5 _ 0.1 0.25 + 4 5 0.41 2.9 R 0.2 R 0.5 3.5 0.8 1.75 7.5 0.9 dia Logo 1 6 2.5 Model No 2 5 2.5 Remark Lot No Pin Hole 3 4 Pressure Port Hole 5 dia PIN CONFIGURATION i = 1.5mA Terminal No. Meaning 1 (+)Input 2 (+)Ouputt 1 3 (-)Input 4 (-)Input 5 (-)Output 6 Open R1 R4 Constant current source + 2 5 R2 R3 V 4 3 - 2007. 6. 15 Revision No : 9 3/4 KPF500G02 ~ KPF102G02 Note 1. Mounting on printed circuit boards When mounting a transistor on a printed circuit, it is assumed that lead wires will be processed or reformed due to space limitation or relations with other components. Even if no such special processing reforming is conducted exercise care on the following points : (a) Make the spaces of lead wire inserting holes on the printed circuit board the same as those of lead wires on a transistor. (b) Even if The spaces are not the same, do not pull the lead wires or push heavily against the sensor element. (c) Use a spacer for form a lead maintain space between a sensor and a printed circuit board, rather than closely contacting them with each other. (d) When forming a lead prior to mounting onto a board - Bend the lead at a point 3mm or more apart from the body(Lead root). - Bend one lead wire after securing the other lead wire. (near the main body) - Keep space between the sensor main body and and a fixing jig. - When bending the lead along the jig, be careful not to damage it with an edge of the jig. - Follow other precautions described in respective standard (e) When mounting a sensor onto a heat sink - Use the specified accessory. - Drill threaded holes on the heat kink as per specifications and keep the surface free from burrs and undulations. - Use KEC’s recommended silicon grease. - Tighten the screw within the specified torque. - Never apply a pneumatic screwdriver to a transistor main body. (f) Do not bend or stretch the lead wires repeatedly. When pulling in the axial directions, apply 500g or 600g power, depending on the shapes of lead wires. 2. Soldering When soldering a sensor to a printed circuit board, the soldering temperature is usually so high that it adversely affects the sensor. Normally, tests are conducted at a soldering temperature of 265 for 10 seconds or 300 for 3 seconds. Be sure to complete soldering procedures under these conditions of temperature and time. Be careful to select a type of flux that will neither corrode the lead wires nor affect the electrical characteristics of a sensor. The basic precautions for soldering procedures are as follows : (a) Complete soldering procedures in a time as short as possible. (b) Do not apply stress to a sensor after soldering by correcting or modifying its location or direction. (c) For a sensor employing a heat sink, mount it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, sensors are apt to float on the solder due to solder surface tension. When adjusting the locations of sensor, be careful not to apply excessive stress to the roots of the sensor lead wires. (f) When using a soldering iron select those which have less leakage, and be sure to ground the soldering iron. 3. Cleaning a circuit board After soldering, circuit boards must be cleaned to remove flux. Observe the following precautions while cleaning them (a) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases which can degrade device performance. (b) Do not rub the indication marks with a brush or one’s fingers when cleaning or while a cleaning agent is applied to the markings. (c) There are ultrasonic wave cleaning methods which offer a high cleaning effect within a short time. Since there methods involve a complicated combination of factors such as the cleaning bath size, ultrasonic wave vibrator output, and printed circuit board mounting method, there is fear that the service life of airtight seal-type sensors may be extremely shortened. Therefore, as far as possible avoid using the ultrasonic wave cleaning method. - Basic requirements of ultrasonic wave cleaning method. Frequency : 27~29kHz Output : 300W or less (300W/ or less) Recommended solvents : Refer to details above Cleaning time : 30seconds or less Constant Current Circuit Unit Application circuit The Pressure sensor is designed to convert a voltage by means of constant current drive and then, if nesessary, it amplifies the Pressure Sensor Amplifier Circuit Unit OP AMP voltage for use. The circuit shown below is a typical example of a OP AMP circuit in which the pressure sensor is used. OP AMP 2007. 6. 15 Revision No : 9 4/4