TECHNICAL DATA KK74LS07 Hex Non-Inverted Buffers with OpenCollector Outputs This device contains hex non inverted buffers with open-collector. • High Output Voltage 30 V • High Speed tPD = 12 ns • Low Power Dissipation PD = 13 mW per Gate ORDERING INFORMATION KK74LS07N Plastic KK74LS07D SOIC TA = 0° to 70° C for all packages LOGIC DIAGRAM PIN ASSIGNMENT Y=A FUNCTION TABLE Inputs Output A Y H H L L PIN 14 =VCC PIN 7 = GND 1 KK74LS07 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC Supply Voltage 7.0 V VIN Input Voltage 5.5 V VOUT Output Voltage 30 V Tstg Storage Temperature Range -65 to +150 °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 5.25 V VCC Supply Voltage 4.75 VIH High Level Input Voltage 2.0 VIL Low Level Input Voltage 0.8 V VOH High Level Output Voltage 30 V IOL Low Level Output Current 40 mA TA Ambient Temperature Range +70 °C 0 V DC ELECTRICAL CHARACTERISTICS over full operating conditions Guaranteed Limit Symbol Parameter Test Conditions Min Max Unit VIK Input Clamp Voltage VCC = 4.75, IIN = -18 mA -1.5 V IOH High Level Output Current VCC = 4.75, VOH= 5.25 250 µA VOL Low Level Output Voltage VCC = 4.75, IOL = 16 mA 0.4 V VCC = 4.75, IOL = 40 mA 0.7 VCC = 5.25, VIN = 2.7 V 20 µA VCC = 5.25, VIN = 5.5 V 1 mA IIH High Level Input Current IIL Low Level Input Current VCC = 5.25, VIN = 0.4 V -0.2 mA ICC Supply Current VCC = 5.25 Total with outputs high 14 mA Total with outputs low 45 2 KK74LS07 AC ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5.0 V, CL = 15 pF, RL = 100 Ω,tr = 15 ns, tf = 6.0 ns) Symbol Parameter Min Max Unit tPLH Propagation Delay, Input A to Output Y 10 ns tPHL Propagation Delay, Input A to Output Y 30 ns Figure 1. Switching Waveforms NOTE A. CL includes probe and jig capacitance. Figure 2. Test Circuit 3 KK74LS07 N SUFFIX PLASTIC DIP (MS - 001AA) A Dimension, mm 8 14 B 7 1 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE N G M K J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AB) Dimension, mm A 14 8 H B 1 G P 7 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 8.55 8.75 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.27 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 4