MITSUMI CIM-H33N

MITSUMI
microSD card connectors
CIM-H33N
Connectors
FEATURES
1. Hinge machanism type
2. Small and tin design
3. Prevents from losing card by attaching a card
to the plate at card attachment and removal.
4. Card attachment and removal is easy by plate
opening with spring force.
5. Contact slide on card pad at card setting with
self-cleaning mechanism.
6. ESD countermeasure is possible at card
attachment.
HOW TO ORDER
H33N-008-21 0 - A G G E
1
1
2
3
4
5
6
7
8
2
3
4
5
6
7 8
Series No. (H33N : Nomal type)
No. of contacts (008 : 8pins)
Housing material (21 : LCP resin)
Housing UL grade (0 : UL94V-0)
Contact plating (A : Gold)
Contact plating thickness (G : 3µm)
Contact read style (G : Angle SMT)
Package (E : Taping)
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
Rated Voltage
Rated Current
Withstanding Voltage
Insulation Resistance
Contact Resistance
AC 50V (rms)
0.5A
500V AC (rms) 1minute
1000MΩ min. (Initial value)
100mΩ max. (Initial value)
MECHANICAL CHARACTERISTICS
Life (Matching Cycle)
Using Temperature Range
10,000times
-25~+85°C
MITSUMI
microSD card connectors
MATERIAL & FINISH
Component Parts
Housing
Contact
Plate
Lock Spring
Wing
Shaft
Torsion Spring
Material
LCP resin
Copper Alloy
SUS
Copper Alloy
Copper Alloy
SUS
SUS
Finish
(Black)
Gold plating
-
Gold plating
Gold plating
-
DIMENSIONS
14
0.55
0.25
13.75
0.55
Slide lock
Slide unlock
Recommended PWB layout
10.1
1.7
1.65
9.625
OPE.1
Card insert
0.5
1
OPE.2
Plate close
4.8
5
1.7
8.35
12.1
OPE.3
Plate slide
1
5.4
0.9
0.9
1
2.7
11.5
1.7
1
9.4
0.9
1
1.4
Note
[For GND]
1.1
1.3
OPE.4
Slide lock position
7.7
10.76
1.7
2.15
6.3
5.7
5.9
#8
0.3
1.1
7.7
1.9
0.6
0.4
0.4
2.7
0.6
0.55
#1
Slide
(13)
16.9
(1.5)
Slide stroke
0.4
12.1
8.3
0.4
12.1
2.5
0.4
2.2
2.15