NICHIA NJSA072T

No. STSE-CC7042A
<Cat.No.070416>
SPECIFICATIONS FOR NICHIA CHIP TYPE AMBER
MODEL : NJSA072T
NICHIA CORPORATION
-0-
LED
Nichia STSE-CC7042A-1
<Cat.No.070622>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
IFP Conditions
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Absolute Maximum Rating
450
900
85
1.8
-40 ~ +100
-40 ~ +100
150
Reflow Soldering : 260°C
Hand Soldering : 350°C
Pulse Width <
= 10msec.
:
and
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
Chromaticity Coordinate
y
-
(Ts=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
for 10sec.
for 3sec.
Duty <
= 1/10
Condition
IF=350[mA]
IF=350[mA]
IF=350[mA]
IF=350[mA]
Typ.
(3.6)
(22)
0.57
0.42
(Ts=25°C)
Max.
Unit
4.0
V
lm
-
Min.
25.5
21.4
18.0
15.1
(Ts=25°C)
Max.
Unit
30.3
25.5
lm
21.4
18.0
½ Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P10
Rank P9
Rank P8
Rank P7
Symbol
Condition
φv
IF=350[mA]
½ Luminous Flux Measurement allowance is ± 7%.
Color Rank
x
y
0.576
0.407
(IF=350mA,Ts=25°C)
Rank L3
0.549
0.562
0.589
0.425
0.438
0.411
½ Color Coordinates Measurement allowance is ± 0.01.
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to figure’s page.
-1-
Nichia STSE-CC7042A
<Cat.No.070416>
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Ceramics
Silicone Resin (with Diffused + Phosphor)
Au Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-2-
B for Nov. )
Nichia STSE-CC7042A
<Cat.No.070416>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Number of
Damaged
0/22
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
-40°C
~
100°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
100 cycles
0/22
100 cycles
0/50
10 cycles
0/50
1000 hrs.
0/50
Ta=60°C,
1000 hrs.
0/50
1000 hrs.
0/50
1000 hrs.
0/50
1000 hrs.
0/50
1000 hrs.
0/50
1000 hrs.
0/50
1 time
0/22
48min.
0/10
3 times
0/22
RH=90%
Ta=-40°C
Ta=25°C, IF=450mA
0/50
½
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
Ta=100°C, IF=180mA
Tested with Nichia standard circuit board.½
60°C, RH=90%, IF=350mA
Tested with Nichia standard circuit board.½
Ta=-40°C, IF=350mA
½
Tested with Nichia standard circuit board.
JEITA ED-4701
500 501
Vibration
JEITA ED-4701
400 403
Electrostatic Discharges
JEITA ED-4701
300 304
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
R=1.5kΩ, C=100pF
Test Voltage=2kV
Negative/Positive
½ Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 65°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=350mA
Initial Level ¯ 1.1
Luminous Flux
φv
IF=350mA
Initial Level ¯ 0.7
½ The test is performed after the board is cooled down to the room temperature.
-3-
Nichia STSE-CC7042A
<Cat.No.070416>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· Nichia LED electrodes are gold plated. The gold surface may be affected by environments which
contain corrosive substances. Please avoid conditions which may cause the LED to corrode,
tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations.
It is recommended that the User use the LEDs as soon as possible.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
-4-
Nichia STSE-CC7042A
<Cat.No.070416>
(4) Designing the position of LED on a board.
· No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder
to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
【No good】
【Recommended Direction】
Cathode mark
Cathode mark
Appropriate LED mounting is to place perpendicularly against the stress affected side.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
D
C
Perforated line
A
B
Slit
Stress : A > B = C > D > E
· Do not split board by hand. Split with exclusive special tool.
· If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack.
For this reason, it is recommended an appropriate verification should be taken before use.
-5-
Nichia STSE-CC7042A
<Cat.No.070416>
(5) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
3.6
Use the following conditions shown in the figure.
3
0.5
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-6-
Nichia STSE-CC7042A
<Cat.No.070416>
(7) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED to improve
the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 35°C /W,
W = Inputting Power (IF VF) : W
(8) Others
· NJSA072 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-7-
Nichia STSE-CC7042A-1
<Cat.No.070622>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
0.5
580
0.4
L3
y
590
600
610
620
0.3 490
630
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-8-
0.5
0.6
0.7
0.8
50
3.0 3.5 4.0 4.5 5.0
Forward Voltage VF (V)
1000
900
2.5
Ta=25°C
2.0
1.5
1.0
0.5
0
0
200 400 600 800 1000
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.0
2.0
-9-
IFP=350mA
4.5
4.0
3.5
3.0
2.5
-60 -30 0 30 60 90 120
Ambient Temperature Ta (°C)
Duty Ratio vs.
Allowable Forward Current
Allowable Forward Current IFP (mA)
100
10
2.5
Forward Voltage VF (V)
Relative Luminous Flux (a.u.)
Ta=25°C
350
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
1000
Forward Current vs.
Relative Luminous Flux
IFP=350mA
1.0
0.5
0.2
-60 -30 0 30 60 90 120
Ambient Temperature Ta (°C)
Ta=25°C
450
200
Pulse Width <
= 10msec.
½
100
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Forward Voltage vs.
Forward Current
500
450
292
239
202
100
0
0
Rja=45°C/W
Rja=55°C/W
Rja=65°C/W
20 40 60 80 100 120
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NJSA072
Title
CHARACTERISTICS
No.
070402763351
Nichia STSE-CC7042A
<Cat.No.070416>
Model
Forward Current vs.
Chromaticity Coordinate
Spectrum
Relative Emission Intensity (a.u.)
0.43
Ta=25°C
900mA 350mA
0.42
y
20mA
0.41
0.40
0.55
0.56
0.57
0.58
x
Ambient Temperature vs.
Chromaticity Coordinate
1.0
Ta=25°C
IFP=350mA
0.8
0.6
0.4
0.2
0
400
500
600
700
Wavelength λ (nm)
0°
1.0
-40°C
0°C
25°C
50°C
100°C
y
0.42
Relative Illuminance (a.u.)
-10-
IFP=350mA
0.41
0.56
0.57
x
800
Directivity
0.43
0.40
0.55
1.2
0.58
10° 20°
30°
Ta=25°C
IFP=350mA
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
0°
0.5
NICHIA CORPORATION
NJSA072
Title
CHARACTERISTICS
No.
070402763361
Nichia STSE-CC7042A
<Cat.No.070416>
Model
90°
1.0
3
2.7
0.8
2.7
0.5
1
R0.6
2.3
3
2.3
Anode
Cathode mark
Cathode
A
K
-11-
Protection device
ITEM
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Ceramics
Silicone Resin (with Diffused + Phosphor)
Au Plating
Model
NICHIA CORPORATION
Title
No.
NxSA072
OUTLINE DIMENSIONS
070402763281
Unit
mm
8/1
Scale
Allow
±0.2
Nichia STSE-CC7042A
<Cat.No.070416>
½ NxSA072 has a protection device built in as a protection
circuit against static electricity.
1.05±0.1
4±0.1
φ 1+0.25
-0
Reel End of tape
3.3±0.1
No LEDs
φ2
1 ±0.8
φ 60+1
-0
3.5±0.05
Cathode mark
11.4±1
9±0.3
φ 180+0
-3
0.2±0.05
3.3±0.1
2±0.05
8+0.3
- 0.1
4±0.1
φ 1.5+0.1
-0
Reel part
1.75±0.1
Taping part
±0.2
φ 13
Label
XXXX LED
TYPE NxSx072T
LOT xxxxxx-U„
QTY
pcs
LEDs mounting part
No LEDs
-12Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NxSx072T
TAPING DIMENSIONS
070409763211
Unit
mm
Scale
Allow
Nichia STSE-CC7042A
<Cat.No.070416>
4,000pcs/Reel
Nichia STSE-CC7042A
<Cat.No.070416>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NxSx072T
xxxxxx-U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NxSx072T
U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
4,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-13-
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
Quantity/box (pcs)
28,000 MAX.
60,000 MAX.
120,000 MAX.
Model
NxSx072T
Title
PACKING
No.
070409763221