NICHIA NS6R083T

No. STSE-CC7117A
<Cat.No.070702>
SPECIFICATIONS FOR NICHIA CHIP TYPE RED LED
MODEL : NS6R083T
NICHIA CORPORATION
-0-
Nichia STSE-CC7117A
<Cat.No.070702>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Absolute Maximum Rating
300
600
85
0.84
-30 ~ + 85
-40 ~ +100
120
(Ta=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
½
x
Chromaticity Coordinate
y
-
Condition
IF=240[mA]
IF=240[mA]
IF=240[mA]
IF=240[mA]
Typ.
(2.2)
(24)
0.700
0.299
(Ta=25°C)
Max.
Unit
2.8
V
lm
-
Min.
25.5
21.4
18.0
15.1
(Ta=25°C)
Max.
Unit
30.3
25.5
lm
21.4
18.0
½ Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P10
Rank P9
Rank P8
Rank P7
Symbol
Condition
φv
IF=240[mA]
½ Luminous Flux Measurement allowance is ± 10%.
Color Rank
x
y
0.67
0.27
(IF=240mA,Ta=25°C)
Rank R
0.67
0.73
0.73
0.33
0.33
0.27
½ Color Coordinates Measurement allowance is ± 0.01.
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
-1-
Nichia STSE-CC7117A
<Cat.No.070702>
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Electrodes
:
:
:
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 6 for 2006, 7 for 2007 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-2-
B for Nov. )
Nichia STSE-CC7117A
<Cat.No.070702>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Number of
Damaged
0/22
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
20 cycles
0/22
100 cycles
0/50
10 cycles
0/22
1000 hrs.
0/22
Ta=60°C, RH=90%
1000 hrs.
0/22
Ta=-40°C
1000 hrs.
0/22
Ta=25°C, IF=300mA
1000 hrs.
0/22
1000 hrs.
0/22
500 hrs.
0/22
1000 hrs.
0/22
48min.
0/22
1 time
0/22
1 time
0/22
3 times
0/22
0/50
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Ta=85°C, IF=250mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=300mA
Tested with Nichia standard circuit board.
Ta=-30°C, IF=240mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
Substrate Bending
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
3mm, 5 ± 1 sec.
Adhesion Strength
JEITA ED-4702
5N,
Electrostatic Discharges
JEITA ED-4701
300 304
R=1.5kΩ, C=100pF
Test Voltage=2kV
10 ± 1 sec.
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 65°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=240mA
Initial Level
Luminous Flux
φv
IF=240mA
Initial Level 0.7
The test is performed after the board is cooled down to the room temperature.
-3-
1.1
Nichia STSE-CC7117A-1
<Cat.No.071213>
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Recommended circuit
· In designing a circuit, the current through each LED must not exceed its absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
-4-
Nichia STSE-CC7117A
<Cat.No.070702>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
(9.5)
Die Heat Sink
2.05
1.05
3.9
(4.3)
Thin line boxes:Solder resist opening
Thick line boxes:Land pattern
Make sure the die heat sink is electrically
connected to the cathode(K).
1.1
K
A
4.5
8
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
If not, please use the heat conductive adhesive.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-5-
Nichia STSE-CC7117A
<Cat.No.070702>
(5) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(6) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
(7) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED (heat sink)
to improve the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 10°C /W,
W = Inputting Power (IF VF) : W
-6-
Nichia STSE-CC7117A
<Cat.No.070702>
(8) Others
· NS6R083 complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-7-
Nichia STSE-CC7117A
<Cat.No.070702>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
0.5
y
580
590
0.4
600
610
0.3
R
490
620
630
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-8-
0.5
0.6
0.7
0.8
240
100
50
Ta=25°C
2.0
1.5
1.0
0.5
0
0 100 200 300 400 500 600 700
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
2.8
2.0
2.6
IFP=240mA
2.4
2.2
2.0
1.8
1.6
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Relative Luminous Flux (a.u.)
-9-
Forward Voltage VF (V)
10
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Forward Voltage VF (V)
2.5
Allowable Forward Current IFP (mA)
Ta=25°C
1000
3.0
IFP=240mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
600
300
200
100
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
1000
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminous Flux
Forward Voltage vs.
Forward Current
500
Thermal resistance
Rja=35°C/W
400
300
250
200
100
0
0
Thermal resistance
Rja=65°C/W
Typical measuring PWB
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NS6R083
Title
CHARACTERISTICS
No.
070628767821
Nichia STSE-CC7117A
<Cat.No.070702>
Model
Spectrum
IFP=240mA
0.32
y
0.31
0.30
0.29
-30°C(621nm)
0°C(623nm)
25°C(625nm)
50°C(627nm)
85°C(630nm)
0.28
0.68 0.69 0.70 0.71 0.72 0.73
x
IFP=240mA
627
625
623
621
619
-40 -20 0
20 40 60 80 100
Dominant Wavelength λ D (nm)
Dominant Wavelength λ D (nm)
-10-
629
1.0
Ta=25°C
IFP=240mA
0.8
0.6
0.4
0.2
0
450 500 550 600 650 700 750
Wavelength λ (nm)
Forward Current vs.
Dominant Wavelength
Ambient Temperature vs.
Dominant Wavelength
631
1.2
Directivity
629
Ta=25°C
627
625
623
621
619
10
0°
1.0
631
Relative Illuminance (a.u.)
0.33
Relative Emission Intensity (a.u.)
Ambient Temperature vs.
Chromaticity Coordinate (λD)
100
1000
10° 20°
30°
Ta=25°C
IFP=240mA
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
NICHIA CORPORATION
0.5
90°
1.0
NS6R083
Title
CHARACTERISTICS
No.
070628767831
Nichia STSE-CC7117A
<Cat.No.070702>
Model
0°
4.3
3.2
3.4
1.6
5
3.5
K
4.3
A
Die Heatsink
Cathode
Internal Circuit
Protection device
Cathode mark
C 1.5
6.5
Die Heatsink
0.6
4.85
Anode
1.35
0.25
-11-
5
0.175
3.4
MATERIALS
PACKAGE
ENCAPSULATING RESIN
ELECTRODES
Heat-Resistant Polymer
Silicone Resin (with Diffused)
Ag Plating Copper Alloy
½ NS6R083 has a protection device built in as a protection
circuit against static electricity.
Model
NICHIA CORPORATION
Title
No.
NS6R083
OUTLINE DIMENSIONS
070622767481
Unit
mm
7/1
Scale
Allow
±0.2
Nichia STSE-CC7117A
<Cat.No.070702>
ITEM
φ 180+0
-3
Reel part
1.75±0.1
Taping part
4±0.1
φ 1.5+0.1
-0
2±0.05
15.4±1
13+1
-0
0.2±0.05
φ 60+1
-0
φ2
1 ±0.8
6.7±0.1
12+0.3
- 0.1
5.5±0.05
Cathode mark
±0.2
φ 13
8±0.1
φ1.5 +0.2
-0
1.55±0.1
Label
RED LED
TYPE NS6R083T
LOT xxxxxx-U„
QTY
pcs
RoHS
5.2±0.1
Reel end of tape
No LEDs
LEDs mounting part
No LEDs
-12Pull direction
Top cover
tape
Embossed carrier tape
Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Reel Lead Min.400mm
Model
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
NICHIA CORPORATION
Title
No.
NS6R083T
TAPING DIMENSIONS
070622767491
Unit
mm
Scale
Allow
Nichia STSE-CC7117A
<Cat.No.070702>
1,400pcs/Reel
Nichia STSE-CC7117A
<Cat.No.070702>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
RED LED
TYPE
LOT
QTY
NS6R083T
xxxxxx-U„
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
RED LED
LED
TYPE
RANK
QTY
NS6R083T
U„
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
1,400 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-13-
Reel/box
5reel MAX.
10reel MAX.
20reel MAX.
Quantity/box (pcs)
7,000 MAX.
14,000 MAX.
28,000 MAX.
Model
NS6R083T
Title
PACKING
No.
070622767501